RTAX2000SL-CGS624V - 2M-Gate Rad-Tolerant FPGA | Microchip
MPN: RTAX2000SL-CGS624V ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8950 | $8,950.00 |
| 10 | $8500 | $85,000.00 |
| 100 | $7900 | $790,000.00 |
| 500 | $7200 | $3,600,000.00 |
| 1,000 | $6500 | $6,500,000.00 |
Drop-in alternatives for RTAX2000SL-CGS624V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
RTAX2000S-CGS624V
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
RTAX2000SL-1CGS624V
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
RTAX2000SL-CGS624
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
RTAX250SL-1CG624V
✅ Drop-In✓ In Stock
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View Datasheet →RTAX250S-CG624V
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View Datasheet →RTAX2000SL-CGS624V Maximum Ratings & Electrical Characteristics
| Equivalent System Gates | 2000000 |
| Logic Cells (CLBs) | 21504 |
| Technology | CMOS antifuse (nonvolatile) |
| User I/Os (maximum) | 684 |
| Embedded Memory | 540 kbits with optional EDAC protection |
| Total Ionizing Dose (TID) | 300 krad (Si) functional / 200 krad (Si) parametric |
| Single-Event Upset Rate | Less than 1E-10 errors per bit-day |
| Configuration | One-time programmable antifuse, live at power-up |
| Embedded SRAM Features | Built-in FIFO control logic |
| Clock Architecture | Segmentable clock structures |
| Routing | Chip-wide highway routing, carry logic |
| Package | CG624 ceramic package |
| Family | RTAX-S/SL Radiation-Tolerant FPGA |
| Application Domain | Space-flight systems |
RTAX2000SL-CGS624V cg624 ceramic package Pin Configuration Guide
Complete pinout information for RTAX2000SL-CGS624V (cg624 ceramic package package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX2000SL-CGS624V.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX2000SL-CGS624V is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Bus Controller Logic, Telemetry, Tracking and Command (TT&C), Scientific Instrument Interfaces, Radiation-Hardened ASIC Alternative / Prototyping, Deep-Space Mission Electronics.
Satellite Payload Data Processing
The RTAX2000SL-CGS624V fits payload processing chains that must move high-rate sensor or communications data through deterministic logic. With 2,000,000 gates and 21,504 CLBs, the device implements wide datapaths, channelizers, and framing engines, while 540 kbits of embedded SRAM with optional EDAC buffers data and protects against single-event upsets - essential at orbital altitudes where SEU rates dominate error budgets. Its antifuse fabric is live at power-up, so payload logic is operational immediately after spacecraft power application without external configuration memory, a reliability benefit over SRAM FPGAs. Placed downstream of ADCs or receivers, the SL low-static-power fabric keeps the payload power budget within typical spacecraft allocations, and the CG624 ceramic package provides the mechanical robustness required for launch vibration environments.
Recommended
Spacecraft Bus Controller Logic
Spacecraft bus functions - command and data handling, mode control, and interface bridging between processors and peripherals - benefit from the RTAX2000SL-CGS624V's live-at-power-up behavior. Because the antifuse configuration is nonvolatile, bus controller logic executes the instant power arrives, enabling safe recovery and housekeeping before a software processor boots. The 684 available user I/Os bridge legacy bus standards (MIL-STD-1553, SpaceWire, UART, SPI) through external transceivers, and the chip-wide highway routing supports clean clock and control distribution. Radiation performance of 300 krad functional TID covers most LEO and GEO missions, while SEU immunity below 1E-10 errors per bit-day keeps control-plane error rates negligible without heavy external mitigation logic.
Recommended
Telemetry, Tracking and Command (TT&C)
TT&C subsystems demand extreme reliability because they are the operator's only link to the spacecraft. The RTAX2000SL-CGS624V implements telecommand decoders, telemetry formatters, and watchdog/safing logic in 2M gates of hardened antifuse fabric with SEU rates below 1E-10 errors per bit-day, minimizing command-corruption risk. Embedded FIFOs with built-in control logic queue telemetry frames efficiently between the encoder and downlink modulator. The SL variant's reduced static power matters because TT&C logic runs continuously across eclipses when solar input is unavailable. The CG624 ceramic package and Microchip's space screening flows support the traceability and lot-control documentation that launch authorities and insurers typically require for command-chain electronics.
Recommended
Scientific Instrument Interfaces
Scientific payloads - imagers, spectrometers, particle detectors - generate data with strict timing and noise requirements. The RTAX2000SL-CGS624V provides 21,504 CLBs of deterministic fabric for trigger logic, timing generators, and high-speed serial or parallel instrument front ends, while carry-logic chains accelerate detection algorithms. The 540 kbit embedded SRAM with optional EDAC serves as safe on-instrument buffering, and segmentable clock trees let designers isolate noisy timing domains from sensitive analog-adjacent logic. Because antifuse programming is permanent and single-chip, instrument electronics avoid configuration-memory single-event functional interrupts, improving observation uptime. The 300 krad functional TID rating covers typical Earth-observation and interplanetary science missions with standard margin.
Recommended
Radiation-Hardened ASIC Alternative / Prototyping
Programs that would traditionally commit to a radiation-hardened ASIC can use the RTAX2000SL-CGS624V to avoid mask NRE, long ASIC foundry queues, and minimum-order commitments. Microchip explicitly positions RTAX-S/SL devices as an alternative to radiation-hardened ASICs, and at 2,000,000 gates the device absorbs mid-scale SoC glue logic, bus bridges, and datapath functions. For workflow, teams develop in Libero SoC and validate on flash-based ProASIC3E silicon using the Aldec RTAX prototyping adaptor, then program the one-time-programmable antifuses only after full verification - eliminating the ASIC tape-out gamble. Unit cost is higher than ASIC at high volume, but for the low quantities typical of space missions (tens of units), the FPGA route is decisively cheaper and faster.
Recommended
Deep-Space Mission Electronics
For missions beyond Earth orbit, electronics face higher radiation doses and no repair opportunity. The RTAX2000SL-CGS624V's 300 krad (functional) total dose rating and sub-1E-10 errors/bit-day SEU rate provide the foundational hardness budget for deep-space avionics, while the SL low-static-power fabric reduces the constant drain that dominates probe power budgets during cruise phases. Its nonvolatile antifuse configuration cannot suffer configuration-memory upsets, a known failure mode of SRAM FPGAs in high-flux environments, eliminating scrubber dependencies for the configured fabric. Designers should still apply triple-module redundancy and EDAC on critical state in HDL, and verify SEE performance (SET on I/O, SEL susceptibility) against mission-specific particle spectra as recommended in Microchip's RTAX reliability application literature.
Recommended
Recommended Products Summary
Engineering reference data for RTAX2000SL-CGS624V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX2000S-CGS624V | RTAX2000SL-1CGS624V | RTAX250SL-1CG624V |
|---|---|---|---|---|
| Package | CG624 ceramic | CG624 ceramic - same | CG624 ceramic - same | CG624 ceramic - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent System Gates | 2000000 | 2000000 | 2000000 | [DATA_NEEDED] ~250000 |
| Logic Cells (CLBs) | 21504 | 21504 | 21504 | [DATA_NEEDED] |
| Total Ionizing Dose | 300 krad functional / 200 krad parametric | 300 krad functional / 200 krad parametric | 300 krad functional / 200 krad parametric | 300 krad functional / 200 krad parametric |
| SEU Immunity | <1E-10 errors per bit-day | <1E-10 errors per bit-day | <1E-10 errors per bit-day | <1E-10 errors per bit-day |
| Speed Grade | Standard (base grade) | Standard | -1 (faster) | -1 (faster, smaller die) |
| Static Power Profile | SL (low static power) | Standard (higher static) | SL (low static power) | SL (low static power, smaller die) |
Key Differentiators
- 2M-gate density in the CG624 footprint (vs RTAX250SL-1CG624V)
- Low static power SL fabric (vs RTAX2000S-CGS624V)
- Live-at-power-up antifuse configuration (vs SRAM-based space FPGAs (cross-brand))
Design Notes
The RTAX2000SL is one-time programmable: antifuses cannot be re-blown after flight programming. Adopt a strict workflow - design in Libero SoC, simulate with certified models, prototype on flash-based ProASIC3E silicon via the Aldec RTAX prototyping adaptor, and only then commit flight units. Budget for at least one engineering-lot cycle before flight lot programming, and never program flight parts from an unverified bitstream.
The SL variant was chosen specifically to cut static power versus the RTAX2000S, which dominates total power in space systems where duty cycles are low. Estimate: verify static current at your worst-case junction temperature from the datasheet tables, since static power rises with temperature; then add dynamic power from Libero SmartPower analysis. Do not rely on room-temperature typical values for eclipse-phase power budgets.
Use triple-module redundancy (TMR) on state registers and implement EDAC on embedded SRAM blocks even though the fabric SEU rate is below 1E-10 errors per bit-day - rare events still accumulate over multi-year missions. Follow Microchip's RTAX reliability application guidance for SET mitigation on I/O, and decouple all I/O banks with ceramic capacitors placed close to the CG624 ball field to control ground bounce during simultaneous switching.
Compliance Information
Space-grade ceramic-packaged device; compliance declarations must be obtained via manufacturer certificate of conformance for the specific flight lot. Related Microchip FPGA parts are qualified per Mil-Prf-38535 (QML class Q/V) per the Microchip DLA Cross Reference Guide; lot-specific qualification data should be requested at quotation.
