Intel

10CX105YF780I6G - Cyclone 10 GX FPGA 104K LE | Intel | 780-FBGA

Артикул: 10CX105YF780I6G ✓ Активен

В наличии Отправка в течение 1–3 рабочих дней

780-Ball FCBGA Package 6 Speed 8,641,536 Memory

От $1495 USD / шт.

MOQ: 1 |

Цена обновлена: 2026-09-05

Оптовые цены

Кол-во	Цена за ед.	Итого
1	$1826.62	$1.826,62
10	$1750	$17.500,00
100	$1620	$162.000,00
250	$1555	$388.750,00
500	$1495	$747.500,00

ℹ️ Все цены указаны в USD

Открыть datasheet (PDF) Смотреть аналоги

Количество

10CX105YF780I6G Обзор

The Intel 10CX105YF780I6G is a Cyclone 10 GX field-programmable gate array (FPGA) with 104,000 logic elements, 8,641,536 bits of embedded memory, and 284 user I/O pins, housed in a 780-ball Flip-Chip BGA (FCBGA) package. Built on Intel's 20 nm process, this device integrates up to 1.5 Gbps LVDS and 6.144 Gbps transceiver capability, targeting high-bandwidth bridging, video connectivity, and industrial vision applications. The Industrial temperature grade (I) ensures operation from -40C to +100C ambient.

An FPGA is a programmable logic device containing configurable logic blocks (CLBs), dedicated DSP blocks, embedded SRAM, and programmable I/O, all interconnected by a programmable routing fabric. FPGAs occupy a middle ground between fixed-function ASICs and general-purpose microcontrollers: they deliver hardware parallelism and deterministic latency for data-pipeline tasks while allowing full logic redesign after PCB fabrication. Within Intel's low-power Cyclone family, the Cyclone 10 GX adds hardened transceivers and an integrated protocol stack for PCI Express Gen2 and 10 GbE (10GBASE-R/KR) on the higher-density members, differentiating it from the transceiver-less Cyclone 10 LP.

Key features of the 10CX105YF780I6G include 104K logic elements, 8,641,536 embedded memory bits, 156 embedded 18x18 multipliers, 1 PLL per side, and 6 transceiver channels operating up to 6.144 Gbps. The device also provides 2 hard memory controllers and 1 PCIe Gen2 hard IP block (x4 root port or endpoint). The 780-pin FCBGA package exposes 284 user I/O supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards.

Architecturally, the Cyclone 10 GX uses a logic-structural fabric with adaptive logic modules (ALMs) of 8-input fracturable look-up tables, fine-grained DSP blocks with pre-adder and accumulator chains, and embedded M20K memory blocks. Hardened protocol IP reduces soft-logic overhead for PCIe and Ethernet, allowing more design resources to be allocated to application logic.

Typical applications include industrial machine vision over GigE Vision or CoaXPress, video broadcast contribution encoders, low-density PCIe endpoint cards, military secure radio, and FPGA-based motor control for industrial drives. Designers choose this part for moderate-density designs that require hardened transceivers without paying the power and cost of higher-end Stratix or Arria 10 devices.

When designing with the 10CX105YF780I6G, engineers should plan power-rail sequencing (1.0V core, 2.5V/3.3V aux, 1.8V transceiver PLL), use a minimum of 8 PCB layers with continuous GND planes for transceiver signal integrity, and ensure thermal dissipation through the exposed die on the FCBGA. The Quartus Prime Lite or Pro toolchain is required for synthesis and place-and-route.

This page synthesizes distributor pricing, drop-in alternatives from the Cyclone 10 GX family, and practical design notes not found in the manufacturer datasheet alone, helping procurement and engineering teams decide quickly whether 10CX105YF780I6G is the correct fit for their volume production.

Аналоги без доработки для 10CX105YF780I6G — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с 10CX105YF780I6G (тот же форм-фактор и посадочное место) — отличается по Package, Transceivers, Logic Elements (LE), Mounting Type, Operating Temperature.

10CX105YF780E5G

Intel

Package: 780-ball FCBGA (F780)

Transceivers: GX transceivers up to 12.5 Gbps

Operating Temperature: 0 C to +100 C (commercial)

Сравнить с 10CX105YF780I6G →

10CX105YF780E6G

Intel

Package: 780-ball FCBGA (F780)

Transceivers: 6 channels, up to 12.5 Gbps

Logic Elements (LE): 104,000

Сравнить с 10CX105YF780I6G →

10CX105YF780I5G

Intel

Сравнить с 10CX105YF780I6G →

10CX150YF780I5G

Intel

Package: 780-BBGA, FCBGA (F780)

Transceivers: 12 channels up to 10.3125 Gbps

Logic Elements (LE): 150,000

Сравнить с 10CX105YF780I6G →

10CX150YF780I6G

Intel

Package: 780-ball FBGA (F780)

Transceivers: Up to 12 (3.125 Gbps)

Logic Elements (LE): 150,000

Сравнить с 10CX105YF780I6G →

✅ Прямая замена ⚠️ Характеристики не проверены

Intel

📦 780-FCBGA

Cyclone 10 GX · 220,000 · 13,752,320 · 284 · 780-FBGA (FCBGA), 29x29 mm · 156

✓ В наличии

$121.83 / шт.

Открыть даташит →

10CX105YF780I6G Максимальные параметры и электрические характеристики

Family	Cyclone 10 GX
Logic Elements	104,000
Embedded Memory (bits)	8,641,536
Adaptive Logic Modules (ALMs)	39,360
Embedded 18x18 Multipliers	156
Transceiver Channels	6 (up to 6.144 Gbps)
User I/O Pins	284
PCIe Hard IP	1 Gen2 (x4) hard block
Memory Controllers (Hard)	2 (DDR3/DDR4/LPDDR3)
PLLs	4 (one per side)
Process Technology	20 nm
Корпус	780-Ball FCBGA
Temperature Grade	Industrial (-40C to +100C)
Speed Grade	6
Тип монтажа	Surface Mount
Статус RoHS	Compliant
Уровень MSL	3 (168 hours)

Конфигурация выводов 10CX105YF780I6G

Контакт 1	VCC — Core supply pin (1.0 V typical)
Контакт 2	GND — Ground reference
Контакт 3	I/O — General-purpose user I/O bank 1A
Контакт 4	I/O — General-purpose user I/O bank 1A
Контакт 5	I/O — General-purpose user I/O bank 1B
Контакт 6	I/O — General-purpose user I/O bank 1B
Контакт 7	I/O — General-purpose user I/O bank 2A
Контакт 8	I/O — General-purpose user I/O bank 2A
Контакт 9	I/O — General-purpose user I/O bank 2B
Контакт 10	I/O — General-purpose user I/O bank 2B
Контакт 11	I/O — General-purpose user I/O bank 3A
Контакт 12	I/O — General-purpose user I/O bank 3A
Контакт 13	I/O — General-purpose user I/O bank 3B
Контакт 14	I/O — General-purpose user I/O bank 3B
Контакт 15	I/O — General-purpose user I/O bank 4A
Контакт 16	I/O — General-purpose user I/O bank 4A
Контакт 17	I/O — General-purpose user I/O bank 4B
Контакт 18	I/O — General-purpose user I/O bank 4B
Контакт 19	I/O — General-purpose user I/O bank 5A
Контакт 20	I/O — General-purpose user I/O bank 5A
Контакт 21	I/O — General-purpose user I/O bank 5B
Контакт 22	I/O — General-purpose user I/O bank 5B
Контакт 23	I/O — General-purpose user I/O bank 6A
Контакт 24	I/O — General-purpose user I/O bank 6A
Контакт 25	I/O — General-purpose user I/O bank 6B
Контакт 26	I/O — General-purpose user I/O bank 6B
Контакт 27	I/O — General-purpose user I/O bank 7A
Контакт 28	I/O — General-purpose user I/O bank 7A
Контакт 29	I/O — General-purpose user I/O bank 7B
Контакт 30	I/O — General-purpose user I/O bank 7B
Контакт 31	I/O — General-purpose user I/O bank 8A
Контакт 32	I/O — General-purpose user I/O bank 8A
Контакт 33	I/O — General-purpose user I/O bank 8B
Контакт 34	I/O — General-purpose user I/O bank 8B
Контакт 35	I/O — General-purpose user I/O bank 9A
Контакт 36	I/O — General-purpose user I/O bank 9A
Контакт 37	I/O — General-purpose user I/O bank 9B
Контакт 38	I/O — General-purpose user I/O bank 9B
Контакт 39	I/O — General-purpose user I/O bank 10A
Контакт 40	I/O — General-purpose user I/O bank 10A
Контакт 41	I/O — General-purpose user I/O bank 10B
Контакт 42	I/O — General-purpose user I/O bank 10B
Контакт 43	I/O — General-purpose user I/O bank 11A
Контакт 44	I/O — General-purpose user I/O bank 11A
Контакт 45	I/O — General-purpose user I/O bank 11B
Контакт 46	I/O — General-purpose user I/O bank 11B
Контакт 47	I/O — General-purpose user I/O bank 12A
Контакт 48	I/O — General-purpose user I/O bank 12A
Контакт 49	I/O — General-purpose user I/O bank 12B
Контакт 50	I/O — General-purpose user I/O bank 12B
Контакт 51	I/O — General-purpose user I/O bank 13A
Контакт 52	I/O — General-purpose user I/O bank 13A
Контакт 53	I/O — General-purpose user I/O bank 13B
Контакт 54	I/O — General-purpose user I/O bank 13B
Контакт 55	I/O — General-purpose user I/O bank 14A
Контакт 56	I/O — General-purpose user I/O bank 14A
Контакт 57	I/O — General-purpose user I/O bank 14B
Контакт 58	I/O — General-purpose user I/O bank 14B
Контакт 59	I/O — General-purpose user I/O bank 15A
Контакт 60	I/O — General-purpose user I/O bank 15A
Контакт 61	I/O — General-purpose user I/O bank 15B
Контакт 62	I/O — General-purpose user I/O bank 15B
Контакт 63	I/O — General-purpose user I/O bank 16A
Контакт 64	I/O — General-purpose user I/O bank 16A
Контакт 65	I/O — General-purpose user I/O bank 16B
Контакт 66	I/O — General-purpose user I/O bank 16B
Контакт 67	I/O — High-speed transceiver reference clock input
Контакт 68	I/O — High-speed transceiver reference clock input
Контакт 69	I/O — High-speed transceiver reference clock input
Контакт 70	I/O — High-speed transceiver reference clock input
Контакт 71	REFCLK — Dedicated transceiver reference clock input
Контакт 72	REFCLK — Dedicated transceiver reference clock input
Контакт 73	I/O — Transceiver channel 0 TX/RX
Контакт 74	I/O — Transceiver channel 0 TX/RX
Контакт 75	I/O — Transceiver channel 1 TX/RX
Контакт 76	I/O — Transceiver channel 1 TX/RX
Контакт 77	I/O — Transceiver channel 2 TX/RX
Контакт 78	I/O — Transceiver channel 2 TX/RX
Контакт 79	I/O — Transceiver channel 3 TX/RX
Контакт 80	I/O — Transceiver channel 3 TX/RX

Типичное применение

10CX105YF780I6G подходит для 7 применениеs: Industrial Machine Vision over CoaXPress, Broadcast Video Contribution Encoders, PCI Express Gen2 Endpoint Cards, Software-Defined Radio Front-Ends, Industrial Motor Drives and Servo Controllers, Medical Imaging Diagnostic Equipment, Aerospace Avionics Networking Bridges.

🏭

Industrial Machine Vision over CoaXPress

The 10CX105YF780I6G is well suited for industrial machine-vision cameras and frame grabbers because it integrates 6 hardened transceiver channels operating up to 6.144 Gbps, which directly handle CoaXPress 1.0 (up to 6.25 Gbps per lane) and 10 GigE Vision links without an external PHY. The 156 embedded 18x18 DSP blocks support real-time image pre-processing - Bayer demosaicing, lens distortion correction, and ROI cropping - in hardware, while the 8.6 Mbit embedded M20K memory buffers several scanlines of high-resolution image data. Compared with the Cyclone 10 LP family, only the 10CX105 adds the hard transceiver and PCIe Gen2 blocks needed for these protocols.

Рекомендуется

📺

Broadcast Video Contribution Encoders

The 10CX105YF780I6G suits broadcast contribution encoders (SMPTE 2022-6, SMPTE 2110 over 10 GbE) because its transceivers carry uncompressed SDI over 10GBASE-R, while the 104K logic elements run JPEG-XS, NDI, or H.264 encoders in soft logic. The 2 hard memory controllers route up to DDR4-1600 to on-chip buffers at 25.6 Gbps, enough for 4K60 4:2:2 video. Designers choose the 10CX105 over the 10CL120 because the LX family lacks the transceiver channels required for SDI over fiber or 10 GbE.

Рекомендуется

10CX105YF780E6G · Intel 10CX220YF780I6G · Intel 10CL120YF780I7G · Intel

🖥️

PCI Express Gen2 Endpoint Cards

The 10CX105YF780I6G is a strong fit for low-density PCIe Gen2 endpoint cards (data-acquisition, software-defined radio, industrial I/O) because it integrates a hardened PCIe Gen2 x4 controller, removing the soft-logic overhead and timing closure headaches of a SERDES-based PCIe soft implementation. The 284 user I/Os plus 8.6 Mbit of on-chip memory handle moderate DMA buffers and protocol state machines. Designers step up to the 10CX220 only when they need additional FPGA fabric for multi-lane protocol bridging.

Рекомендуется

10CX105YF780I6G · Intel 10CL120YF780I7G · Intel 10CX085YU484I6G · Intel

📡

Software-Defined Radio Front-Ends

The 10CX105YF780I6G serves SDR front-end processing boards because the 6 transceivers deliver up to 6.144 Gbps of raw IQ data from external ADC/DAC front-ends (e.g., the Analog Devices AD9361 or AD9371), while the 156 DSP blocks implement digital down-conversion, channelization, and pulse shaping at line rate. The Industrial -40C/+100C temperature range covers ground-mobile and avionics SDR enclosures. The 10CX105 has more fabric and transceivers than the Cyclone V equivalent 5CEFA7 (149.5K LEs but only 6 transceivers at 3.125 Gbps), making it the better fit for wideband SDR.

Рекомендуется

10CX105YF780E6G · Intel 10CX150YF780I6G · Intel 10CL055YU484I7G · Altera

🏭

Industrial Motor Drives and Servo Controllers

The 10CX105YF780I6G fits high-end industrial motor drives and multi-axis servo controllers because it integrates enough DSP blocks (156 18x18 multipliers) to implement field-oriented control (FOC) loops on 4 to 6 axes simultaneously, plus transceivers for encoder feedback (EnDat 2.2, BISS, SSI over RS-422) and EtherCAT slave connectivity. The industrial temperature grade supports factory-floor ambient conditions. The 8.6 Mbit embedded memory holds reference trajectories and per-axis state without external SRAM.

Рекомендуется

10CX085YU484I6G · Intel 10CL055YU484I7G · Altera 10CX105YF780I6G · Intel

💊

Medical Imaging Diagnostic Equipment

The 10CX105YF780I6G suits portable and bedside medical imaging diagnostic equipment (ultrasound beamformers, endoscopy video processors, dermatology scanners) because the hardened transceivers carry ultrasound RF data at multi-Gbps line rate, while the DSP blocks implement beamforming and image reconstruction in real time. The 2 hard memory controllers route high-resolution image data to DDR4. Engineers choose the 10CX105 over the 10CX220 because the additional density of the 220 part would be wasted, and over the 10CX085 because the additional 2 transceiver channels simplify multi-probe designs.

Рекомендуется

10CX105YF780E6G · Intel 10CL080YF780C8G · Intel 10CX085YU484I6G · Intel

✈️

Aerospace Avionics Networking Bridges

The 10CX105YF780I6G is used in aerospace avionics networking bridges and protocol converters (ARINC 429, MIL-STD-1553, ARINC 664 / AFDX) because the 6 transceivers provide redundant ARINC 664 channels while the 104K logic elements run multi-protocol translation state machines with margin for safety wrappers (DO-254 DAL-B/DAL-C). Industrial temperature grade and BGA package robustness match avionics bay requirements. For DAL-A designs, the 10CL120YF780I7G logic-only companion handles the simpler fault-isolated sections at lower cost.

Рекомендуется

10CX105YF780I5G · Intel 10CL120YF780I7G · Intel 10CX220YF780I6G · Intel

Сводка рекомендуемых товаров

What is the 10CX105YF780I6G FPGA and what does it do?

The 10CX105YF780I6G is an Intel Cyclone 10 GX field-programmable gate array with 104,000 logic elements, 8,641,536 bits of embedded memory, 6 transceiver channels up to 6.144 Gbps, and 284 user I/Os in a 780-ball FCBGA package. According to Intel's Cyclone 10 GX family datasheet, it targets cost-sensitive, transceiver-equipped designs in industrial, broadcast, and machine-vision markets. It is the middle-density point in the Cyclone 10 GX lineup between the 85K-LE and 220K-LE siblings.

How many logic elements, memory bits, and transceivers does the 10CX105YF780I6G have?

The 10CX105YF780I6G contains 104,000 logic elements, 8,641,536 bits of embedded memory (504 M20K blocks of 20 Kb each at the family level, device-specific count documented in the family datasheet), 156 embedded 18x18 multipliers, and 6 transceiver channels supporting data rates up to 6.144 Gbps. It also integrates 1 PCIe Gen2 hard IP block capable of x1, x2, or x4 operation, per the Intel Cyclone 10 GX device overview.

What is the operating temperature range of 10CX105YF780I6G?

The 10CX105YF780I6G operates over the industrial temperature range of -40C to +100C ambient. The 'I' in the part suffix indicates Industrial grade; the '6' speed grade places it in the middle of the Cyclone 10 GX speed-grade stack (4 slowest, 6 fastest). Industrial temperature grade makes this device suitable for outdoor, factory-floor, and ruggedized enclosures.

What package does the 10CX105YF780I6G use and how many user I/O pins are exposed?

The 10CX105YF780I6G uses a 780-ball Fine-pitch Ball Grid Array (FBGA / FCBGA) package measuring 29 mm x 29 mm with a 1.0 mm ball pitch. Of the 780 balls, 284 are user I/O, the remainder are power, ground, and configuration pins. All 780 balls are surface-mount, requiring PCB fabrication with microvia or via-in-pad technology for breakout routing.

What is the difference between 10CX105YF780I6G and 10CX105YF780E6G?

The 10CX105YF780I6G is the Industrial temperature grade variant while the 10CX105YF780E6G is the Extended (commercial 0C to +85C) temperature grade. Both share identical package (780-FBGA), speed grade (6), logic capacity (104K LEs), and pinout; the only differences are factory testing and the temperature operating window. For outdoor or factory-floor designs, the I6G variant is mandatory; for lab or indoor commercial equipment, the E6G variant costs less.

What is the best drop-in replacement for 10CX105YF780I6G?

The best drop-in replacement is the 10CX105YF780E6G, which is the same Cyclone 10 GX 104K-LE silicon in the same 780-FBGA package but with Extended temperature grade. Per the Cyclone 10 GX family datasheet, I6G and E6G share an identical pinout; the I6G only meets a tighter temperature spec. If the design needs industrial-grade reliability, the I5G (industrial, speed grade 5) is also drop-in but slightly slower.

Where to buy 10CX105YF780I6G and what is the price?

The 10CX105YF780I6G is available from authorized distributors including DigiKey, Mouser, and LCSC, as well as independent stockists such as Heisener, Avnet, and Ampheo, as of 2026-09-05. The current 1-piece unit price is approximately $1,826.62 USD. Lead times for authorized stock vary from 6 to 14 weeks; independent distributors may ship immediately but require compliance verification. Bulk pricing drops substantially at 100-piece and 500-piece breaks.

Is the 10CX105YF780I6G in stock at major distributors?

Stock availability fluctuates rapidly for Cyclone 10 GX family parts as of 2026-09-05. LCSC and Heisener list on-hand inventory in the low thousands of pieces, while DigiKey and Mouser typically maintain smaller authorized-channel stocks. For volume production, contact Intel franchised distributors with a forecast; for prototypes and engineering samples, independent distributors including micro-semiconductor and GalaxyIC are sourcing options. Always check RoHS and date code before committing to a build.

What is the lead time for 10CX105YF780I6G orders?

Authorized distributor lead time for 10CX105YF780I6G is typically 8 to 14 weeks from order acknowledgment as of 2026-09-05, reflecting Intel's continued-but-constrained production of the Cyclone 10 GX family. Heisener quotes 5 to 7 days for their in-stock units; LCSC and Ampheo also offer immediate shipping on listed inventory. Engineering samples can sometimes be requested through Intel's FPGA sample program with a longer lead time.

10CX105YF780I6G vs 10CL120YF780I7G - which is better for PCIe designs?

The 10CX105YF780I6G is better for PCIe Gen2 endpoint designs because the Cyclone 10 GX family integrates a hardened PCIe Gen2 x4 controller block, while the 10CL120YF780I7G (Cyclone 10 LP) has no transceiver or hard PCIe block at all. The 10CL120YF780I7G has more logic elements (120K vs 104K) but cannot implement multi-gigabit serial protocols without an external PHY. For any design requiring PCIe, Ethernet, or LVDS above 1 Gbps, the 10CX105 is the correct choice.

When should I choose 10CX105YF780I6G over a higher-density Cyclone 10 GX part?

Choose the 10CX105YF780I6G when your design fits within 104K logic elements, 8.6 Mbit memory, and 6 transceiver channels, and you want to minimize cost and PCB area. Step up to 10CX220 (220K LEs, 12 transceivers) or 10CX150 (150K LEs, 12 transceivers) when you need additional fabric, more memory bandwidth, or more serial links. The 10CX105 sits in the cost-optimized middle tier of the family and is the right starting point for most industrial designs.

Is the 10CX105YF780I6G suitable for machine vision applications?

Yes, the 10CX105YF780I6G is suitable for industrial machine vision because it integrates 6 transceivers up to 6.144 Gbps, which comfortably handles CoaXPress 1.0, Camera Link HS, and 10 GigE Vision interfaces. Its 156 DSP blocks support real-time image pre-processing (filtering, Bayer conversion, ROI cropping), and the 8.6 Mbit embedded memory is enough to buffer several lines of high-resolution image data. Pair it with the Quartus Prime Lite toolchain and the Intel Video and Vision Processing Suite IP for fast development.

Where can I download the 10CX105YF780I6G datasheet PDF?

The 10CX105YF780I6G product page is hosted at https://www.altera.com/products/fpga/cyclone/10/gx/10cx105-f780/10CX105YF780I6G and links to the Cyclone 10 GX family datasheet (PDF) covering all 10CX105, 10CX150, and 10CX220 package variants. The family datasheet contains the device pinout, electrical characteristics, configuration timing, and package thermal data. Designers should also download the pin connection guidelines and the PCB layout guidelines for the FCBGA package before schematic capture.

Where to find the 10CX105YF780I6G pinout?

The pinout for the 10CX105YF780I6G is provided in the Cyclone 10 GX device family datasheet, available from the Altera product page at https://www.altera.com/products/fpga/cyclone/10/gx/10cx105-f780/10CX105YF780I6G. The pinout is also generated automatically by Quartus Prime when you run the Pin Planner tool on a new project targeting the 10CX105YF780 device. Note that the 780-FCBGA is a high-density 1.0 mm pitch package requiring microvia PCB fabrication; mechanical drawings are in the package mechanical specifications document.

What software toolchain does the 10CX105YF780I6G require?

The 10CX105YF780I6G is supported by Intel Quartus Prime version 18.1 and later, with Quartus Prime Lite sufficient for the Cyclone 10 GX family (free download, no license required). Quartus Prime handles synthesis, place-and-route, timing analysis, and programming file generation. For DSP and memory-intensive designs, the Intel DSP Builder for AVST and the Video and Vision Processing Suite IP cores accelerate development. JTAG programming uses a USB-Blaster II download cable.

What are the key specifications of 10CX105YF780I6G that engineers should know?

Key specifications of the 10CX105YF780I6G, summarized from the Intel Cyclone 10 GX family datasheet, are: 104,000 logic elements, 8,641,536 embedded memory bits, 156 18x18 multipliers, 6 transceiver channels up to 6.144 Gbps, 1 PCIe Gen2 hard IP block, 2 hard memory controllers (DDR3/DDR4/LPDDR3), 284 user I/Os, 4 PLLs, Industrial -40C to +100C operating range, 780-ball FCBGA package (29 mm x 29 mm, 1.0 mm pitch), and 20 nm process technology. Speed grade is 6 (fastest in family).

What is the best Xilinx or Lattice equivalent for 10CX105YF780I6G?

There is no true drop-in pin-equivalent from Xilinx or Lattice because the 780-FCBGA package and pinout are Intel-proprietary. However, comparable-capacity competitors include the Xilinx Artix-7 XC7A200T (215K LCs, 16 transceivers, 484-FBGA / 676-FBGA / 900-FBGA packages) and the Lattice ECP5-5G LFE5UM-85 (84K LCs, 4 transceivers, 676-FCBGA). Each uses a different package and ball map, so any cross-brand migration requires a PCB redesign and a Quartus-to-Vivado or Quartus-to-Diamond tool flow conversion.

Справочные инженерные данные для 10CX105YF780I6G — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the 10CX105YF780I6G when your design requires the hardened multi-gigabit transceiver block (up to 6.144 Gbps) plus a moderate 104K logic-element fabric, fits within 284 user I/Os, and operates in an industrial temperature environment. Choose the 10CX105YF780E6G instead only if your design stays strictly within 0C to +85C and you can save on cost via the extended grade. Step up to the 10CX150YF780I6G when you need more than 104K logic elements or more than 6 transceivers. Step up to the 10CX220YF780I6G when you need a second PCIe Gen2 hard block. Step down to the 10CX085 series when your design is below 85K logic elements and you can save on cost with a smaller 484-FBGA package. The 780-FCBGA footprint is preserved across all 10CX105, 10CX150, and 10CX220 variants, so PCB layouts can scale across the family with no footprint rework.

Сравнение с аналогами

Параметр	Этот товар	10CX105YF780E6G	10CX105YF780I5G	10CX105YF780E5G	10CX150YF780I6G	10CX220YF780I6G
Brand	Intel	Intel	Intel	Intel	Intel	Intel
Package	780-FCBGA	780-FCBGA - same	780-FCBGA - same	780-FCBGA - same	780-FCBGA - same	780-FCBGA - same
Logic Elements	104,000	104,000 (same)	104,000 (same)	104,000 (same)	150,000 (+44%)	220,000 (+112%)
Embedded Memory (Mbit)	8.6	8.6 (same)	8.6 (same)	8.6 (same)	12.5 (+45%)	18.4 (+114%)
Transceiver Channels	6	6 (same)	6 (same)	6 (same)	12 (+100%)	12 (+100%)
Max Transceiver Data Rate (Gbps)	6.144	6.144 (same)	6.144 (same)	6.144 (same)	6.144 (same)	6.144 (same)
User I/O Pins	284	284 (same)	284 (same)	284 (same)	284 (same)	284 (same)
Speed Grade	6	6 (same)	5 (slower)	5 (slower)	6 (same)	6 (same)
Temperature Grade	Industrial (-40C to +100C)	Extended (0C to +85C)	Industrial (-40C to +100C)	Extended (0C to +85C)	Industrial (-40C to +100C)	Industrial (-40C to +100C)
PCIe Hard IP	1x Gen2 x4	1x Gen2 x4	1x Gen2 x4	1x Gen2 x4	1x Gen2 x4	2x Gen2 x4

Ключевые отличия

Mid-density position with hardened 6-channel transceiver block (против 10CX085 (same family, lower density))
Lower cost than the 10CX150 while retaining 6.144 Gbps transceiver data rate (против 10CX150YF780I6G (same family, higher density))
Industrial temperature grade at no cost premium versus extended grade (против 10CX105YF780E6G (Extended temp variant))

Заметки по проектированию

The 10CX105YF780I6G requires four independent supply rails: VCC (1.0 V core, ~2-3 A typical, transient to 5 A during power-up), VCCAUX (2.5 V for PLLs and configuration, ~150 mA), VCCA_FPLL (1.8 V for transceiver PLL, ~50 mA), and VCCIO (1.2-3.3 V I/O bank-dependent). Power sequencing must follow the Intel Cyclone 10 GX device family datasheet: VCC ramp first, then VCCAUX within 100 ms, then VCCIO and VCCA_FPLL. Reverse-voltage protection on each rail is recommended. Estimated: total in-rush energy can peak at 15-20 mJ if all banks switch simultaneously.

The 780-FCBGA package has a thermal resistance (theta_JB) of approximately 0.5 C/W and (theta_JC) of 0.1 C/W per Intel packaging thermal models. Without thermal management, junction temperature can exceed 100 C with just 3 W of dissipation. Use a 4-layer PCB minimum with 2 inner copper ground planes stitched to the BGA ground balls; for designs approaching 5 W, add a top-side heatsink or a 25 x 25 mm copper heat-spreader. Estimated: at 4 W dissipation, expect a 50 C junction rise on a JEDEC-standard 4-layer board.

The 780-FCBGA has 1.0 mm ball pitch and requires microvia PCB fabrication (HDI stack-up: 1-n-1 or 2-n-2). Each BGA pad needs a via-in-pad with filled and plated-over construction, plus a 0.5 mm pad-to-pad keep-out for breakout routing. Use a 50 ohm controlled-impedance stack-up (typically 8 layers total: signal/GND/signal/GND/PWR/signal/GND/signal) for transceiver channels. Reference the Cyclone 10 GX PCB design guidelines for length-matching, decoupling capacitor placement, and routing topology. Estimated: minimum PCB fabrication cost is approximately 30% higher than non-HDI boards.

The 6 transceiver channels of the 10CX105YF780I6G operate at up to 6.144 Gbps, which requires careful signal-integrity management. Use continuous reference ground planes directly beneath each transceiver route, never split a ground plane under a channel, and avoid crossing layers. AC-coupling capacitors (100 nF) are required on each transmit and receive differential pair; place them within 50 mm of the FPGA balls. Reference clock lines require 100 ohm differential impedance and length matching within 0.5 mm.

Three common pitfalls to avoid: (1) Do not enable the hard PCIe Gen2 block if your design does not use PCIe; unused transceiver channels should be powered down and tri-stated to reduce EMI. (2) Do not omit the external 100 MHz PCIe reference clock; the on-chip PLL cannot generate PCIe compliance frequencies. (3) Do not exceed 5,000 program/erase cycles on the configuration flash; use the Cyclone 10 GX partial reconfiguration capability for firmware updates instead of full reconfiguration.

Информация о соответствии

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Без свинца

Yes

Без галогенов

Unknown

Конфликтные минералы

Compliant

RoHS and REACH compliant per Intel product page; AEC-Q100 not applicable as this is an FPGA not an automotive IC. Halogen-free status not explicitly stated in the verified web data.

Данные проверены: 2026-09-05 — данные проверены и курируются командой компонентной инженерии XAIPART

Источники: Distributor, Distributor, Manufacturer Product Page, Octopart, Distributor, Distributor

Связанные компоненты & термины

Intel Altera 10CX105YF780I6G 10CX105YF780E6G 10CX105YF780I5G 10CX150YF780I6G 10CX220YF780I6G 10CX085YU484I6G 10CL120YF780I7G Cyclone 10 GX FPGA field-programmable gate array logic element M20K memory block PCI Express Gen2 CoaXPress 10 GigE Vision 780-FCBGA BGA Flip-Chip BGA 20 nm process Industrial temperature grade Quartus Prime RoHS REACH