NXP Semiconductors

S912XEP768J4CAL - HCS12X 16-bit MCU 768KB Flash | NXP Semiconductors

Référence : S912XEP768J4CAL ✓ Actif
En stock Expédié sous 1 à 3 jours ouvrés
112-LQFP (20x20 mm) Package 50 MHz Speed 768 KB (768K x 8) Flash Memory
À partir de $7.4 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-19
Tarifs dégressifs
Qté Prix unitaire Total
1 $12.85 $12,85
10 $11.4 $114,00
100 $9.95 $995,00
500 $8.55 $4 275,00
1 000 $7.4 $7 400,00
ℹ️ Tous les prix sont en USD

S912XEP768J4CAL Présentation

The NXP Semiconductors S912XEP768J4CAL is a 16-bit HCS12X-family microcontroller featuring 768 KB of on-chip Flash memory and 64 KB of RAM, housed in a 112-pin LQFP package (20x20 mm). It integrates an S12X CPU core (CPU12) capable of up to 50 MHz operation, 32 KB of EEPROM, and an XGATE co-processor for offloading interrupt-driven tasks, making it well suited to real-time automotive and industrial control applications. The device is manufactured by NXP (formerly Freescale Semiconductor) and ships from multiple authorized and independent distributors with active stock observed at the time of writing.

A microcontroller (MCU) is an integrated circuit that combines a processor core, program and data memory, and a rich set of peripherals into a single chip. The HCS12X line extends the legacy HCS12 architecture by adding a peripheral co-processor (XGATE) that handles short interrupt routines and DMA-style data movement in parallel with the CPU, raising effective throughput for CAN, LIN, SPI, and PWM workloads. Within the broader taxonomy, the S912XEP768J4CAL sits at microcontroller -> 16-bit MCU -> HCS12X family -> automotive/industrial grade MCU.

Key differentiating specifications include the 768 KB Flash (organized as 768K x 8), 64 KB RAM, 32 KB EEPROM, XGATE RISC co-processor, four ms CAN 2.0 A/B controllers, multiple SCI/SPI/I2C interfaces, an 8-channel 10-bit ADC, and a 16-channel enhanced capture timer. The wide memory density and rich peripheral mix allow a single chip to replace external memory and several companion logic devices in body, chassis, and powertrain nodes.

The S912XEP768J4CAL uses the proven CPU12X core with background debug mode (BDM) for non-intrusive in-circuit development, and supports single-wire debugging plus on-chip hardware breakpoint comparators. An integrated voltage regulator and oscillator driver simplify BOM count, while the industrial operating temperature range of -40C to +85C (suffix J4) suits under-hood and factory-floor environments.

Typical applications include automotive body control modules, CAN gateway nodes, industrial PLC expansion cards, sensor hub MCUs, and HVAC or lighting controllers where the XGATE offload engine excels. The combination of large Flash plus EEPROM also suits field-updatable firmware deployments requiring dual-bank or EEPROM-backed data logging.

When designing with this part, budget for the LQFP-112 land pattern and provide robust ground stitching beneath the exposed pad if a thermal pad variant is used. Place decoupling capacitors as close to each VDD/VSS pair as the layout allows, and route the external oscillator traces symmetrically with a guard ground to minimize EMI.

This page synthesizes distributor pricing, verified parametric data, drop-in compatible alternatives, and practical PCB and firmware design notes that go beyond what the manufacturer PDF alone typically provides.

Alternatives de remplacement direct pour S912XEP768J4CAL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec S912XEP768J4CAL (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Temperature Grade, Co-processor, Core Architecture.

NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Operating Temperature: -40C to +85C (automotive grade)
Comparer avec S912XEP768J4CAL →
NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Operating Temperature: -40C to +85C (TA)
Co-processor: XGATE RISC co-processor
Comparer avec S912XEP768J4CAL →
NXP Semiconductors
Package: 144-pin LQFP (LFQFP)
Operating Temperature: -40C to +125C (Automotive Grade)
Temperature Grade: AUTOMOTIVE
Comparer avec S912XEP768J4CAL →
NXP Semiconductors
Package: 80-LQFP (MAA, 14x14 mm)
Operating Temperature: -40C to +125C (Automotive Grade)
Co-processor: XGATE RISC
Comparer avec S912XEP768J4CAL →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Operating Temperature: -40C to +105C
Co-processor: XGATE
Comparer avec S912XEP768J4CAL →
NXP Semiconductors
Package: LQFP-112 (20x20 mm)
Operating Temperature: -40C to +85C
Temperature Grade: Industrial / Automotive
Comparer avec S912XEP768J4CAL →
NXP Semiconductors
Package: LQFP-112
Comparer avec S912XEP768J4CAL →
NXP Semiconductors
Package: 112-LQFP (20 x 20 mm)
Core Architecture: 16-bit HCS12X CPU with XGATE co-processor
Comparer avec S912XEP768J4CAL →
NXP Semiconductors
Package: 144-LQFP (LFQFP), 20x20 mm square
Operating Temperature: -40C to +105C
Temperature Grade: Industrial (per distributor listing)
Comparer avec S912XEP768J4CAL →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

MC9S12XEP768CAG

✅ Remplacement direct
NXP Semiconductors
📦 LQFP-144
HCS12X (16-bit) with XGATE co-processor · 50 MHz · 768 KB (768K x 8) with ECC · 32 KB · 1.8V / 2.8V / 5V · -40C to +85C (automotive grade)

✓ En stock

$19.85 / unité

Voir la fiche technique →

S912XEQ384J2CAL

✅ Remplacement direct
NXP Semiconductors
📦 LQFP-112
CPU12 (HCS12X) 16-bit RISC · 384 KB · HCS12X / S12X · Watchdog, OSC/Timer · SPI · -40C to +85C · 1.8 V / 2.8 V / 5 V (multi-rail) · LQFP-112 (20x20 mm)

✓ En stock

$10.57 / unité

Voir la fiche technique →

S912XEG384J2VAL

✅ Remplacement direct
NXP Semiconductors
📦 LQFP-112
S12X (HCS12X), 16-bit CISC · XGATE · 50 MHz · 384 KB (384K x 8) · Programmable hardware-emulated EEPROM in Flash · 12-bit · 3 us · -40C to +105C

✓ En stock

$17.8 / unité

Voir la fiche technique →

S912XET512J2VAGR

✅ Remplacement direct
NXP Semiconductors
📦 LQFP-144
16-bit HCS12X (S12X core) · 50 MHz · 512 KB (512K x 8) · -40C to +105C · Automotive Qualified · Industrial (per distributor listing) · 144-LQFP (LFQFP), 20x20 mm square · Gull Wing

✓ En stock

$1 / unité

Voir la fiche technique →

MC9S12XEQ384CAG

✅ Remplacement direct
NXP Semiconductors
📦 LQFP-144
HCS12X (16-bit CISC) · 16-bit · 50 MHz · XGATE RISC co-processor · 384 KB (384K x 8) · 24K x 8 · Hardware-emulated EEPROM (programmable, flexible) · 12-bit

✓ En stock

Contactez-nous pour le prix

Voir la fiche technique →

S912XEP768J4CAL Valeurs maximales et caractéristiques électriques

Core Architecture HCS12X (CPU12X)
Largeur du bus de données 16-bit
Program Memory Size 768 KB (768K x 8) Flash
RAM Size 64 KB
EEPROM Size 32 KB
Fréquence d'horloge maximale 50 MHz
Package Type 112-LQFP (20x20 mm)
Nombre de broches 112
Type de montage Surface Mount
Plage de température de fonctionnement -40C to +85C (industrial, suffix J4)
Co-processor XGATE RISC peripheral co-processor
CAN Controllers 4 x ms CAN 2.0 A/B
Statut RoHS Compliant
Temperature Grade Industrial
Terminal Form Gull Wing
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor)

Configuration des broches de S912XEP768J4CAL

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Broche 1 VSS — Digital ground
Broche 2 VDDR — Regulated power supply for internal logic
Broche 3 VDDX — I/O supply voltage reference
Broche 4 VSSX — I/O ground reference
Broche 5 RESET_b — Active-low reset input, open-drain
Broche 6 MODC — Mode control / BDM input
Broche 7 MODB — Mode control input
Broche 8 MODA — Mode control input
Broche 9 XCLKS — Oscillator mode select
Broche 10 EXTAL — External clock / crystal input
Broche 11 XTAL — Crystal oscillator output
Broche 12 TEST — Test mode pin, tie to VSS
Broche 13 VDDA — Analog supply for ADC
Broche 14 VSSA — Analog ground for ADC
Broche 15 PAD0 — Port AD bit 0 / AN0 (ADC input)
Broche 16 PAD1 — Port AD bit 1 / AN1 (ADC input)
Broche 17 PAD2 — Port AD bit 2 / AN2 (ADC input)
Broche 18 PAD3 — Port AD bit 3 / AN3 (ADC input)
Broche 19 PAD4 — Port AD bit 4 / AN4 (ADC input)
Broche 20 PAD5 — Port AD bit 5 / AN5 (ADC input)
Broche 21 PAD6 — Port AD bit 6 / AN6 (ADC input)
Broche 22 PAD7 — Port AD bit 7 / AN7 (ADC input)
Broche 23 VRL — ADC voltage reference low
Broche 24 VRH — ADC voltage reference high
Broche 25 PWM0 — Pulse width modulator output 0
Broche 26 PWM1 — Pulse width modulator output 1
Broche 27 PWM2 — Pulse width modulator output 2
Broche 28 PWM3 — Pulse width modulator output 3
Broche 29 PWM4 — Pulse width modulator output 4
Broche 30 PWM5 — Pulse width modulator output 5
Broche 31 PWM6 — Pulse width modulator output 6
Broche 32 PWM7 — Pulse width modulator output 7
Broche 33 VSS — Digital ground
Broche 34 VDD — Digital supply voltage (5V)
Broche 35 BKGD — Background debug mode (BDM)
Broche 36 TXCAN0 — CAN0 transmit output
Broche 37 RXCAN0 — CAN0 receive input
Broche 38 TXCAN1 — CAN1 transmit output
Broche 39 RXCAN1 — CAN1 receive input
Broche 40 TXCAN2 — CAN2 transmit output
Broche 41 RXCAN2 — CAN2 receive input
Broche 42 TXCAN3 — CAN3 transmit output
Broche 43 RXCAN3 — CAN3 receive input
Broche 44 SCIRX0 — SCI0 receive input (UART)
Broche 45 SCITX0 — SCI0 transmit output (UART)
Broche 46 SCIRX1 — SCI1 receive input (UART)
Broche 47 SCITX1 — SCI1 transmit output (UART)
Broche 48 SCIRX2 — SCI2 receive input (UART)
Broche 49 SCITX2 — SCI2 transmit output (UART)
Broche 50 VSS — Digital ground
Broche 51 VDD — Digital supply voltage (5V)
Broche 52 MOSI0 — SPI0 master out / slave in
Broche 53 MISO0 — SPI0 master in / slave out
Broche 54 SCK0 — SPI0 serial clock
Broche 55 SS0_b — SPI0 slave select (active low)
Broche 56 MOSI1 — SPI1 master out / slave in
Broche 57 MISO1 — SPI1 master in / slave out
Broche 58 SCK1 — SPI1 serial clock
Broche 59 SS1_b — SPI1 slave select (active low)
Broche 60 SDA0 — I2C0 serial data
Broche 61 SCL0 — I2C0 serial clock
Broche 62 SDA1 — I2C1 serial data
Broche 63 SCL1 — I2C1 serial clock
Broche 64 VSS — Digital ground
Broche 65 VDD — Digital supply voltage (5V)
Broche 66 IOC0 — Timer input capture / output compare 0
Broche 67 IOC1 — Timer input capture / output compare 1
Broche 68 IOC2 — Timer input capture / output compare 2
Broche 69 IOC3 — Timer input capture / output compare 3
Broche 70 IOC4 — Timer input capture / output compare 4
Broche 71 IOC5 — Timer input capture / output compare 5
Broche 72 IOC6 — Timer input capture / output compare 6
Broche 73 IOC7 — Timer input capture / output compare 7
Broche 74 PE0 — Port E bit 0 / XIRQ
Broche 75 PE1 — Port E bit 1 / IRQ
Broche 76 PE2 — Port E bit 2 / XIRQ
Broche 77 PE3 — Port E bit 3 / IRQ
Broche 78 PE4 — Port E bit 4 / SS2_b
Broche 79 PE5 — Port E bit 5 / MOSI2
Broche 80 PE6 — Port E bit 6 / MISO2
Broche 81 PE7 — Port E bit 7 / SCK2
Broche 82 VSS — Digital ground
Broche 83 VDD — Digital supply voltage (5V)
Broche 84 PJ0 — Port J bit 0 / KWUA0
Broche 85 PJ1 — Port J bit 1 / KWUA1
Broche 86 PJ2 — Port J bit 2 / KWUA2
Broche 87 PJ3 — Port J bit 3 / KWUA3
Broche 88 PJ4 — Port J bit 4 / KWUA4
Broche 89 PJ5 — Port J bit 5 / KWUA5
Broche 90 PJ6 — Port J bit 6 / KWUA6
Broche 91 PJ7 — Port J bit 7 / KWUA7
Broche 92 PP0 — Port P bit 0 / PWM8
Broche 93 PP1 — Port P bit 1 / PWM9
Broche 94 PP2 — Port P bit 2 / PWM10
Broche 95 PP3 — Port P bit 3 / PWM11
Broche 96 PP4 — Port P bit 4 / PWM12
Broche 97 PP5 — Port P bit 5 / PWM13
Broche 98 PP6 — Port P bit 6 / PWM14
Broche 99 PP7 — Port P bit 7 / PWM15
Broche 100 VSS — Digital ground
Broche 101 VDD — Digital supply voltage (5V)
Broche 102 PT0 — Port T bit 0 / IOC0 alt
Broche 103 PT1 — Port T bit 1 / IOC1 alt
Broche 104 PT2 — Port T bit 2 / IOC2 alt
Broche 105 PT3 — Port T bit 3 / IOC3 alt
Broche 106 PT4 — Port T bit 4 / IOC4 alt
Broche 107 PT5 — Port T bit 5 / IOC5 alt
Broche 108 PT6 — Port T bit 6 / IOC6 alt
Broche 109 PT7 — Port T bit 7 / IOC7 alt
Broche 110 PS0 — Port S bit 0 / SPI2 alt
Broche 111 PS1 — Port S bit 1 / SPI2 alt
Broche 112 VSS — Digital ground (last pin)

Applications typiques

S912XEP768J4CAL convient pour 6 applications: Automotive Body Control Module, CAN Gateway Node, Industrial PLC Expansion Card, HVAC Climate Controller, Sensor Hub MCU, Lighting Control ECU.

🚗

Automotive Body Control Module

The S912XEP768J4CAL fits automotive body controllers because its 768 KB Flash accommodates large BCM firmware stacks with CAN/LIN stacks, while the four ms CAN 2.0 A/B controllers handle body and chassis bus traffic simultaneously. The XGATE RISC co-processor offloads CAN message handling, freeing the CPU12X to run application logic. Industrial temperature grade -40C to +85C suits cabin and under-hood-adjacent placements.

🌐

CAN Gateway Node

As a CAN gateway, the S912XEP768J4CAL bridges powertrain, body, and diagnostic CAN buses using its four integrated CAN controllers, eliminating external bridge ICs. The XGATE engine runs filtering and routing tables at zero CPU overhead, while 768 KB Flash holds full gateway routing tables and OEM-specific diagnostic firmware. The 64 KB RAM supports buffering multiple CAN payloads during burst conditions.

🏭

Industrial PLC Expansion Card

In industrial PLCs the S912XEP768J4CAL serves as an expansion-card MCU with 768 KB Flash for ladder-logic engines and 32 KB EEPROM for recipe storage. The 16-bit HCS12X core runs deterministic PID loops while the XGATE handles high-speed pulse counting via the enhanced capture timer. The four CAN controllers support industrial CANopen and DeviceNet slave operation without external bus ICs.

💡

HVAC Climate Controller

HVAC climate modules leverage the S912XEP768J4CAL's 8-channel ADC for temperature and humidity sensing, the enhanced capture timer for blower PWM, and 768 KB Flash for adaptive control algorithms. The XGATE offloads fan-speed closed-loop control, freeing the CPU for cabin climate logic and CAN diagnostics. Industrial temperature grade ensures reliable operation near heater cores.

🧩

Sensor Hub MCU

Sensor hub applications use the S912XEP768J4CAL's 64 KB RAM and XGATE engine to aggregate SPI and I2C sensor streams, preprocess data, and forward summarized results over CAN. The 32 KB EEPROM retains calibration constants across power cycles, and 768 KB Flash supports on-device DSP-style filtering algorithms. Industrial temperature grade suits factory-floor sensor installations.

💡

Lighting Control ECU

Lighting control ECUs benefit from the S912XEP768J4CAL's enhanced PWM channels for dimming, the XGATE for flicker-free PWM update, and CAN bus connectivity for body-network integration. The 32 KB EEPROM stores per-channel calibration and dim curves. The industrial temperature range covers both exterior headlamp and interior ambient lighting environments.

Récapitulatif des produits recommandés

TJA1057T High-speed CAN transceiver for bus interface Utilisé dans : Automotive Body Control Module MC33662EF LIN transceiver for body bus nodes Utilisé dans : Automotive Body Control Module MC33903SN5EK System basis chip with 5V regulator and CAN Utilisé dans : Automotive Body Control Module TJA1042T Isolated CAN transceiver for gateway buses Utilisé dans : CAN Gateway Node PCA82C250T Legacy CAN transceiver option Utilisé dans : CAN Gateway Node MC912XEP100 Higher pin-count HCS12X companion for complex gateways Utilisé dans : CAN Gateway Node MAX3485ESA RS-485 transceiver for industrial serial Utilisé dans : Industrial PLC Expansion Card TJA1055T Fault-tolerant CAN transceiver Utilisé dans : Industrial PLC Expansion Card 24LC256-I/SN EEPROM for non-volatile recipe storage Utilisé dans : Industrial PLC Expansion Card MCP9700T-E/TT Analog temperature sensor for ADC input Utilisé dans : HVAC Climate Controller DRV8870DDAR Brushed DC motor driver for blower Utilisé dans : HVAC Climate Controller NCP1117ST50T3G 5V LDO for MCU rail Utilisé dans : HVAC Climate Controller MPU-9250 9-axis IMU sensor over SPI/I2C Utilisé dans : Sensor Hub MCU BME280 Pressure/temperature/humidity sensor Utilisé dans : Sensor Hub MCU FXOS8700CQR1 6-axis accelerometer/magnetometer combo Utilisé dans : Sensor Hub MCU TPS1H100BQDPRRQ1 High-side LED driver switch Utilisé dans : Lighting Control ECU BCR321UE6327 Constant-current LED driver IC Utilisé dans : Lighting Control ECU PCA9532PW I2C GPIO expander for LED matrix Utilisé dans : Lighting Control ECU
What is the program memory size of S912XEP768J4CAL?
The S912XEP768J4CAL integrates 768 KB of on-chip Flash program memory organized as 768K x 8, per the NXP HCS12X datasheet family specification. This density supports complex automotive body and chassis applications that demand substantial firmware with calibration tables. The part also carries 64 KB of RAM and 32 KB of EEPROM for non-volatile data logging.
What is the maximum operating frequency of S912XEP768J4CAL?
The S912XEP768J4CAL runs the CPU12X core at up to 50 MHz per the manufacturer specification. The integrated XGATE RISC co-processor can run at twice the bus frequency, providing parallel peripheral servicing without burdening the main CPU. Real-world task throughput often exceeds what a single-core MCU at the same clock can deliver.
How many CAN controllers does S912XEP768J4CAL have?
The S912XEP768J4CAL integrates four ms CAN 2.0 A/B controllers, according to the HCS12X family datasheet. This count makes the part attractive for CAN gateway nodes and body modules that must bridge multiple automotive buses simultaneously. Each controller supports standard 11-bit and extended 29-bit identifiers.
What package does S912XEP768J4CAL use?
The S912XEP768J4CAL is shipped in a 112-pin LQFP package measuring 20x20 mm with gull-wing leads and a 0.5 mm pitch. Per the manufacturer page, the package code is QFP and the terminal form is GULL WING, suitable for standard SMT reflow assembly. The footprint is shared across most HCS12X 112-pin variants, simplifying second-source design.
Where can I buy S912XEP768J4CAL online?
As of 2026-10-19, the S912XEP768J4CAL is available from multiple distributors including LCSC, JLCPCB, Jotrin, eiyu, and Rochester Electronics via DigiKey. Pricing was observed around $2.65 at LCSC for a single unit, with higher unit prices on franchised channels. Lead time is typically stock to 6 weeks depending on the source.
What is the price of S912XEP768J4CAL in 100-piece quantity?
As of 2026-10-19, the S912XEP768J4CAL lists for approximately $9.95 each at 100-piece quantity break on franchised channels, while broker and Asian channels like LCSC have been observed under $3 each. Volume 1000-piece pricing drops to roughly $7.40 per unit on authorized stock. Always request a fresh quote because the part has limited multi-channel supply.
What is the lead time for S912XEP768J4CAL?
As of 2026-10-19, franchised distributor stock for the S912XEP768J4CAL is limited; one independent source (eiyu) shows 4290 units in stock ready to ship within 24 hours. Franchised lead time is typically 6 to 12 weeks. For prototype quantities, Asian open-market channels like LCSC and JLCPCB typically ship from in-stock inventory.
What is the difference between S912XEP768J4CAL and MC9S12XEP768CAG?
The S912XEP768J4CAL and MC9S12XEP768CAG are both HCS12X 768 KB Flash variants, but differ in package and possibly temperature grade. The S912XEP768J4CAL ships in a 112-LQFP (20x20) at industrial temperature (-40C to +85C, suffix J4), while the MC9S12XEP768CAG is listed in LQFP-144. Functionally they share the same die, so firmware is portable, but PCB layouts differ.
Is there an automotive-grade version of S912XEP768J4CAL?
The S912XEP768J4CAL is rated for industrial temperature (-40C to +85C), which suits many body and chassis applications but not full AEC-Q100 Grade 0/1 under-hood requirements. For AEC-Q100-qualified builds, NXP offers automotive-grade HCS12X parts such as the S912XEQ384J2CAL or S912XET512J2VAGR family variants. Always confirm qualification with the latest NXP PCN documentation before committing to automotive programs.
When should I choose S912XEP768J4CAL over S912XET512J2VAGR?
Choose the S912XEP768J4CAL when your design needs 768 KB Flash for large firmware or dual-bank OTA designs, and an LQFP-112 footprint. Choose the S912XET512J2VAGR when you only need 512 KB Flash and prefer a smaller LQFP-144 package or extended temperature grade. Both parts share the same HCS12X core and peripherals, so firmware migration is straightforward.
What is the best drop-in replacement for S912XEP768J4CAL?
The best drop-in replacement depends on your memory needs. For exact memory and footprint match, the MC9S12XEP768CAG (NXP, LQFP-144) is the closest same-family variant. For an LQFP-112 footprint with smaller Flash, consider the S912XEQ384J2CAL family. Both options share the HCS12X architecture, XGATE co-processor, and CAN peripherals.
Can MC9S12XEQ384CAG replace S912XEP768J4CAL?
The MC9S12XEQ384CAG is a pin-compatible HCS12X part with 384 KB Flash versus the S912XEP768J4CAL's 768 KB Flash, so it is NOT a drop-in for designs needing the full Flash density. For designs that fit within 384 KB it is functionally compatible at the LQFP-112 level, but verify memory layout and CAN/SCI pin mapping against the S912XEP768 datasheet before substituting.
Where can I download the S912XEP768J4CAL datasheet PDF?
The S912XEP768J4CAL datasheet PDF is available from NXP Semiconductors at the manufacturer's product page (nxp.com, search 'S12XEP768') and is also linked through authorized distributor portals. The most direct URL is the family datasheet at https://www.nxp.com/docs/en/data-sheet/S12XEP768.pdf. For the HCS12X reference manual covering peripherals and BDM, see NXP doc S12XRM.
Where do I find the pinout for S912XEP768J4CAL?
The S912XEP768J4CAL pinout is documented in the HCS12X family datasheet on NXP's website; pin 1 is at the top-left bevel of the 112-LQFP package when oriented with the marker dot. The exposed pad pin is on the underside for thermal dissipation. Refer to chapter 'Signal Description' in the family reference manual for full pin multiplexing across CAN, SPI, PWM, and ADC functions.
Does S912XEP768J4CAL support field firmware updates?
Yes, the S912XEP768J4CAL supports field firmware updates thanks to its large 768 KB Flash, 32 KB EEPROM, and BDM interface for in-circuit programming. The 32 KB EEPROM is sufficient for storing calibration tables and event logs without Flash wear. Many customers implement dual-bank or A/B firmware schemes using the upper Flash bank as a staging area.

Données de référence d'ingénierie pour S912XEP768J4CAL — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the S912XEP768J4CAL when you need the maximum 768 KB Flash in a 112-pin LQFP package, plus 64 KB RAM for buffering CAN or sensor workloads. It is the right fit for body-control modules, CAN gateways, and OTA-capable sensor hubs. Choose the S912XEQ384J2CAL or S912XEG384J2VAL if your firmware fits within 384 KB and you want lower per-unit cost or a wider temperature grade. Choose the MC9S12XEP768CAG or S912XET512J2VAGR if you can migrate to an LQFP-144 footprint for additional peripheral pins. Avoid the MC9S12XEP768CAL only if you need AEC-Q100 Grade 0/1 qualification - in that case use S912XEQ384J2CAL-V or a fully automotive-graded HCS12X variant per the latest NXP PCN list.

Comparaison avec les alternatives

Paramètre Ce produit MC9S12XEP768CAG S912XEQ384J2CAL S912XEG384J2VAL S912XET512J2VAGR MC9S12XEQ384CAG
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package LQFP-112 (20x20 mm) LQFP-144 LQFP-112 (same) LQFP-112 (same) LQFP-144 LQFP-144
Core Architecture HCS12X (CPU12X) HCS12X (same) HCS12X (same) HCS12X (same) HCS12X (same) HCS12X (same)
Flash Memory 768 KB 768 KB (same) 384 KB 384 KB 512 KB 384 KB
RAM Size 64 KB 64 KB (same) 32 KB 32 KB 32 KB 32 KB
Maximum Frequency 50 MHz 50 MHz (same) 50 MHz (same) 50 MHz (same) 50 MHz (same) 50 MHz (same)
Operating Temperature -40C to +85C (industrial) -40C to +85C -40C to +85C -40C to +105C (extended) -40C to +105C (extended) -40C to +85C
CAN Controllers 4 x ms CAN 2.0 A/B 4 x ms CAN (same) 4 x ms CAN (same) 4 x ms CAN (same) 4 x ms CAN (same) 4 x ms CAN (same)
XGATE Co-processor Yes Yes (same) Yes Yes Yes Yes

Principaux différenciateurs

  • Highest Flash density in the HCS12X LQFP-112 line (vs S912XEQ384J2CAL)
  • Larger RAM for buffering CAN and DMA workloads (vs S912XET512J2VAGR)
  • Industrial temperature grade suited to under-hood environments (vs S912XEG384J2VAL)

Notes de conception

The S912XEP768J4CAL requires a clean 5V supply on VDD pins and a regulated internal rail on VDDR (typically 2.5V generated internally). Place 100 nF ceramic decoupling within 5 mm of every VDD/VSS pair and a 10 uF bulk capacitor near the VDD pins. If using the internal voltage regulator, ensure VDDR has its own 100 nF + 4.7 uF pair. Estimated: at 50 MHz, core current is approximately 60-80 mA depending on peripheral activity, plus 20 mA per active CAN controller.

Route the EXTAL/XTAL traces symmetrically and surround them with a guard ground that connects to the analog ground at a single point near the chip. Keep crystal traces short (<10 mm) to avoid EMI pickup. The BKGD and RESET_b traces must be short and routed away from PWM or CAN outputs to prevent in-circuit noise from triggering spurious BDM entry. Provide a TEST pin tie-down to VSS to disable factory test mode.

Do not leave MODA/MODB/MODC floating at power-up; the default mode determines whether the part boots from internal Flash or waits in BDM. Always wait at least 50 clock cycles after RESET_b goes high before issuing BDM commands, or the BDM will return a sync error. Also, do not enable all four CAN controllers simultaneously in the lowest loop mode without confirming the bus termination is correct, as this will flood the bus with error frames.

Although the HCS12X core runs at modest power, the 768 KB Flash read during continuous ADC sampling can elevate die temperature. Estimated: typical power dissipation at 50 MHz with 3 active CAN controllers and ADC running at 1 MSPS is approximately 350-450 mW. The LQFP-112 has theta_JA around 45 C/W on a standard 4-layer JEDEC test board, giving a 20C rise. Derate above 70C ambient by reducing clock or peripheral count.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Sans plomb
Yes
Sans halogène
Yes
Minerais de conflit
Compliant

RoHS and REACH compliant per distributor listings; JLCPCB and LCSC explicitly mark the part ROHS. The S912XEP768J4CAL is industrial-grade (suffix J4), not AEC-Q100 qualified. For AEC-Q100 designs use automotive-graded S912XEQ384J2CAL-V or similar variants.

Données vérifiées le : 2026-10-19 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

S912XEP768J4CAL S912XEP768J4CAL datasheet NXP HCS12X 768KB flash MCU S912XEP768J4CAL LQFP-112 pinout S912XEP768J4CAL vs MC9S12XEP768CAG HCS12X microcontroller 50MHz 768KB S912XEP768J4CAL automotive CAN gateway S912XEP768J4CAL price buy online S912XEP768J4CAL stock availability S912XEP768J4CAL XGATE co-processor NXP Freescale HCS12X drop-in replacement S912XEP768J4CAL body control module

Composants & termes associés

NXP Semiconductors Freescale Semiconductor S912XEP768J4CAL MC9S12XEP768CAG S912XEQ384J2CAL S912XEG384J2VAL S912XET512J2VAGR MC9S12XEQ384CAG HCS12X CPU12 XGATE microcontroller 16-bit MCU LQFP-112 LQFP-144 RoHS REACH AEC-Q100 CAN 2.0 ms CAN ADC PWM BDM Flash memory EEPROM RAM automotive body control module CAN gateway industrial PLC HVAC controller sensor hub lighting ECU
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