RTAX2000SL-1CGS624B - Rad-Tolerant FPGA 2M Gates CCGA624 | Microchip
Référence : RTAX2000SL-1CGS624B ✓ Actif| Qté | Prix unitaire | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
RTAX2000SL-1CGS624B Présentation
A radiation-tolerant FPGA is a programmable logic device engineered to survive the total ionizing dose (TID), single-event latchup (SEL), and single-event upset (SEU) environments of orbital and deep-space flight. Within the power-management hierarchy of a spacecraft avionics stack, the FPGA sits between the onboard computer and mission-specific interface electronics, implementing glue logic, bus interfaces, and payload processing. The RTAX-S/SL family is derived from the commercial Microsemi Axcelerator architecture, adapted for space flight with live-at-power-up operation and a true single-chip form factor.
Key differentiating features include the one-time-programmable antifuse interconnect, which is inherently immune to configuration upsets caused by radiation, embedded SRAM blocks with built-in FIFO control logic, segmentable clocking resources, and chip-wide enabling features. The -1 speed grade and 1.5V core supply support clock rates up to several hundred megahertz in the RTAX-SL family, enabling demanding onboard data processing.
Architecturally, the device combines Core tiles of logic modules (C-cells and R-cells) with embedded SRAM FIFO modules and I/O clusters, all interconnected through the low-skew antifuse routing fabric. Because configuration is hard-wired at programming time, no external configuration PROM or configuration bitstream upload is required at power-up, reducing system parts count and boot risk.
Typical applications include satellite avionics and platform control, payload data processing and compression, spacecraft bus interfacing (MIL-STD-1553, SpaceWire, CAN), launch vehicle flight control electronics, and instrumentation for scientific missions.
A key design consideration is that antifuse FPGAs are one-time programmable: design sign-off must be complete before device programming, so engineers typically prototype on flash-based devices such as Microchip ProASIC3E using Aldec RTAX prototyping adaptors before committing.
This page synthesizes verified distributor data, drop-in same-package alternatives, and practical design guidance not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour RTAX2000SL-1CGS624B — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec RTAX2000SL-1CGS624B (même facteur de forme et même empreinte) — différant par Package, Core Supply Voltage, Embedded Memory, Configuration, Equivalent System Gates.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
RTAX2000SL-CGS624V
✅ Remplacement direct✓ En stock
$6500 / unité
Voir la fiche technique →RTAX2000SL-CGS624B
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Voir la fiche technique →RTAX250SL-1CG624V
✅ Remplacement direct✓ En stock
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Voir la fiche technique →RTAX250S-CG624V
✅ Remplacement direct✓ En stock
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Voir la fiche technique →RTAX250S-1CG624V
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Voir la fiche technique →RTAX2000SL-1CGS624B Valeurs maximales et caractéristiques électriques
| Family | RTAX-S/SL Radiation-Tolerant FPGA |
| Logic Blocks (CLBs) | 21504 |
| Equivalent System Gates | 2000000 |
| ASIC Gates | 250000 |
| Process Technology | 0.15 um CMOS |
| Core Supply Voltage | 1.5 V |
| Speed Grade | -1 |
| Fréquence d'horloge maximale | 649 MHz (family max, Jotrin listing) |
| Programmability | One-Time Programmable (antifuse) |
| Configuration | Live at power-up, single-chip |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Radiation Tolerance | Radiation-tolerant (space-flight qualified family) |
| Boîtier | 624-pin Ceramic Column Grid Array (CCGA / CGA-624, ceramic) |
| Type de montage | Surface Mount |
Guide de configuration des broches du RTAX2000SL-1CGS624B 624-pin ceramic column grid array (ccga / cga-624, ceramic)
Configuration des broches du RTAX2000SL-1CGS624B (boîtier 624-pin ceramic column grid array (ccga / cga-624, ceramic)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour RTAX2000SL-1CGS624B.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
RTAX2000SL-1CGS624B convient pour 6 applications: Satellite Platform Avionics, Payload Data Processing, Launch Vehicle Flight Control, SpaceWire and Bus Interface Bridging, Design Prototyping and Emulation, Scientific Instrument Electronics.
Satellite Platform Avionics
The RTAX2000SL-1CGS624B is widely used as the platform controller FPGA in satellite avionics, where its 21,504 CLBs and 2,000,000-gate capacity implement bus controllers, telemetry formatting, and mode management on a single chip. Its antifuse configuration is immune to configuration upsets from heavy ions, and live-at-power-up operation removes external configuration PROMs, cutting board area and boot-failure risk - both critical constraints on spacecraft buses. With a 1.5V core and low static power from the 0.15 um CMOS process, it fits strict spacecraft power budgets. Designers typically close timing at -1 speed grade clock rates suitable for OBC-adjacent logic while reserving I/O for MIL-STD-1553, CAN, and discrete interfaces routed to the CGA-624 package columns.
Recommandé
Payload Data Processing
For imaging and science payloads, the RTAX2000SL-1CGS624B provides onboard data formatting, packetization, and compression preprocessing. Its embedded SRAM blocks with built-in FIFO control logic buffer high-rate sensor streams without external FIFO chips, and the 2M-gate fabric absorbs correlation, filtering, and CCSDS framing logic that would overload smaller RTAX250 devices. The wide CCGA-624 pin count supports wide parallel data buses to ADCs, memories, and downlink modulators. Because the antifuse fabric has no configuration memory to upset, processed data integrity depends only on SEU-mitigated registers (e.g., TMR in RTL), a well-understood mitigation flow for RTAX designers. Estimated: power scales with switching activity, so clock gating in RTL is the primary lever for payload duty-cycle savings.
Recommandé
Launch Vehicle Flight Control
Launch avionics demand deterministic, live-at-power-up logic with high single-event immunity during the radiation-belt transit and ascent phase. The RTAX2000SL-1CGS624B's one-time-programmable antifuse interconnect guarantees the flight configuration cannot be corrupted, meeting the single-chip, no-boot-sequence requirement typical of flight control computers. Its 21,504-CLB capacity accommodates redundant-voting control channels, sensor interface logic, and safety cross-strapping in one device, reducing parts count on flight-critical boards. The ceramic CCGA-624 package offers the mechanical robustness and thermal column array required for high-vibration launch environments. Designers should apply TMR to control registers and verify SEU rates against mission radiation specifications during qualification.
Recommandé
SpaceWire and Bus Interface Bridging
Spacecraft subsystems commonly need bridges between SpaceWire, MIL-STD-1553, CAN, and custom serial links. The RTAX2000SL-1CGS624B implements multi-protocol interface logic in one 2M-gate fabric, using embedded FIFO SRAM for elasticity buffering between clock domains. The generous I/O of the CGA-624 package lets a single device host several independent link interfaces plus discrete command/status lines, replacing multiple smaller interface ASICs and simplifying qualification. RTAX-S/SL I/O supports the signaling standards commonly used in space link electronics; per Microchip documentation, designers should confirm I/O standard support and drive strength per pin in the datasheet I/O section before finalizing schematics. Live-at-power-up ensures link logic is available the moment subsystem power is applied.
Recommandé
Design Prototyping and Emulation
Because RTAX antifuse devices are one-time programmable, every RTAX2000SL-1CGS624B flight program uses reprogrammable prototyping to de-risk RTL before committing hardware. Aldec and Microchip jointly offer RTAX prototyping adaptors that map RTAX-S/SL designs onto flash-based Microchip ProASIC3E FPGAs, allowing iterative simulation-in-hardware, timing exploration, and functional verification with the same design flow. This workflow matters financially: each OTP flight device is expensive and lot-controlled, so catching functional bugs on a flash prototype avoids consuming scarce flight stock. XAIPART recommends reserving RTAX2000SL-1CGS624B units for the final programmed lot and documenting utilization and pin mapping parity between the prototype and flight packages.
Recommandé
Scientific Instrument Electronics
Science instruments on observatories and interplanetary probes use the RTAX2000SL-1CGS624B for detector readout sequencing, histogramming, and instrument state machines. The 0.15 um CMOS process delivers low static power, important for instruments with strict thermal dissipation limits, while the 2M-gate capacity implements on-instrument reduction pipelines that reduce downlink volume. Embedded SRAM FIFOs accumulate detector frames between readouts without external memory parts that would add radiation-sensitive mass. The CCGA-624 ceramic package tolerates the thermal cycling of eclipse orbits. Missions should derate TID and SEE specifications to their orbit and apply scrubbing-free design techniques appropriate to OTP fabric, then verify single-event effects against the mission's radiation design margin requirements.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour RTAX2000SL-1CGS624B — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | RTAX2000SL-CGS624V | RTAX2000SL-CGS624B | RTAX250SL-1CG624V | RTAX250S-CG624V | RTAX250S-1CG624V |
|---|---|---|---|---|---|---|
| Package | CCGA-624 (ceramic) | CCGA-624 - same | CCGA-624 - same | CCGA-624 - same | CCGA-624 - same | CCGA-624 - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent System Gates | 2,000,000 (+250,000 ASIC gates) | 2,000,000 | 2,000,000 | ~250,000 (RTAX250 class) | ~250,000 (RTAX250 class) | ~250,000 (RTAX250 class) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Programmability | OTP antifuse, live at power-up | OTP antifuse | OTP antifuse | OTP antifuse | OTP antifuse | OTP antifuse |
Principaux différenciateurs
- Full 2M-gate density on the 624-pin footprint (vs RTAX250SL-1CG624V)
- SEU-immune configuration fabric (vs SRAM-based space FPGAs (e.g., AMD/Xilinx space series))
- Faster speed grade availability (vs RTAX250S-CG624V)
Notes de conception
RTAX devices are one-time programmable: the bitstream is burned into antifuses and cannot be revised. Complete timing simulation, SEU-mitigation review (TMR on control and status registers), and a formal design freeze before submitting devices for programming. Industry practice per Aldec/Microchip prototyping guidance is to verify the design on a flash-based ProASIC3E prototype first; budget prototype iterations and keep pin mapping consistent between prototype and flight CCGA-624 designs.
The CCGA-624 ceramic column grid array requires deliberate land-pattern and reflow planning: ceramic columns have different coplanarity behavior than plastic BGAs, and column arrays are more sensitive to board flex. Follow the package mechanical drawing in the Microchip RTAX-S/SL datasheet (DS2169) for land pattern and keepout dimensions. Support the board during column solder inspection (X-ray recommended) and avoid localized board warping near the device during card integration.
Estimated: supply budgeting should combine the 1.5V core rail with the specified I/O rail voltages from the DS2169 datasheet, scaling core current with switching activity and utilization on the 21,504-CLB fabric. Use the Microchip Libero power estimator with post-layout activity data, then apply mission derating. Add local bulk and 0.1 uF decoupling per power rail group at the CCGA-624 ball clusters; the low static power of the 0.15 um CMOS process helps, but payload-mode activity spikes still dominate the budget.
With hundreds of I/O available on the CGA-624 package, group wide parallel buses by return-path plane assignment and maintain controlled impedance for SpaceWire and other high-speed links. Because RTAX I/O standards and drive strengths vary by bank, confirm per-pin electrical specifications in the datasheet I/O section before schematic capture, and add series termination on long board-level routes rather than relying on FPGA internal termination options.
Informations de conformité
Space-flight device family referenced in the Microchip DLA Cross Reference Guide; DLA drawing coverage and screening flow (per Mil Prf 38535 class Q/V context in that guide) must be confirmed per order code. RoHS/REACH status not stated in verified data - ceramic CCGA space parts are frequently exempt.
