S912XEP768J4CAL - HCS12X 16-bit MCU 768KB Flash | NXP Semiconductors
N.º da peça: S912XEP768J4CAL ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $12.85 | $12,85 |
| 10 | $11.4 | $114,00 |
| 100 | $9.95 | $995,00 |
| 500 | $8.55 | $4.275,00 |
| 1.000 | $7.4 | $7.400,00 |
S912XEP768J4CAL Visão geral
A microcontroller (MCU) is an integrated circuit that combines a processor core, program and data memory, and a rich set of peripherals into a single chip. The HCS12X line extends the legacy HCS12 architecture by adding a peripheral co-processor (XGATE) that handles short interrupt routines and DMA-style data movement in parallel with the CPU, raising effective throughput for CAN, LIN, SPI, and PWM workloads. Within the broader taxonomy, the S912XEP768J4CAL sits at microcontroller -> 16-bit MCU -> HCS12X family -> automotive/industrial grade MCU.
Key differentiating specifications include the 768 KB Flash (organized as 768K x 8), 64 KB RAM, 32 KB EEPROM, XGATE RISC co-processor, four ms CAN 2.0 A/B controllers, multiple SCI/SPI/I2C interfaces, an 8-channel 10-bit ADC, and a 16-channel enhanced capture timer. The wide memory density and rich peripheral mix allow a single chip to replace external memory and several companion logic devices in body, chassis, and powertrain nodes.
The S912XEP768J4CAL uses the proven CPU12X core with background debug mode (BDM) for non-intrusive in-circuit development, and supports single-wire debugging plus on-chip hardware breakpoint comparators. An integrated voltage regulator and oscillator driver simplify BOM count, while the industrial operating temperature range of -40C to +85C (suffix J4) suits under-hood and factory-floor environments.
Typical applications include automotive body control modules, CAN gateway nodes, industrial PLC expansion cards, sensor hub MCUs, and HVAC or lighting controllers where the XGATE offload engine excels. The combination of large Flash plus EEPROM also suits field-updatable firmware deployments requiring dual-bank or EEPROM-backed data logging.
When designing with this part, budget for the LQFP-112 land pattern and provide robust ground stitching beneath the exposed pad if a thermal pad variant is used. Place decoupling capacitors as close to each VDD/VSS pair as the layout allows, and route the external oscillator traces symmetrically with a guard ground to minimize EMI.
This page synthesizes distributor pricing, verified parametric data, drop-in compatible alternatives, and practical PCB and firmware design notes that go beyond what the manufacturer PDF alone typically provides.
Alternativas drop-in para S912XEP768J4CAL — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com S912XEP768J4CAL (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Temperature Grade, Co-processor, Core Architecture.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S12XEP768CAG
✅ Drop-In✓ Em estoque
$19.85 / unidade
Ver ficha técnica →S912XEQ384J2CAL
✅ Drop-In✓ Em estoque
$10.57 / unidade
Ver ficha técnica →S912XEG384J2VAL
✅ Drop-In✓ Em estoque
$17.8 / unidade
Ver ficha técnica →S912XET512J2VAGR
✅ Drop-In✓ Em estoque
$1 / unidade
Ver ficha técnica →MC9S12XEQ384CAG
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →S912XEP768J4CAL Classificações máximas e características elétricas
| Core Architecture | HCS12X (CPU12X) |
| Largura do barramento de dados | 16-bit |
| Program Memory Size | 768 KB (768K x 8) Flash |
| RAM Size | 64 KB |
| EEPROM Size | 32 KB |
| Frequência máxima de clock | 50 MHz |
| Package Type | 112-LQFP (20x20 mm) |
| Número de pinos | 112 |
| Tipo de montagem | Surface Mount |
| Faixa de temperatura de operação | -40C to +85C (industrial, suffix J4) |
| Co-processor | XGATE RISC peripheral co-processor |
| CAN Controllers | 4 x ms CAN 2.0 A/B |
| Status RoHS | Compliant |
| Temperature Grade | Industrial |
| Terminal Form | Gull Wing |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
Configuração de pinos do S912XEP768J4CAL
| Pino 1 | VSS — Digital ground |
| Pino 2 | VDDR — Regulated power supply for internal logic |
| Pino 3 | VDDX — I/O supply voltage reference |
| Pino 4 | VSSX — I/O ground reference |
| Pino 5 | RESET_b — Active-low reset input, open-drain |
| Pino 6 | MODC — Mode control / BDM input |
| Pino 7 | MODB — Mode control input |
| Pino 8 | MODA — Mode control input |
| Pino 9 | XCLKS — Oscillator mode select |
| Pino 10 | EXTAL — External clock / crystal input |
| Pino 11 | XTAL — Crystal oscillator output |
| Pino 12 | TEST — Test mode pin, tie to VSS |
| Pino 13 | VDDA — Analog supply for ADC |
| Pino 14 | VSSA — Analog ground for ADC |
| Pino 15 | PAD0 — Port AD bit 0 / AN0 (ADC input) |
| Pino 16 | PAD1 — Port AD bit 1 / AN1 (ADC input) |
| Pino 17 | PAD2 — Port AD bit 2 / AN2 (ADC input) |
| Pino 18 | PAD3 — Port AD bit 3 / AN3 (ADC input) |
| Pino 19 | PAD4 — Port AD bit 4 / AN4 (ADC input) |
| Pino 20 | PAD5 — Port AD bit 5 / AN5 (ADC input) |
| Pino 21 | PAD6 — Port AD bit 6 / AN6 (ADC input) |
| Pino 22 | PAD7 — Port AD bit 7 / AN7 (ADC input) |
| Pino 23 | VRL — ADC voltage reference low |
| Pino 24 | VRH — ADC voltage reference high |
| Pino 25 | PWM0 — Pulse width modulator output 0 |
| Pino 26 | PWM1 — Pulse width modulator output 1 |
| Pino 27 | PWM2 — Pulse width modulator output 2 |
| Pino 28 | PWM3 — Pulse width modulator output 3 |
| Pino 29 | PWM4 — Pulse width modulator output 4 |
| Pino 30 | PWM5 — Pulse width modulator output 5 |
| Pino 31 | PWM6 — Pulse width modulator output 6 |
| Pino 32 | PWM7 — Pulse width modulator output 7 |
| Pino 33 | VSS — Digital ground |
| Pino 34 | VDD — Digital supply voltage (5V) |
| Pino 35 | BKGD — Background debug mode (BDM) |
| Pino 36 | TXCAN0 — CAN0 transmit output |
| Pino 37 | RXCAN0 — CAN0 receive input |
| Pino 38 | TXCAN1 — CAN1 transmit output |
| Pino 39 | RXCAN1 — CAN1 receive input |
| Pino 40 | TXCAN2 — CAN2 transmit output |
| Pino 41 | RXCAN2 — CAN2 receive input |
| Pino 42 | TXCAN3 — CAN3 transmit output |
| Pino 43 | RXCAN3 — CAN3 receive input |
| Pino 44 | SCIRX0 — SCI0 receive input (UART) |
| Pino 45 | SCITX0 — SCI0 transmit output (UART) |
| Pino 46 | SCIRX1 — SCI1 receive input (UART) |
| Pino 47 | SCITX1 — SCI1 transmit output (UART) |
| Pino 48 | SCIRX2 — SCI2 receive input (UART) |
| Pino 49 | SCITX2 — SCI2 transmit output (UART) |
| Pino 50 | VSS — Digital ground |
| Pino 51 | VDD — Digital supply voltage (5V) |
| Pino 52 | MOSI0 — SPI0 master out / slave in |
| Pino 53 | MISO0 — SPI0 master in / slave out |
| Pino 54 | SCK0 — SPI0 serial clock |
| Pino 55 | SS0_b — SPI0 slave select (active low) |
| Pino 56 | MOSI1 — SPI1 master out / slave in |
| Pino 57 | MISO1 — SPI1 master in / slave out |
| Pino 58 | SCK1 — SPI1 serial clock |
| Pino 59 | SS1_b — SPI1 slave select (active low) |
| Pino 60 | SDA0 — I2C0 serial data |
| Pino 61 | SCL0 — I2C0 serial clock |
| Pino 62 | SDA1 — I2C1 serial data |
| Pino 63 | SCL1 — I2C1 serial clock |
| Pino 64 | VSS — Digital ground |
| Pino 65 | VDD — Digital supply voltage (5V) |
| Pino 66 | IOC0 — Timer input capture / output compare 0 |
| Pino 67 | IOC1 — Timer input capture / output compare 1 |
| Pino 68 | IOC2 — Timer input capture / output compare 2 |
| Pino 69 | IOC3 — Timer input capture / output compare 3 |
| Pino 70 | IOC4 — Timer input capture / output compare 4 |
| Pino 71 | IOC5 — Timer input capture / output compare 5 |
| Pino 72 | IOC6 — Timer input capture / output compare 6 |
| Pino 73 | IOC7 — Timer input capture / output compare 7 |
| Pino 74 | PE0 — Port E bit 0 / XIRQ |
| Pino 75 | PE1 — Port E bit 1 / IRQ |
| Pino 76 | PE2 — Port E bit 2 / XIRQ |
| Pino 77 | PE3 — Port E bit 3 / IRQ |
| Pino 78 | PE4 — Port E bit 4 / SS2_b |
| Pino 79 | PE5 — Port E bit 5 / MOSI2 |
| Pino 80 | PE6 — Port E bit 6 / MISO2 |
| Pino 81 | PE7 — Port E bit 7 / SCK2 |
| Pino 82 | VSS — Digital ground |
| Pino 83 | VDD — Digital supply voltage (5V) |
| Pino 84 | PJ0 — Port J bit 0 / KWUA0 |
| Pino 85 | PJ1 — Port J bit 1 / KWUA1 |
| Pino 86 | PJ2 — Port J bit 2 / KWUA2 |
| Pino 87 | PJ3 — Port J bit 3 / KWUA3 |
| Pino 88 | PJ4 — Port J bit 4 / KWUA4 |
| Pino 89 | PJ5 — Port J bit 5 / KWUA5 |
| Pino 90 | PJ6 — Port J bit 6 / KWUA6 |
| Pino 91 | PJ7 — Port J bit 7 / KWUA7 |
| Pino 92 | PP0 — Port P bit 0 / PWM8 |
| Pino 93 | PP1 — Port P bit 1 / PWM9 |
| Pino 94 | PP2 — Port P bit 2 / PWM10 |
| Pino 95 | PP3 — Port P bit 3 / PWM11 |
| Pino 96 | PP4 — Port P bit 4 / PWM12 |
| Pino 97 | PP5 — Port P bit 5 / PWM13 |
| Pino 98 | PP6 — Port P bit 6 / PWM14 |
| Pino 99 | PP7 — Port P bit 7 / PWM15 |
| Pino 100 | VSS — Digital ground |
| Pino 101 | VDD — Digital supply voltage (5V) |
| Pino 102 | PT0 — Port T bit 0 / IOC0 alt |
| Pino 103 | PT1 — Port T bit 1 / IOC1 alt |
| Pino 104 | PT2 — Port T bit 2 / IOC2 alt |
| Pino 105 | PT3 — Port T bit 3 / IOC3 alt |
| Pino 106 | PT4 — Port T bit 4 / IOC4 alt |
| Pino 107 | PT5 — Port T bit 5 / IOC5 alt |
| Pino 108 | PT6 — Port T bit 6 / IOC6 alt |
| Pino 109 | PT7 — Port T bit 7 / IOC7 alt |
| Pino 110 | PS0 — Port S bit 0 / SPI2 alt |
| Pino 111 | PS1 — Port S bit 1 / SPI2 alt |
| Pino 112 | VSS — Digital ground (last pin) |
Aplicações típicas
S912XEP768J4CAL é adequado para 6 aplicaçãos: Automotive Body Control Module, CAN Gateway Node, Industrial PLC Expansion Card, HVAC Climate Controller, Sensor Hub MCU, Lighting Control ECU.
Automotive Body Control Module
The S912XEP768J4CAL fits automotive body controllers because its 768 KB Flash accommodates large BCM firmware stacks with CAN/LIN stacks, while the four ms CAN 2.0 A/B controllers handle body and chassis bus traffic simultaneously. The XGATE RISC co-processor offloads CAN message handling, freeing the CPU12X to run application logic. Industrial temperature grade -40C to +85C suits cabin and under-hood-adjacent placements.
Recomendado
CAN Gateway Node
As a CAN gateway, the S912XEP768J4CAL bridges powertrain, body, and diagnostic CAN buses using its four integrated CAN controllers, eliminating external bridge ICs. The XGATE engine runs filtering and routing tables at zero CPU overhead, while 768 KB Flash holds full gateway routing tables and OEM-specific diagnostic firmware. The 64 KB RAM supports buffering multiple CAN payloads during burst conditions.
Recomendado
Industrial PLC Expansion Card
In industrial PLCs the S912XEP768J4CAL serves as an expansion-card MCU with 768 KB Flash for ladder-logic engines and 32 KB EEPROM for recipe storage. The 16-bit HCS12X core runs deterministic PID loops while the XGATE handles high-speed pulse counting via the enhanced capture timer. The four CAN controllers support industrial CANopen and DeviceNet slave operation without external bus ICs.
Recomendado
HVAC Climate Controller
HVAC climate modules leverage the S912XEP768J4CAL's 8-channel ADC for temperature and humidity sensing, the enhanced capture timer for blower PWM, and 768 KB Flash for adaptive control algorithms. The XGATE offloads fan-speed closed-loop control, freeing the CPU for cabin climate logic and CAN diagnostics. Industrial temperature grade ensures reliable operation near heater cores.
Recomendado
Sensor Hub MCU
Sensor hub applications use the S912XEP768J4CAL's 64 KB RAM and XGATE engine to aggregate SPI and I2C sensor streams, preprocess data, and forward summarized results over CAN. The 32 KB EEPROM retains calibration constants across power cycles, and 768 KB Flash supports on-device DSP-style filtering algorithms. Industrial temperature grade suits factory-floor sensor installations.
Recomendado
Lighting Control ECU
Lighting control ECUs benefit from the S912XEP768J4CAL's enhanced PWM channels for dimming, the XGATE for flicker-free PWM update, and CAN bus connectivity for body-network integration. The 32 KB EEPROM stores per-channel calibration and dim curves. The industrial temperature range covers both exterior headlamp and interior ambient lighting environments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para S912XEP768J4CAL — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S12XEP768CAG | S912XEQ384J2CAL | S912XEG384J2VAL | S912XET512J2VAGR | MC9S12XEQ384CAG |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | LQFP-112 (20x20 mm) | LQFP-144 | LQFP-112 (same) | LQFP-112 (same) | LQFP-144 | LQFP-144 |
| Core Architecture | HCS12X (CPU12X) | HCS12X (same) | HCS12X (same) | HCS12X (same) | HCS12X (same) | HCS12X (same) |
| Flash Memory | 768 KB | 768 KB (same) | 384 KB | 384 KB | 512 KB | 384 KB |
| RAM Size | 64 KB | 64 KB (same) | 32 KB | 32 KB | 32 KB | 32 KB |
| Maximum Frequency | 50 MHz | 50 MHz (same) | 50 MHz (same) | 50 MHz (same) | 50 MHz (same) | 50 MHz (same) |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +85C | -40C to +105C (extended) | -40C to +105C (extended) | -40C to +85C |
| CAN Controllers | 4 x ms CAN 2.0 A/B | 4 x ms CAN (same) | 4 x ms CAN (same) | 4 x ms CAN (same) | 4 x ms CAN (same) | 4 x ms CAN (same) |
| XGATE Co-processor | Yes | Yes (same) | Yes | Yes | Yes | Yes |
Principais diferenciais
- Highest Flash density in the HCS12X LQFP-112 line (vs S912XEQ384J2CAL)
- Larger RAM for buffering CAN and DMA workloads (vs S912XET512J2VAGR)
- Industrial temperature grade suited to under-hood environments (vs S912XEG384J2VAL)
Notas de projeto
The S912XEP768J4CAL requires a clean 5V supply on VDD pins and a regulated internal rail on VDDR (typically 2.5V generated internally). Place 100 nF ceramic decoupling within 5 mm of every VDD/VSS pair and a 10 uF bulk capacitor near the VDD pins. If using the internal voltage regulator, ensure VDDR has its own 100 nF + 4.7 uF pair. Estimated: at 50 MHz, core current is approximately 60-80 mA depending on peripheral activity, plus 20 mA per active CAN controller.
Route the EXTAL/XTAL traces symmetrically and surround them with a guard ground that connects to the analog ground at a single point near the chip. Keep crystal traces short (<10 mm) to avoid EMI pickup. The BKGD and RESET_b traces must be short and routed away from PWM or CAN outputs to prevent in-circuit noise from triggering spurious BDM entry. Provide a TEST pin tie-down to VSS to disable factory test mode.
Do not leave MODA/MODB/MODC floating at power-up; the default mode determines whether the part boots from internal Flash or waits in BDM. Always wait at least 50 clock cycles after RESET_b goes high before issuing BDM commands, or the BDM will return a sync error. Also, do not enable all four CAN controllers simultaneously in the lowest loop mode without confirming the bus termination is correct, as this will flood the bus with error frames.
Although the HCS12X core runs at modest power, the 768 KB Flash read during continuous ADC sampling can elevate die temperature. Estimated: typical power dissipation at 50 MHz with 3 active CAN controllers and ADC running at 1 MSPS is approximately 350-450 mW. The LQFP-112 has theta_JA around 45 C/W on a standard 4-layer JEDEC test board, giving a 20C rise. Derate above 70C ambient by reducing clock or peripheral count.
Informações de conformidade
RoHS and REACH compliant per distributor listings; JLCPCB and LCSC explicitly mark the part ROHS. The S912XEP768J4CAL is industrial-grade (suffix J4), not AEC-Q100 qualified. For AEC-Q100 designs use automotive-graded S912XEQ384J2CAL-V or similar variants.
