10CX150YF780I6G - 150K LE Cyclone 10 GX FPGA 780-FBGA | Intel
Артикул: 10CX150YF780I6G ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $460 | $460,00 |
| 10 | $432.4 | $4.324,00 |
| 100 | $404.8 | $40.480,00 |
| 500 | $365 | $182.500,00 |
| 1.000 | $325 | $325.000,00 |
10CX150YF780I6G Обзор
A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device that allows designers to configure custom digital logic, memory blocks, DSP slices, and I/O after fabrication. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) -> complex programmable logic devices (CPLDs) -> FPGAs -> high-performance FPGAs, and are widely used for parallel data processing, hardware acceleration, and interface bridging where ASIC NRE cost is unjustified. The Cyclone 10 GX family targets cost-sensitive mid-density designs that still need transceiver bandwidth and DSP throughput.
Key features include 1.25 GHz LVDS performance on the FPGA fabric, hard memory controllers for DDR3/DDR3L/LPDDR3 external memory, hard PCIe Gen2 hard IP blocks, and hardened floating-point multipliers. The device supports up to 480 user I/O pins (industrial grade, 6-speed grade, 780-pin FBGA, the F780 package code) and integrates a hardened Security feature set for bitstream protection. Industrial temperature range is -40C to +100C (junction), with the I6G speed grade denoting the industrial tier.
The Cyclone 10 GX architecture combines a logic fabric of adaptive logic modules (ALMs), M20K SRAM blocks, and variable-precision DSP blocks. The 20 nm process allows higher integration at lower static power versus the prior 28 nm Cyclone V generation, while embedded hard IP (PCIe Gen2, transceivers, memory controllers) frees up fabric resources for user logic.
Typical applications include industrial machine-vision cameras, video broadcast and professional AV equipment, motor control and industrial Ethernet interfaces, low-cost PCIe Gen2 endpoint cards, and 4K video processing. Transceivers enable 3G-SDI, DisplayPort, and GigE Vision connectivity.
Design considerations: power estimation must use the Intel Early Power Estimator (EPE) before pin assignment; an FPGA of this density typically requires a multi-layer PCB with continuous GND planes and decoupling per Intel's Cyclone 10 GX pin connection guidelines.
This page synthesizes distributor pricing, parametric alternatives in the same FBGA-780 footprint, and practical design notes not found in the manufacturer datasheet.
Аналоги без доработки для 10CX150YF780I6G — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с 10CX150YF780I6G (тот же форм-фактор и посадочное место) — отличается по Package, Speed Grade, Transceivers, Mounting Type, DSP Blocks.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
10CX150YF780I5G
✅ Прямая замена✓ В наличии
$165 / шт.
Открыть даташит →10CX150YF780E6G
✅ Прямая замена✓ В наличии
$575 / шт.
Открыть даташит →10CX150YF780E5G
✅ Прямая замена✓ В наличии
$160 / шт.
Открыть даташит →10CX105YF780I6G
✅ Прямая замена✓ В наличии
$1495 / шт.
Открыть даташит →10CX105YF780I5G
✅ Прямая замена✓ В наличии
$115 / шт.
Открыть даташит →10CX105YF780E6G
✅ Прямая замена✓ В наличии
$580 / шт.
Открыть даташит →10CX150YF780I6G Максимальные параметры и электрические характеристики
| Family | Cyclone 10 GX |
| Logic Elements (LE) | 150,000 |
| Embedded Memory (total bits) | 10,907,648 bits |
| DSP Blocks (18x19 multipliers) | 484 |
| Transceivers | Up to 12 (3.125 Gbps) |
| Корпус | 780-ball FBGA (F780) |
| Process Node | 20 nm |
| Speed Grade | I6G (industrial, -40C to +100C junction) |
| Temperature Range | Industrial: -40C to +100C (TJ) |
| Hard Memory Controller | DDR3 / DDR3L / LPDDR3 |
| Hard PCIe | PCIe Gen2 (x1/x2/x4 hard IP) |
| Configuration | Active Serial (AS), Passive Serial (PS), JTAG |
| Статус RoHS | Compliant (per distributor listing) |
| Тип монтажа | Surface Mount (FBGA) |
Руководство по цоколевке 10CX150YF780I6G в корпусе 780-ball fbga (f780)
Цоколевка для 10CX150YF780I6G (корпус 780-ball fbga (f780)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для 10CX150YF780I6G.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
10CX150YF780I6G подходит для 7 применениеs: Industrial Machine Vision, Video Broadcast and Professional AV, PCIe Gen2 Endpoint Cards, Industrial Motor Control and Drives, Test and Measurement Instrumentation, Aerospace and Avionics Subsystems, Medical Imaging Equipment.
Industrial Machine Vision
The 10CX150YF780I6G fits industrial machine-vision pipelines because its 484 DSP blocks deliver the parallel throughput needed for real-time Bayer demosaic, edge detection, and defect classification at 4K sensor resolutions. The 12 integrated transceivers at 3.125 Gbps directly drive CoaXPress, Camera Link HS, or multi-channel GigE Vision links without external PHY devices, reducing BOM cost. The DDR3 hard memory controller handles high-bandwidth frame buffering at up to 1.6 GT/s, while the 780-ball FBGA package allows compact multi-camera frame grabber designs. Industrial temperature grade (I6G, -40C to +100C junction) supports factory-floor deployment without thermal derating. Compared to a Cyclone V 5CGXFC7 migration path, the 10CX150 provides ~40% more logic and 3x more DSP at comparable cost.
Рекомендуется
Video Broadcast and Professional AV
In 4K broadcast routers, multi-viewers, and contribution encoders, the 10CX150YF780I6G is well-suited because its 150K logic elements and 484 DSP slices can process 4:2:2 and 4:4:4 video at 60 fps on a single device. The 12 transceivers natively support 3G-SDI, 6G-SDI, and 12G-SDI (via external retiming) plus DisplayPort 1.2 sink/source for monitor walls. PCIe Gen2 hard IP enables direct connection to host CPUs for streaming workflows. The 20 nm process keeps static power low enough for fanless chassis designs common in broadcast studios. Combined with Intel's Video and Image Processing (VIP) IP suite, the device replaces discrete ASSP encoder/decoder chips in mid-tier broadcast products.
Рекомендуется
PCIe Gen2 Endpoint Cards
The 10CX150YF780I6G integrates PCIe Gen2 hard IP (x1, x2, x4 lane support), making it a drop-in endpoint controller for low-cost accelerator cards, data-acquisition boards, and protocol analyzers. With 150K logic elements, designers can implement multi-protol packet processing, custom DMA engines, and timing-critical interface logic alongside the PCIe stack. The DDR3 hard memory controller (up to 1.6 GT/s) buffers high-throughput streams from the host bus, while 12 transceivers provide optional auxiliary high-speed links (e.g., Aurora, Interlaken lite) for multi-card synchronization. The F780 FBGA package fits standard PCIe x4 form-factor card designs with adequate thermal headroom under industrial airflow.
Рекомендуется
Industrial Motor Control and Drives
The 10CX150YF780I6G suits multi-axis servo drives and high-end motor controllers because its 484 DSP blocks execute field-oriented control (FOC), space-vector PWM, and sinusoidal filters for up to 6 axes simultaneously. The 150K logic elements absorb additional safety logic (STO, SLS, SDI) for functional-safety implementations, while industrial temperature grade supports cabinet-mounted drive electronics. The 12 transceivers enable multi-axis EtherCAT or PROFINET IRT master implementations using external PHYs. Hardened memory controllers interface directly to DDR3 for encoder feedback buffering. Compared to MCU-based solutions, the FPGA approach delivers deterministic latency and faster control-loop rates (sub-microsecond).
Рекомендуется
Test and Measurement Instrumentation
For mid-range oscilloscopes, protocol analyzers, and logic analyzers, the 10CX150YF780I6G is an appropriate signal-processing engine because its 150K logic elements implement custom trigger logic, protocol decoding (PCIe, USB, I2C, SPI), and high-speed ADC interface glue logic. The 484 DSP blocks accelerate FFT-based spectrum analysis and digital filtering at sample rates above 1 GSPS. The 12 transceivers handle serialized data capture and trigger distribution across multi-instrument racks. Industrial temperature grade and DDR3 buffering of deep acquisition memory make the device suitable for portable and rack-mounted test equipment. Quartus Prime integration with MathWorks MATLAB/Simulink accelerates signal-processing IP development.
Рекомендуется
Aerospace and Avionics Subsystems
Although not DO-254-qualified, the 10CX150YF780I6G is used in commercial aerospace subsystems (in-flight entertainment, cabin networking, flight-data recorders) where its 150K logic elements, 12 transceivers, and industrial temperature grade provide the required performance envelope. The DDR3 hard memory controller buffers streaming sensor data, while PCIe Gen2 hard IP links to flight computers. The 20 nm process lowers power versus prior-generation FPGA choices, an important consideration for airborne weight and cooling budgets. Designers implement custom ARINC 429, MIL-STD-1553 (with external transceiver), and Ethernet interfaces using the transceiver channels and DSP blocks. For full DO-254 platforms, designers select qualified companions rather than this commercial-grade variant.
Рекомендуется
Medical Imaging Equipment
The 10CX150YF780I6G fits mid-tier medical imaging modalities (portable ultrasound, endoscopy processors, dental 3D scanners) because its 484 DSP blocks accelerate beamforming, image reconstruction, and real-time filtering of ultrasound RF data or optical coherence tomography signals. The 12 transceivers link to high-speed ADC front-ends and medical-grade camera sensors. DDR3 hard memory controller handles large frame buffers, while PCIe Gen2 hard IP interfaces to host CPUs for DICOM image transfer. Industrial temperature grade supports hospital and ambulatory environments. The combination of low static power (20 nm) and high DSP throughput delivers a favorable perf-per-watt profile for portable diagnostic devices.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для 10CX150YF780I6G — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | 10CX150YF780I5G | 10CX150YF780E6G | 10CX150YF780E5G | 10CX105YF780I6G | 10CX105YF780I5G | 10CX105YF780E6G |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FBGA (F780) | 780-ball FBGA (F780) | 780-ball FBGA (F780) | 780-ball FBGA (F780) | 780-ball FBGA (F780) | 780-ball FBGA (F780) | 780-ball FBGA (F780) |
| Logic Elements (LE) | 150,000 | 150,000 | 150,000 | 150,000 | 105,000 | 105,000 | 105,000 |
| Speed Grade | I6G (industrial, -40C to +100C TJ) | I5G (industrial, lower speed) | E6G (extended temperature) | E5G (extended, lower speed) | I6G | I5G | E6G |
| Transceivers | 12 (up to 3.125 Gbps) | 12 (up to 3.125 Gbps) | 12 (up to 3.125 Gbps) | 12 (up to 3.125 Gbps) | 12 (up to 3.125 Gbps) | 12 (up to 3.125 Gbps) | 12 (up to 3.125 Gbps) |
| DSP Blocks (18x19) | 484 | 484 | 484 | 484 | 156 | 156 | 156 |
| Embedded Memory (M20K bits) | 10,907,648 | 10,907,648 | 10,907,648 | 10,907,648 | 5,560,320 (approx) | 5,560,320 (approx) | 5,560,320 (approx) |
| Hard PCIe IP | PCIe Gen2 x1/x2/x4 | PCIe Gen2 x1/x2/x4 | PCIe Gen2 x1/x2/x4 | PCIe Gen2 x1/x2/x4 | PCIe Gen2 x1/x2/x4 | PCIe Gen2 x1/x2/x4 | PCIe Gen2 x1/x2/x4 |
| Approx. Unit Price (qty 1, USD) | $460.00 | ~$440 (lower speed, similar price) | ~$480 (extended grade premium) | ~$455 (extended + lower speed) | ~$320 (lower-density savings ~30%) | ~$305 | ~$335 |
Ключевые отличия
- Highest speed grade in Cyclone 10 GX 150K LE F780 family (против 10CX150YF780I5G)
- Industrial junction temperature range (vs extended grade) (против 10CX150YF780E6G)
- Full 150K LE and 484 DSP capacity (против 10CX105YF780I6G)
- Same F780 footprint across density grades enables PCB reuse (против 10CX085YU484I6G)
Заметки по проектированию
Estimated: a Cyclone 10 GX 10CX150 device at typical 60-70% utilization with 8 active transceivers at 3.125 Gbps draws approximately 4-6 W of dynamic power plus 0.5-1.0 W static. Use the Intel Early Power Estimator (EPE) for pre-layout power budgeting; Quartus Prime PowerPlay produces post-fit power figures after place-and-route. For fanless industrial enclosures, plan for at least 30 mm x 30 mm of continuous top-layer copper under the F780 exposed pad connected to a 4-layer PCB with GND plane.
The F780 FBGA has 0.8 mm ball pitch and 780 balls arranged in a fully-populated array. Use at least a 6-layer PCB stackup with 1 oz copper on outer layers; escape routing requires 4 mil (0.1 mm) trace and space with microvia-in-pad for inner-row balls. The center GND balls and exposed pad must be soldered to a GND plane with thermal vias (0.3 mm drill, 1.0 mm pitch, filled-and-capped for optimal thermal dissipation). Decoupling: 0.1 uF + 1 uF X7R 0402/0201 per power pin within 1 mm trace length per Intel's Cyclone 10 GX pin connection guidelines.
Transceiver channels must be routed with controlled impedance (100 ohm differential) using a vendor stackup calculator; reference plane must be continuous under the entire channel. Keep high-speed serial traces away from clock and power switching nodes by at least 5x the dielectric height. The PCIe hard IP blocks have dedicated TX/RX pin assignments that must be reserved during pin planning in Pin Planner before place-and-route to avoid costly changes. DCM and PLL reference clock inputs require 50 ohm single-ended termination as close to the FPGA pin as possible.
Estimated: with the F780 exposed pad connected to a 1 square inch (645 sq mm) of GND copper on a 4-layer PCB, theta_JA is approximately 12-15 C/W. At 5 W dissipation and 70 C ambient, junction temperature reaches 130-145 C, exceeding the industrial 100 C limit. Active cooling (small heatsink or 50 LFM airflow) is required for designs utilizing full transceiver and DSP bandwidth. Use the thermal resistor values from the Intel Cyclone 10 GX packaging thermal model document for accurate simulation.
Do not skip the configuration mode jumper resistors: the Cyclone 10 GX uses MSEL[3:0] pins to select AS/PS/JTAG configuration mode, and incorrect settings will brick the board. Verify pin planning in Quartus Prime Pin Planner before PCB fab; AS configuration requires a serial flash (EPCQ-L or compatible) connected to specific dedicated pins. The I6G speed grade is not backward compatible with software-generated bitstreams targeting E6G or I5G; bitstream files are speed-grade-specific and must be regenerated after migration.
Информация о соответствии
RoHS compliance per distributor listings (DigiKey, Mouser). Industrial temperature grade I6G (-40C to +100C junction) is qualified per Intel Cyclone 10 GX datasheet. AEC-Q100 not applicable (FPGA is not an automotive-grade IC at this grade level). REACH compliance assumed per EU distributor listings.