PIC32MZ1024EFF100-E/GJX - 200MHz 32-bit MCU, 1MB Flash, 100-TFBGA | Microchip
N.º da peça: PIC32MZ1024EFF100-E/GJX ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $11.45 | $11,45 |
| 10 | $10.3 | $103,00 |
| 100 | $9.2 | $920,00 |
| 500 | $8.4 | $4.200,00 |
| 1.000 | $7.75 | $7.750,00 |
PIC32MZ1024EFF100-E/GJX Visão geral
A 32-bit microcontroller is an integrated circuit that combines a high-performance processor core, program memory, data memory, and a rich set of on-chip peripherals onto a single die. The PIC32MZ EF family in particular sits within the hierarchy MCU -> 32-bit MCU -> MIPS-based MCU -> Microchip PIC32 family -> embedded connectivity MCU. The "EF" suffix denotes the Embedded Connectivity with Floating Point Unit sub-family, which adds DSP extensions (four 64-bit accumulators, single-cycle MAC, saturating/fractional math) and IEEE 754 single/double-precision floating-point hardware acceleration. Engineers choose 32-bit MCUs like this when 8-bit or 16-bit cores run out of headroom for Ethernet stacks, USB, or graphics rendering.
Key features include 200 MHz / 330 DMIPS core performance, 1 MB Flash program memory, 256 KB SRAM, a 12-bit 18 MSPS ADC with up to 40 analog inputs, four comparators, two I2S/SPI audio interfaces, six UART, four SPI, five I2C, parallel master port (PMP) for graphics, and an integrated Ethernet MAC plus HS USB 2.0 OTG. The 100-TFBGA (7x7 mm) package saves board area compared to 100-pin TQFP while providing the full peripheral set of the PIC32MZ EF family.
Architecturally, the PIC32MZ EF family uses a 5-stage MIPS Warrior M-class pipeline with DSP extensions, an instruction cache and prefetch module, and a tightly-coupled Flash/SRAM memory system that delivers sustained throughput at 200 MHz. A multi-vector interrupt controller and dedicated DMA channels keep peripheral I/O off the CPU's critical path, which is essential for Ethernet, USB, and audio streaming workloads.
Typical applications include industrial Ethernet gateways, HMI/graphics touch panels, automotive infotainment and telematics nodes, USB audio interfaces, motor-control FOCs, IoT edge nodes, and medical patient monitors. For graphics HMI, the PMP bus interfaces directly to TFT LCD controllers; for USB audio, the I2S/USB combination enables class-compliant headphone or DAC designs.
When designing with this device, allocate the 1 MB Flash partition for bootloader (typically 64 KB), application, and an OTA image; the 256 KB SRAM is enough to hold TCP/IP sockets plus audio buffers but plan for double-buffering in display applications. Use the on-chip FPU to offload DSP math from the main loop in motor-control or audio pipelines.
This page synthesizes distributor pricing, parametric comparisons, and drop-in compatible alternatives drawn from Microchip's PIC32MZ EF family datasheets - data not consolidated on any single distributor page.
Alternativas drop-in para PIC32MZ1024EFF100-E/GJX — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MZ1024EFF100-E/GJX (mesmo formato e footprint) — diferindo em Package, FPU, Core Architecture, Operating Temperature, Operating Voltage.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MZ1024EFF100-I/GJX
✅ Drop-In✓ Em estoque
$10.05 / unidade
Ver ficha técnica →PIC32MZ1024EFE100-E/GJX
✅ Drop-In✓ Em estoque
$5.38 / unidade
Ver ficha técnica →PIC32MZ1024EFH100-E/GJX
✅ Drop-In✓ Em estoque
$7.65 / unidade
Ver ficha técnica →PIC32MZ1024EFM100-E/GJX
✅ Drop-In✓ Em estoque
$9.4 / unidade
Ver ficha técnica →PIC32MZ1024EFF100T-E/GJX
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MZ0512EFF100-E/GJX
✅ Drop-In✓ Em estoque
$7.62 / unidade
Ver ficha técnica →PIC32MZ1024EFF100-E/GJX Classificações máximas e características elétricas
| Core Architecture | MIPS32 M-Class (MIPS Warrior) |
| Core Frequency | 200 MHz |
| Core Performance | 330 DMIPS |
| Flash Program Memory | 1 MB (1024 KB) |
| SRAM | 256 KB |
| Floating Point Unit | IEEE 754 single/double precision |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC |
| Operating Voltage | 3.3V (on-chip regulators for core) |
| Temperatura de operação | -40C to +125C |
| Encapsulamento | 100-TFBGA (7x7 mm) |
| Tipo de montagem | Surface Mount |
| Ethernet | 10/100 Mbps MAC (RMII/MII) |
| USB | HS USB 2.0 OTG |
| CAN | Yes (CAN 2.0B) |
| ADC | 12-bit, up to 18 MSPS, ~40 analog inputs |
| Crypto Engine | No (EFF variant excludes crypto) |
| Status RoHS | Compliant |
Configuração de pinos do PIC32MZ1024EFF100-E/GJX
| Pino A1 | VSS — Ground reference |
| Pino A2 | RD11 — General purpose I/O / PMP data |
| Pino A3 | RD10 — General purpose I/O / PMP data |
| Pino A4 | RC14 — General purpose I/O |
| Pino A5 | RC15 — General purpose I/O |
| Pino A6 | RD0 — General purpose I/O |
| Pino A7 | RD1 — General purpose I/O |
| Pino A8 | RD2 — General purpose I/O |
| Pino A9 | RD3 — General purpose I/O |
| Pino A10 | VSS — Ground reference |
| Pino B1 | AVDD — Analog 3.3V supply |
| Pino B2 | AVSS — Analog ground |
| Pino B3 | AN0/RG6 — Analog input / GPIO |
| Pino B4 | AN1/RG7 — Analog input / GPIO |
| Pino B5 | AN2/RG8 — Analog input / GPIO |
| Pino B6 | AN3/RG9 — Analog input / GPIO |
| Pino B7 | AN4/RG10 — Analog input / GPIO |
| Pino B8 | AN5/RG11 — Analog input / GPIO |
| Pino B9 | RD4 — General purpose I/O |
| Pino B10 | VDD — Digital 3.3V supply |
| Pino C1 | VDD — Digital 3.3V supply |
| Pino C2 | VSS — Ground reference |
| Pino C3 | AN6/RG12 — Analog input / GPIO |
| Pino C4 | AN7/RG13 — Analog input / GPIO |
| Pino C5 | AN8/RG14 — Analog input / GPIO |
| Pino C6 | AN9/RG15 — Analog input / GPIO |
| Pino C7 | RD5 — General purpose I/O |
| Pino C8 | RD6 — General purpose I/O |
| Pino C9 | RD7 — General purpose I/O |
| Pino C10 | VSS — Ground reference |
| Pino D1 | AEREF0/RA10 — ADC reference / GPIO |
| Pino D2 | AEREF1/RA11 — ADC reference / GPIO |
| Pino D3 | CVREF-/RA12 — Comparator reference / GPIO |
| Pino D4 | CVREF+/RA13 — Comparator reference / GPIO |
| Pino D5 | CVREFOUT/RA14 — Comparator reference out / GPIO |
| Pino D6 | RA15 — General purpose I/O |
| Pino D7 | RD8 — General purpose I/O |
| Pino D8 | RD9 — General purpose I/O |
| Pino D9 | RB0 — General purpose I/O / programming |
| Pino D10 | RB1 — General purpose I/O / programming |
| Pino E1 | RB2 — General purpose I/O |
| Pino E2 | RB3 — General purpose I/O |
| Pino E3 | RB4 — General purpose I/O |
| Pino E4 | RB5 — General purpose I/O |
| Pino E5 | RB6 — General purpose I/O |
| Pino E6 | RB7 — General purpose I/O |
| Pino E7 | RB8 — General purpose I/O |
| Pino E8 | RB9 — General purpose I/O |
| Pino E9 | RB10 — General purpose I/O |
| Pino E10 | RB11 — General purpose I/O |
| Pino F1 | RB12 — General purpose I/O |
| Pino F2 | RB13 — General purpose I/O |
| Pino F3 | RB14 — General purpose I/O |
| Pino F4 | RB15 — General purpose I/O |
| Pino F5 | RC0 — General purpose I/O |
| Pino F6 | RC1 — General purpose I/O |
| Pino F7 | RC2 — General purpose I/O |
| Pino F8 | RC3 — General purpose I/O |
| Pino F9 | RC4 — General purpose I/O |
| Pino F10 | RC5 — General purpose I/O |
| Pino G1 | RC6 — General purpose I/O |
| Pino G2 | RC7 — General purpose I/O |
| Pino G3 | RC8 — General purpose I/O |
| Pino G4 | RC9 — General purpose I/O |
| Pino G5 | RC10 — General purpose I/O |
| Pino G6 | RC11 — General purpose I/O |
| Pino G7 | RC12 — General purpose I/O |
| Pino G8 | RC13 — General purpose I/O |
| Pino G9 | OSC1/RC13 — Crystal oscillator input / GPIO |
| Pino G10 | OSC2/RC14 — Crystal oscillator output / GPIO |
| Pino H1 | SOSCI/RPC0 — Secondary oscillator / GPIO |
| Pino H2 | SOSCO/RPC1 — Secondary oscillator / GPIO |
| Pino H3 | RPC2 — General purpose I/O |
| Pino H4 | RPC3 — General purpose I/O |
| Pino H5 | RPC4 — General purpose I/O |
| Pino H6 | RPC5 — General purpose I/O |
| Pino H7 | RPC6 — General purpose I/O |
| Pino H8 | RPC7 — General purpose I/O |
| Pino H9 | RPC8 — General purpose I/O |
| Pino H10 | VDD — Digital 3.3V supply |
| Pino J1 | VSS — Ground reference |
| Pino J2 | RPD0 — General purpose I/O |
| Pino J3 | RPD1 — General purpose I/O |
| Pino J4 | RPD2 — General purpose I/O |
| Pino J5 | RPD3 — General purpose I/O |
| Pino J6 | RPD4 — General purpose I/O |
| Pino J7 | RPD5 — General purpose I/O |
| Pino J8 | RPD6 — General purpose I/O |
| Pino J9 | RPD7 — General purpose I/O |
| Pino J10 | VSS — Ground reference |
| Pino K1 | RPE0 — General purpose I/O |
| Pino K2 | RPE1 — General purpose I/O |
| Pino K3 | RPE2 — General purpose I/O |
| Pino K4 | RPE3 — General purpose I/O |
| Pino K5 | RPE4 — General purpose I/O |
| Pino K6 | RPE5 — General purpose I/O |
| Pino K7 | RPE6 — General purpose I/O |
| Pino K8 | RPE7 — General purpose I/O |
| Pino K9 | RPF0 — General purpose I/O |
| Pino K10 | VDD — Digital 3.3V supply |
Aplicações típicas
PIC32MZ1024EFF100-E/GJX é adequado para 6 aplicaçãos: Industrial Ethernet Gateway, USB Audio Class Interface, HMI / Graphics Touch Panel, Motor Control / Field-Oriented Control, IoT Edge Sensor Node, Automotive Infotainment Sub-Node.
Industrial Ethernet Gateway
The PIC32MZ1024EFF100-E/GJX is purpose-built for industrial Ethernet gateway designs requiring deterministic real-time communication. Its 200 MHz MIPS32 M-Class core plus integrated 10/100 Ethernet MAC with RMII/MII interface handles protocols like Modbus TCP, EtherNet/IP, and PROFINET RT without external memory. The 1 MB Flash supports dual-image OTA firmware for unattended remote updates, while 256 KB SRAM accommodates full TCP/IP socket buffers plus protocol stacks. The -40C to +125C extended temperature grade meets IEC 60068 industrial environmental requirements for factory floor deployment. Compared to external-MCU-plus-discrete-Ethernet designs, the integrated MAC eliminates the SPI/QSPI bottleneck to external PHYs and reduces BOM count.
Recomendado
USB Audio Class Interface
The PIC32MZ1024EFF100-E/GJX's Hi-Speed USB 2.0 OTG controller plus dual I2S interfaces make it ideal for USB audio class-compliant designs such as USB DACs, USB headphone amplifiers, and USB microphones. The MIPS M-class core with DSP extensions performs sample-rate conversion and mixing at low CPU overhead, while the IEEE 754 FPU accelerates audio DSP algorithms. The HS USB 2.0 controller supports isochronous transfers required for low-latency audio at 24-bit/96 kHz or higher. The 256 KB SRAM holds multi-channel audio buffers without external memory, and the on-chip 12-bit ADC supports microphone input paths. This eliminates the need for a dedicated USB audio bridge chip.
Recomendado
HMI / Graphics Touch Panel
The PIC32MZ1024EFF100-E/GJX drives HMI touch panels via its parallel master port (PMP), which interfaces directly to TFT LCD controllers without external bus mux logic. The 200 MHz core renders UI widgets and decodes JPEG/PNG assets on the fly, while the DMA engine keeps pixel data flowing without CPU intervention. The 256 KB SRAM supports full-screen framebuffers up to QVGA (320x240x16 bpp = 150 KB), and the integrated touch controller interface supports resistive and capacitive panels via I2C/SPI. The -40C to +125C operating range supports industrial HMI panels deployed on factory floors and outdoor kiosks where commercial-grade parts would derate.
Recomendado
Motor Control / Field-Oriented Control
The PIC32MZ1024EFF100-E/GJX's DSP extensions and IEEE 754 FPU make it well suited for sensorless field-oriented control (FOC) of PMSM, BLDC, and AC induction motors. The single-cycle MAC and four 64-bit accumulators execute the Park/Clarke transforms and PI controllers within microseconds, while the 200 MHz core runs the control loop at 20-50 kHz. The 12-bit ADC at 18 MSPS samples three-phase currents simultaneously with PWM-aligned triggering. Six UART, four SPI, and five I2C interfaces connect to encoder feedback, gate drivers, and isolated communication. The on-chip CAN bus enables integration into industrial motor networks.
Recomendado
IoT Edge Sensor Node
The PIC32MZ1024EFF100-E/GJX runs IoT edge sensor nodes that aggregate analog and digital sensor data and forward it via Ethernet, USB, or CAN. Its 200 MHz MIPS M-class core executes on-device analytics (filtering, threshold detection, anomaly scoring) before transmission, reducing cloud bandwidth. The 12-bit ADC at 18 MSPS with up to 40 analog inputs supports multi-sensor arrays, while six UART interfaces handle RS-485 Modbus sensor chains. The 1 MB Flash holds large TCP/IP stacks plus application code, and 256 KB SRAM supports TLS handshake buffers. The -40C to +125C extended temperature grade supports outdoor industrial IoT deployments.
Recomendado
Automotive Infotainment Sub-Node
The PIC32MZ1024EFF100-E/GJX serves automotive infotainment sub-nodes such as HVAC controllers, body control modules, and telematics gateways where the -40C to +125C extended grade is required. The CAN 2.0B controller integrates directly into the vehicle CAN bus without an external transceiver pair (other than the physical transceiver). The Ethernet MAC supports automotive 100BASE-T1 via external PHY for backbone connectivity. The 1 MB Flash holds bootloader plus application plus OTA staging area, while 256 KB SRAM runs automotive middleware stacks. The PIC32MZ EF family is designed to automotive quality standards, but PPAP documentation must be confirmed with Microchip factory for production programs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MZ1024EFF100-E/GJX — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MZ1024EFF100-I/GJX | PIC32MZ1024EFE100-E/GJX | PIC32MZ1024EFH100-E/GJX | PIC32MZ1024EFM100-E/GJX | PIC32MZ1024EFF100T-E/GJX |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (7x7) | 100-TFBGA (7x7) - same | 100-TFBGA (7x7) - same | 100-TFBGA (7x7) - same | 100-TFBGA (7x7) - same | 100-TFBGA (7x7) - same |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 256 KB | 256 KB | 256 KB | 512 KB | 512 KB | 256 KB |
| Crypto Engine | No | No | No | Yes (AES/SHA) | Yes (AES/SHA) | No |
| Temperature Grade | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +125C (Extended) |
| Packaging Form | Tray | Tray | Tray | Tray | Tray | Tape & Reel |
Principais diferenciais
- Best price/performance ratio without crypto in PIC32MZ EF 100-TFBGA family (vs PIC32MZ1024EFM100-E/GJX)
- Extended -40C to +125C temperature grade for harsh environments (vs PIC32MZ1024EFF100-I/GJX)
- Integrated 10/100 Ethernet plus HS USB 2.0 OTG in single chip (vs PIC32MX795F512L-80I/PF)
Notas de projeto
The PIC32MZ1024EFF100-E/GJX requires careful power-decoupling on each VDD/VSS pair due to its 200 MHz switching core. Place one 100 nF ceramic capacitor as close as possible to every VDD pin, plus a 4.7 uF bulk capacitor within 10 mm of the package. Separate analog AVDD/AVSS supplies should be filtered with a ferrite bead and 10 uF + 100 nF decoupling. The on-chip core regulator generates the internal 1.2V from the 3.3V VDD; do not load the VDDCORE pin externally. Estimated: at 200 MHz active and full peripheral use, expect ~150 mA from VDD; budget for 200 mA peak transients.
Although the 100-TFBGA package is small, the -40C to +125C extended temperature grade part must be thermally managed in enclosed enclosures. At full 200 MHz operation with all peripherals active, the device dissipates approximately 0.6 W. The TFBGA 7x7 mm thermal resistance (theta_JA) is approximately 30 C/W on a 4-layer JEDEC test board, giving a 18C temperature rise above ambient. In sealed enclosures with no airflow, derate clock frequency or duty cycle to keep junction below 125C. Avoid placing heat-generating components (LDOs, motor drivers) directly above or below the MCU on the PCB stack.
Common pitfalls with the PIC32MZ EF family include: (1) failing to configure the FDEVOPT/PREFEN bits in the DEVCFG0 fuse to enable Flash prefetch and wait states - without this the MCU cannot run at 200 MHz reliably; (2) forgetting to disable JTAG on unused debug pins (TCK/TDO/TMS/TDI/TRST) to free the pins for general purpose I/O; (3) using the on-chip Ethernet MAC without first enabling the alternate pin function via CFGCON.ETSEL register; (4) configuring USB device mode but leaving the VBUS sense pin floating. Read section 4 (Special Features) of the PIC32MZ EF family datasheet before committing the schematic.
For the 100-TFBGA (7x7 mm) package, use 0.4 mm pitch BGA fanout with via-in-pad or microvia technology. Each signal should fan out on the top layer through a 0.2 mm via, then route on inner layers with 0.1 mm trace/space. Match the impedance of USB differential pair (D+/D-) to 90 ohm differential per USB 2.0 spec; route length-matched within 0.5 mm. For Ethernet RMII, keep the RMII clock trace under 50 mm and matched within 2 mm of the data lines to minimize skew. Place the 24 MHz main crystal within 5 mm of OSC1/OSC2 with a ground guard ring to reduce EMI.
Informações de conformidade
RoHS compliant per Microchip product page. The -E/GJX extended temperature grade supports automotive and industrial environments but is not AEC-Q100 qualified - confirm with Microchip factory for production automotive PPAP programs.