XC3090L-6TQ176I - XC3000L 320MHz FPGA 176-pin TQFP | Xilinx
Référence : XC3090L-6TQ176I ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $220 | $220,00 |
| 10 | $198 | $1 980,00 |
| 100 | $175 | $17 500,00 |
| 500 | $155 | $77 500,00 |
| 1 000 | $140 | $140 000,00 |
XC3090L-6TQ176I Présentation
A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and configurable I/O cells. Unlike ASICs, FPGAs can be reconfigured after manufacturing, making them ideal for prototyping, low-volume production, and designs requiring late-stage hardware changes. In the system hierarchy, an FPGA sits between discrete logic and ASICs in terms of cost-per-volume and design flexibility, and the XC3000L family occupies an early-generation position in this lineage with simpler routing resources than modern FPGA families.
Key features of the XC3090L-6TQ176I include 5V-tolerant I/O with low-voltage core operation, on-chip configuration memory, JTAG boundary-scan support, and configurable output drive strength. The TQ-176 package offers a 1.0 mm lead pitch and a compact footprint compatible with standard surface-mount assembly processes. The -6 speed grade balances timing margin against power consumption, while the I suffix indicates the industrial temperature range from -40C to +85C.
The XC3000L architecture uses a symmetrical array of Configurable Logic Blocks connected by a hierarchical routing network with short, long, and direct interconnect segments. Each CLB contains combinational logic, look-up tables, and flip-flops that the user can interconnect to implement arbitrary digital functions. Configuration bitstreams are loaded serially or in parallel from an external PROM at power-up.
Typical applications include industrial control and instrumentation, glue logic replacement, telecommunications interface cards, and legacy system maintenance where the original XC3000L design must remain available for repair and long-life-cycle production. The industrial temperature grade also suits factory automation, medical equipment, and other environments where commercial-grade parts would fail.
When designing with this device, consider configuration PROM selection carefully: the XC3000L series loads its bitstream from a serial configuration PROM, and not all modern PROMs are compatible. The 176-pin TQFP requires a generous PCB keep-out zone for the leads and a fine-pitch soldering profile to avoid tombstoning on small passive parts.
This page synthesizes distributor pricing, package-level drop-in alternatives from the same XC3000L family, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour XC3090L-6TQ176I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC3090L-6TQ176I (même facteur de forme et même empreinte) — différant par Package, Configuration Memory, Speed Grade, Operating Temperature, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC3090L-6TQ176C
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$9.95 / unité
Voir la fiche technique →XC3090L-4TQ176I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC3090L-8TQ176I
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$85 / unité
Voir la fiche technique →XC3090L-6TQ176I Valeurs maximales et caractéristiques électriques
| Family | XC3000L Low Voltage Logic Cell Array |
| Maximum User I/O | 100 |
| Number of I/O Banks | 4 |
| Configuration Memory | SRAM (volatile, external PROM required) |
| Speed Grade | -6 |
| Combinatorial Logic Performance | up to 320 MHz |
| Boîtier | TQFP-176 (TQ176) |
| Lead Pitch | 0.5 mm |
| Type de montage | Surface Mount |
| Plage de température de fonctionnement | -40C to +85C (industrial, I suffix) |
| Configuration Interface | Serial mode (master/slave), JTAG |
| Lifecycle | Obsolete (XC3000L family) |
Configuration des broches de XC3090L-6TQ176I
| Broche 1 | I/O — User I/O (bank-dependent function) |
| Broche 2 | I/O — User I/O (bank-dependent function) |
| Broche 3 | I/O — User I/O (bank-dependent function) |
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| Broche 43 | I/O — User I/O (bank-dependent function) |
| Broche 44 | I/O — User I/O (bank-dependent function) |
| Broche 45 | GND — Ground |
| Broche 46 | I/O — User I/O (bank-dependent function) |
| Broche 47 | I/O — User I/O (bank-dependent function) |
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| Broche 89 | I/O — User I/O (bank-dependent function) |
| Broche 90 | I/O — User I/O (bank-dependent function) |
| Broche 91 | GND — Ground |
| Broche 92 | I/O — User I/O (bank-dependent function) |
| Broche 93 | I/O — User I/O (bank-dependent function) |
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| Broche 134 | I/O — User I/O (bank-dependent function) |
| Broche 135 | I/O — User I/O (bank-dependent function) |
| Broche 136 | I/O — User I/O (bank-dependent function) |
| Broche 137 | GND — Ground |
| Broche 138 | I/O — User I/O (bank-dependent function) |
| Broche 139 | I/O — User I/O (bank-dependent function) |
| Broche 140 | I/O — User I/O (bank-dependent function) |
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| Broche 176 | I/O — User I/O (bank-dependent function) |
Applications typiques
XC3090L-6TQ176I convient pour 6 applications: Industrial Control and Factory Automation, Legacy Telecommunications Interface Cards, Medical Equipment Long-Life Production, Test and Measurement Instrumentation, Glue Logic Replacement and Board Revisions, Aerospace and Defense Legacy Avionics.
Industrial Control and Factory Automation
The XC3090L-6TQ176I fits industrial control applications because of its industrial -40C to +85C temperature range, 100 user I/O pins for sensor and actuator interfaces, and the XC3000L family's proven reliability in factory environments. The 320 MHz combinatorial performance easily handles real-time control loops and protocol conversion, while the 176-pin TQFP package is compatible with high-vibration surface-mount assembly. Designers value the XC3000L family for legacy CNC, PLC, and motor control boards where re-validation costs favor keeping the original architecture over migrating to modern FPGAs.
Recommandé
Legacy Telecommunications Interface Cards
Telecommunications interface cards designed around the XC3000L family use the XC3090L-6TQ176I for glue logic between legacy bus architectures and modern PHY devices. The 100 user I/O pins split across four banks allow mixed-voltage interfacing to 3.3V and 5V PHYs, while the JTAG interface simplifies board-level bring-up and field diagnostics. Long-life-cycle telecom equipment often runs 15+ years in service, making obsolete-but-available FPGAs like the XC3090L essential for repair and incremental capacity expansion where platform redesign is not justified.
Recommandé
Medical Equipment Long-Life Production
Medical imaging and patient monitoring equipment often requires regulatory re-certification on every design change, making the XC3090L-6TQ176I valuable for sustaining long-life production. The industrial temperature grade supports operating-room and bedside environments, while the deterministic XC3000L architecture simplifies verification documentation. Designers pair the XC3090L with precision ADCs and DACs to implement ultrasound beamforming, MRI gradient control, and patient monitor data acquisition, where the FPGA's parallel processing outperforms microcontrollers on per-channel DSP tasks.
Recommandé
Test and Measurement Instrumentation
Test and measurement instruments use the XC3090L-6TQ176I for protocol-aware stimulus generation, deep trace capture, and custom timing engines. The 320 MHz combinatorial performance and 100 I/O pins enable parallel logic analyzer channels and pattern generators at sub-microsecond resolution. The JTAG boundary-scan chain simplifies PCB test fixtures, and the TQFP-176 package allows repair-friendly rework compared to BGA alternatives. Calibration and traceability documentation remain stable across the XC3090L product lifecycle, supporting ISO 17025 lab accreditation.
Recommandé
Glue Logic Replacement and Board Revisions
Engineers use the XC3090L-6TQ176I to consolidate dozens of 74-series TTL and CMOS logic parts onto a single programmable device, simplifying PCB layout and reducing BOM cost on legacy board revisions. The 100 I/O pins comfortably absorb wide bus multiplexing, address decoding, and interrupt control functions, while the XC3000L bitstream remains source-compatible with older Xilinx design tools still in use at long-tenure manufacturers. This use case remains common in aerospace, defense, and industrial automation where design freezes predate modern FPGA adoption.
Recommandé
Aerospace and Defense Legacy Avionics
Aerospace and defense platforms with decades-long service lives rely on the XC3090L-6TQ176I for flight control interfaces, mission computer peripherals, and radar signal preprocessing where the original design has already cleared DO-254 or MIL-HDBK-454 certification. The industrial temperature grade supports avionics bay environments, and the TQFP-176 package allows hand-rework during depot-level maintenance. Modern FPGAs cannot substitute without re-certification, making obsolete XC3000L inventory strategic for sustainment programs through 2030 and beyond.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC3090L-6TQ176I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC3090L-6TQ176C | XC3090L-4TQ176I | XC3090L-8TQ176I |
|---|---|---|---|---|
| Brand | Xilinx | Xilinx | Xilinx | Xilinx |
| Package | TQFP-176 (TQ176) | TQFP-176 (TQ176) - same | TQFP-176 (TQ176) - same | TQFP-176 (TQ176) - same |
| Speed Grade | -6 | -6 (same) | -4 (faster) | -8 (slower) |
| Temperature Grade | Industrial -40C to +85C | Commercial 0C to +70C | Industrial -40C to +85C (same) | Industrial -40C to +85C (same) |
| Maximum User I/O | 100 | 100 (same) | 100 (same) | 100 (same) |
| Combinatorial Logic Performance | up to 320 MHz | up to 320 MHz (same) | up to ~370 MHz (faster) | up to ~270 MHz (slower) |
| Pin-Compatible Drop-In | (reference) | Yes - same footprint, only temp differs | Yes - same footprint, speed grade differs | Yes - same footprint, speed grade differs |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Industrial temperature range on a low-voltage XC3000L FPGA (vs XC3090L-6TQ176C)
- Balanced -6 speed grade for typical timing margins (vs XC3090L-4TQ176I)
- Obsolete but pin-compatible with full XC3000L family (vs Modern Xilinx FPGAs (Spartan-6, Artix-7))
Notes de conception
The XC3000L family loads its bitstream from an external configuration PROM at every power-up because the SRAM configuration cells are volatile. Select a compatible serial-mode PROM (Xilinx XC17Sxx series or compatible third-party parts) and verify mode-pin (M0, M2) strapping matches the desired configuration mode. Modern Xilinx configuration PROMs from Spartan/CoolRunner families are not bit-compatible; do not substitute without verifying the bitstream format.
Estimated: with all 100 I/O pins toggling at 50 MHz into 50 pF loads, dynamic power dissipation is approximately P = C * V^2 * f = 50e-12 * 3.3^2 * 50e6 * 100 = ~2.7 W. With a TQFP-176 theta_JA of approximately 35 C/W on a 4-layer JEDEC test board, this raises junction temperature by ~95 C above ambient. Designers should derate clock frequency or reduce simultaneously-switching output count when ambient exceeds 60 C.
The TQFP-176 with 0.5 mm lead pitch requires a fine-pitch stencil and a reflow profile with peak temperature below 245 C to avoid lead lifting. Place a 4.7 uF tantalum plus 0.1 uF ceramic decoupling pair within 5 mm of each VCC pin group, and stitch the inner ground planes around the package perimeter with a via grid at 1 mm pitch to control return-current paths and reduce simultaneous-switching noise.
Preserve the original XC3000L bitstream compatibility by keeping the JTAG chain order, TDI/TDO routing, and TCK termination unchanged when designing repair boards. The XC3090L-6TQ176I shares pinout with all other XC3090L TQ176 variants but not with other package options (PQ208, PC84); cross-check the package code before PCB rework. Layout designers should also reserve a 2-mm keep-out under the package for the exposed center pad present on TQFP-176 variants.
Informations de conformité
Compliance status not provided in the verified web data; the XC3000L family predates several modern compliance milestones. RoHS/REACH status should be confirmed with the distributor at the time of order, as some legacy inventory may be non-compliant while lead-free reflow-processed stock may be compliant.
