PIC32MZ2025DAR169T-V/6J - 200MHz MCU, 2MB Flash, 169-LFBGA | Microchip
N.º da peça: PIC32MZ2025DAR169T-V/6J ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.85 | $168,50 |
| 100 | $14.92 | $1.492,00 |
| 500 | $13.45 | $6.725,00 |
| 1.000 | $12.1 | $12.100,00 |
PIC32MZ2025DAR169T-V/6J Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory, and peripherals. The PIC32MZ DA family belongs to the MIPS32 microAptiv Harvard architecture family within Microchip's broader 32-bit microcontroller portfolio, bridging MCU simplicity with MPU-class performance for graphical human-machine interface (HMI) applications.
Key features of this part include 32 MB or 128 MB of externally addressable DDR2 DRAM interface, an integrated Graphics Controller and Graphics Processor, a 12-bit 18 MSPS ADC module with up to 45 analog inputs, plus CAN, HS USB, and multiple UART/SPI/I2C interfaces. The combination of L1 cache, large SRAM, and DDR2 controller delivers MPU-like throughput while retaining deterministic MCU interrupt behavior.
Typical applications include industrial HMI panels, automotive instrument clusters, graphical touch-screen controllers, IoT gateways with rich UIs, medical patient monitors, and multi-rail power-aware appliances where 2 MB of Flash supports vector graphics assets and DDR2 RAM buffers large framebuffers.
When designing with this MCU, follow the Microchip DDR2 layout guide for the LFBGA escape and allocate adequate decoupling. Provide separate analog and digital supplies and respect the V-temp thermal limits during board-level qualification.
Alternativas drop-in para PIC32MZ2025DAR169T-V/6J — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MZ2025DAR169T-V/6J (mesmo formato e footprint) — diferindo em Operating Temperature, Graphics Controller, USB, ADC, Core Architecture.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MZ2025DAR169-I/6J
✅ Drop-In✓ Em estoque
$13.25 / unidade
Ver ficha técnica →PIC32MZ2025DAR169-V/6J
✅ Drop-In✓ Em estoque
$12.95 / unidade
Ver ficha técnica →PIC32MZ2025DAG169T-I/6J
✅ Drop-In✓ Em estoque
$11.85 / unidade
Ver ficha técnica →PIC32MZ2025DAH169T-I/6J
✅ Drop-In✓ Em estoque
$11.85 / unidade
Ver ficha técnica →PIC32MZ1025DAR169T-I/6J
✅ Drop-In✓ Em estoque
$11.88 / unidade
Ver ficha técnica →PIC32MZ2025DAR169T-V/6J Classificações máximas e características elétricas
| Core Architecture | MIPS32 microAptiv (PIC32MZ DAR) |
| Bit Width | 32-bit |
| Max CPU Clock | 200 MHz |
| Flash Program Memory | 2 MB (2M x 8) |
| SRAM | 640 KB |
| External DRAM Interface | DDR2, up to 32 MB or 128 MB |
| Graphics Controller | Integrated (with Graphics Processor) |
| ADC | 12-bit, up to 18 MSPS |
| Analog Inputs (max) | 45 |
| Encapsulamento | 169-LFBGA (11x11 mm) |
| Temperatura de operação | -40C to +105C (V-temp) |
| Temperature Grade Suffix | -V (V-temp) |
| Packaging Form | Tape & Reel (T suffix) |
| Communication Interfaces | CAN, HS USB, UART, SPI, I2C |
| Status RoHS | Compliant (per Microchip product page) |
Guia de Configuração de Pinos do PIC32MZ2025DAR169T-V/6J 169-lfbga (11x11 mm)
Configuração de pinos para PIC32MZ2025DAR169T-V/6J (pacote 169-lfbga (11x11 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para PIC32MZ2025DAR169T-V/6J.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
PIC32MZ2025DAR169T-V/6J é adequado para 6 aplicaçãos: Industrial HMI Touch Panels, Automotive Instrument Clusters, Medical Patient Monitors, IoT Gateways with Rich UIs, Smart Home Control Panels, Industrial Printer Control Boards.
Industrial HMI Touch Panels
The PIC32MZ2025DAR169T-V/6J is engineered for industrial HMI touch panels: its 200 MHz MIPS32 microAptiv core combined with 2 MB Flash and 640 KB SRAM handles vector graphics and GUI state machines smoothly, while the integrated Graphics Controller and Graphics Processor offload 2D primitives for fluid touch response. The DDR2 controller with up to 128 MB external DRAM buffers full-screen framebuffers for WVGA and higher resolutions. The 12-bit 18 MSPS ADC with up to 45 analog inputs supports analog touch-sensing and front-end measurements, while V-temp -40C to +105C operation tolerates factory-floor and outdoor-enclosure temperatures. CAN and HS USB connectivity enables industrial networking and field-updatable firmware, making this MCU ideal for factory automation HMIs.
Recomendado
Automotive Instrument Clusters
The PIC32MZ2025DAR169T-V/6J's V-temp -40C to +105C grade suits automotive instrument cluster designs running behind the dashboard: the 200 MHz core plus integrated Graphics Controller drive TFT gauges, telltales, and driver-information graphics. The DDR2 interface supports smooth frame composition at high refresh rates, and 2 MB Flash accommodates multilingual fonts, gauge skins, and CAN J1939 stacks. The integrated ADC handles analog sensor inputs such as fuel level and battery voltage. For full AEC-Q100 qualification, designers should select the automotive-grade equivalent from Microchip's PIC32MZ DA family selector. Designers also benefit from the 169-LFBGA's compact 11x11 mm footprint for space-constrained cluster PCBs.
Recomendado
Medical Patient Monitors
The PIC32MZ2025DAR169T-V/6J fits medical patient monitors: the MIPS32 microAptiv core at 200 MHz plus 2 MB Flash runs RTOS plus waveform rendering, and the Graphics Controller handles real-time ECG/SpO2 waveforms. The 12-bit ADC at 18 MSPS captures analog biosignals with up to 45 channels supporting multi-lead ECG front-ends. CAN and HS USB integrate with hospital network gateways and bedside device buses. V-temp grade tolerates clinical-environment thermal variation, and 640 KB SRAM plus external DDR2 buffers waveform histories. According to Microchip, the PIC32MZ DA family also provides IEC 60730 software-test-friendly documentation for safety-critical firmware. The LFBGA-169 footprint suits compact bedside monitor designs.
Recomendado
IoT Gateways with Rich UIs
The PIC32MZ2025DAR169T-V/6J serves IoT gateways with rich UIs: the 200 MHz core plus Graphics Controller renders touch-friendly dashboards, while 2 MB Flash stores OTA firmware images, certificates, and graphical assets. The DDR2 interface with up to 128 MB external DRAM caches web-page rendering and asset libraries. HS USB enables Wi-Fi/BLE module bridging, while CAN and UART support industrial sensor and Modbus buses. According to Microchip, the PIC32MZ DA family supports crypto accelerators and secure-boot flows for hardened IoT deployments. V-temp grade suits outdoor enclosures, and the LFBGA-169 footprint keeps gateway PCBs compact while integrating rich UIs at the edge.
Recomendado
Smart Home Control Panels
The PIC32MZ2025DAR169T-V/6J fits premium smart home control panels: the Graphics Controller renders fluid touch UIs, and 2 MB Flash stores multilingual icon sets and Z-Wave or Matter protocol stacks. The 12-bit ADC plus 45 analog inputs supports ambient light, temperature, and capacitive touch sensing. HS USB bridges to external radios, while CAN and UART link to HVAC and lighting subsystems. According to Microchip, the V-temp grade supports in-wall enclosure thermal rise. The DDR2 controller buffers high-resolution floorplan maps and camera streams, and the LFBGA-169 keeps the panel PCB compact for slim wall-mounted designs.
Recomendado
Industrial Printer Control Boards
The PIC32MZ2025DAR169T-V/6J powers industrial printer control boards: 200 MHz core plus DDR2 buffers print-data pipelines, and the integrated Graphics Controller drives the operator LCD and status UIs. The 2 MB Flash stores fonts, print-job logs, and PostScript/PDF interpreters, while 640 KB SRAM holds active buffers. The 12-bit ADC with up to 45 analog inputs reads print-head temperature sensors and analog encoders. V-temp grade tolerates factory-floor heat. CAN and HS USB enable industrial network integration and field firmware updates. According to Microchip, the DDR2 controller's bandwidth also helps with high-speed raster image processing on label and barcode printers.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MZ2025DAR169T-V/6J — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MZ2025DAR169-I/6J | PIC32MZ2025DAR169-V/6J | PIC32MZ2025DAG169T-I/6J | PIC32MZ2025DAH169T-I/6J | PIC32MZ1025DAR169T-I/6J |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same |
| Operating Temperature | -40C to +105C (V-temp) | -40C to +85C (I-temp) | -40C to +105C (V-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) |
| Flash Memory | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | 1 MB (-50%) |
| Core Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| External DRAM | DDR2 32/128 MB | DDR2 32/128 MB | DDR2 32/128 MB | DDR2 32/128 MB | DDR2 32/128 MB | DDR2 32/128 MB |
| ADC | 12-bit, 18 MSPS, 45 inputs | 12-bit, 18 MSPS, 45 inputs | 12-bit, 18 MSPS, 45 inputs | 12-bit, 18 MSPS, 45 inputs | 12-bit, 18 MSPS, 45 inputs | 12-bit, 18 MSPS, 45 inputs |
| Packaging Form | Tape & Reel | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tape & Reel |
Principais diferenciais
- V-temp grade for industrial HMI clusters (vs PIC32MZ2025DAR169-I/6J)
- 2 MB Flash versus 1 MB Flash variant (vs PIC32MZ1025DAR169T-I/6J)
- Tape & Reel packaging for high-volume SMT (vs PIC32MZ2025DAR169-V/6J)
Notas de projeto
The 169-LFBGA package requires a Microchip-recommended land pattern with via-in-pad or microvia escape for the inner-row balls to route the DDR2 data, address, and clock groups cleanly. Place 100 nF decoupling capacitors on every VDDCORE/VDDIO ball pair within 1 mm of the BGA, and provide a ground plane immediately under the package to control return paths. According to the Microchip PIC32MZ DA family hardware design guide, keep DDR2 trace lengths matched within the datasheet's tolerance window to avoid setup/hold violations at 200 MHz.
Estimated: at 200 MHz with the Graphics Processor active, the 169-LFBGA can dissipate around 1.0-1.5 W depending on DDR2 traffic. Without a thermal pad under the BGA, junction temperature can rise significantly above ambient. Add an LFBGA thermal land array stitched with thermal vias to an inner copper plane, and respect the V-temp -40C to +105C limit during board-level thermal validation.
Do not assume the 169-LFBGA variants across the PIC32MZ DA family are pin-to-pin identical for ALL balls - although the 169-LFBGA footprint is shared, some balls may differ in peripheral assignment between sub-families such as DAH vs DAR. Always re-check the per-ball function map when substituting between DAR/DAG/DAH/DAK in the same 169-LFBGA. According to the PIC32MZ DA family datasheet, ball function differs at several positions between sub-families, so do a full pin-mapping cross-check before committing a new variant to production.
Informações de conformidade
RoHS and REACH compliance stated by Microchip product page. V-temp grade supports industrial to extended-temperature use; AEC-Q100 automotive qualification requires the Q-grade family variant.