PIC32MZ1024EFF100-E/GJX - 200MHz 32-bit MCU, 1MB Flash, 100-TFBGA | Microchip
Référence : PIC32MZ1024EFF100-E/GJX ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $11.45 | $11,45 |
| 10 | $10.3 | $103,00 |
| 100 | $9.2 | $920,00 |
| 500 | $8.4 | $4 200,00 |
| 1 000 | $7.75 | $7 750,00 |
PIC32MZ1024EFF100-E/GJX Présentation
A 32-bit microcontroller is an integrated circuit that combines a high-performance processor core, program memory, data memory, and a rich set of on-chip peripherals onto a single die. The PIC32MZ EF family in particular sits within the hierarchy MCU -> 32-bit MCU -> MIPS-based MCU -> Microchip PIC32 family -> embedded connectivity MCU. The "EF" suffix denotes the Embedded Connectivity with Floating Point Unit sub-family, which adds DSP extensions (four 64-bit accumulators, single-cycle MAC, saturating/fractional math) and IEEE 754 single/double-precision floating-point hardware acceleration. Engineers choose 32-bit MCUs like this when 8-bit or 16-bit cores run out of headroom for Ethernet stacks, USB, or graphics rendering.
Key features include 200 MHz / 330 DMIPS core performance, 1 MB Flash program memory, 256 KB SRAM, a 12-bit 18 MSPS ADC with up to 40 analog inputs, four comparators, two I2S/SPI audio interfaces, six UART, four SPI, five I2C, parallel master port (PMP) for graphics, and an integrated Ethernet MAC plus HS USB 2.0 OTG. The 100-TFBGA (7x7 mm) package saves board area compared to 100-pin TQFP while providing the full peripheral set of the PIC32MZ EF family.
Architecturally, the PIC32MZ EF family uses a 5-stage MIPS Warrior M-class pipeline with DSP extensions, an instruction cache and prefetch module, and a tightly-coupled Flash/SRAM memory system that delivers sustained throughput at 200 MHz. A multi-vector interrupt controller and dedicated DMA channels keep peripheral I/O off the CPU's critical path, which is essential for Ethernet, USB, and audio streaming workloads.
Typical applications include industrial Ethernet gateways, HMI/graphics touch panels, automotive infotainment and telematics nodes, USB audio interfaces, motor-control FOCs, IoT edge nodes, and medical patient monitors. For graphics HMI, the PMP bus interfaces directly to TFT LCD controllers; for USB audio, the I2S/USB combination enables class-compliant headphone or DAC designs.
When designing with this device, allocate the 1 MB Flash partition for bootloader (typically 64 KB), application, and an OTA image; the 256 KB SRAM is enough to hold TCP/IP sockets plus audio buffers but plan for double-buffering in display applications. Use the on-chip FPU to offload DSP math from the main loop in motor-control or audio pipelines.
This page synthesizes distributor pricing, parametric comparisons, and drop-in compatible alternatives drawn from Microchip's PIC32MZ EF family datasheets - data not consolidated on any single distributor page.
Alternatives de remplacement direct pour PIC32MZ1024EFF100-E/GJX — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1024EFF100-E/GJX (même facteur de forme et même empreinte) — différant par Package, FPU, Core Architecture, Operating Temperature, Operating Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024EFF100-I/GJX
✅ Remplacement direct✓ En stock
$10.05 / unité
Voir la fiche technique →PIC32MZ1024EFE100-E/GJX
✅ Remplacement direct✓ En stock
$5.38 / unité
Voir la fiche technique →PIC32MZ1024EFH100-E/GJX
✅ Remplacement direct✓ En stock
$7.65 / unité
Voir la fiche technique →PIC32MZ1024EFM100-E/GJX
✅ Remplacement direct✓ En stock
$9.4 / unité
Voir la fiche technique →PIC32MZ1024EFF100T-E/GJX
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ0512EFF100-E/GJX
✅ Remplacement direct✓ En stock
$7.62 / unité
Voir la fiche technique →PIC32MZ1024EFF100-E/GJX Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M-Class (MIPS Warrior) |
| Core Frequency | 200 MHz |
| Core Performance | 330 DMIPS |
| Flash Program Memory | 1 MB (1024 KB) |
| SRAM | 256 KB |
| Floating Point Unit | IEEE 754 single/double precision |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC |
| Operating Voltage | 3.3V (on-chip regulators for core) |
| Température de fonctionnement | -40C to +125C |
| Boîtier | 100-TFBGA (7x7 mm) |
| Type de montage | Surface Mount |
| Ethernet | 10/100 Mbps MAC (RMII/MII) |
| USB | HS USB 2.0 OTG |
| CAN | Yes (CAN 2.0B) |
| ADC | 12-bit, up to 18 MSPS, ~40 analog inputs |
| Crypto Engine | No (EFF variant excludes crypto) |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MZ1024EFF100-E/GJX
| Broche A1 | VSS — Ground reference |
| Broche A2 | RD11 — General purpose I/O / PMP data |
| Broche A3 | RD10 — General purpose I/O / PMP data |
| Broche A4 | RC14 — General purpose I/O |
| Broche A5 | RC15 — General purpose I/O |
| Broche A6 | RD0 — General purpose I/O |
| Broche A7 | RD1 — General purpose I/O |
| Broche A8 | RD2 — General purpose I/O |
| Broche A9 | RD3 — General purpose I/O |
| Broche A10 | VSS — Ground reference |
| Broche B1 | AVDD — Analog 3.3V supply |
| Broche B2 | AVSS — Analog ground |
| Broche B3 | AN0/RG6 — Analog input / GPIO |
| Broche B4 | AN1/RG7 — Analog input / GPIO |
| Broche B5 | AN2/RG8 — Analog input / GPIO |
| Broche B6 | AN3/RG9 — Analog input / GPIO |
| Broche B7 | AN4/RG10 — Analog input / GPIO |
| Broche B8 | AN5/RG11 — Analog input / GPIO |
| Broche B9 | RD4 — General purpose I/O |
| Broche B10 | VDD — Digital 3.3V supply |
| Broche C1 | VDD — Digital 3.3V supply |
| Broche C2 | VSS — Ground reference |
| Broche C3 | AN6/RG12 — Analog input / GPIO |
| Broche C4 | AN7/RG13 — Analog input / GPIO |
| Broche C5 | AN8/RG14 — Analog input / GPIO |
| Broche C6 | AN9/RG15 — Analog input / GPIO |
| Broche C7 | RD5 — General purpose I/O |
| Broche C8 | RD6 — General purpose I/O |
| Broche C9 | RD7 — General purpose I/O |
| Broche C10 | VSS — Ground reference |
| Broche D1 | AEREF0/RA10 — ADC reference / GPIO |
| Broche D2 | AEREF1/RA11 — ADC reference / GPIO |
| Broche D3 | CVREF-/RA12 — Comparator reference / GPIO |
| Broche D4 | CVREF+/RA13 — Comparator reference / GPIO |
| Broche D5 | CVREFOUT/RA14 — Comparator reference out / GPIO |
| Broche D6 | RA15 — General purpose I/O |
| Broche D7 | RD8 — General purpose I/O |
| Broche D8 | RD9 — General purpose I/O |
| Broche D9 | RB0 — General purpose I/O / programming |
| Broche D10 | RB1 — General purpose I/O / programming |
| Broche E1 | RB2 — General purpose I/O |
| Broche E2 | RB3 — General purpose I/O |
| Broche E3 | RB4 — General purpose I/O |
| Broche E4 | RB5 — General purpose I/O |
| Broche E5 | RB6 — General purpose I/O |
| Broche E6 | RB7 — General purpose I/O |
| Broche E7 | RB8 — General purpose I/O |
| Broche E8 | RB9 — General purpose I/O |
| Broche E9 | RB10 — General purpose I/O |
| Broche E10 | RB11 — General purpose I/O |
| Broche F1 | RB12 — General purpose I/O |
| Broche F2 | RB13 — General purpose I/O |
| Broche F3 | RB14 — General purpose I/O |
| Broche F4 | RB15 — General purpose I/O |
| Broche F5 | RC0 — General purpose I/O |
| Broche F6 | RC1 — General purpose I/O |
| Broche F7 | RC2 — General purpose I/O |
| Broche F8 | RC3 — General purpose I/O |
| Broche F9 | RC4 — General purpose I/O |
| Broche F10 | RC5 — General purpose I/O |
| Broche G1 | RC6 — General purpose I/O |
| Broche G2 | RC7 — General purpose I/O |
| Broche G3 | RC8 — General purpose I/O |
| Broche G4 | RC9 — General purpose I/O |
| Broche G5 | RC10 — General purpose I/O |
| Broche G6 | RC11 — General purpose I/O |
| Broche G7 | RC12 — General purpose I/O |
| Broche G8 | RC13 — General purpose I/O |
| Broche G9 | OSC1/RC13 — Crystal oscillator input / GPIO |
| Broche G10 | OSC2/RC14 — Crystal oscillator output / GPIO |
| Broche H1 | SOSCI/RPC0 — Secondary oscillator / GPIO |
| Broche H2 | SOSCO/RPC1 — Secondary oscillator / GPIO |
| Broche H3 | RPC2 — General purpose I/O |
| Broche H4 | RPC3 — General purpose I/O |
| Broche H5 | RPC4 — General purpose I/O |
| Broche H6 | RPC5 — General purpose I/O |
| Broche H7 | RPC6 — General purpose I/O |
| Broche H8 | RPC7 — General purpose I/O |
| Broche H9 | RPC8 — General purpose I/O |
| Broche H10 | VDD — Digital 3.3V supply |
| Broche J1 | VSS — Ground reference |
| Broche J2 | RPD0 — General purpose I/O |
| Broche J3 | RPD1 — General purpose I/O |
| Broche J4 | RPD2 — General purpose I/O |
| Broche J5 | RPD3 — General purpose I/O |
| Broche J6 | RPD4 — General purpose I/O |
| Broche J7 | RPD5 — General purpose I/O |
| Broche J8 | RPD6 — General purpose I/O |
| Broche J9 | RPD7 — General purpose I/O |
| Broche J10 | VSS — Ground reference |
| Broche K1 | RPE0 — General purpose I/O |
| Broche K2 | RPE1 — General purpose I/O |
| Broche K3 | RPE2 — General purpose I/O |
| Broche K4 | RPE3 — General purpose I/O |
| Broche K5 | RPE4 — General purpose I/O |
| Broche K6 | RPE5 — General purpose I/O |
| Broche K7 | RPE6 — General purpose I/O |
| Broche K8 | RPE7 — General purpose I/O |
| Broche K9 | RPF0 — General purpose I/O |
| Broche K10 | VDD — Digital 3.3V supply |
Applications typiques
PIC32MZ1024EFF100-E/GJX convient pour 6 applications: Industrial Ethernet Gateway, USB Audio Class Interface, HMI / Graphics Touch Panel, Motor Control / Field-Oriented Control, IoT Edge Sensor Node, Automotive Infotainment Sub-Node.
Industrial Ethernet Gateway
The PIC32MZ1024EFF100-E/GJX is purpose-built for industrial Ethernet gateway designs requiring deterministic real-time communication. Its 200 MHz MIPS32 M-Class core plus integrated 10/100 Ethernet MAC with RMII/MII interface handles protocols like Modbus TCP, EtherNet/IP, and PROFINET RT without external memory. The 1 MB Flash supports dual-image OTA firmware for unattended remote updates, while 256 KB SRAM accommodates full TCP/IP socket buffers plus protocol stacks. The -40C to +125C extended temperature grade meets IEC 60068 industrial environmental requirements for factory floor deployment. Compared to external-MCU-plus-discrete-Ethernet designs, the integrated MAC eliminates the SPI/QSPI bottleneck to external PHYs and reduces BOM count.
Recommandé
USB Audio Class Interface
The PIC32MZ1024EFF100-E/GJX's Hi-Speed USB 2.0 OTG controller plus dual I2S interfaces make it ideal for USB audio class-compliant designs such as USB DACs, USB headphone amplifiers, and USB microphones. The MIPS M-class core with DSP extensions performs sample-rate conversion and mixing at low CPU overhead, while the IEEE 754 FPU accelerates audio DSP algorithms. The HS USB 2.0 controller supports isochronous transfers required for low-latency audio at 24-bit/96 kHz or higher. The 256 KB SRAM holds multi-channel audio buffers without external memory, and the on-chip 12-bit ADC supports microphone input paths. This eliminates the need for a dedicated USB audio bridge chip.
Recommandé
HMI / Graphics Touch Panel
The PIC32MZ1024EFF100-E/GJX drives HMI touch panels via its parallel master port (PMP), which interfaces directly to TFT LCD controllers without external bus mux logic. The 200 MHz core renders UI widgets and decodes JPEG/PNG assets on the fly, while the DMA engine keeps pixel data flowing without CPU intervention. The 256 KB SRAM supports full-screen framebuffers up to QVGA (320x240x16 bpp = 150 KB), and the integrated touch controller interface supports resistive and capacitive panels via I2C/SPI. The -40C to +125C operating range supports industrial HMI panels deployed on factory floors and outdoor kiosks where commercial-grade parts would derate.
Recommandé
Motor Control / Field-Oriented Control
The PIC32MZ1024EFF100-E/GJX's DSP extensions and IEEE 754 FPU make it well suited for sensorless field-oriented control (FOC) of PMSM, BLDC, and AC induction motors. The single-cycle MAC and four 64-bit accumulators execute the Park/Clarke transforms and PI controllers within microseconds, while the 200 MHz core runs the control loop at 20-50 kHz. The 12-bit ADC at 18 MSPS samples three-phase currents simultaneously with PWM-aligned triggering. Six UART, four SPI, and five I2C interfaces connect to encoder feedback, gate drivers, and isolated communication. The on-chip CAN bus enables integration into industrial motor networks.
Recommandé
IoT Edge Sensor Node
The PIC32MZ1024EFF100-E/GJX runs IoT edge sensor nodes that aggregate analog and digital sensor data and forward it via Ethernet, USB, or CAN. Its 200 MHz MIPS M-class core executes on-device analytics (filtering, threshold detection, anomaly scoring) before transmission, reducing cloud bandwidth. The 12-bit ADC at 18 MSPS with up to 40 analog inputs supports multi-sensor arrays, while six UART interfaces handle RS-485 Modbus sensor chains. The 1 MB Flash holds large TCP/IP stacks plus application code, and 256 KB SRAM supports TLS handshake buffers. The -40C to +125C extended temperature grade supports outdoor industrial IoT deployments.
Recommandé
Automotive Infotainment Sub-Node
The PIC32MZ1024EFF100-E/GJX serves automotive infotainment sub-nodes such as HVAC controllers, body control modules, and telematics gateways where the -40C to +125C extended grade is required. The CAN 2.0B controller integrates directly into the vehicle CAN bus without an external transceiver pair (other than the physical transceiver). The Ethernet MAC supports automotive 100BASE-T1 via external PHY for backbone connectivity. The 1 MB Flash holds bootloader plus application plus OTA staging area, while 256 KB SRAM runs automotive middleware stacks. The PIC32MZ EF family is designed to automotive quality standards, but PPAP documentation must be confirmed with Microchip factory for production programs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1024EFF100-E/GJX — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024EFF100-I/GJX | PIC32MZ1024EFE100-E/GJX | PIC32MZ1024EFH100-E/GJX | PIC32MZ1024EFM100-E/GJX | PIC32MZ1024EFF100T-E/GJX |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (7x7) | 100-TFBGA (7x7) - same | 100-TFBGA (7x7) - same | 100-TFBGA (7x7) - same | 100-TFBGA (7x7) - same | 100-TFBGA (7x7) - same |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 256 KB | 256 KB | 256 KB | 512 KB | 512 KB | 256 KB |
| Crypto Engine | No | No | No | Yes (AES/SHA) | Yes (AES/SHA) | No |
| Temperature Grade | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +125C (Extended) |
| Packaging Form | Tray | Tray | Tray | Tray | Tray | Tape & Reel |
Principaux différenciateurs
- Best price/performance ratio without crypto in PIC32MZ EF 100-TFBGA family (vs PIC32MZ1024EFM100-E/GJX)
- Extended -40C to +125C temperature grade for harsh environments (vs PIC32MZ1024EFF100-I/GJX)
- Integrated 10/100 Ethernet plus HS USB 2.0 OTG in single chip (vs PIC32MX795F512L-80I/PF)
Notes de conception
The PIC32MZ1024EFF100-E/GJX requires careful power-decoupling on each VDD/VSS pair due to its 200 MHz switching core. Place one 100 nF ceramic capacitor as close as possible to every VDD pin, plus a 4.7 uF bulk capacitor within 10 mm of the package. Separate analog AVDD/AVSS supplies should be filtered with a ferrite bead and 10 uF + 100 nF decoupling. The on-chip core regulator generates the internal 1.2V from the 3.3V VDD; do not load the VDDCORE pin externally. Estimated: at 200 MHz active and full peripheral use, expect ~150 mA from VDD; budget for 200 mA peak transients.
Although the 100-TFBGA package is small, the -40C to +125C extended temperature grade part must be thermally managed in enclosed enclosures. At full 200 MHz operation with all peripherals active, the device dissipates approximately 0.6 W. The TFBGA 7x7 mm thermal resistance (theta_JA) is approximately 30 C/W on a 4-layer JEDEC test board, giving a 18C temperature rise above ambient. In sealed enclosures with no airflow, derate clock frequency or duty cycle to keep junction below 125C. Avoid placing heat-generating components (LDOs, motor drivers) directly above or below the MCU on the PCB stack.
Common pitfalls with the PIC32MZ EF family include: (1) failing to configure the FDEVOPT/PREFEN bits in the DEVCFG0 fuse to enable Flash prefetch and wait states - without this the MCU cannot run at 200 MHz reliably; (2) forgetting to disable JTAG on unused debug pins (TCK/TDO/TMS/TDI/TRST) to free the pins for general purpose I/O; (3) using the on-chip Ethernet MAC without first enabling the alternate pin function via CFGCON.ETSEL register; (4) configuring USB device mode but leaving the VBUS sense pin floating. Read section 4 (Special Features) of the PIC32MZ EF family datasheet before committing the schematic.
For the 100-TFBGA (7x7 mm) package, use 0.4 mm pitch BGA fanout with via-in-pad or microvia technology. Each signal should fan out on the top layer through a 0.2 mm via, then route on inner layers with 0.1 mm trace/space. Match the impedance of USB differential pair (D+/D-) to 90 ohm differential per USB 2.0 spec; route length-matched within 0.5 mm. For Ethernet RMII, keep the RMII clock trace under 50 mm and matched within 2 mm of the data lines to minimize skew. Place the 24 MHz main crystal within 5 mm of OSC1/OSC2 with a ground guard ring to reduce EMI.
Informations de conformité
RoHS compliant per Microchip product page. The -E/GJX extended temperature grade supports automotive and industrial environments but is not AEC-Q100 qualified - confirm with Microchip factory for production automotive PPAP programs.