Microchip Technology

RTAX250S-CG624V - 250K-Gate Rad-Tolerant FPGA | Microchip

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1.5 V nominal Vdss 624-pin Ceramic Column Grid Array (CCGA) Package 649 MHz Speed Embedded SRAM with built-in FIFO control logic Memory
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Drop-in alternatives for RTAX250S-CG624V β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

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RTAX250S-1CG624V

βœ… Drop-In
πŸ“¦ 624-pin CCGA (CG624)
faster -1 speed grade of same die, identical footprint and pinout

πŸ“‹ Reference alternative (not in catalog)

RTAX250SL-CG624V

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πŸ“¦ 624-pin CCGA (CG624)
SL process variant, same CG624 footprint and 250K gate density

πŸ“‹ Reference alternative (not in catalog)

RTAX250SL-1CG624V

βœ… Drop-In
Microchip Technology
πŸ“¦ 624-pin CCGA (CG624)
RTAX-S/SL Radiation-Tolerant FPGA Β· 250000 gates Β· 4224 Β· 2816 Β· 248 Β· 248 Β· 1.425 V to 1.575 V Β· CMOS, antifuse

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RTAX250S-LG624V

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πŸ“¦ 624-pin CCGA footprint (LG624 package variant)
LGA instead of column interconnect, same 624-terminal footprint, same 250K-gate die

πŸ“‹ Reference alternative (not in catalog)

RTAX250S-1LG624V

βœ… Drop-In
πŸ“¦ 624-pin CCGA footprint (LG624 package variant)
LGA variant with -1 speed grade, same 624-terminal footprint

πŸ“‹ Reference alternative (not in catalog)

RTAX250SL-1CG624V

βœ… Drop-In
Microchip Technology
πŸ“¦ 624-pin CCGA (CG624)
RTAX-S/SL Radiation-Tolerant FPGA Β· 250000 gates Β· 4224 Β· 2816 Β· 248 Β· 248 Β· 1.425 V to 1.575 V Β· CMOS, antifuse

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RTAX250S-CG624V Maximum Ratings & Electrical Characteristics

Family RTAX-S Radiation-Tolerant FPGA
Equivalent System Gates 250000
Configurable Logic Blocks (CLBs) 2816
Logic Cells 4224
Maximum System Frequency 649 MHz
Process Technology 0.15 um CMOS
Core Supply Voltage 1.5 V nominal
User I/O 248
Package 624-pin Ceramic Column Grid Array (CCGA)
Operating Temperature -55C to +125C
Programming Technology Antifuse (live at power-up)
SEU Immunity SEU-hardened registers, immune to single-event upsets
Embedded Memory Embedded SRAM with built-in FIFO control logic
Special Routing Segmentable clocks, chip-wide highway routing, carry logic
Mounting Type Surface Mount
Target Application Space-flight systems

RTAX250S-CG624V 624-pin ceramic column grid array (ccga) Pin Configuration Guide

Complete pinout information for RTAX250S-CG624V (624-pin ceramic column grid array (ccga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

624-pin ceramic column grid array (ccga) package pinout diagram for RTAX250S-CG624V

No detailed pinout data available for RTAX250S-CG624V.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for RTAX250S-CG624V Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

RTAX250S-CG624V is suitable for 6 applications: Satellite Command and Data Handling, Payload Data Processing, Telemetry Encoder and Downlink Formatting, Radiation-Tolerant Glue Logic Consolidation, Spacecraft Bus Controller / Interface Bridge, Launch Vehicle and Avionics Support Electronics.

✈️

Satellite Command and Data Handling

The RTAX250S-CG624V fits spacecraft command and data handling (CDH) units where 250K system gates cover telemetry formatting, telecommand decoding, and bus protocol bridging. Its SEU-hardened registers provide flip-flop immunity to single-event upsets without mandatory triple module redundancy, reducing design overhead, while live-at-power-up antifuse configuration removes the external configuration memory that is itself an SEU failure point in SRAM FPGAs. In a typical CDH board the device sits between the onboard computer and the spacecraft bus interface, running at moderate clock rates where the 1.5 V core keeps power within the spacecraft power budget, and the 624-pin CCGA withstands launch vibration and on-orbit thermal cycling.

✈️

Payload Data Processing

For instrument payload processing on Earth-observation and science satellites, the RTAX250S-CG624V implements front-end data formatting, FIFO buffering, and compression pre-processing. Embedded SRAM blocks with built-in FIFO control logic handle sensor data stream buffering without external memory, and dedicated carry logic accelerates checksum and filter arithmetic. The 649 MHz performance capability gives headroom for parallel processing channels, while 248 user I/O accommodate high-width sensor interfaces. Designers typically prototype on footprint-compatible adaptors with ProASIC3/A3PE3000 devices, then migrate the verified netlist to the RTAX-S flight unit, minimizing radiation-part risk during algorithm development and shortening overall program schedules.

🌐

Telemetry Encoder and Downlink Formatting

The RTAX250S-CG624V serves as a telemetry encoder, implementing CCSDS-class framing, scrambling, and channel coding functions within its 2816 CLB fabric. Its segmentable clock resources let designers run the coding pipeline and the downlink interface from independent clock domains, and chip-wide highway routing keeps high-fanout control signals timing-clean across the die. Because the antifuse fabric is radiation-tolerant by construction and registers are SEU hardened, the encoder maintains data integrity in proton and heavy-ion environments where SRAM-based FPGAs would require continuous scrubbing. The 1.5 V nominal supply keeps encoder power low, preserving link budget margin for the transmitter chain on power-limited small satellites.

🧩

Radiation-Tolerant Glue Logic Consolidation

Space programs traditionally used multiple rad-hard ASICs or SSI/MSI logic for address decoding, bus interfacing, and control; the RTAX250S-CG624V consolidates these functions into one programmable device, cutting board area, mass, and assembly cost. Its 250K gate capacity absorbs dozens of legacy MSI functions, and design changes late in the program are handled by reprogramming rather than respinning an ASIC - critical when launch dates are fixed. The ceramic CCGA package offers proven hermeticity and column interconnect reliability, and operation from -55C to +125C covers the full qualification envelope of typical spacecraft internal environments, including eclipse-induced thermal swings on unheated boards.

🏭

Spacecraft Bus Controller / Interface Bridge

As a bus controller or interface bridge, the RTAX250S-CG624V connects spacecraft subsystems across MIL-STD-1553-adjacent, CAN-like, or custom serial buses, translating protocols and arbitrating access. The 248 user I/O support wide parallel interfaces to legacy rad-hard processors, and the antifuse fabric's live-at-power-up behavior means the bridge is operational immediately at spacecraft power application - an advantage during AIT (assembly, integration and test) when SRAM FPGAs must first be configured. Designers exploit the embedded FIFO logic to decouple bus timing from processor timing, and the SEU-hardened registers keep arbitration state machines operational through single-event upset events without system resets.

✈️

Launch Vehicle and Avionics Support Electronics

In launch vehicle avionics support roles - sequencers, health-monitoring concentrators, and safe-and-arm interface logic - the RTAX250S-CG624V offers deterministic antifuse fabric with no configuration latency and robust single-chip integration. The -55C to +125C operating range and ceramic CCGA packaging tolerate the harsh thermal and mechanical environment of boost phase, while SEU-hardened registers address the elevated radiation exposure at higher altitudes. With 2816 CLBs and dedicated carry logic, designers implement time-critical sequencing and redundancy voting circuits in a single device, replacing multi-chip rad-hard logic families and improving mean-time-between-failure estimates for mission-critical flight control support functions.

Recommended Products Summary

RTAX250S-1CG624V Faster speed-grade drop-in for timing-critical CDH designs Used in: Satellite Command and Data Handling, Telemetry Encoder and Downlink Formatting, Radiation-Tolerant Glue Logic Consolidation, Spacecraft Bus Controller / Interface Bridge, Launch Vehicle and Avionics Support Electronics RTAX250SL-CG624V SL process variant, same footprint Used in: Satellite Command and Data Handling, Radiation-Tolerant Glue Logic Consolidation A3PE3000L-FG324 Microsemi Used in: Payload Data Processing RTAX250SL-1CG624V Microchip Technology Used in: Payload Data Processing, Spacecraft Bus Controller / Interface Bridge RTAX4000S-1CQ352V Microchip Technology Used in: Telemetry Encoder and Downlink Formatting RTAX250S-LG624V LGA footprint variant option Used in: Launch Vehicle and Avionics Support Electronics
What is the RTAX250S-CG624V?
The RTAX250S-CG624V is a radiation-tolerant FPGA from Microchip Technology (formerly Actel/Microsemi) in the RTAX-S family, offering 250,000 equivalent system gates, 2816 configurable logic blocks (4224 logic cells), and 248 user I/O in a 624-pin ceramic column grid array (CCGA) package. It operates from -55C to +125C on a 1.5 V nominal core supply and uses SEU-hardened antifuse fabric designed for space-flight systems such as satellites and planetary probes.
What are the key specifications of RTAX250S-CG624V that engineers should know?
Key specifications: 250K equivalent system gates, 2816 CLBs / 4224 logic cells, up to 649 MHz system performance, 0.15 um CMOS process, 1.5 V nominal core voltage, 248 user I/O, and a 624-terminal CCGA package rated for -55C to +125C. According to the Microchip RTAX-S/SL datasheet, the device features SEU-hardened registers, embedded SRAM with FIFO control, segmentable clocks, and live-at-power-up antifuse configuration for space applications.
Where can I download the RTAX250S-CG624V datasheet PDF?
The RTAX250S-CG624V is documented in the 'RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs Datasheet' available from Microchip's official website at ww1.microchip.com (document rtaxs_ds2169). This datasheet covers features, ordering information, package options, and electrical specifications for the full RTAX-S/SL family, including the CG624 package variant. Always use the official Microchip source rather than third-party mirrors to ensure you have the latest revision.
What is the price of RTAX250S-CG624V?
The RTAX250S-CG624V is a space-grade component that is typically sold on a quotation basis rather than through standard tiered distributor pricing, as of 2026-09-01. Pricing depends on screening level (standard vs. flight lot), quantity, and delivery terms. Contact space-qualified distributors such as Microchip USA or request a quote through XAIPART for current pricing; published catalog pricing is generally not available for radiation-tolerant RTAX-S devices.
Is RTAX250S-CG624V in stock and what is the lead time?
Stock for RTAX250S-CG624V is limited and varies by distributor, as of 2026-09-01. Space-grade FPGAs in ceramic CCGA packages are frequently built to order, with lead times that can extend to several months depending on screening and lot acceptance requirements. Check current availability at specialized distributors like Microchip USA or request a quote; planning procurements early is strongly recommended for flight programs with fixed launch schedules.
Where to buy RTAX250S-CG624V online?
You can buy RTAX250S-CG624V from space-qualified component distributors such as Microchip USA, Jotrin Electronics, and VEKEMO, or request a quote directly through XAIPART as of 2026-09-01. This part is generally not stocked at broadline distributors like DigiKey or Mouser because it targets space-flight programs requiring traceability and screening documentation. Verify the screening level and date codes with the supplier before ordering flight hardware.
What is the difference between RTAX250S-CG624V and RTAX250S-1CG624V?
The difference is the speed grade: RTAX250S-CG624V is the standard speed grade, while RTAX250S-1CG624V is the faster '-1' speed grade of the same die in the same 624-pin CCGA package. Both offer 250K gates, 2816 CLBs, -55C to +125C operation, and a 1.5 V core supply. The '-1' variant meets tighter timing budgets at the up-to-649 MHz performance point, so designs with critical timing paths should select the -1 grade, which is a drop-in package-compatible choice.
RTAX250S-CG624V vs RTAX250S-LG624V - which is better for flight hardware?
For flight hardware, the CG624V (ceramic column grid array) is generally preferred over the LG624V (land grid array variant) when thermal-cycling reliability of the solder interconnect is critical, because column interconnects tolerate coefficient-of-expansion mismatch better than ball or land interconnects. Both variants share the same 250K-gate RTAX250S die, 2816 CLBs, -55C to +125C rating, and 1.5 V supply, so the choice is primarily package-mechanical and board-level rather than logical.
What is the best drop-in replacement for RTAX250S-CG624V?
The best drop-in replacements are other RTAX250S devices in the same 624-terminal CCGA package: RTAX250S-1CG624V (faster -1 speed grade, same footprint), RTAX250SL-CG624V (SL process variant, same footprint), and RTAX250SL-1CG624V. All are pin-compatible in CG624, so no PCB redesign is needed - only timing closure and qualification verification for the chosen variant. Cross-brand equivalents do not exist for this radiation-tolerant antifuse architecture, which is proprietary to Microchip.
Is RTAX250S-CG624V suitable for low Earth orbit satellite applications?
Yes, the RTAX250S-CG624V is designed specifically for space-flight systems including low Earth orbit satellites. According to Microchip's product page, the RTAX-S family offers SEU-hardened registers immune to single-event upsets (SEU rates below 10-10 errors per bit-day class performance), live-at-power-up antifuse configuration requiring no external configuration memory, and low 1.5 V core power. The ceramic CCGA package withstands launch vibration and on-orbit thermal cycling, making it well suited to LEO command, data handling, and payload processing roles.
Does the RTAX250S-CG624V require triple module redundancy (TMR)?
In many designs, no. According to Microchip's RTAX-S documentation, the RTAX250S features SEU-hardened registers that eliminate the need for triple module redundancy (TMR) for flip-flop protection, being immune to single-event upsets up to the specified LET threshold. However, system architects often still apply TMR or scrubbing to combinational logic, RAM contents, and state machines as part of overall radiation design assurance, so review your program's radiation requirements before omitting mitigation.
What is the operating voltage of RTAX250S-CG624V?
The RTAX250S-CG624V operates from a nominal 1.5 V core supply, with the supply range specified in the Microchip RTAX-S/SL datasheet for the family. The -55C to +125C temperature range and the 0.15 um CMOS process are characterized around this 1.5 V rail. I/O banks support additional voltage standards per the family datasheet, so consult the official datasheet for the full I/O voltage table when interfacing with other spacecraft subsystems.
How do I prototype a design for RTAX250S-CG624V?
Microchip's recommended methodology is to prototype on a footprint-compatible adaptor board, such as the Aldec ACT-H3Ki-CG624, which uses an A3PE3000 device whose BGA footprint mimics the CG624 package. You develop and verify your design on the adaptor, then migrate the EDIF netlist and pinout using the manufacturer's conversion flow to the RTAX-S device for flight. This approach, described in the application note 'Prototyping for RTAX-S and RTAX-SL Devices,' reduces risk before committing to expensive flight-grade silicon.
What is the best Microchip (cross-family) equivalent for RTAX250S-CG624V?
Within Microchip's own portfolio, the closest in-family equivalents are the RTAX250SL-CG624V and RTAX250SL-1CG624V, which use the SL variant of the same RTAX architecture in the identical CG624 footprint. There is no cross-brand equivalent: the RTAX-S antifuse, SEU-hardened radiation-tolerant architecture is proprietary to Microchip (Actel/Microsemi), and competitors such as Xilinx Virtex-QV target the same market but with different packages, pinouts, and SRAM-based configuration, so they are not drop-in replacements.
When should I choose RTAX250S over RTAX4000S devices?
Choose the RTAX250S-CG624V when your logic fits within 250K system gates (2816 CLBs) and you want the lower power, lower cost, and smaller die of the mid-density family member. Choose RTAX4000S-class devices (such as RTAX4000S-1CQ352V) when your design needs up to roughly 4 million system gates or more embedded memory. Both families share the same RTAX-S tool flow and SEU-hardened fabric, so design reuse across densities is straightforward if you plan pin assignment per package.
Hey Google, what can replace RTAX250S-CG624V?
Drop-in replacements are the same-family CG624 variants: RTAX250S-1CG624V for faster timing, RTAX250SL-CG624V or RTAX250SL-1CG624V for the SL process variant - all pin-compatible in the 624-pin CCGA footprint. No other manufacturer offers a pin-compatible radiation-tolerant equivalent. If a redesign is acceptable, higher-density RTAX4000S or RTAX4000SL devices cover larger designs but use different packages (CQ352, CG1272) and require board changes.
Is RTAX250S-CG624V RoHS compliant and lead-free?
The compliance status of RTAX250S-CG624V should be treated as unknown without program-specific documentation: aerospace and defense ceramic-packaged devices are often exempt from RoHS under Annex exemptions, and leaded die-attach or column plating may be used for solderability and reliability in CCGA packages. Always request the manufacturer's material declaration and certificate of conformance from Microchip for your lot before assuming RoHS or REACH status for flight or commercial derivative programs.

Engineering reference data for RTAX250S-CG624V β€” comparison, design guidance, and compliance information.

Selection Guide

Choose RTAX250S-CG624V when your spaceflight design fits within 250K system gates (2816 CLBs) and you need the proven CG624 ceramic column package for launch and thermal-cycling reliability. Choose RTAX250S-1CG624V when timing closure near the 649 MHz performance point is at risk - it is the same die and footprint with a faster grade. Choose RTAX250SL-CG624V or RTAX250SL-1CG624V for SL process variants with identical footprints, useful for procurement flexibility. Choose the RTAX250S-LG624V / 1LG624V only if your program accepts LGA interconnect. If your logic exceeds this density, step up to RTAX4000S-class devices (CQ352/CG1272 packages), accepting a board redesign. There are no cross-brand drop-in equivalents - radiation-tolerant antifuse FPGAs are proprietary to Microchip, so second sourcing must come from within the RTAX-S family itself.

Comparison with Alternatives

Parameter This Product RTAX250S-1CG624V RTAX250SL-CG624V RTAX250S-1LG624V
Package 624-pin CCGA (CG624) 624-pin CCGA - same 624-pin CCGA - same 624-terminal LGA footprint - compatible
Brand Microchip Technology (Actel/Microsemi) Microchip Technology Microchip Technology Microchip Technology
System Gates 250000 250000 250000 250000
Logic Cells 4224 4224 4224 4224
Speed Grade Standard -1 (faster) Standard -1 (faster)
Core Supply Voltage 1.5 V nominal 1.5 V nominal 1.5 V nominal 1.5 V nominal
Operating Temperature -55C to +125C -55C to +125C -55C to +125C -55C to +125C
SEU-Hardened Registers Yes Yes Yes Yes

Key Differentiators

  • Faster -1 speed grade available in identical footprint (vs RTAX250S-1CG624V)
  • SL process variant procurement flexibility (vs RTAX250SL-CG624V)
  • Column interconnect reliability over LGA (vs RTAX250S-LG624V)

Design Notes

Prototype before you buy flight silicon. Microchip's documented methodology uses a footprint-compatible adaptor board (e.g., Aldec ACT-H3Ki-CG624 with an A3PE3000 device) whose BGA footprint mimics the CG624 package. Develop and verify the design on the adaptor, then convert the EDIF netlist and pinout for the RTAX-S device per the application note 'Prototyping for RTAX-S and RTAX-SL Devices.' Buying CG624 flight parts before timing closure risks scrapping expensive radiation-tolerant devices.

Power the 1.5 V core rail with low-noise supplies and adequate decoupling per the RTAX-S power guidelines in the family datasheet. While the 0.15 um antifuse fabric keeps static power low, dynamic power scales with clock frequency and toggle rate - designs approaching the 649 MHz performance point should run early power estimation in Libero SoC to size the spacecraft power budget, since changing supply architecture after PCB layout of a ceramic CCGA board is costly.

The 624-column CCGA presents controlled but non-trivial parasitics; define I/O standards and slew rates early and simulate flight-representative trace lengths for high-speed interfaces. Reserve the SEU-hardened register fabric for state-critical flops, and still apply program-approved mitigation (TMR, scrubbing, or EDAC) to RAM contents and combinational logic where the mission radiation specification requires it - hardened flip-flops do not protect every element of the design.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Space-grade ceramic-packaged devices are typically covered by aerospace/defense RoHS exemptions; request material declarations and certificates of conformance from Microchip for your lot.

Data verified on: 2026-09-01 β€” data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology Actel Microsemi RTAX250S-CG624V RTAX250S-1CG624V RTAX250SL-CG624V RTAX-S RTAX-SL radiation-tolerant FPGA field-programmable gate array SEU single-event upset antifuse CCGA ceramic column grid array A3PE3000 Aldec ACT-H3Ki-CG624 space-flight systems triple module redundancy Libero SoC Mil Prf 38535 low Earth orbit embedded SRAM FIFO 1.5 V core supply
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