TPS543C20RVFR - 40A 14V Sync Step-Down SWIFT Converter | TI
N.º da peça: TPS543C20RVFR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.85 | $6,85 |
| 10 | $6.17 | $61,70 |
| 100 | $5.48 | $548,00 |
| 500 | $4.93 | $2.465,00 |
| 1.000 | $4.38 | $4.380,00 |
TPS543C20RVFR Visão geral
A buck (step-down) DC-DC switching regulator is a power-management integrated circuit that converts a higher DC input voltage into a lower DC output voltage by rapidly switching an internal MOSFET pair and smoothing the resulting pulsed waveform with an LC output filter. Within the broader power-electronics taxonomy, the TPS543C20 sits in the non-isolated POL (point-of-load) converter family -> DC-DC switching regulator -> voltage regulator -> power-management IC hierarchy. SWIFT converters from TI combine internal MOSFETs, current-mode control, and adaptive compensation to deliver high efficiency at multi-MHz switching frequencies in compact surface-mount footprints.
Key features include integrated 3 mΩ/0.9 mΩ stacked NexFET power stages, differential remote sensing for tight load-point regulation, monolithic integration that eliminates external compensation components, and a stackable architecture that lets two devices operate in parallel for up to 80 A. Internally compensated emulated peak current-mode control provides a wide bandwidth loop, and the switching frequency is synchronizable to an external clock for EMI-sensitive rails. A built-in integrator and ramp-tracking amplifier allow stable operation across the full 0.6 V to 5.5 V output range.
The TPS543C20 architecture uses internal MOSFETs driven by an emulated peak current-mode controller with a clock-synchronizable, fixed-frequency modulator. The internal integrator and directly amplifying ramp tracking loop eliminate the need for external compensation across the wide operating range, simplifying PCB layout and shrinking the BOM. Differential sensing cancels PCB IR-drop in high-current paths, allowing the regulated voltage at the load to remain within ±1% tolerance even at 40 A.
Typical applications include space-constrained point-of-load rails in networking switches and routers, FPGA/ASIC core and transceiver supplies, server and storage POLs, and stacked 80 A configurations for high-current ASIC and processor rails. The 40-pin PowerLFQFN package exposes the die through a thermal pad, allowing multi-layer PCB copper pours to dissipate the heat generated at full load.
When designing with the TPS543C20, observe the datasheet-required minimum input/output capacitor values (including ripple-current-rated ceramics) and keep the SYNC/FSEL loop short to the IC. Differential remote-sense traces must be routed as a matched pair directly to the load to suppress PCB IR-drop in high-current applications.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para TPS543C20RVFR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com TPS543C20RVFR (mesmo formato e footprint) — diferindo em Clock Synchronization, Control Mode, Input Voltage Range, Output Voltage Range, Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
TPS543C20ARVFR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
TPS543C20RVFT
✅ Drop-In✓ Em estoque
$7.1 / unidade
Ver ficha técnica →TPS543C20ARVFT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
TPS543B20RVFR
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
TPS543C20RVFR
✅ Drop-In✓ Em estoque
$4.38 / unidade
Ver ficha técnica →TPS543C20RVFR Classificações máximas e características elétricas
| Topologia | Synchronous Buck (Step-Down) |
| Faixa de tensão de entrada | 4 V to 14 V (A-version: 4 V to 16 V) |
| Faixa de tensão de saída | 0.6 V to 5.5 V |
| Corrente máxima de saída | 40 A continuous |
| Control Mode | Emulated Peak Current Mode |
| Internal MOSFETs (High-Side / Low-Side) | 3 mΩ / 0.9 mΩ stacked NexFET |
| Tipo de saída | Adjustable (resistor divider) |
| Remote Sensing | Differential (true remote sense) |
| Clock Synchronization | Yes (SYNC input) |
| Compensation | Adaptive Internal (no external comp network) |
| Encapsulamento | 40-Pin PowerLFQFN (RVF) with exposed thermal pad |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +125C junction |
| Status RoHS | Compliant |
Configuração de pinos do TPS543C20RVFR
| Pino 1 | VIN — Input voltage supply |
| Pino 2 | VIN — Input voltage supply |
| Pino 3 | PGND — Power ground |
| Pino 4 | SW — Switching node |
| Pino 5 | SW — Switching node |
| Pino 6 | SW — Switching node |
| Pino 7 | SW — Switching node |
| Pino 8 | PGND — Power ground |
| Pino 9 | BOOT — Bootstrap capacitor for high-side gate drive |
| Pino 10 | VOUT — Output voltage sense |
| Pino 11 | VOUT — Output voltage sense |
| Pino 12 | PGND — Power ground |
| Pino 13 | PGND — Power ground |
| Pino 14 | PGND — Power ground |
| Pino 15 | PGND — Power ground |
| Pino 16 | AGND — Analog ground |
| Pino 17 | DIFF+ — Differential remote sense positive |
| Pino 18 | DIFF- — Differential remote sense negative |
| Pino 19 | FBK — Feedback input |
| Pino 20 | REF — Reference voltage output |
| Pino 21 | EN — Enable input |
| Pino 22 | PGOOD — Power-good indicator output |
| Pino 23 | SYNC — External clock synchronization input |
| Pino 24 | FSEL — Frequency select resistor input |
| Pino 25 | MODE — Mode selection (stack primary/secondary) |
| Pino 26 | PWM/STACK — PWM output / stack interface |
| Pino 27 | TRK — Tracking input |
| Pino 28 | SS — Soft-start capacitor |
| Pino 29 | COMP — Compensation node (internal) |
| Pino 30 | AVIN — Analog input supply |
| Pino 31 | PGND — Power ground |
| Pino 32 | PGND — Power ground |
| Pino 33 | PGND — Power ground |
| Pino 34 | PGND — Power ground |
| Pino 35 | VIN — Input voltage supply |
| Pino 36 | VIN — Input voltage supply |
| Pino 37 | VIN — Input voltage supply |
| Pino 38 | VIN — Input voltage supply |
| Pino 39 | VIN — Input voltage supply |
| Pino 40 | NC — Not connected (per datasheet) |
| Pino EP | PGND_PAD — Exposed thermal pad - power ground |
Aplicações típicas
TPS543C20RVFR é adequado para 6 aplicaçãos: FPGA Core and Transceiver POL Supply, Networking Switch and Router ASIC Rails, Server and Storage Point-of-Load Conversion, Stacked 80 A High-Current ASIC Rail, Industrial 24 V to 5 V / 3.3 V Conversion, PCIe Card Auxiliary Power Rails.
FPGA Core and Transceiver POL Supply
The TPS543C20RVFR delivers 0.85 V to 1.8 V rails at up to 40 A directly to high-performance FPGAs (Xilinx Versal, Intel Stratix, etc.). Its 0.6 V to 5.5 V adjustable output covers every common FPGA core and transceiver voltage. Differential remote sensing maintains ±1% regulation at the load by canceling PCB IR-drop in the 40 A power path. Adaptive internal compensation eliminates the comp network that typically clutters dense FPGA power trees, shrinking the POL footprint.
Recomendado
Networking Switch and Router ASIC Rails
Routers and top-of-rack switches require multiple 40 A to 80 A rails for switch ASICs and packet processors. The TPS543C20RVFR handles one rail at 40 A, and two devices stack for 80 A on the most demanding ASIC rails. The SYNC input lets multiple TPS543C20 phases lock to a single clock, eliminating beat-frequency noise in dense multi-rail enclosures. The 4 V to 14 V input accepts standard 12 V backplane/connector power directly.
Recomendado
Server and Storage Point-of-Load Conversion
Inside hyperscale servers, 12 V main bus power is stepped down at the motherboard to 0.6 V to 3.3 V for CPUs, DDR5, and accelerators. The TPS543C20RVFR fits this POL slot with 95% peak efficiency, programmable frequency, and remote sensing. The 40-pin PowerLFQFN footprint allows high-density placement next to memory DIMMs and M.2 SSDs. Stackable architecture scales to 80 A for accelerator cards without paralleling external MOSFETs.
Recomendado
Stacked 80 A High-Current ASIC Rail
Two TPS543C20RVFR devices in a primary-secondary stack deliver 80 A continuous to a single high-current ASIC rail, per the TI reference design. Internal current-sharing loop balances load automatically without external circuitry. This eliminates discrete parallel-FET designs that require complex current-matching networks. Differential sensing on both phases keeps the load-point regulation within ±1% even with 80 A of PCB IR-drop.
Recomendado
Industrial 24 V to 5 V / 3.3 V Conversion
The TPS543C20A revision (4 V to 16 V input) tolerates industrial 24 V rails when paired with a TVS/clamp pre-protector. Its 40 A capability drives motor-control, PLC logic, and industrial Ethernet PHYs at 5 V or 3.3 V. The exposed thermal pad of the PowerLFQFN package couples directly to PCB copper for fan-less cooling in sealed enclosures. Differential sensing compensates for long harness drops in distributed control cabinets.
Recomendado
PCIe Card Auxiliary Power Rails
PCIe accelerator cards draw auxiliary 12 V from the edge connector and step down to 0.8 V to 1.2 V for the local ASIC. The TPS543C20RVFR fits this application with 40 A capability, 12 V input direct from the slot, and a compact 40-pin PowerLFQFN footprint that fits inside tight add-in-card height envelopes. Programmable soft-start lets the card meet PCIe hot-plug inrush limits without extra hot-swap controllers.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para TPS543C20RVFR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | TPS543C20ARVFR | TPS543C20RVFT | TPS543C20ARVFT | TPS543B20RVFR |
|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 40-Pin PowerLFQFN (RVF) | 40-Pin PowerLFQFN (RVF) - same | 40-Pin PowerLFQFN (RVF) - same | 40-Pin PowerLFQFN (RVF) - same | 40-Pin PowerLFQFN (RVF) - same |
| Input Voltage Range | 4 V to 14 V | 4 V to 16 V | 4 V to 14 V | 4 V to 16 V | 4 V to 14 V |
| AEC-Q100 Automotive Qualified | No | No | No | No | No |
| RoHS / Lead-Free | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes |
Principais diferenciais
- Highest power density in 40-pin PowerLFQFN at 40 A (vs TPS543B20RVFR)
- Wider input voltage range with the A-version (vs TPS543C20RVFR (standard))
- True stackable architecture for 80 A (vs TPS543C20RVFT (single phase))
Notas de projeto
Estimated: At VIN=12V, VOUT=1.0V, 40A load, the TPS543C20RVFR dissipates approximately 12 V x 40 A x (1 - 0.95) = 24 W (assuming 95% efficiency). The 40-pin PowerLFQFN package couples this heat through its exposed thermal pad to PCB copper. Per TI TPS543C20 datasheet, designers should use a minimum 6-layer board with at least 1 oz copper on inner layers and a 2 oz top layer to keep junction temperature below 125C. A thermal pad land with at least 25 thermal vias into the inner copper pour is mandatory.
Differential remote sense traces (DIFF+ and DIFF-) must be routed as a matched-length, tightly-coupled pair directly from the IC pins to the load sense points, per TI TPS543C20 datasheet layout guidelines. This cancels common-mode noise from the switching node and prevents ground loops. Place the SYNC and FSEL traces away from the SW node to avoid capacitive coupling; if possible, shield them with a ground trace. Keep input/output ceramic capacitors (X7R, ripple-current rated) within 2 mm of the IC pins.
Do not exceed the absolute maximum input voltage of 18 V on the TPS543C20 (14 V version) or 20 V on the TPS543C20A (16 V version) per the TI datasheet. The TPS548D21RVFT is NOT pin-compatible with the TPS543C20 - per the TI E2E forum, switching between them requires redesign of both schematic and PCB layout. When stacking two devices for 80 A, follow the TI TPS543C20 reference design exactly to ensure the primary/secondary current-sharing loop remains stable across all load steps.
Keep the SW (switching) node copper area small to minimize radiated EMI. Use a shielded inductor (semi-toroidal) at the output rather than an open drum core to reduce near-field emissions. The exposed thermal pad (EP) must be soldered to a sufficiently large copper pour (per datasheet minimum) to keep thermal resistance within the spec. Star-ground the analog GND (AGND) returns into the PGND at a single point to avoid ground bounce corrupting the feedback loop.
Informações de conformidade
RoHS compliant and lead-free per TI product page. Halogen-free and full material declaration available via TI MDDS download. Not AEC-Q100 qualified - for automotive designs use the TPS543C20-Q1 variants. For full SVHC REACH declaration see ti.com/product/TPS543C20.
