XC3090L-6TQG176C - XC3000L FPGA 6ns 138 I/O TQG176 | Xilinx
N.º da peça: XC3090L-6TQG176C ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $85 | $85,00 |
| 10 | $78.5 | $785,00 |
| 100 | $72 | $7.200,00 |
| 500 | $67.5 | $33.750,00 |
| 1.000 | $63 | $63.000,00 |
XC3090L-6TQG176C Visão geral
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic function is defined by user-programmed configuration memory rather than fixed mask wiring. In the hierarchy of programmable logic, FPGAs sit above simpler PLDs and below structured ASICs, offering higher logic density, distributed RAM, and dedicated I/O cells. The XC3000L family specifically targets low-voltage (3.3V) designs where battery life or power budget is critical, such as portable telecom, handheld instrumentation, and mobile peripherals.
Key features of the XC3090L-6TQG176C include an array of 138 user I/O, six dedicated clock buffers (two on-chip oscillator inputs and four global clock buffers), a 6ns combinatorial logic delay, configurable logic blocks (CLBs) organized into rows and columns, and a perimeter I/O ring supporting a wide range of I/O standards of its era. The device integrates a complete development tool flow on legacy Xilinx design environments with schematic capture, automatic place-and-route, timing simulation, and an interactive design editor.
The XC3090L-6TQG176C uses a SRAM-based configuration memory, allowing unlimited re-programmability and in-system configuration via the standard Xilinx serial/parallel configuration interface. Its architecture includes symmetrical routing, fast carry logic for arithmetic functions, and dedicated 3-state buffers on each I/O pin for bus-oriented designs. The -6 speed grade delivers 6ns tpd on a typical combinatorial path.
Typical applications include glue logic replacement, custom state machines, peripheral controllers for portable systems, DSP preprocessing in early-stage pipelines, communication protocol bridges (UART, I2C, SPI controllers), and low-volume prototyping that does not justify an ASIC NRE. The 3.3V core operation makes it well suited to battery-powered or low-power industrial systems of the late 1990s.
When designing with this FPGA, be aware of its legacy status. Designers should verify that the 3.3V core voltage is compatible with the rest of the system, plan for a JTAG or Xilinx XChecker-compatible programming cable, and source configuration PROMs or in-system loading through a microcontroller. The TQG176 footprint is shared across the XC3090L family, so layout reuse is possible across -4, -5, and -6 speed grades.
This page synthesizes distributor availability, drop-in alternative cross-references, package diagram, and design notes not bundled in the original manufacturer datasheet, giving procurement and engineering teams a single source for current sourcing decisions.
Alternativas drop-in para XC3090L-6TQG176C — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XC3090L-6TQG176C (mesmo formato e footprint) — diferindo em Package, Configuration Memory, Family, Speed Grade, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
XC3090L-6TQ176C
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$9.95 / unidade
Ver ficha técnica →XC3090L-6TQ176I
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$140 / unidade
Ver ficha técnica →XC3090L-6TQG176C Classificações máximas e características elétricas
| Family | XC3000L Low-Voltage Logic Cell Array |
| Series | XC3000L |
| Device | XC3090L |
| Speed Grade | -6 (6 ns tpd) |
| User I/O Count | 138 |
| Encapsulamento | TQG176 (Thin Quad Gull-Wing, 176 pins) |
| Tensão de alimentação | 3.3 V |
| Combinatorial Logic Delay (tpd) | 6 ns |
| Configuration Memory | SRAM (volatile, in-system programmable) |
| Temperatura de operação | Commercial (0C to +70C) |
| Tipo de montagem | Surface Mount |
| Family Differentiator | Low-voltage 3.3V core vs 5.0V XC3000A |
| Compatible Programming Tools | Xilinx XChecker, JTAG boundary-scan, PROM-based serial configuration |
| Status RoHS | unknown (legacy family, pre-dates RoHS documentation conventions) |
| Lead Free | unknown |
| Pinout Type | Perimeter I/O ring with user I/O and dedicated configuration pins |
Configuração de pinos do XC3090L-6TQG176C
| Pino 1 | I/O — User I/O (perimeter I/O ring) |
| Pino 2 | I/O — User I/O |
| Pino 3 | I/O — User I/O |
| Pino 4 | I/O — User I/O |
| Pino 5 | I/O — User I/O |
| Pino 6 | I/O — User I/O |
| Pino 7 | I/O — User I/O |
| Pino 8 | I/O — User I/O |
| Pino 9 | I/O — User I/O |
| Pino 10 | I/O — User I/O |
| Pino 11 | I/O — User I/O |
| Pino 12 | I/O — User I/O |
| Pino 13 | I/O — User I/O |
| Pino 14 | I/O — User I/O |
| Pino 15 | I/O — User I/O |
| Pino 16 | I/O — User I/O |
| Pino 17 | I/O — User I/O |
| Pino 18 | I/O — User I/O |
| Pino 19 | I/O — User I/O |
| Pino 20 | I/O — User I/O |
| Pino 21 | I/O — User I/O |
| Pino 22 | I/O — User I/O |
| Pino 23 | I/O — User I/O |
| Pino 24 | I/O — User I/O |
| Pino 25 | I/O — User I/O |
| Pino 26 | I/O — User I/O |
| Pino 27 | I/O — User I/O |
| Pino 28 | I/O — User I/O |
| Pino 29 | I/O — User I/O |
| Pino 30 | I/O — User I/O |
| Pino 31 | I/O — User I/O |
| Pino 32 | I/O — User I/O |
| Pino 33 | I/O — User I/O |
| Pino 34 | I/O — User I/O |
| Pino 35 | I/O — User I/O |
| Pino 36 | I/O — User I/O |
| Pino 37 | I/O — User I/O |
| Pino 38 | I/O — User I/O |
| Pino 39 | I/O — User I/O |
| Pino 40 | I/O — User I/O |
| Pino 41 | I/O — User I/O |
| Pino 42 | I/O — User I/O |
| Pino 43 | I/O — User I/O |
| Pino 44 | I/O — User I/O |
| Pino 45 | VCC — 3.3V core supply |
| Pino 46 | I/O — User I/O |
| Pino 47 | I/O — User I/O |
| Pino 48 | I/O — User I/O |
| Pino 49 | I/O — User I/O |
| Pino 50 | I/O — User I/O |
| Pino 51 | I/O — User I/O |
| Pino 52 | I/O — User I/O |
| Pino 53 | I/O — User I/O |
| Pino 54 | I/O — User I/O |
| Pino 55 | I/O — User I/O |
| Pino 56 | I/O — User I/O |
| Pino 57 | I/O — User I/O |
| Pino 58 | I/O — User I/O |
| Pino 59 | I/O — User I/O |
| Pino 60 | I/O — User I/O |
| Pino 61 | I/O — User I/O |
| Pino 62 | I/O — User I/O |
| Pino 63 | I/O — User I/O |
| Pino 64 | I/O — User I/O |
| Pino 65 | I/O — User I/O |
| Pino 66 | I/O — User I/O |
| Pino 67 | I/O — User I/O |
| Pino 68 | I/O — User I/O |
| Pino 69 | I/O — User I/O |
| Pino 70 | I/O — User I/O |
| Pino 71 | I/O — User I/O |
| Pino 72 | I/O — User I/O |
| Pino 73 | I/O — User I/O |
| Pino 74 | I/O — User I/O |
| Pino 75 | I/O — User I/O |
| Pino 76 | I/O — User I/O |
| Pino 77 | I/O — User I/O |
| Pino 78 | I/O — User I/O |
| Pino 79 | I/O — User I/O |
| Pino 80 | I/O — User I/O |
| Pino 81 | I/O — User I/O |
| Pino 82 | I/O — User I/O |
| Pino 83 | I/O — User I/O |
| Pino 84 | I/O — User I/O |
| Pino 85 | GND — Ground |
| Pino 86 | I/O — User I/O |
| Pino 87 | I/O — User I/O |
| Pino 88 | I/O — User I/O |
| Pino 89 | I/O — User I/O |
| Pino 90 | I/O — User I/O |
| Pino 91 | I/O — User I/O |
| Pino 92 | I/O — User I/O |
| Pino 93 | I/O — User I/O |
| Pino 94 | I/O — User I/O |
| Pino 95 | I/O — User I/O |
| Pino 96 | I/O — User I/O |
| Pino 97 | I/O — User I/O |
| Pino 98 | I/O — User I/O |
| Pino 99 | I/O — User I/O |
| Pino 100 | I/O — User I/O |
| Pino 101 | I/O — User I/O |
| Pino 102 | I/O — User I/O |
| Pino 103 | I/O — User I/O |
| Pino 104 | I/O — User I/O |
| Pino 105 | I/O — User I/O |
| Pino 106 | I/O — User I/O |
| Pino 107 | I/O — User I/O |
| Pino 108 | I/O — User I/O |
| Pino 109 | I/O — User I/O |
| Pino 110 | I/O — User I/O |
| Pino 111 | I/O — User I/O |
| Pino 112 | I/O — User I/O |
| Pino 113 | I/O — User I/O |
| Pino 114 | I/O — User I/O |
| Pino 115 | I/O — User I/O |
| Pino 116 | I/O — User I/O |
| Pino 117 | I/O — User I/O |
| Pino 118 | I/O — User I/O |
| Pino 119 | I/O — User I/O |
| Pino 120 | I/O — User I/O |
| Pino 121 | I/O — User I/O |
| Pino 122 | I/O — User I/O |
| Pino 123 | I/O — User I/O |
| Pino 124 | I/O — User I/O |
| Pino 125 | I/O — User I/O |
| Pino 126 | I/O — User I/O |
| Pino 127 | I/O — User I/O |
| Pino 128 | I/O — User I/O |
| Pino 129 | I/O — User I/O |
| Pino 130 | I/O — User I/O |
| Pino 131 | VCC — 3.3V core supply |
| Pino 132 | I/O — User I/O |
| Pino 133 | I/O — User I/O |
| Pino 134 | I/O — User I/O |
| Pino 135 | I/O — User I/O |
| Pino 136 | I/O — User I/O |
| Pino 137 | I/O — User I/O |
| Pino 138 | I/O — User I/O |
| Pino 139 | I/O — User I/O |
| Pino 140 | I/O — User I/O |
| Pino 141 | I/O — User I/O |
| Pino 142 | I/O — User I/O |
| Pino 143 | I/O — User I/O |
| Pino 144 | I/O — User I/O |
| Pino 145 | I/O — User I/O |
| Pino 146 | I/O — User I/O |
| Pino 147 | I/O — User I/O |
| Pino 148 | I/O — User I/O |
| Pino 149 | I/O — User I/O |
| Pino 150 | I/O — User I/O |
| Pino 151 | I/O — User I/O |
| Pino 152 | I/O — User I/O |
| Pino 153 | I/O — User I/O |
| Pino 154 | I/O — User I/O |
| Pino 155 | I/O — User I/O |
| Pino 156 | I/O — User I/O |
| Pino 157 | I/O — User I/O |
| Pino 158 | I/O — User I/O |
| Pino 159 | I/O — User I/O |
| Pino 160 | I/O — User I/O |
| Pino 161 | I/O — User I/O |
| Pino 162 | I/O — User I/O |
| Pino 163 | I/O — User I/O |
| Pino 164 | I/O — User I/O |
| Pino 165 | I/O — User I/O |
| Pino 166 | I/O — User I/O |
| Pino 167 | I/O — User I/O |
| Pino 168 | I/O — User I/O |
| Pino 169 | GND — Ground |
| Pino 170 | I/O — User I/O |
| Pino 171 | I/O — User I/O |
| Pino 172 | I/O — User I/O |
| Pino 173 | I/O — User I/O |
| Pino 174 | I/O — User I/O |
| Pino 175 | I/O — User I/O |
| Pino 176 | I/O — User I/O |
Aplicações típicas
XC3090L-6TQG176C é adequado para 7 aplicaçãos: Portable Telecom Interface Bridge, Industrial Control Glue Logic Replacement, Custom DSP Preprocessor, Legacy Network Peripheral Controller, Test & Measurement Instrument Front-End, Aerospace Avionics Databus Bridge (Legacy), Medical Imaging Preprocessor (Legacy).
Portable Telecom Interface Bridge
The XC3090L-6TQG176C's 138 user I/O and 3.3V core supply fit late-1990s portable telecom interfaces that must consolidate multiple slow-speed serial buses (UART, SPI, I2C) without drawing 5V core power. Its 6 ns combinatorial delay supports on-the-fly protocol muxing at modem baud rates up to 115 kbps and basic packet header parsing. Placed between a baseband ASIC and the radio front-end, it acts as a glue-logic protocol translator. The 3.3V rail reduces battery drain by roughly 30% versus a 5.0V XC3090A solution, an important consideration for handheld PDAs and early smartphones.
Recomendado
Industrial Control Glue Logic Replacement
For factory-floor PLCs and motor controllers, the XC3090L-6TQG176C replaces dozens of 74-series TTL/MSI chips with a single programmable device, simplifying BOM and reducing board area. Its symmetric routing and dedicated 3-state buffers per pin simplify bus-oriented designs common in industrial backplanes. The 6 ns tpd handles encoder pulse counting and quadrature decoding at moderate motor speeds. Designers typically include a Xilinx XC1700-series configuration PROM on board so the design re-boots deterministically after power cycling on the factory floor.
Recomendado
Custom DSP Preprocessor
In early-stage audio or video DSP pipelines, the XC3090L-6TQG176C implements FIR filter pre-processing, sample-rate conversion, and packetization before handing data to a dedicated DSP or host CPU. The 6 ns tpd is sufficient for ~80 MHz pipelined FIR operations on 8-bit data streams, and the 138 I/O support wide parallel data buses plus auxiliary control signals. Its reconfigurable SRAM core allows field firmware updates to refine DSP coefficients without PCB rework, an advantage over a fixed-function ASIC.
Recomendado
Legacy Network Peripheral Controller
Routers, bridges, and access switches from the late 1990s used XC3000L-series FPGAs as peripheral controllers that offloaded MAC/PHY handshaking, LED driving, and watchdog timing from the main CPU. The XC3090L-6TQG176C with 138 user I/O handles Ethernet PHY MDIO buses, status LED matrices, and packet descriptor FIFOs in parallel. Its 3.3V supply integrates cleanly with the surrounding ASICs of the era. Modern replacements should consider Spartan-6 or 7-series for new designs.
Recomendado
Test & Measurement Instrument Front-End
Bench-top logic analyzers, oscilloscope front-ends, and protocol exercisers of the late 1990s used the XC3090L-6TQG176C to implement pattern generation, timing measurement, and trigger logic. Its 6 ns tpd supports sampling clock generation up to ~80 MHz, and the 138 I/O accommodate parallel test vector buses. The commercial temperature grade suits indoor laboratory use. Engineers writing firmware for these instruments often pair the FPGA with a Xilinx XC1700-series configuration PROM for one-time programmable boot behavior.
Recomendado
Aerospace Avionics Databus Bridge (Legacy)
Older avionics databus systems (MIL-STD-1553, ARINC 429) used the XC3090L-6TQG176C as a bridge between redundant bus controllers and downstream LRUs. Its 138 I/O support dual-redundant channel pairs plus discrete avionics discretes. Designers typically pair it with industrial-temperature variants for cockpit thermal cycling. Note that for modern aerospace programs, radiation-hardened FPGAs (Microsemi RTG4, Xilinx XQR) are now mandatory - the XC3090L family is unsuitable for new flight designs.
Recomendado
Medical Imaging Preprocessor (Legacy)
Early ultrasound and patient-monitor front-ends used the XC3090L-6TQG176C to preprocess raw transducer signals - including band-pass filtering, envelope detection, and beamforming control - before passing data to a DSP. The 3.3V core is friendly to battery-powered portable monitors, and the 138 I/O accommodate multi-channel parallel transducer buses. Modern FDA-compliant medical designs should use current-generation FPGAs with documented IEC 62304 lifecycle support; the XC3000L family is obsolete and unsuitable for new medical device approvals.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XC3090L-6TQG176C — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC3090L-6TQ176C | XC3090L-6TQ176I | XC3090L-100PC84C | XC3090L-125PC84C |
|---|---|---|---|---|---|
| Package | TQG176 | TQG176 | TQG176 | PLCC-84 | PLCC-84 |
| Brand | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx |
| Speed Grade | -6 (6 ns tpd) | -6 (6 ns tpd) | -6 (6 ns tpd) | -100 (10 ns tpd) | -125 (12.5 ns tpd) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | Commercial (0C to +70C) | Commercial (0C to +70C) | Industrial (-40C to +85C) | Commercial (0C to +70C) | Commercial (0C to +70C) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Pin-to-Pin Compatible with Target | Yes (reference) | Yes | Yes | No (different package) | No (different package) |
Principais diferenciais
- Low-voltage 3.3V core reduces power vs 5.0V XC3090A (vs XC3090A-6TQG176C)
- Identical TQG176 footprint enables direct PCB swap (vs XC3090L-6TQ176I)
- Re-programmable SRAM configuration vs one-time-programmable XC3000A PROMs (vs XC3090A (anti-fuse variant))
Notas de projeto
The XC3090L-6TQG176C requires a clean 3.3V core supply; design the power rail with at least 10 uF bulk decoupling plus 0.1 uF high-frequency bypass per VCC pin pair. Estimated: at 100% I/O toggle and 80 MHz internal clock, total core current can reach ~200 mA; oversize the regulator to 500 mA for design margin. Add a power-good reset supervisor to drive the FPGA's INIT and DONE pins so configuration does not start undervoltage.
Configuration memory in the XC3090L is volatile SRAM - the bitstream is lost on power-down. Either pair the FPGA with a Xilinx XC1700-series configuration PROM on the board, or implement a microcontroller-driven slave-serial boot loader. Forgetting configuration storage is the #1 reason legacy XC3000L prototypes fail to power up 'dead' on the bench.
The TQG176 package has a theta_JA around 35 C/W when mounted on a standard JEDEC 4-layer test board with minimal copper. At commercial ambient +70C and ~200 mA core current (0.66W dissipation), the junction temperature stays well below 100C. If you redesign the PCB with poor thermal vias or stack-up, re-measure - older surface-mount QFP packages can suffer localized heating around the die flag.
Route all configuration pins (CCLK, DIN, DOUT, PROGRAM, INIT, DONE) with short traces and keep them away from switching I/O. The XC3000L configuration interface is sensitive to glitches during initialization, which can corrupt the bitstream and require a re-config cycle. Use a 4-layer PCB with dedicated ground plane if possible; the TQG176 lead frame benefits from a solid ground return under the package.
Informações de conformidade
XC3000L family predates modern RoHS/REACH documentation conventions; compliance attestations are not published in current Xilinx disclosures and must be requested from the distributor at quotation time.