EP2SGX90EF1152C4N vs EP2SGX90EF1152C3ES Сравнение
Подробное сравнение бок о бок EP2SGX90EF1152C4N от Intel и EP2SGX90EF1152C3ES от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Intel
EP2SGX90EF1152C4N - Stratix II GX FPGA, 90960 LE, 1152-FBGA | Intel
EP2SGX90EF1152C4N ⚠ Последняя закупкаIntel
EP2SGX90EF1152C3ES - Stratix II GX FPGA 90nm 558 I/O 1152-BBGA | Intel
EP2SGX90EF1152C3ES ⚠ Последняя закупкаСравнение характеристик
| Параметр | EP2SGX90EF1152C4N | EP2SGX90EF1152C3ES |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Последняя закупка | Последняя закупка |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $695,00 | $2.050,00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LE) | 90,960 | — |
| LABs/CLBs | 4,548 | — |
| Total RAM Bits | 4,520,448 bits | — |
| User I/O Count | 558 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Core Voltage | 1.2 V | 1.5 V (Enhanced, 'E' suffix) |
| Process Node | 90 nm | 90 nm |
| Transceivers | Up to 20 channels, 6.375 Gbps per channel | — |
| Speed Grade | C4 | C3 |
| Рабочая температура | Commercial (0C to +85C) | — |
| Корпус | 1152-BBGA / FC-FBGA-1152 | 1152-BBGA (FineLine BGA, 35x35 mm) |
| Тип монтажа | Surface Mount (BGA) | Surface Mount (BGA) |
| Уровень MSL | MSL-3 / MS-034AAR-1 (per package outline) | — |
| Lead-Free / RoHS | Lead free; RoHS compliance per JEDEC | — |
| Logic Elements | — | 90,960 |
| Embedded Memory | — | 4,520,448 bits (approx. 4.5 Mbit) |
| User I/O Pins | — | 558 |
| Temperature Grade | — | Commercial Extended (-40 C to +100 C) |
| High-Speed Transceivers | — | Up to 12 channels (per Stratix II GX family) |
| Transceiver Data Rate | — | Up to 6.375 Gbps per channel (family spec) |
| DSP Blocks | — | Yes, dedicated 18x18 multipliers and accumulators |
| PLL Count | — | [DATA_NEEDED: PLL count for EP2SGX90 variant] |
| User I/O Banks | — | 24 (per package datasheet) |
| Configuration | — | SRAM-based, supports Fast Passive Parallel, Fast Active Serial, JTAG |
| Статус RoHS | — | Compliant |
| Lead-Free | — | Yes |