XC6SLX25-2FGG484C - 24K Spartan-6 LX FPGA | AMD
Référence : XC6SLX25-2FGG484C ✓ ActifXC6SLX25-2FGG484C Présentation
An FPGA is a semiconductor whose digital behavior is configured after manufacture. It belongs to the programmable-logic hierarchy, combining configurable logic blocks, programmable I/O, memory resources, clocking, and dedicated hard IP into one integrated device. Compared with a fixed-function application-specific integrated circuit, an FPGA permits design revisions, parallel processing, adaptable interfaces, and shorter development cycles when system requirements evolve.
The Spartan-6 LX family targets low-cost, low-power programmable designs while retaining a large selection of dedicated resources. The XC6SLX25 provides 24,051 logic cells and 1,879 configurable logic blocks, giving designers more parallel capacity than small CPLDs. Its -2 speed designation identifies the middle Spartan-6 performance option, while the C suffix denotes the commercial operating-temperature grade. The package combines a 484-ball grid with approximately 0.80 mm ball pitch and dimensions listed as 15 mm by 15 mm.
Programmable logic is complemented by block RAM, dedicated DSP resources, clock-management circuitry, and high-speed I/O paths. These resources allow designers to implement parallel data paths, protocol bridges, control logic, and fixed-point processing without relying on multiple discrete devices. The internal frequency of 500 MHz establishes the device’s published logic-performance reference, while actual interface throughput depends on the selected I/O standard, clocking, timing constraints, and design implementation.
Typical uses include industrial control panels, motor and motion controllers, test equipment, embedded communications, video and image processing, and general-purpose embedded systems. The Spartan-6 architecture is particularly useful when a design requires deterministic parallel logic, numerous peripheral interfaces, or field programmability. It also helps consolidate small CPLD, microcontroller, and discrete logic functions into a single device when board space and inventory reduction are priorities.
Board design must account for the dense FBGA footprint, numerous power and ground connections, high-speed I/O constraints, and thermal-management requirements. Use the AMD Spartan-6 package pinout files and the manufacturer’s design-support documentation to assign balls and implement the power grid. Validate power sequencing, decoupling, signal integrity, and timing with the appropriate FPGA implementation flow before releasing the PCB.
This page combines device specifications, commercial sourcing guidance, same-package alternatives, comparison criteria, and practical implementation notes. It is intended to help engineers identify the correct Spartan-6 option, assess whether an alternative can replace the target without PCB changes, and plan a robust implementation around the FGG484 package.
Alternatives de remplacement direct pour XC6SLX25-2FGG484C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC6SLX25-2FGG484C (même facteur de forme et même empreinte) — différant par Device Type, Operating Temperature, Package, Speed Grade, Process Technology.
XC6SLX25-2FGG484I
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC6SLX25-2FG484C
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Voir la fiche technique →XC6SLX25-3FGG484I
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Voir la fiche technique →XC6SLX25T-2FGG484C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX25T-2FGG484I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX25-2FGG484C Valeurs maximales et caractéristiques électriques
| Device Type | FPGA |
| FPGA Family | Spartan-6 LX |
| Logic Cells | 24,051 cells |
| Configurable Logic Blocks | 1,879 CLBs |
| Internal Frequency | 500 MHz |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Température de fonctionnement | 0°C to 85°C |
| Package Type | Lead-free 484-BBGA |
| Package Dimensions | 15 mm x 15 mm |
| Ball Pitch | 0.80 mm |
| Ball Count | 484 balls |
| Speed Grade | -2 |
| Temperature Grade | Commercial |
| Type de montage | Surface Mount |
| Hot-Swap Support | Supported |
| AES Encryption Support | Supported |
| Statut RoHS | Compliant |
Guide de configuration des broches du XC6SLX25-2FGG484C 15 mm x 15 mm
Configuration des broches du XC6SLX25-2FGG484C (boîtier 15 mm x 15 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC6SLX25-2FGG484C.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC6SLX25-2FGG484C convient pour 6 applications: Industrial Control and Automation, Embedded Communications Interface, Test and Measurement Equipment, Video and Image Processing, Embedded Motor and Motion Control, Programmable Security and Access Control.
Industrial Control and Automation
The XC6SLX25-2FGG484C fits industrial controllers that combine deterministic digital logic with numerous external interfaces. Its 24,051 logic cells and 1,879 configurable logic blocks can implement sequencing, interlocks, motion-control functions, communications adaptation, and I/O expansion in parallel. The 500 MHz internal frequency provides a useful performance reference for control pipelines, while the 0°C to 85°C commercial range suits ordinary indoor equipment. Place the device in a controlled thermal environment and use the AMD package files to implement the dense FBGA power grid and I/O routing.
Recommandé
Embedded Communications Interface
The XC6SLX25-2FGG484C is suitable for protocol bridges, packet processing, test interfaces, and embedded communication equipment requiring parallel programmable logic. Its 1,879 CLBs can accommodate multiple state machines, buffering paths, framing logic, and interface controllers, reducing reliance on separate programmable logic devices. The 1.2 V core and 45 nm CMOS implementation support compact integration, while the 484-BBGA package offers ample I/O connectivity. Validate signal rates against the selected I/O standards and complete timing analysis before production release.
Recommandé
Test and Measurement Equipment
XC6SLX25-2FGG484C implementations can serve in programmable test systems, pattern generators, acquisition front ends, and instrumentation control. The 24,051-cell device allows parallel acquisition channels, digital stimulus generation, timing logic, and interface management to share one programmable platform. Its 500 MHz internal frequency supports clocked processing pipelines, although externally observable timing still depends on I/O selection and design constraints. The 0°C to 85°C range is appropriate for many indoor instruments, while precision analog measurement functions should remain on dedicated front-end devices.
Recommandé
Video and Image Processing
The XC6SLX25-2FGG484C can implement parallel pixel pipelines, color processing, frame timing, test-pattern generation, and interface conversion in programmable video equipment. Its 1,879 CLBs and dedicated FPGA resources allow multiple lanes to be processed concurrently, while the 484-ball package provides substantial I/O connectivity for external memory and display interfaces. The -2 speed grade balances performance and power for cost-sensitive embedded systems. System timing, external memory interfaces, and video standards should be verified through the AMD implementation and simulation tools.
Recommandé
Embedded Motor and Motion Control
The XC6SLX25-2FGG484C is appropriate for motor-drive control, encoder processing, and multi-axis sequencing where deterministic parallel logic and field programmability are valuable. Separate logic pipelines can handle position feedback, command decoding, fault monitoring, and protection sequencing while the FPGA consolidates functions that would otherwise require several small programmable devices. Its 500 MHz internal frequency supports demanding control pipelines, and the 45 nm CMOS process provides a capable logic platform. Keep high-current switching stages outside the FPGA and validate protection behavior during fault-injection testing.
Recommandé
Programmable Security and Access Control
XC6SLX25-2FGG484C can support programmable authentication, protocol handling, secure transport, and access-control logic when the design includes a verified security implementation. The device is documented as supporting AES encryption, and its 24,051 logic cells provide room for parallel cryptographic pipelines and surrounding control logic. The 484-BBGA format supports the substantial pin and power requirements of an FPGA-based subsystem. Security depends on the complete bitstream, key-management architecture, device configuration controls, and threat model rather than on the FPGA family name alone.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC6SLX25-2FGG484C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC6SLX25-2FGG484I | XC6SLX25-2FG484C | XC6SLX25-3FGG484I | XC6SLX25T-2FGG484C | XC6SLX25T-2FGG484I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA |
| Device Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LXT | Spartan-6 LXT |
| Speed Grade | -2 | -2 | -2 | -3 | -2 | -2 |
| Operating Temperature | 0°C to 85°C | Industrial grade | Commercial grade | Industrial grade | 0°C to 85°C | Industrial grade |
| Logic Cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells |
| Process Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Principaux différenciateurs
- Commercial-grade -2 option in the Spartan-6 LX family (vs XC6SLX25-2FGG484I)
- Mid-tier -2 speed grade (vs XC6SLX25-3FGG484I)
- Spartan-6 LX feature level (vs XC6SLX25T-2FGG484C)
Notes de conception
Use the AMD Spartan-6 package-device pinout file as the authoritative source for all 484 ball assignments. The dense FBGA package requires a continuous power and ground plane arrangement with the manufacturer-recommended via pattern, short return paths, and local decoupling. Treat configuration pins and dedicated pins separately from general user I/O, and confirm every ball assignment against the selected device, speed grade, and package suffix before releasing Gerber files.
Thermal performance depends on device utilization, clock activity, I/O loading, ambient temperature, and PCB copper rather than the package name alone. Preserve the package thermal path with the recommended exposed-area layout and connect it to a suitable ground plane. Use AMD power-estimation and thermal-analysis tools after the design is implemented, then verify the worst-case case-temperature condition in system testing.
Create clean, length-matched routing for high-speed interfaces and follow the selected I/O standard’s constraints in the AMD design guidance. Account for package-ball transitions, board-layer transitions, return-path discontinuities, and connector or memory parasitics during simulation. Constraints must reflect the actual -2 device speed grade, and design timing should be rerun whenever placement, routing, or the external interface changes.
Do not infer that a shared 484-BBGA package proves device interchangeability. LX and LXT variants can differ in available resources, while C and I suffixes change the operating-temperature grade, and -2 versus -3 suffixes change performance. Before replacing the target, compare device selection, package-ball files, electrical limits, supported features, configuration behavior, and the compiled bitstream requirements.
Follow the manufacturer’s recommended startup and supply sequencing for the core and auxiliary rails. Place input, output, and bypass capacitors at the device according to the datasheet layout, and confirm that each rail's load, ripple, droop, and startup current remain within its limits under the worst supported configuration. Configuration activity can create a distinct current profile, so include it in the power-supply and sequencing analysis.
Informations de conformité
The target is identified as RoHS compliant and lead-free in the verified product information. The available information does not establish REACH, halogen-free, conflict-minerals, or automotive qualification status.
