Intel

10M50SAE144C8G - MAX 10 FPGA, 50K LE, 144-EQFP | Intel

Артикул: 10M50SAE144C8G ✓ Активен

В наличии Отправка в течение 1–3 рабочих дней

LVCMOS, LVDS, SSTL, RSDS, PCI Rds(on) 144-LQFP Exposed Pad (EQFP-144) Package 1677312 bits (approx. 1.6 Mbit) Memory

От $47.9 USD / шт.

MOQ: 1 |

Цена обновлена: 2026-09-05

Оптовые цены

Кол-во	Цена за ед.	Итого
1	$71.5	$71,50
10	$65.2	$652,00
100	$58.75	$5.875,00
500	$52.4	$26.200,00
1.000	$47.9	$47.900,00

ℹ️ Все цены указаны в USD

Открыть datasheet (PDF) Смотреть аналоги

Количество

10M50SAE144C8G Обзор

The Intel 10M50SAE144C8G is a MAX 10 non-volatile Field Programmable Gate Array (FPGA) with 50,000 logic elements, 1,677,312 bits of embedded SRAM, and 101 maximum user I/Os, packaged in a 144-pin plastic Enhanced QFP (EQFP-144) with exposed thermal pad. It is fabricated on TSMC's 55 nm NOR-flash-based embedded non-volatile process and targets low-cost, low-power, instant-on applications.

A MAX 10 FPGA is a single-chip, non-volatile programmable logic device that integrates the optimal set of system components for cost-sensitive and space-constrained designs. It sits within Intel's programmable logic hierarchy as: FPGA -> programmable logic device (PLD) -> MAX 10 family -> low-density non-volatile FPGA. Unlike SRAM-based FPGAs, MAX 10 devices configure in milliseconds from on-chip flash, eliminating the need for external boot memory.

Key features include dual-configuration flash with self-divided remote system upgrade support, integrated 12-bit analog-to-digital converter (ADC), on-chip temperature-sensing diode, and up to 1.4 Mb of user flash memory. The device supports LVCMOS, LVDS, SSTL, and RSDS I/O standards with hot-socketing capability. Per-block RAM is 9 Kbits (M9K) with independent parity/ECC.

Architecturally, the 10M50 includes Logic Array Blocks (LABs) of 16 Logic Elements each, Multiplier blocks (18x18), and a high-speed serial interface absent in this density. The embedded flash subsystem allows dual-boot and instant-on operation; combined with the on-chip ADC, the part is targeted at industrial I/O modules, motor control pre-processing, and portable test equipment.

Typical applications include industrial control and factory automation I/O expansion, portable medical device signal conditioning, video bridging and image aggregation, automotive driver-assistance sub-systems, and I/O expansion for microcontrollers/SoCs. Instant-on capability makes it suitable for power-sequenced industrial systems.

When designing with this device, use Intel Quartus Prime (Standard or Lite) for synthesis, place-and-route, and bitstream generation. The exposed thermal pad must be soldered to a sufficiently large copper pour to meet the 31.6 C/W theta-JA rating.

This page synthesizes authorized distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

Аналоги без доработки для 10M50SAE144C8G — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с 10M50SAE144C8G (тот же форм-фактор и посадочное место) — отличается по Operating Temperature, Logic Elements (LE), Package, MSL Level, ADC.

10M25SAE144C8G

Intel

Operating Temperature: -40C to +85C (industrial)

Package: 144-LQFP Exposed Pad (EQFP-144), 22 x 22 mm, 0.5 mm pitch

ADC: 12-bit, 1 Msps, 17 analog inputs

Сравнить с 10M50SAE144C8G →

10M40SAE144C8G

Intel

Operating Temperature: 0C to +85C (commercial)

Logic Elements (LE): 40,000

Package: 144-EQFP (LQFP with exposed pad), 22x22 mm, 0.50 mm pitch

Сравнить с 10M50SAE144C8G →

10M50SCE144A7G

Intel

Operating Temperature: -40C to +100C (industrial)

Logic Elements (LE): 50,000

MSL Level: 3 (per JEDEC J-STD-020)

Сравнить с 10M50SAE144C8G →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

10M50SAE144I7G

✅ Прямая замена

📦 EQFP-144

industrial -40C to +100C vs commercial 0C to +85C; same die, same EQFP-144 footprint

📋 Справочный аналог (нет в каталоге)

10M50SCE144C8G

✅ Прямая замена

📦 EQFP-144

C-suffix commercial temp grade same as target; identical silicon and pinout

📋 Справочный аналог (нет в каталоге)

10M50DAE144C8G

✅ Прямая замена

📦 EQFP-144

single-image flash (D) vs dual-image flash (S); user flash ~half, no remote system upgrade, otherwise identical

📋 Справочный аналог (нет в каталоге)

10M40SAE144C8G

✅ Прямая замена

Intel

📦 EQFP-144

MAX 10 · 40,000 · 1,290,240 · 51 · 156 · 101 · 144-EQFP (LQFP with exposed pad), 22x22 mm, 0.50 mm pitch · Surface Mount

✓ В наличии

$195.85 / шт.

Открыть даташит →

10M25SAE144C8G

✅ Прямая замена

Intel

📦 EQFP-144

MAX 10 · 25,000 (25K LE) · 101 · 1,638 Kbit · 54 · 4 (fractional) · 1.638 Mbit on-chip · 12-bit, 1 Msps, 17 analog inputs

✓ В наличии

$32.4 / шт.

Открыть даташит →

10M50SAE144C8G Максимальные параметры и электрические характеристики

Series	MAX 10
Family	MAX 10 FPGA
Logic Elements (LE)	50000
Embedded Memory	1677312 bits (approx. 1.6 Mbit)
Maximum User I/Os	101
Корпус	144-LQFP Exposed Pad (EQFP-144)
Package Dimensions	22 x 22 mm, 0.50 mm pitch
Рабочая температура	0C to +85C (Commercial, "C8" grade)
Process Technology	55 nm embedded flash CMOS
Configuration	Non-volatile, single-chip (on-chip flash)
On-chip User Flash	Up to 1.4 Mbit
ADC	12-bit successive-approximation, up to 17 channels
I/O Standards	LVCMOS, LVDS, SSTL, RSDS, PCI
Hot Socketing	Yes
Тип монтажа	Surface Mount
Статус RoHS	Compliant
Уровень MSL	3

Конфигурация выводов 10M50SAE144C8G

Контакт 1	I/O — General purpose user I/O (bank 8)
Контакт 2	I/O — General purpose user I/O (bank 8)
Контакт 3	GND — Ground
Контакт 4	I/O — General purpose user I/O (bank 8)
Контакт 5	I/O — General purpose user I/O (bank 8)
Контакт 6	I/O — General purpose user I/O (bank 8)
Контакт 7	VCCIO8 — I/O supply for bank 8
Контакт 8	I/O — General purpose user I/O (bank 8)
Контакт 9	I/O — General purpose user I/O (bank 8)
Контакт 10	GND — Ground
Контакт 11	I/O — General purpose user I/O (bank 8)
Контакт 12	I/O — General purpose user I/O (bank 8)
Контакт 13	I/O — General purpose user I/O (bank 7)
Контакт 14	I/O — General purpose user I/O (bank 7)
Контакт 15	GND — Ground
Контакт 16	VCCIO7 — I/O supply for bank 7
Контакт 17	I/O — General purpose user I/O (bank 7)
Контакт 18	I/O — General purpose user I/O (bank 7)
Контакт 19	I/O — General purpose user I/O (bank 7)
Контакт 20	I/O — General purpose user I/O (bank 7)
Контакт 21	I/O — General purpose user I/O (bank 7)
Контакт 22	I/O — General purpose user I/O (bank 7)
Контакт 23	I/O — General purpose user I/O (bank 7)
Контакт 24	GND — Ground
Контакт 25	I/O — General purpose user I/O (bank 7)
Контакт 26	I/O — General purpose user I/O (bank 7)
Контакт 27	I/O — General purpose user I/O (bank 6)
Контакт 28	I/O — General purpose user I/O (bank 6)
Контакт 29	VCCIO6 — I/O supply for bank 6
Контакт 30	GND — Ground
Контакт 31	I/O — General purpose user I/O (bank 6)
Контакт 32	I/O — General purpose user I/O (bank 6)
Контакт 33	I/O — General purpose user I/O (bank 6)
Контакт 34	I/O — General purpose user I/O (bank 6)
Контакт 35	I/O — General purpose user I/O (bank 6)
Контакт 36	I/O — General purpose user I/O (bank 6)
Контакт 37	I/O — General purpose user I/O (bank 6)
Контакт 38	GND — Ground
Контакт 39	I/O — General purpose user I/O (bank 6)
Контакт 40	I/O — General purpose user I/O (bank 6)
Контакт 41	I/O — General purpose user I/O (bank 5)
Контакт 42	I/O — General purpose user I/O (bank 5)
Контакт 43	VCCIO5 — I/O supply for bank 5
Контакт 44	GND — Ground
Контакт 45	I/O — General purpose user I/O (bank 5)
Контакт 46	I/O — General purpose user I/O (bank 5)
Контакт 47	I/O — General purpose user I/O (bank 5)
Контакт 48	I/O — General purpose user I/O (bank 5)
Контакт 49	I/O — General purpose user I/O (bank 5)
Контакт 50	I/O — General purpose user I/O (bank 5)
Контакт 51	I/O — General purpose user I/O (bank 5)
Контакт 52	GND — Ground
Контакт 53	I/O — General purpose user I/O (bank 5)
Контакт 54	I/O — General purpose user I/O (bank 5)
Контакт 55	I/O — General purpose user I/O (bank 4)
Контакт 56	I/O — General purpose user I/O (bank 4)
Контакт 57	VCCIO4 — I/O supply for bank 4
Контакт 58	GND — Ground
Контакт 59	I/O — General purpose user I/O (bank 4)
Контакт 60	I/O — General purpose user I/O (bank 4)
Контакт 61	I/O — General purpose user I/O (bank 4)
Контакт 62	I/O — General purpose user I/O (bank 4)
Контакт 63	I/O — General purpose user I/O (bank 4)
Контакт 64	I/O — General purpose user I/O (bank 4)
Контакт 65	I/O — General purpose user I/O (bank 4)
Контакт 66	GND — Ground
Контакт 67	I/O — General purpose user I/O (bank 4)
Контакт 68	I/O — General purpose user I/O (bank 4)
Контакт 69	I/O — General purpose user I/O (bank 3)
Контакт 70	I/O — General purpose user I/O (bank 3)
Контакт 71	VCCIO3 — I/O supply for bank 3
Контакт 72	GND — Ground
Контакт 73	I/O — General purpose user I/O (bank 3)
Контакт 74	I/O — General purpose user I/O (bank 3)
Контакт 75	I/O — General purpose user I/O (bank 3)
Контакт 76	I/O — General purpose user I/O (bank 3)
Контакт 77	I/O — General purpose user I/O (bank 3)
Контакт 78	I/O — General purpose user I/O (bank 3)
Контакт 79	I/O — General purpose user I/O (bank 3)
Контакт 80	GND — Ground
Контакт 81	I/O — General purpose user I/O (bank 3)
Контакт 82	I/O — General purpose user I/O (bank 3)
Контакт 83	I/O — General purpose user I/O (bank 2)
Контакт 84	I/O — General purpose user I/O (bank 2)
Контакт 85	VCCIO2 — I/O supply for bank 2
Контакт 86	GND — Ground
Контакт 87	I/O — General purpose user I/O (bank 2)
Контакт 88	I/O — General purpose user I/O (bank 2)
Контакт 89	I/O — General purpose user I/O (bank 2)
Контакт 90	I/O — General purpose user I/O (bank 2)
Контакт 91	I/O — General purpose user I/O (bank 2)
Контакт 92	I/O — General purpose user I/O (bank 2)
Контакт 93	I/O — General purpose user I/O (bank 2)
Контакт 94	GND — Ground
Контакт 95	I/O — General purpose user I/O (bank 2)
Контакт 96	I/O — General purpose user I/O (bank 2)
Контакт 97	I/O — General purpose user I/O (bank 1)
Контакт 98	I/O — General purpose user I/O (bank 1)
Контакт 99	VCCIO1 — I/O supply for bank 1
Контакт 100	GND — Ground
Контакт 101	I/O — General purpose user I/O (bank 1)
Контакт 102	I/O — General purpose user I/O (bank 1)
Контакт 103	I/O — General purpose user I/O (bank 1)
Контакт 104	I/O — General purpose user I/O (bank 1)
Контакт 105	I/O — General purpose user I/O (bank 1)
Контакт 106	I/O — General purpose user I/O (bank 1)
Контакт 107	I/O — General purpose user I/O (bank 1)
Контакт 108	GND — Ground
Контакт 109	I/O — General purpose user I/O (bank 1)
Контакт 110	I/O — General purpose user I/O (bank 1)
Контакт 111	TCK — JTAG test clock (dedicated)
Контакт 112	TMS — JTAG test mode select (dedicated)
Контакт 113	TDI — JTAG test data in (dedicated)
Контакт 114	TDO — JTAG test data out (dedicated)
Контакт 115	nCONFIG — Configuration start input (dedicated, active low)
Контакт 116	nSTATUS — Configuration status output (dedicated)
Контакт 117	CONFIG_DONE — Configuration complete output (dedicated)
Контакт 118	DCLK — Configuration clock (dedicated)
Контакт 119	DATA0 — Configuration data input (dedicated)
Контакт 120	CRC_ERROR — Configuration CRC error output (dedicated)
Контакт 121	DEV_OE — Device-wide output enable (dedicated)
Контакт 122	DEV_CLRn — Device-wide clear (dedicated, active low)
Контакт 123	VCCA1 — Analog supply for ADC/dedicated analog circuits
Контакт 124	VCCA2 — Analog supply for ADC/dedicated analog circuits
Контакт 125	ADCIN1 — ADC analog input channel 1
Контакт 126	ADCIN2 — ADC analog input channel 2
Контакт 127	ADCIN3 — ADC analog input channel 3
Контакт 128	ADCIN4 — ADC analog input channel 4
Контакт 129	GND — Ground
Контакт 130	VCC — Core supply voltage
Контакт 131	VCC — Core supply voltage
Контакт 132	GND — Ground
Контакт 133	NC — Not connected (per datasheet)
Контакт 134	NC — Not connected (per datasheet)
Контакт 135	I/O — General purpose user I/O (bank 1B/2B)
Контакт 136	I/O — General purpose user I/O (bank 1B/2B)
Контакт 137	I/O — General purpose user I/O (bank 1B/2B)
Контакт 138	I/O — General purpose user I/O (bank 1B/2B)
Контакт 139	VCCIO1B — I/O supply for bank 1B
Контакт 140	GND — Ground
Контакт 141	I/O — General purpose user I/O (bank 1B/2B)
Контакт 142	I/O — General purpose user I/O (bank 1B/2B)
Контакт 143	I/O — General purpose user I/O (bank 1B/2B)
Контакт 144	EPAD — Exposed thermal pad (must be soldered to ground)

Типичное применение

10M50SAE144C8G подходит для 6 применениеs: Industrial Control I/O Expansion, Portable Medical Device Signal Conditioning, Video Bridging and Image Aggregation, I/O Expansion for SoCs and Microcontrollers, Test & Measurement Instrumentation, Motor Control Pre-Processing.

🏭

Industrial Control I/O Expansion

The 10M50SAE144C8G's 50,000 logic elements and 101 user I/Os make it well-suited as a deterministic I/O expansion coprocessor for industrial PLCs, IPCs, and microcontroller-based controllers. It can be paired with a host MCU over parallel or SPI bridge, offloading high-speed pulse counting, quadrature decoding, and multi-axis stepper pulse generation that exceed the host MCU's bandwidth. Its instant-on non-volatile flash configuration ensures deterministic boot within milliseconds, critical for fail-safe industrial startup. The integrated 12-bit ADC with up to 17 channels also eliminates an external ADC for slow analog monitoring of temperature, pressure, or supply rails. Recommended companion parts: 10M25SAE144C8G (lower-density option), host MCU such as a MAX 10 Cortex-M variant, and an isolated RS-485 transceiver.

Рекомендуется

10M25SAE144C8G · Intel MAX3162EEUE (Isolated RS-485/RS-232 transceiver)

💊

Portable Medical Device Signal Conditioning

The 10M50SAE144C8G fits portable medical monitoring designs because of its on-chip 12-bit ADC, low static power, and small 22 x 22 mm EQFP-144 footprint that fits handheld enclosures. The 50K-LE fabric can implement custom digital filters, ECG/EEG feature extraction, and packetization for Bluetooth/USB uplink to a host. On-chip flash and dual-boot remote-update support firmware upgrades in the field without requiring external boot memory. Combined with the integrated temperature-sensing diode, the FPGA can also supervise battery and PCB thermal conditions during long-term patient monitoring. Recommended companion parts: a low-noise analog front-end op-amp and a Bluetooth Low Energy module.

Рекомендуется

ADAR1000ACCZN · Analog Devices

📺

Video Bridging and Image Aggregation

With 1.6 Mbit of embedded SRAM and 101 I/Os, the 10M50SAE144C8G can aggregate multiple image sensor streams (parallel CMOS, MIPI-CSI via serializer, or LVDS), perform pixel-level pre-processing (debayer, gamma, scaling) and forward the result over USB 3.0 or Ethernet to a host processor. The MAX 10 fabric is large enough for two simultaneous 720p60 streams with line buffering in M9K blocks. The instant-on flash configuration means the bridge is ready to forward the first frame within milliseconds of power-up, important for vision-based driver-assistance and machine-vision startup. Recommended companion parts: image sensor serializers and a USB 3.0 controller.

Рекомендуется

AD9680BCPZ-500 · Analog Devices

🧩

I/O Expansion for SoCs and Microcontrollers

The 10M50SAE144C8G is frequently deployed as a flexible I/O expander alongside application processors in industrial gateways, where the SoC lacks enough GPIO, PWM channels, or special-purpose interfaces. The FPGA maps to the SoC over SPI or a parallel bus, exposing custom peripherals (PWM, quadrature encoder, custom UART, IrDA, LCD timing). Hot-socketing capability means the FPGA can be inserted onto a powered backplane without back-driving the system. Quartus IP libraries include UART, SPI, I2C, and PWM cores that can be stitched into a custom peripheral in days rather than months. Recommended companion parts: a Cortex-A industrial SoM and an SPI flash for SoC boot.

Рекомендуется

10M50DCF672C8G · Intel

🔬

Test & Measurement Instrumentation

Test and measurement front-ends benefit from the 10M50SAE144C8G's deterministic fabric, on-chip ADC, and 101 LVDS-capable I/Os. The device can implement custom trigger logic, pattern generation, and protocol-aware decoding for serial buses (I2C, SPI, UART, CAN, LVDS) without off-the-shelf logic analyzer ASICs. The 12-bit on-chip ADC is sufficient for slow analog measurements like supply-rail health and front-end temperature, while the 50K-LE fabric handles real-time state machines for sequencer control. Combined with the non-volatile flash, instrument designers can ship one board that supports multiple firmware personalities selected at boot. Recommended companion parts: high-speed ADCs and precision references.

Рекомендуется

AD9680BCPZ-1250 · Analog Devices

🤖

Motor Control Pre-Processing

The 10M50SAE144C8G is well-suited to offload real-time motor-control pre-processing from the main MCU: it can implement up to 6-channel PWM generation with dead-time insertion, quadrature encoder decoding, and field-oriented control (FOC) math in logic using the embedded multipliers. The on-chip ADC simultaneously samples phase currents and bus voltage, reducing component count and improving loop determinism. Closed-loop control loop latency is bounded by FPGA fabric delays rather than software interrupts, enabling higher PWM frequencies and quieter operation. The exposed thermal pad supports the elevated power dissipation typical when the device is fully populated with logic. Recommended companion parts: gate drivers and current-sense amplifiers.

Рекомендуется

10M25DAF484C8G · Intel

Сводка рекомендуемых товаров

10M25SAE144C8G Intel Используется в: Industrial Control I/O Expansion MAX3162EEUE Isolated RS-485/RS-232 transceiver Используется в: Industrial Control I/O Expansion ADAR1000ACCZN Analog Devices Используется в: Portable Medical Device Signal Conditioning AD9680BCPZ-500 Analog Devices Используется в: Video Bridging and Image Aggregation 10M50DCF672C8G Intel Используется в: I/O Expansion for SoCs and Microcontrollers AD9680BCPZ-1250 Analog Devices Используется в: Test & Measurement Instrumentation 10M25DAF484C8G Intel Используется в: Motor Control Pre-Processing

What is the operating temperature range of the 10M50SAE144C8G?

The 10M50SAE144C8G operates over a commercial temperature range of 0C to +85C, as indicated by the "C8" speed/temperature suffix in the ordering part number. This commercial grade is suitable for indoor industrial control, test equipment, and consumer applications but is not qualified for automotive or extended-industrial environments. For -40C to +100C industrial, use the I7 grade variants such as 10M50SAE144I7G.

How many logic elements does the 10M50SAE144C8G have?

The 10M50SAE144C8G contains 50,000 Logic Elements (LEs), placing it in the upper-middle of the MAX 10 family. Each LE consists of a 4-input LUT and a programmable register, organized into Logic Array Blocks (LABs) of 16 LEs. This density comfortably fits designs such as industrial protocol bridges, I/O expansion, video aggregation, and motor-control pre-processing without requiring external memory or DSP blocks.

Is the 10M50SAE144C8G volatile or non-volatile?

The 10M50SAE144C8G is non-volatile, integrating the configuration flash on-chip rather than relying on external boot memory. According to Intel's MAX 10 Family datasheet, configuration completes in milliseconds from internal flash, enabling instant-on behavior. Dual-configuration flash supports remote system upgrade, so a failed bitstream can be reverted at next power-up, which is critical for unattended industrial installations.

What package does the 10M50SAE144C8G use?

The 10M50SAE144C8G is packaged in a 144-pin plastic Enhanced QFP (EQFP-144) measuring 22 x 22 mm with a 0.50 mm lead pitch and an exposed thermal pad. The exposed pad must be soldered to a ground plane to meet the package's thermal performance. This is a surface-mount JEDEC-compliant QFP form factor compatible with standard SMT assembly lines.

Does the 10M50SAE144C8G include an ADC?

Yes, the 10M50SAE144C8G integrates a 12-bit successive-approximation ADC with up to 17 analog input channels, shared between the on-chip temperature-sensing diode and external analog inputs. This is unique among FPGAs in this density range and removes the need for an external ADC in many industrial and motor-control applications, reducing both BOM cost and PCB area.

Where can I download the 10M50SAE144C8G datasheet PDF?

The official 10M50SAE144C8G datasheet is available from Altera/Intel's product page at https://www.altera.com/products/fpga/max/10/10m50-e144/10M50SAE144C8G and mirrored at https://www.alterasemi.com/datasheet/alterasemi/10M50SAE144C8G.pdf. The document covers electrical characteristics, pinout, configuration, and package thermal data for the MAX 10 10M50 device in the E144 package.

What software do I use to program the 10M50SAE144C8G?

The 10M50SAE144C8G is programmed using Intel Quartus Prime design software (Lite, Standard, or Pro edition depending on device support). Quartus handles synthesis, place-and-route, timing analysis, power estimation, and bitstream generation. Programming hardware includes the USB-Blaster, ByteBlaster, or JTAG chains, and the on-chip flash is programmed via JTAG or Active Serial using a .pof file.

How much embedded memory does the 10M50SAE144C8G have?

The 10M50SAE144C8G contains 1,677,312 bits (approximately 1.6 Mbit) of embedded SRAM, organized as M9K blocks of 9 Kbits each. These blocks can be configured as RAM, ROM, FIFO, or shift registers with independent parity bits and optional ECC. This is sufficient for line buffers, packet FIFOs, and dual-port buffers in industrial bridging and video aggregation designs.

What is the difference between 10M50SAE144C8G and 10M50DAE144C8G?

Both share the same 50K-LE MAX 10 silicon and EQFP-144 package, but the S-suffix (10M50SAE144C8G) is the dual-image flash version, while the D-suffix (10M50DAE144C8G) is the single-image flash version. The S variant supports dual-boot remote system upgrade, while the D variant uses one configuration image, freeing more on-chip flash for user data. They are pin-to-pin compatible drop-in alternatives in the same EQFP-144 footprint.

Can the 10M50SAE144C8G operate in industrial -40C to +85C environments?

No, the 10M50SAE144C8G is the commercial-grade "C8" variant rated 0C to +85C. For industrial -40C to +100C operation, choose the I7 grade, such as 10M50SAE144I7G, which uses the same EQFP-144 footprint and is a drop-in replacement. The I7 variant goes through additional Intel qualification for thermal and reliability margins expected in factory-floor deployments.

What is a drop-in replacement for the 10M50SAE144C8G?

Same-family drop-in replacements in the EQFP-144 footprint include 10M50SAE144I7G (industrial temp grade), 10M50SCE144C8G (commercial temp, same 50K LE silicon), and the D-suffix 10M50DAE144C8G (single-image flash). For cross-brand drop-in equivalents, Xilinx Spartan-6 LX45 in FGG484 and Lattice ECP5 LFE5U-45F in cabg256 are functionally compatible but use different footprints and are not pin-compatible at the PCB level.

What are the key specifications of the 10M50SAE144C8G that engineers should know?

The 10M50SAE144C8G is a 50K-LE non-volatile MAX 10 FPGA in a 144-pin EQFP, with 1.6 Mbit embedded SRAM, 101 max user I/Os, on-chip 12-bit ADC with up to 17 channels, dual-configuration flash for remote system upgrade, support for LVCMOS/LVDS/SSTL I/O, and commercial 0C to +85C temperature grade. It uses the 55 nm embedded-flash process enabling instant-on without external boot memory.

What is the price of the 10M50SAE144C8G in 100-piece quantities?

The 10M50SAE144C8G is priced at approximately $58.75 per unit in 100-piece quantities as of 2026-09-05, with tier pricing dropping to roughly $47.90 at 1000 pieces. Pricing is quoted through authorized distributors such as DigiKey and Mouser, and lead time for the C8 commercial grade is typically 8 to 12 weeks from Intel. For urgent orders, contact authorized distributors directly to confirm current stock and expedite options.

Where can I buy the 10M50SAE144C8G online with current stock?

The 10M50SAE144C8G is in stock at authorized distributors including DigiKey (part number 5284852 on their product page) and Mouser, with Octopart listing current pricing across both. Lead times for non-stocked quantities from Intel typically run 8 to 12 weeks. Independent distributors (RLX Solutions, Precision Logic, Lisleapex, Chipkind) also carry stock but verify authenticity and traceability before placing orders for production builds.

Справочные инженерные данные для 10M50SAE144C8G — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the 10M50SAE144C8G when you need a non-volatile, instant-on FPGA with 50K logic elements, integrated 12-bit ADC, and dual-image remote-upgrade flash in a commercial-grade 22x22 mm EQFP-144 footprint. If your deployment requires industrial -40C to +100C operation, swap to the same-footprint 10M50SAE144I7G with no layout change. If your design fits in 40K or 25K LE, step down to 10M40SAE144C8G or 10M25SAE144C8G respectively for cost savings, also in the same EQFP-144. If you do not need dual-boot and want to reclaim on-chip flash for user data, use the D-suffix 10M50DAE144C8G. Cross-brand alternatives (Xilinx Spartan-6, Lattice ECP5) require PCB rework because of incompatible pinouts.

Сравнение с аналогами

Параметр	Этот товар	10M50SAE144I7G	10M50SCE144C8G	10M50DAE144C8G	10M40SAE144C8G	10M25SAE144C8G
Brand	Intel	Intel	Intel	Intel	Intel	Intel
Package	EQFP-144 (22x22 mm)	EQFP-144 - same	EQFP-144 - same	EQFP-144 - same	EQFP-144 - same	EQFP-144 - same
Logic Elements	50000	50000	50000	50000	40000	25000
Embedded Memory	1677312 bits	1677312 bits	1677312 bits	1677312 bits	1290240 bits	806400 bits
Max User I/Os	101	101	101	101	101	101
Temperature Grade	0C to +85C (Commercial, C8)	-40C to +100C (Industrial, I7)	0C to +85C (Commercial, C8)	0C to +85C (Commercial, C8)	0C to +85C (Commercial, C8)	0C to +85C (Commercial, C8)
Configuration Flash	Dual-image (S-suffix)	Dual-image (S-suffix)	Dual-image (S-suffix)	Single-image (D-suffix)	Dual-image (S-suffix)	Dual-image (S-suffix)
ADC	12-bit, up to 17 channels	12-bit, up to 17 channels	12-bit, up to 17 channels	12-bit, up to 17 channels	12-bit, up to 17 channels	12-bit, up to 17 channels

Ключевые отличия

Non-volatile instant-on with on-chip 12-bit ADC (против 10M40SAE144C8G (40K LE variant))
Dual-image flash for remote system upgrade (против 10M50DAE144C8G (single-image flash))
50K LE in EQFP-144 with commercial temp grade (против 10M25SAE144C8G (25K LE variant))

Заметки по проектированию

Solder the exposed thermal pad (EPAD, pin 144) to a continuous ground copper pour of at least 1 square inch on the top layer with multiple thermal vias stitching the pad to internal ground planes. The EQFP-144 thermal performance depends entirely on this pad; without adequate copper the junction temperature can exceed the 125C limit at elevated ambient. Estimated: at 1 W dissipation in still air with 1 sq-in copper pour, junction temperature rises approximately 25-30C above ambient. Keep high-power external components away from the pad area to avoid thermal coupling.

Decouple every VCC and VCCIO bank pin with a 0.1 uF X7R ceramic capacitor placed within 100 mils of the pin, and add a single 10 uF bulk capacitor near each bank. The MAX 10 has separate VCC (core) and VCCIO1 through VCCIO8 (per-bank I/O) supplies, plus VCCA1/VCCA2 for the ADC analog circuits. Analog supplies should be filtered with a ferrite bead and have their own 10 uF + 0.1 uF local decoupling to minimise ADC crosstalk. Power-up sequencing should follow Intel's MAX 10 Hardware Design Guidelines; in particular VCCA must ramp with or after VCC to avoid latch-up.

Bank I/O voltages (VCCIO1-VCCIO8) can be set independently to support mixed-voltage interfaces (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V) without external level shifters. When routing differential pairs (LVDS), keep the P/N traces length-matched within 50 mils and maintain 100-ohm differential impedance with 50-ohm single-ended reference to ground. JTAG chain pins (TCK, TMS, TDI, TDO) should be pulled to known logic levels through 10 kohm resistors if unused, to avoid floating inputs that can corrupt boundary-scan tests.

Do not leave configuration pins (nCONFIG, nSTATUS, CONFIG_DONE, DCLK, DATA0) floating; if not used in the application, tie nCONFIG through 10 kohm to VCC, leave nSTATUS and CONFIG_DONE as outputs, and route DCLK and DATA0 to a JTAG header for in-field reprogramming. Note that the S-suffix part supports dual-boot remote system upgrade, while the D-suffix uses single-image flash and frees more user flash at the cost of field-upgrade safety. Choose density carefully: 10M40/10M25 variants are pin-compatible drop-ins only when your design fits the smaller LE count.

The MAX 10 LVDS I/O can operate at up to 800 Mbps per channel. Maintain 100-ohm differential impedance and keep ground reference continuous under the pair; route over an unbroken reference plane to avoid return-path discontinuities that cause common-mode noise. For ADC inputs, use a 0.1 uF X7R bypass close to the ADCIN pin and a 10 kohm anti-aliasing RC network on each input. Quartus Prime's Pin Planner reports per-pin signal integrity advisories; always run Fitter and Timing Analyzer before tape-out.

Информация о соответствии

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Qualified

Без свинца

Yes

Без галогенов

Unknown

Конфликтные минералы

Compliant

RoHS compliant and lead-free per Altera/Intel product page (https://www.altera.com/products/fpga/max/10/10m50-e144/10M50SAE144C8G). Not AEC-Q100 qualified - choose AEC-Q100 variants for automotive. Halogen-free status not explicitly stated in the verified data.

Данные проверены: 2026-09-05 — данные проверены и курируются командой компонентной инженерии XAIPART

Источники: Distributor, Distributor, Octopart, Manufacturer Product Page, Manufacturer Datasheet

Связанные компоненты & термины

Intel Altera 10M50SAE144C8G 10M50SAE144I7G 10M50SCE144C8G 10M50DAE144C8G 10M40SAE144C8G 10M25SAE144C8G MAX 10 FPGA field programmable gate array programmable logic device (PLD) non-volatile FPGA logic element (LE) embedded SRAM M9K memory block EQFP-144 LQFP exposed pad 12-bit ADC dual-configuration flash remote system upgrade RoHS Quartus Prime JTAG industrial automation video bridging motor control portable medical device test and measurement