EP2SGX90EF1152C4N vs EP2SGX90EF1152C3ES 对比

详细并排对比 EP2SGX90EF1152C4N 出自 Intel 和 EP2SGX90EF1152C3ES 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP2SGX90EF1152C4N EP2SGX90EF1152C4N - Stratix II GX FPGA, 90960 LE, 1152-FBGA | Intel

EP2SGX90EF1152C4N - Stratix II GX FPGA, 90960 LE, 1152-FBGA | Intel

EP2SGX90EF1152C4N ⚠ 最后一次采购
Intel
EP2SGX90EF1152C3ES EP2SGX90EF1152C3ES - Stratix II GX FPGA 90nm 558 I/O 1152-BBGA | Intel

EP2SGX90EF1152C3ES - Stratix II GX FPGA 90nm 558 I/O 1152-BBGA | Intel

EP2SGX90EF1152C3ES ⚠ 最后一次采购

规格对比

参数 EP2SGX90EF1152C4N EP2SGX90EF1152C3ES
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 最后采购期
库存状态 有库存 有库存
单价(USD) $695.00 $2,050.00
Family Stratix II GX Stratix II GX
Logic Elements (LE) 90,960 —
LABs/CLBs 4,548 —
Total RAM Bits 4,520,448 bits —
User I/O Count 558 —
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
Core Voltage 1.2 V 1.5 V (Enhanced, 'E' suffix)
Process Node 90 nm 90 nm
Transceivers Up to 20 channels, 6.375 Gbps per channel —
Speed Grade C4 C3
工作温度 Commercial (0C to +85C) —
封装 1152-BBGA / FC-FBGA-1152 1152-BBGA (FineLine BGA, 35x35 mm)
安装类型 Surface Mount (BGA) Surface Mount (BGA)
MSL 等级 MSL-3 / MS-034AAR-1 (per package outline) —
Lead-Free / RoHS Lead free; RoHS compliance per JEDEC —
Logic Elements — 90,960
Embedded Memory — 4,520,448 bits (approx. 4.5 Mbit)
User I/O Pins — 558
Temperature Grade — Commercial Extended (-40 C to +100 C)
High-Speed Transceivers — Up to 12 channels (per Stratix II GX family)
Transceiver Data Rate — Up to 6.375 Gbps per channel (family spec)
DSP Blocks — Yes, dedicated 18x18 multipliers and accumulators
PLL Count — [DATA_NEEDED: PLL count for EP2SGX90 variant]
User I/O Banks — 24 (per package datasheet)
Configuration — SRAM-based, supports Fast Passive Parallel, Fast Active Serial, JTAG
RoHS 状态 — Compliant
Lead-Free — Yes

数据手册与资源

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