RTAX2000SL-1CGS624B - Rad-Tolerant FPGA 2M Gates CCGA624 | Microchip
N.º da peça: RTAX2000SL-1CGS624B ✓ Ativo| Qtd. | Preço unitário | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
RTAX2000SL-1CGS624B Visão geral
A radiation-tolerant FPGA is a programmable logic device engineered to survive the total ionizing dose (TID), single-event latchup (SEL), and single-event upset (SEU) environments of orbital and deep-space flight. Within the power-management hierarchy of a spacecraft avionics stack, the FPGA sits between the onboard computer and mission-specific interface electronics, implementing glue logic, bus interfaces, and payload processing. The RTAX-S/SL family is derived from the commercial Microsemi Axcelerator architecture, adapted for space flight with live-at-power-up operation and a true single-chip form factor.
Key differentiating features include the one-time-programmable antifuse interconnect, which is inherently immune to configuration upsets caused by radiation, embedded SRAM blocks with built-in FIFO control logic, segmentable clocking resources, and chip-wide enabling features. The -1 speed grade and 1.5V core supply support clock rates up to several hundred megahertz in the RTAX-SL family, enabling demanding onboard data processing.
Architecturally, the device combines Core tiles of logic modules (C-cells and R-cells) with embedded SRAM FIFO modules and I/O clusters, all interconnected through the low-skew antifuse routing fabric. Because configuration is hard-wired at programming time, no external configuration PROM or configuration bitstream upload is required at power-up, reducing system parts count and boot risk.
Typical applications include satellite avionics and platform control, payload data processing and compression, spacecraft bus interfacing (MIL-STD-1553, SpaceWire, CAN), launch vehicle flight control electronics, and instrumentation for scientific missions.
A key design consideration is that antifuse FPGAs are one-time programmable: design sign-off must be complete before device programming, so engineers typically prototype on flash-based devices such as Microchip ProASIC3E using Aldec RTAX prototyping adaptors before committing.
This page synthesizes verified distributor data, drop-in same-package alternatives, and practical design guidance not consolidated in the manufacturer datasheet.
Alternativas drop-in para RTAX2000SL-1CGS624B — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com RTAX2000SL-1CGS624B (mesmo formato e footprint) — diferindo em Package, Core Supply Voltage, Embedded Memory, Configuration, Equivalent System Gates.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
RTAX2000SL-CGS624V
✅ Drop-In✓ Em estoque
$6500 / unidade
Ver ficha técnica →RTAX2000SL-CGS624B
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →RTAX250SL-1CG624V
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →RTAX250S-CG624V
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →RTAX250S-1CG624V
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Consulte o preço
Ver ficha técnica →RTAX2000SL-1CGS624B Classificações máximas e características elétricas
| Family | RTAX-S/SL Radiation-Tolerant FPGA |
| Logic Blocks (CLBs) | 21504 |
| Equivalent System Gates | 2000000 |
| ASIC Gates | 250000 |
| Process Technology | 0.15 um CMOS |
| Core Supply Voltage | 1.5 V |
| Speed Grade | -1 |
| Frequência máxima de clock | 649 MHz (family max, Jotrin listing) |
| Programmability | One-Time Programmable (antifuse) |
| Configuration | Live at power-up, single-chip |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Radiation Tolerance | Radiation-tolerant (space-flight qualified family) |
| Encapsulamento | 624-pin Ceramic Column Grid Array (CCGA / CGA-624, ceramic) |
| Tipo de montagem | Surface Mount |
Guia de Configuração de Pinos do RTAX2000SL-1CGS624B 624-pin ceramic column grid array (ccga / cga-624, ceramic)
Configuração de pinos para RTAX2000SL-1CGS624B (pacote 624-pin ceramic column grid array (ccga / cga-624, ceramic)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para RTAX2000SL-1CGS624B.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
RTAX2000SL-1CGS624B é adequado para 6 aplicaçãos: Satellite Platform Avionics, Payload Data Processing, Launch Vehicle Flight Control, SpaceWire and Bus Interface Bridging, Design Prototyping and Emulation, Scientific Instrument Electronics.
Satellite Platform Avionics
The RTAX2000SL-1CGS624B is widely used as the platform controller FPGA in satellite avionics, where its 21,504 CLBs and 2,000,000-gate capacity implement bus controllers, telemetry formatting, and mode management on a single chip. Its antifuse configuration is immune to configuration upsets from heavy ions, and live-at-power-up operation removes external configuration PROMs, cutting board area and boot-failure risk - both critical constraints on spacecraft buses. With a 1.5V core and low static power from the 0.15 um CMOS process, it fits strict spacecraft power budgets. Designers typically close timing at -1 speed grade clock rates suitable for OBC-adjacent logic while reserving I/O for MIL-STD-1553, CAN, and discrete interfaces routed to the CGA-624 package columns.
Recomendado
Payload Data Processing
For imaging and science payloads, the RTAX2000SL-1CGS624B provides onboard data formatting, packetization, and compression preprocessing. Its embedded SRAM blocks with built-in FIFO control logic buffer high-rate sensor streams without external FIFO chips, and the 2M-gate fabric absorbs correlation, filtering, and CCSDS framing logic that would overload smaller RTAX250 devices. The wide CCGA-624 pin count supports wide parallel data buses to ADCs, memories, and downlink modulators. Because the antifuse fabric has no configuration memory to upset, processed data integrity depends only on SEU-mitigated registers (e.g., TMR in RTL), a well-understood mitigation flow for RTAX designers. Estimated: power scales with switching activity, so clock gating in RTL is the primary lever for payload duty-cycle savings.
Recomendado
Launch Vehicle Flight Control
Launch avionics demand deterministic, live-at-power-up logic with high single-event immunity during the radiation-belt transit and ascent phase. The RTAX2000SL-1CGS624B's one-time-programmable antifuse interconnect guarantees the flight configuration cannot be corrupted, meeting the single-chip, no-boot-sequence requirement typical of flight control computers. Its 21,504-CLB capacity accommodates redundant-voting control channels, sensor interface logic, and safety cross-strapping in one device, reducing parts count on flight-critical boards. The ceramic CCGA-624 package offers the mechanical robustness and thermal column array required for high-vibration launch environments. Designers should apply TMR to control registers and verify SEU rates against mission radiation specifications during qualification.
Recomendado
SpaceWire and Bus Interface Bridging
Spacecraft subsystems commonly need bridges between SpaceWire, MIL-STD-1553, CAN, and custom serial links. The RTAX2000SL-1CGS624B implements multi-protocol interface logic in one 2M-gate fabric, using embedded FIFO SRAM for elasticity buffering between clock domains. The generous I/O of the CGA-624 package lets a single device host several independent link interfaces plus discrete command/status lines, replacing multiple smaller interface ASICs and simplifying qualification. RTAX-S/SL I/O supports the signaling standards commonly used in space link electronics; per Microchip documentation, designers should confirm I/O standard support and drive strength per pin in the datasheet I/O section before finalizing schematics. Live-at-power-up ensures link logic is available the moment subsystem power is applied.
Recomendado
Design Prototyping and Emulation
Because RTAX antifuse devices are one-time programmable, every RTAX2000SL-1CGS624B flight program uses reprogrammable prototyping to de-risk RTL before committing hardware. Aldec and Microchip jointly offer RTAX prototyping adaptors that map RTAX-S/SL designs onto flash-based Microchip ProASIC3E FPGAs, allowing iterative simulation-in-hardware, timing exploration, and functional verification with the same design flow. This workflow matters financially: each OTP flight device is expensive and lot-controlled, so catching functional bugs on a flash prototype avoids consuming scarce flight stock. XAIPART recommends reserving RTAX2000SL-1CGS624B units for the final programmed lot and documenting utilization and pin mapping parity between the prototype and flight packages.
Recomendado
Scientific Instrument Electronics
Science instruments on observatories and interplanetary probes use the RTAX2000SL-1CGS624B for detector readout sequencing, histogramming, and instrument state machines. The 0.15 um CMOS process delivers low static power, important for instruments with strict thermal dissipation limits, while the 2M-gate capacity implements on-instrument reduction pipelines that reduce downlink volume. Embedded SRAM FIFOs accumulate detector frames between readouts without external memory parts that would add radiation-sensitive mass. The CCGA-624 ceramic package tolerates the thermal cycling of eclipse orbits. Missions should derate TID and SEE specifications to their orbit and apply scrubbing-free design techniques appropriate to OTP fabric, then verify single-event effects against the mission's radiation design margin requirements.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para RTAX2000SL-1CGS624B — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | RTAX2000SL-CGS624V | RTAX2000SL-CGS624B | RTAX250SL-1CG624V | RTAX250S-CG624V | RTAX250S-1CG624V |
|---|---|---|---|---|---|---|
| Package | CCGA-624 (ceramic) | CCGA-624 - same | CCGA-624 - same | CCGA-624 - same | CCGA-624 - same | CCGA-624 - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent System Gates | 2,000,000 (+250,000 ASIC gates) | 2,000,000 | 2,000,000 | ~250,000 (RTAX250 class) | ~250,000 (RTAX250 class) | ~250,000 (RTAX250 class) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Programmability | OTP antifuse, live at power-up | OTP antifuse | OTP antifuse | OTP antifuse | OTP antifuse | OTP antifuse |
Principais diferenciais
- Full 2M-gate density on the 624-pin footprint (vs RTAX250SL-1CG624V)
- SEU-immune configuration fabric (vs SRAM-based space FPGAs (e.g., AMD/Xilinx space series))
- Faster speed grade availability (vs RTAX250S-CG624V)
Notas de projeto
RTAX devices are one-time programmable: the bitstream is burned into antifuses and cannot be revised. Complete timing simulation, SEU-mitigation review (TMR on control and status registers), and a formal design freeze before submitting devices for programming. Industry practice per Aldec/Microchip prototyping guidance is to verify the design on a flash-based ProASIC3E prototype first; budget prototype iterations and keep pin mapping consistent between prototype and flight CCGA-624 designs.
The CCGA-624 ceramic column grid array requires deliberate land-pattern and reflow planning: ceramic columns have different coplanarity behavior than plastic BGAs, and column arrays are more sensitive to board flex. Follow the package mechanical drawing in the Microchip RTAX-S/SL datasheet (DS2169) for land pattern and keepout dimensions. Support the board during column solder inspection (X-ray recommended) and avoid localized board warping near the device during card integration.
Estimated: supply budgeting should combine the 1.5V core rail with the specified I/O rail voltages from the DS2169 datasheet, scaling core current with switching activity and utilization on the 21,504-CLB fabric. Use the Microchip Libero power estimator with post-layout activity data, then apply mission derating. Add local bulk and 0.1 uF decoupling per power rail group at the CCGA-624 ball clusters; the low static power of the 0.15 um CMOS process helps, but payload-mode activity spikes still dominate the budget.
With hundreds of I/O available on the CGA-624 package, group wide parallel buses by return-path plane assignment and maintain controlled impedance for SpaceWire and other high-speed links. Because RTAX I/O standards and drive strengths vary by bank, confirm per-pin electrical specifications in the datasheet I/O section before schematic capture, and add series termination on long board-level routes rather than relying on FPGA internal termination options.
Informações de conformidade
Space-flight device family referenced in the Microchip DLA Cross Reference Guide; DLA drawing coverage and screening flow (per Mil Prf 38535 class Q/V context in that guide) must be confirmed per order code. RoHS/REACH status not stated in verified data - ceramic CCGA space parts are frequently exempt.
