Xilinx

XC3090L-6TQ176I - XC3000L 320MHz FPGA 176-pin TQFP | Xilinx

N.º da peça: XC3090L-6TQ176I ✗ Fim de vida

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TQFP-176 (TQ176) Package -6 Speed SRAM (volatile, external PROM required) Memory

A partir de $140 USD / unidade

MOQ: 1 |

Preço atualizado: 2026-09-13

Preços por volume

Qtd.	Preço unitário	Total
1	$220	$220,00
10	$198	$1.980,00
100	$175	$17.500,00
500	$155	$77.500,00
1.000	$140	$140.000,00

ℹ️ Todos os preços estão em USD

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Quantidade

XC3090L-6TQ176I Visão geral

The Xilinx XC3090L-6TQ176I is a member of the XC3000L Low Voltage Logic Cell Array Family of Field-Programmable Gate Arrays, housed in a 176-pin TQFP package with -6 speed grade and industrial temperature rating. The XC3000L family uses a low-voltage SRAM-based logic cell architecture optimized for low-power, high-density designs, and the XC3090L device delivers approximately 320 MHz of combinatorial logic performance with 100 I/O pins organized into four I/O banks for mixed-voltage interfacing.

A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and configurable I/O cells. Unlike ASICs, FPGAs can be reconfigured after manufacturing, making them ideal for prototyping, low-volume production, and designs requiring late-stage hardware changes. In the system hierarchy, an FPGA sits between discrete logic and ASICs in terms of cost-per-volume and design flexibility, and the XC3000L family occupies an early-generation position in this lineage with simpler routing resources than modern FPGA families.

Key features of the XC3090L-6TQ176I include 5V-tolerant I/O with low-voltage core operation, on-chip configuration memory, JTAG boundary-scan support, and configurable output drive strength. The TQ-176 package offers a 1.0 mm lead pitch and a compact footprint compatible with standard surface-mount assembly processes. The -6 speed grade balances timing margin against power consumption, while the I suffix indicates the industrial temperature range from -40C to +85C.

The XC3000L architecture uses a symmetrical array of Configurable Logic Blocks connected by a hierarchical routing network with short, long, and direct interconnect segments. Each CLB contains combinational logic, look-up tables, and flip-flops that the user can interconnect to implement arbitrary digital functions. Configuration bitstreams are loaded serially or in parallel from an external PROM at power-up.

Typical applications include industrial control and instrumentation, glue logic replacement, telecommunications interface cards, and legacy system maintenance where the original XC3000L design must remain available for repair and long-life-cycle production. The industrial temperature grade also suits factory automation, medical equipment, and other environments where commercial-grade parts would fail.

When designing with this device, consider configuration PROM selection carefully: the XC3000L series loads its bitstream from a serial configuration PROM, and not all modern PROMs are compatible. The 176-pin TQFP requires a generous PCB keep-out zone for the leads and a fine-pitch soldering profile to avoid tombstoning on small passive parts.

This page synthesizes distributor pricing, package-level drop-in alternatives from the same XC3000L family, and practical design notes not found in the manufacturer datasheet alone.

Alternativas drop-in para XC3090L-6TQ176I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com XC3090L-6TQ176I (mesmo formato e footprint) — diferindo em Package, Configuration Memory, Speed Grade, Operating Temperature, Family.

XC3090L-6TQ176C

Xilinx

Package: TQFP-176 (TQ)

Configuration Memory: SRAM (volatile, requires boot PROM)

Operating Temperature: -40 C to +85 C (commercial, per TQ176 suffix)