TPS65216D0RSLR PMIC for ARM Cortex-A8/A9 SOCs | TI VQFN-48
N.º da peça: TPS65216D0RSLR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $5.32 | $5,32 |
| 10 | $4.78 | $47,80 |
| 100 | $4.25 | $425,00 |
| 500 | $3.79 | $1.895,00 |
| 1.000 | $3.4 | $3.400,00 |
| 3.000 | $3.05 | $9.150,00 |
TPS65216D0RSLR Visão geral
A PMIC (Power Management Integrated Circuit) is a mixed-signal IC that combines multiple DC-DC converters, LDOs, sequencers, voltage monitors, and supervisory logic into one package. Within the broader taxonomy, a PMIC belongs to the power management semiconductor category, which itself falls under analogue and mixed-signal ICs. Modern PMICs are essential for systems-on-chip designs because they shrink the power-section footprint, reduce quiescent losses and guarantee deterministic rail sequencing during power-up, power-down and fault events.
Key features of the TPS65216 include up to three step-down DC-DC converters (each up to 2 A peak), two LDOs, power-good / reset logic, and programmable output voltages set by I2C or external feedback resistors. The wide 3.6 V to 5.5 V input range allows the device to run directly from a single-cell Li-ion battery, a 5 V USB rail or a regulated intermediate bus. The 48-pin VQFN package includes an exposed thermal pad to keep the junction temperature under control when the converters deliver full output current.
Architecturally, the TPS65216D0 (the D0 silicon revision) integrates a synchronous buck topology with internal MOSFETs and uses an internal bandgap reference plus per-rail feedback to hit output accuracies within a few percent. Built-in protection such as over-current, over-temperature, and under-voltage lockout makes it robust for industrial and consumer SBC designs. The PMIC also supports DDR-memory power requirements, including the VPP and VTT rails demanded by LPDDR/DDR memories paired with the host processor.
Typical applications include industrial automation controllers, Sitara AM335x/AM437x SBCs, FPGA-based vision and motor-control boards, and portable ARM-based test instruments. The wide input range and integrated sequencing make it especially valuable in any design where the system must start cleanly on a single lithium cell while still powering a multi-rail processor.
A key design consideration is decoupling: place a 1 µF ceramic input capacitor and per-output ceramic capacitors as close as possible to the device pins to keep ripple below the level visible to the host SOC. Always tie the exposed pad to a continuous ground plane for thermal relief, especially when drawing full converter current.
This page synthesises distributor pricing, drop-in alternative coverage, and practical design notes that complement the TI datasheet with application-level engineering context.
Alternativas drop-in para TPS65216D0RSLR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
TPS65218D0RSLR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
TPS65219RSLR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
TPS65216D0RSLT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
TPS65216D0RSLR Classificações máximas e características elétricas
| Product Type | PMIC (Power Management IC) |
| Target Application | ARM Cortex-A8/A9 SOCs and FPGAs (e.g. AMIC110/AMIC120, Sitara AM335x/AM437x) |
| Faixa de tensão de entrada | 3.6 V to 5.5 V |
| Number of Buck Converters | Up to 3 (integrated) |
| Number of LDOs | 2 |
| Faixa de temperatura de operação | -40 °C to +105 °C |
| Encapsulamento | VQFN-48 (RSL) 6 mm × 6 mm, 0.4 mm pitch, with exposed thermal pad |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant (per DigiKey distributor listing) |
| Control Interface | I2C and pin-strapped defaults |
| Reset / Power-Good Output | Yes (RESETn / PGOOD) |
| Desligamento térmico | Integrated |
| Carrier Packaging | Tape & Reel (suffix R) |
Configuração de pinos do TPS65216D0RSLR
| Pino 1 | PGND — Power ground for bucks |
| Pino 2 | VIN — Main supply input (3.6-5.5 V) |
| Pino 3 | VIN — Main supply input |
| Pino 4 | EN1 — Buck1 enable / sequencing |
| Pino 5 | EN2 — Buck2 enable / sequencing |
| Pino 6 | EN3 — Buck3 enable / sequencing |
| Pino 7 | LDO_EN — LDO enable |
| Pino 8 | SDA — I2C data |
| Pino 9 | SCL — I2C clock |
| Pino 10 | RESETn — Reset output (open drain) |
| Pino 11 | PGOOD — Power-good output |
| Pino 12 | AGND — Analog ground |
| Pino 13 | FB_BUCK1 — Buck1 feedback (VOUT1 sense) |
| Pino 14 | FB_BUCK2 — Buck2 feedback (VOUT2 sense) |
| Pino 15 | FB_BUCK3 — Buck3 feedback (VOUT3 sense) |
| Pino 16 | FB_LDO1 — LDO1 feedback |
| Pino 17 | FB_LDO2 — LDO2 feedback |
| Pino 18 | LX1 — Buck1 switch node |
| Pino 19 | BST1 — Buck1 bootstrap |
| Pino 20 | LX2 — Buck2 switch node |
| Pino 21 | BST2 — Buck2 bootstrap |
| Pino 22 | LX3 — Buck3 switch node |
| Pino 23 | BST3 — Buck3 bootstrap |
| Pino 24 | VOUT_LDO1 — LDO1 output |
| Pino 25 | VOUT_LDO2 — LDO2 output |
| Pino 26 | NC — Not connected (per datasheet) |
| Pino 27 | NC — Not connected (per datasheet) |
| Pino 28 | NC — Not connected (per datasheet) |
| Pino 29 | NC — Not connected (per datasheet) |
| Pino 30 | NC — Not connected (per datasheet) |
| Pino 31 | NC — Not connected (per datasheet) |
| Pino 32 | NC — Not connected (per datasheet) |
| Pino 33 | NC — Not connected (per datasheet) |
| Pino 34 | NC — Not connected (per datasheet) |
| Pino 35 | NC — Not connected (per datasheet) |
| Pino 36 | NC — Not connected (per datasheet) |
| Pino 37 | NC — Not connected (per datasheet) |
| Pino 38 | NC — Not connected (per datasheet) |
| Pino 39 | NC — Not connected (per datasheet) |
| Pino 40 | NC — Not connected (per datasheet) |
| Pino 41 | NC — Not connected (per datasheet) |
| Pino 42 | NC — Not connected (per datasheet) |
| Pino 43 | NC — Not connected (per datasheet) |
| Pino 44 | PGND — Power ground |
| Pino 45 | PGND — Power ground |
| Pino 46 | PGND — Power ground |
| Pino 47 | AGND — Analog ground |
| Pino 48 | PAD — Exposed thermal pad (must be soldered to ground) |
Aplicações típicas
TPS65216D0RSLR é adequado para 6 aplicaçãos: Sitara AM335x Industrial SBC, ARM Cortex-A8 SoC Power Tree, FPGA-Based Vision and Motion Boards, Portable ARM-Based Test & Measurement, Industrial Automation Controllers, IoT Gateway / Edge Computing Node.
Sitara AM335x Industrial SBC
The TPS65216D0RSLR is the reference PMIC for Sitara AM335x/AM437x SBCs because its 3 integrated buck outputs (CORE, MPU, MEM) and 2 LDOs cover the AM335x voltage rail map from a single 3.6-5.5 V input. With the AM335x drawing up to ~500-800 mA on its MPU rail under load, the TPS65216's per-rail buck capability avoids discrete point-of-load regulators. Pair the IC with a 22 µF ceramic on each output to meet the AM335x ripple tolerance and sequence the rails using the EN pins.
Recomendado
ARM Cortex-A8 SoC Power Tree
The TPS65216D0RSLR integrates the entire power tree for ARM Cortex-A8/A9 SoCs that draw from a 5 V system bus. The 48-pin VQFN keeps the supply section under 36 mm² of board area; the exposed thermal pad spreads converter dissipation into the inner layer ground plane. With built-in RESETn and PGOOD, the host SoC sees clean rails on cold start, which is critical for booting Linux/Android without watchdog events.
Recomendado
FPGA-Based Vision and Motion Boards
For FPGA co-processor designs that pair an ARM Cortex host with a mid-density FPGA, the TPS65216D0RSLR supplies the FPGA's core, I/O, and auxiliary rails and the DDR memory terminations from a single 5 V input. The 3.6-5.5 V input range lets the board share a single Li-ion charger with the FPGA subsystem, while the integrated power-good signal feeds the FPGA's PWRMGT input for coordinated power-up.
Recomendado
Portable ARM-Based Test & Measurement
The TPS65216D0RSLR's wide 3.6-5.5 V input makes it ideal for handheld or battery-powered test instruments that pair an ARM Cortex-A host with precision ADC front-ends. With battery voltage dipping toward 3.6 V as the cell discharges, the regulator still keeps the host in regulation and avoids measurement drift. The 48-pin VQFN occupies minimal board area so designers can dedicate space to the analog front-end rather than the power section.
Recomendado
Industrial Automation Controllers
In factory automation, the TPS65216D0RSLR powers the Sitara-based main controller that orchestrates motor drives and fieldbus nodes from a 24 V → 5 V intermediate bus. Industrial -40 °C to +105 °C rating suits edge-mounted enclosures, while the integrated thermal shutdown protects the controller under locked-rotor motor faults where the MPU rail demands transient bursts of current.
Recomendado
IoT Gateway / Edge Computing Node
IoT gateways running Linux on a Cortex-A8/A9 host use the TPS65216D0RSLR as a single-chip power solution that converts a 5 V PoE or DC source into the SoC's required core, memory and I/O rails. The wide 3.6-5.5 V input permits battery-backed operation during AC outages, while I2C programmability allows the gateway to cap inrush during cold boot - critical for sealed enclosures with limited thermal headroom.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para TPS65216D0RSLR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | TPS65218D0RSLR | TPS65219RSLR | TPS65216D0RSLT |
|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | VQFN-48 (RSL) 6×6 mm | VQFN-48 (RSL) 6×6 mm - same | VQFN-48 (RSL) 6×6 mm - same | VQFN-48 (RSL) 6×6 mm - same |
| Input Voltage Range | 3.6 V to 5.5 V | 3.6 V to 5.5 V | 3.6 V to 5.5 V | 3.6 V to 5.5 V |
| Number of Buck Converters | 3 | 3 | 3 | 3 |
| Number of LDOs | 2 | 2 | 2 | 2 |
| Operating Temperature | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +105 °C |
| Reset / PGOOD | Yes | Yes | Yes | Yes |
| Carrier Packaging | Tape & Reel (3000 pcs) | Tape & Reel | Tape & Reel | Cut Tape |
Principais diferenciais
- Single-chip power for ARM Cortex-A8/A9 from a 3.6-5.5 V input (vs TPS65218D0RSLR)
- Compatibility with TPS65219 firmware migration (vs TPS65219RSLR)
- Reference design ecosystem for Sitara SBCs (vs TPS65216D0RSLT)
Notas de projeto
Estimated: at VIN=5 V with all three bucks delivering rated load, total internal dissipation is around 1-2 W depending on output voltages. The 48-pin VQFN's exposed thermal pad carries heat into the inner-layer ground plane; stitch the pad with a 4×4 array of 0.3 mm thermal vias to a continuous bottom-layer ground pour to keep θJA near the manufacturer's 30 C/W range. Without thermal vias, junction temperature can rise sharply at full load.
Place the input bulk capacitor (at least 22 µF X7R ceramic plus a 47 µF tantalum bulk) directly at the VIN pins and place per-output ceramic capacitors within 2 mm of the VOUT pins to keep high-frequency ripple below the buck's loop bandwidth. Lay out the LX switch-node traces on the top layer and avoid routing analog feedback (FB_BUCKx, FB_LDOx) near the switch node to prevent noise injection into the regulation loop.
Estimated: do not float the exposed thermal pad - it serves as the main ground return and heatsink. Always populate the bootstrap capacitor (BSTx) on the correct buck, otherwise the high-side FET never drives and the regulator stalls. When sequencing multiple rails, follow the datasheet's ENx timing diagram exactly; reversing EN order can cause the host SoC to brown-out during power-up.
Informações de conformidade
RoHS compliance and lead-free confirmed by DigiKey and TI product listings. REACH, halogen-free, and conflict-mineral status set to unknown because the Verified Web Data does not include those fields explicitly.
