XC6SLX25-2FGG484C - 24K Spartan-6 LX FPGA | AMD
N.º da peça: XC6SLX25-2FGG484C ✓ AtivoXC6SLX25-2FGG484C Visão geral
An FPGA is a semiconductor whose digital behavior is configured after manufacture. It belongs to the programmable-logic hierarchy, combining configurable logic blocks, programmable I/O, memory resources, clocking, and dedicated hard IP into one integrated device. Compared with a fixed-function application-specific integrated circuit, an FPGA permits design revisions, parallel processing, adaptable interfaces, and shorter development cycles when system requirements evolve.
The Spartan-6 LX family targets low-cost, low-power programmable designs while retaining a large selection of dedicated resources. The XC6SLX25 provides 24,051 logic cells and 1,879 configurable logic blocks, giving designers more parallel capacity than small CPLDs. Its -2 speed designation identifies the middle Spartan-6 performance option, while the C suffix denotes the commercial operating-temperature grade. The package combines a 484-ball grid with approximately 0.80 mm ball pitch and dimensions listed as 15 mm by 15 mm.
Programmable logic is complemented by block RAM, dedicated DSP resources, clock-management circuitry, and high-speed I/O paths. These resources allow designers to implement parallel data paths, protocol bridges, control logic, and fixed-point processing without relying on multiple discrete devices. The internal frequency of 500 MHz establishes the device’s published logic-performance reference, while actual interface throughput depends on the selected I/O standard, clocking, timing constraints, and design implementation.
Typical uses include industrial control panels, motor and motion controllers, test equipment, embedded communications, video and image processing, and general-purpose embedded systems. The Spartan-6 architecture is particularly useful when a design requires deterministic parallel logic, numerous peripheral interfaces, or field programmability. It also helps consolidate small CPLD, microcontroller, and discrete logic functions into a single device when board space and inventory reduction are priorities.
Board design must account for the dense FBGA footprint, numerous power and ground connections, high-speed I/O constraints, and thermal-management requirements. Use the AMD Spartan-6 package pinout files and the manufacturer’s design-support documentation to assign balls and implement the power grid. Validate power sequencing, decoupling, signal integrity, and timing with the appropriate FPGA implementation flow before releasing the PCB.
This page combines device specifications, commercial sourcing guidance, same-package alternatives, comparison criteria, and practical implementation notes. It is intended to help engineers identify the correct Spartan-6 option, assess whether an alternative can replace the target without PCB changes, and plan a robust implementation around the FGG484 package.
Alternativas drop-in para XC6SLX25-2FGG484C — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XC6SLX25-2FGG484C (mesmo formato e footprint) — diferindo em Device Type, Operating Temperature, Package, Speed Grade, Process Technology.
XC6SLX25-2FGG484I
✅ Drop-InConsulte o preço
Ver ficha técnica →XC6SLX25-2FG484C
✅ Drop-InConsulte o preço
Ver ficha técnica →XC6SLX25-3FGG484I
✅ Drop-InConsulte o preço
Ver ficha técnica →XC6SLX25T-2FGG484C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC6SLX25T-2FGG484I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC6SLX25-2FGG484C Classificações máximas e características elétricas
| Device Type | FPGA |
| FPGA Family | Spartan-6 LX |
| Logic Cells | 24,051 cells |
| Configurable Logic Blocks | 1,879 CLBs |
| Internal Frequency | 500 MHz |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Temperatura de operação | 0°C to 85°C |
| Package Type | Lead-free 484-BBGA |
| Package Dimensions | 15 mm x 15 mm |
| Ball Pitch | 0.80 mm |
| Ball Count | 484 balls |
| Speed Grade | -2 |
| Temperature Grade | Commercial |
| Tipo de montagem | Surface Mount |
| Hot-Swap Support | Supported |
| AES Encryption Support | Supported |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do XC6SLX25-2FGG484C 15 mm x 15 mm
Configuração de pinos para XC6SLX25-2FGG484C (pacote 15 mm x 15 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para XC6SLX25-2FGG484C.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
XC6SLX25-2FGG484C é adequado para 6 aplicaçãos: Industrial Control and Automation, Embedded Communications Interface, Test and Measurement Equipment, Video and Image Processing, Embedded Motor and Motion Control, Programmable Security and Access Control.
Industrial Control and Automation
The XC6SLX25-2FGG484C fits industrial controllers that combine deterministic digital logic with numerous external interfaces. Its 24,051 logic cells and 1,879 configurable logic blocks can implement sequencing, interlocks, motion-control functions, communications adaptation, and I/O expansion in parallel. The 500 MHz internal frequency provides a useful performance reference for control pipelines, while the 0°C to 85°C commercial range suits ordinary indoor equipment. Place the device in a controlled thermal environment and use the AMD package files to implement the dense FBGA power grid and I/O routing.
Recomendado
Embedded Communications Interface
The XC6SLX25-2FGG484C is suitable for protocol bridges, packet processing, test interfaces, and embedded communication equipment requiring parallel programmable logic. Its 1,879 CLBs can accommodate multiple state machines, buffering paths, framing logic, and interface controllers, reducing reliance on separate programmable logic devices. The 1.2 V core and 45 nm CMOS implementation support compact integration, while the 484-BBGA package offers ample I/O connectivity. Validate signal rates against the selected I/O standards and complete timing analysis before production release.
Recomendado
Test and Measurement Equipment
XC6SLX25-2FGG484C implementations can serve in programmable test systems, pattern generators, acquisition front ends, and instrumentation control. The 24,051-cell device allows parallel acquisition channels, digital stimulus generation, timing logic, and interface management to share one programmable platform. Its 500 MHz internal frequency supports clocked processing pipelines, although externally observable timing still depends on I/O selection and design constraints. The 0°C to 85°C range is appropriate for many indoor instruments, while precision analog measurement functions should remain on dedicated front-end devices.
Recomendado
Video and Image Processing
The XC6SLX25-2FGG484C can implement parallel pixel pipelines, color processing, frame timing, test-pattern generation, and interface conversion in programmable video equipment. Its 1,879 CLBs and dedicated FPGA resources allow multiple lanes to be processed concurrently, while the 484-ball package provides substantial I/O connectivity for external memory and display interfaces. The -2 speed grade balances performance and power for cost-sensitive embedded systems. System timing, external memory interfaces, and video standards should be verified through the AMD implementation and simulation tools.
Recomendado
Embedded Motor and Motion Control
The XC6SLX25-2FGG484C is appropriate for motor-drive control, encoder processing, and multi-axis sequencing where deterministic parallel logic and field programmability are valuable. Separate logic pipelines can handle position feedback, command decoding, fault monitoring, and protection sequencing while the FPGA consolidates functions that would otherwise require several small programmable devices. Its 500 MHz internal frequency supports demanding control pipelines, and the 45 nm CMOS process provides a capable logic platform. Keep high-current switching stages outside the FPGA and validate protection behavior during fault-injection testing.
Recomendado
Programmable Security and Access Control
XC6SLX25-2FGG484C can support programmable authentication, protocol handling, secure transport, and access-control logic when the design includes a verified security implementation. The device is documented as supporting AES encryption, and its 24,051 logic cells provide room for parallel cryptographic pipelines and surrounding control logic. The 484-BBGA format supports the substantial pin and power requirements of an FPGA-based subsystem. Security depends on the complete bitstream, key-management architecture, device configuration controls, and threat model rather than on the FPGA family name alone.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XC6SLX25-2FGG484C — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC6SLX25-2FGG484I | XC6SLX25-2FG484C | XC6SLX25-3FGG484I | XC6SLX25T-2FGG484C | XC6SLX25T-2FGG484I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA |
| Device Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LXT | Spartan-6 LXT |
| Speed Grade | -2 | -2 | -2 | -3 | -2 | -2 |
| Operating Temperature | 0°C to 85°C | Industrial grade | Commercial grade | Industrial grade | 0°C to 85°C | Industrial grade |
| Logic Cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells |
| Process Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Principais diferenciais
- Commercial-grade -2 option in the Spartan-6 LX family (vs XC6SLX25-2FGG484I)
- Mid-tier -2 speed grade (vs XC6SLX25-3FGG484I)
- Spartan-6 LX feature level (vs XC6SLX25T-2FGG484C)
Notas de projeto
Use the AMD Spartan-6 package-device pinout file as the authoritative source for all 484 ball assignments. The dense FBGA package requires a continuous power and ground plane arrangement with the manufacturer-recommended via pattern, short return paths, and local decoupling. Treat configuration pins and dedicated pins separately from general user I/O, and confirm every ball assignment against the selected device, speed grade, and package suffix before releasing Gerber files.
Thermal performance depends on device utilization, clock activity, I/O loading, ambient temperature, and PCB copper rather than the package name alone. Preserve the package thermal path with the recommended exposed-area layout and connect it to a suitable ground plane. Use AMD power-estimation and thermal-analysis tools after the design is implemented, then verify the worst-case case-temperature condition in system testing.
Create clean, length-matched routing for high-speed interfaces and follow the selected I/O standard’s constraints in the AMD design guidance. Account for package-ball transitions, board-layer transitions, return-path discontinuities, and connector or memory parasitics during simulation. Constraints must reflect the actual -2 device speed grade, and design timing should be rerun whenever placement, routing, or the external interface changes.
Do not infer that a shared 484-BBGA package proves device interchangeability. LX and LXT variants can differ in available resources, while C and I suffixes change the operating-temperature grade, and -2 versus -3 suffixes change performance. Before replacing the target, compare device selection, package-ball files, electrical limits, supported features, configuration behavior, and the compiled bitstream requirements.
Follow the manufacturer’s recommended startup and supply sequencing for the core and auxiliary rails. Place input, output, and bypass capacitors at the device according to the datasheet layout, and confirm that each rail's load, ripple, droop, and startup current remain within its limits under the worst supported configuration. Configuration activity can create a distinct current profile, so include it in the power-supply and sequencing analysis.
Informações de conformidade
The target is identified as RoHS compliant and lead-free in the verified product information. The available information does not establish REACH, halogen-free, conflict-minerals, or automotive qualification status.
