XC6SLX75-3FGG484C - Spartan-6 LX FPGA, 74,637 Logic Cells | AMD
N.º da peça: XC6SLX75-3FGG484C ✓ AtivoXC6SLX75-3FGG484C Visão geral
An FPGA is a semiconductor device whose logic, interconnects and I/O are defined by a configuration bitstream loaded from an external memory rather than by fixed mask wiring. Within the broader taxonomy, the XC6SLX75 belongs to the Spartan-6 LX family, which sits between low-cost CPLDs and higher-density FPGAs: it is a programmable logic device (PLD) built on 45 nm SRAM logic fabric with hard DSP slices and block RAM. The -3 suffix designates the fastest speed grade available in the family, while the FGG484 suffix defines the 484-ball flip-chip BGA package, and the trailing C identifies the commercial temperature grade.
Key features of this device include the 667 MHz internal clock frequency, 280 I/O pins for external interfacing, and 74,637 logic cells for parallel datapath and control logic. Because the fabric is SRAM-based, the same silicon can be reconfigured in the field, allowing firmware-driven function updates, partial reconfiguration of individual regions, and in-field repair of deployed equipment. The 484-ball BGA package also exposes a large number of dedicated clock, configuration and power pins required for high-fanout designs.
Architecturally, the Spartan-6 LX device combines programmable logic arrays, dedicated DSP48A slices for multiply-accumulate operations, and block RAM for on-chip buffering. The -3 speed grade delivers the highest logic performance of the Spartan-6 LX family, so designs that were previously timing-limited on -2 or -1L grades can close timing at lower clock periods without a device change. The same FGG484 land pattern is shared across several LX75 and LX100 variants, which simplifies PCB respins between density levels.
Typical applications include industrial control and PLC I/O expansion, industrial Ethernet and protocol bridging, motor and motion control front-ends, test and measurement data acquisition, video and image processing pipelines, and embedded instrumentation gateways where deterministic parallel logic and re programmability are valuable.
When designing around this device, budget careful for the 484-ball BGA escape routing and for decoupling across the many distributed power and ground balls. Confirm the bitstream configuration interface levels and the required I/O standard for each bank, and verify that the -3 speed grade is genuinely needed before paying the performance premium over the -2 grade.
This page consolidates verified distributor pricing, package and pinout references, drop-in same-footprint alternatives, and practical design guidance that are spread across many separate distributor and datasheet listings for the XC6SLX75-3FGG484C.
Alternativas drop-in para XC6SLX75-3FGG484C — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XC6SLX75-3FGG484C (mesmo formato e footprint) — diferindo em Logic Cells, Speed Grade, Operating Temperature, Package, Mounting Type.
XC6SLX75-3FGG484I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC6SLX75-3FG484C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC6SLX75-2FGG484C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC6SLX100-3FGG484C
✅ Drop-InConsulte o preço
Ver ficha técnica →XC6SLX100T-3FGG484C
✅ Drop-InConsulte o preço
Ver ficha técnica →XC6SLX150-3FGG484C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XA6SLX75-3FGG484I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC6SLX75-3FGG484C Classificações máximas e características elétricas
| Device Type | Field Programmable Gate Array (FPGA) |
| Series | Spartan-6 LX |
| Logic Cells | 74,637 |
| User I/O Count | 280 |
| Package Type | 484-ball FBGA (MS-034) |
| Package Body Size | 23 x 23 mm |
| Package Pitch | 1.0 mm |
| Internal Clock Frequency | 667 MHz |
| Speed Grade | -3 (highest performance in Spartan-6 LX family) |
| Faixa de temperatura de operação | 0 °C to 85 °C (commercial grade) |
| Tipo de montagem | Surface Mount (SMD) |
| Manufacturer | AMD (formerly Xilinx) |
| Status RoHS | unknown |
| Order Code Suffix | C = commercial temperature grade |
Guia de Configuração de Pinos do XC6SLX75-3FGG484C 1.0 mm
Configuração de pinos para XC6SLX75-3FGG484C (pacote 1.0 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para XC6SLX75-3FGG484C.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
XC6SLX75-3FGG484C é adequado para 6 aplicaçãos: Industrial Control and PLC I/O Expansion, Industrial Ethernet and Protocol Bridging, Motor Control and Motion Drive Front-Ends, Test, Measurement and Data Acquisition, Video, Image and Display Processing Pipelines, Smart Home and IoT Gateway Terminals.
Industrial Control and PLC I/O Expansion
The XC6SLX75-3FGG484C fits machine-control front-ends that need hundreds of digital I/O plus parallel logic for interlock and sequencing. Its 280 user I/O in a single 484-ball FBGA (1.0 mm pitch, 23 x 23 mm) lets one device absorb what would otherwise take several CPLDs, and the 74,637 logic cells allow substantial state-machine and protocol logic alongside the I/O. Because the fabric is SRAM-based and reloadable, a single board can be reconfigured for different machine variants in the field, cutting the number of distinct PCB part numbers. The -3 speed grade and 667 MHz internal clock also give comfortable timing margin for fast encoder, differential line-driver and safety interlock interfaces, while the commercial 0 °C to 85 °C range suits standard factory-floor enclosures.
Recomendado
Industrial Ethernet and Protocol Bridging
The XC6SLX75-3FGG484C is well suited to industrial networking equipment that must terminate or translate multiple physical-layer protocols. The 280 I/O in the 484-ball FBGA package supports parallel interfaces to PHY devices, and 74,637 logic cells are ample for MAC, frame-buffer management and time-slot arbitration logic. Its 667 MHz internal clock and -3 speed grade allow tight timing on packet-parallel datapaths where a slower -2 grade might not close timing, and SRAM configuration permits protocol upgrades without board respins. For gateways spanning fieldbus and Ethernet, the same silicon can host a hardware protocol converter alongside a small MCU handling management traffic, reducing board count in DIN-rail and substation equipment.
Recomendado
Motor Control and Motion Drive Front-Ends
In servo and stepper drive electronics, the XC6SLX75-3FGG484C can host the entire real-time control datapath: PWM generation, encoder capture, current-loop interpolation and fault handling. Its 74,637 logic cells and 280 I/O give enough parallel I/O for multiple encoder channels, differential analog front-end interfaces via external ADC/FPGA partners, and gate-drive enable lines. The -3 speed grade, the fastest available in Spartan-6 LX, minimizes propagation delay in closed-loop timing critical to current-loop bandwidth, and the 667 MHz internal clock leaves margin for a 200 MHz class control clock with headroom for DSP pipelines. The commercial temperature grade fits indoor machine-tool and robotics cabinets.
Recomendado
Test, Measurement and Data Acquisition
Instrumentation front-ends that need simultaneous high-speed sampling control, trigger sequencing and data packing map naturally onto the XC6SLX75-3FGG484C. The 280 I/O in the FGG484 package allows direct capture of many parallel acquisition channels, while the 74,637 logic cells implement channel interleaving, windowing and decimation pipelines without off-chip logic. The -3 speed grade and 667 MHz internal clock support deterministic acquisition timing for automated test equipment, and the SRAM-based configuration allows instrument personalities to be selected at power-up from stored bitstreams. Instrument makers also benefit from the availability of the same 484-ball footprint across LX75, LX100 and LX150 densities, which allows one PCB to serve several product tiers.
Recomendado
Video, Image and Display Processing Pipelines
The XC6SLX75-3FGG484C supports parallel video timing, pixel pipeline and scaler logic in compact embedded systems. Its 280 user I/O in the 484-ball FBGA package can absorb parallel or multiplexed RGB, LVDS-derived and camera-interface signals, and 74,637 logic cells are sufficient for multi-stage pipelines combining color conversion, gamma and overlay functions. The -3 speed grade, with a 667 MHz internal clock, gives the timing margin needed for pixel-clock-rate processing, while reconfiguration allows a single board to present different imaging personalities. In surveillance cameras, industrial vision and display controllers, this device bridges sensor input to a downstream processor without requiring a discrete frame-buffer ASIC.
Recomendado
Smart Home and IoT Gateway Terminals
Gateway and controller designs in consumer and IoT products often need to terminate several mixed-signal interfaces while remaining compact and low cost. The XC6SLX75-3FGG484C concentrates that glue logic into one 484-ball FBGA with 280 I/O, handling sensor aggregation, relay and LED drive, and host-processor bus arbitration, so the main MCU is freed for application code. The 74,637 logic cells also allow local protocol translation between wireless module UARTs and Ethernet or USB stacks. Because the configuration is SRAM-based, vendors can ship field-updatable interface profiles and enable new features over the air, and the same FGG484 land pattern supports product family variants from LX75 to LX150 without PCB rework.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XC6SLX75-3FGG484C — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC6SLX75-3FGG484I | XC6SLX75-3FG484C | XC6SLX75-2FGG484C | XC6SLX100-3FGG484C | XC6SLX100T-3FGG484C |
|---|---|---|---|---|---|---|
| Package | 484-ball FBGA (FGG484, 23 x 23 mm, 1.0 mm pitch) | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FGG484) - same |
| Brand | AMD (formerly Xilinx) | AMD (formerly Xilinx) | AMD (formerly Xilinx) | AMD (formerly Xilinx) | AMD (formerly Xilinx) | AMD (formerly Xilinx) |
| Series | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Speed Grade | -3 (highest performance) | -3 | -3 | -2 (lower performance, lower cost) | -3 | -3 |
| Operating Temperature Range | 0 °C to 85 °C (commercial) | Extended industrial range | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) |
| Key Distinguishing Feature | Baseline -3 commercial LX75 device | Industrial temperature qualification | Abbreviated ordering code of the same device | Cost-optimized -2 speed grade | Higher logic density in identical package | DSP-enhanced logic for MAC-heavy designs |
Principais diferenciais
- Fastest available Spartan-6 LX speed grade in a fully populated 484-ball package (vs XC6SLX75-2FGG484C)
- 280 user I/O in a single 23 x 23 mm package instead of multiple discrete devices (vs XC6SLX25-2CSG324C)
- Cost-optimized capacity step without changing the PCB footprint (vs XC6SLX100-3FGG484C)
- Commercial-grade baseline with a documented industrial sibling for the same footprint (vs XC6SLX75-3FGG484I)
Notas de projeto
The 484-ball FBGA at 1.0 mm pitch forces a multilayer PCB with a buried or through-via fanout grid under the device; plan at least 8 signal layers with a dedicated plane pair for the core supply so that every VCC/VTT ball connects through short, low-impedance vias instead of long traces. Keep the BGA escape fanout symmetric so that power delivery and ground return paths are balanced across all four quadrants, and place the decoupling capacitor array at the perimeter of the land pattern rather than distributing it only under the package.
Power budgeting for the XC6SLX75-3FGG484C must include both static core current, which scales with configuration and activity, and dynamic current from clock tree and I/O switching. Estimated: with a 1.0 V core rail and a 2.5 A worst-case device current, core dissipation is approximately 2.5 W, which alone can raise junction temperature sharply without a solid ground plane and adequate via arrays. Use the AMD power estimator with your actual utilisation percentage rather than assuming full utilisation, and derate for the -3 speed grade's higher switching activity versus -2.
A frequent error is assuming that any Spartan-6 device in the FGG484 outline is a legal substitute for this design. The XC6SLX75, XC6SLX100 and XC6SLX150 share the 484-ball package, but logic resources, dedicated RAM and DSP slice counts differ, so an LX100 or LX150 fit requires re-running synthesis, placement and timing at the higher utilisation the tools will report. A second pitfall is treating the -3 and -2 grades as interchangeable in a timing sign-off; the -2 grade is slower, and a design that only closes on -3 will fail on -2.
Because 280 of the 484 balls are user I/O, board-level channel-length matching directly affects interface margin. Route single-ended and differential pairs on the same layer with matched length to the associated BGA ball, keep the 100-ohm differential pairs on a continuous reference plane, and avoid routing I/O signals directly beneath the package where they would share the same via field as power. For LVDS or high-speed serial links, prefer a lossless microstrip or stripline structure and de-embed the connector and package parasitics in pre-emphasis and eye-diagram analysis.
Estimated: with approximately 2.5 W of core dissipation and no dedicated heatsink, even a well-poured 4-layer board can see junction temperature rise sufficient to reduce reliability margin, because FBGA devices have limited top-side heat path. Verify the junction temperature in the AMD thermal model using the actual stack-up and copper weight, and consider a thermal via array or heat spreader over the package if the enclosure has limited airflow. Keep airflow-sensitive equipment designs in mind where the commercial 0 °C to 85 °C rating leaves little margin near the upper limit.
Informações de conformidade
Cross-reference databases report RoHS and REACH status for this part, but no declaration values appeared in the verified distributor data, so those fields are marked unknown. The automotive-qualified relative is the XA6SLX75-3FGG484I, not the standard XC6SLX75-3FGG484C.
