10CX105YF780E6G - Cyclone 10 GX FPGA, 104K LE, 780-FCBGA | Altera/Intel
MPN: 10CX105YF780E6G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $720 | $720.00 |
| 10 | $685 | $6,850.00 |
| 50 | $645 | $32,250.00 |
| 100 | $615 | $61,500.00 |
| 500 | $580 | $290,000.00 |
Drop-in alternatives for 10CX105YF780E6G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CX105YF780E5G
✅ Drop-In✓ In Stock
$350 / Unit
View Datasheet →10CX105YF780I6G
✅ Drop-In✓ In Stock
$1495 / Unit
View Datasheet →10CX105YF780I5G
✅ Drop-In✓ In Stock
$115 / Unit
View Datasheet →10CX105YU484E6G
✅ Drop-In✓ In Stock
$65.8 / Unit
View Datasheet →10CX105YU484I6G
✅ Drop-In✓ In Stock
$372 / Unit
View Datasheet →10CX105YF780E6G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 GX |
| Series / Model | 10CX105 |
| Logic Elements (LE) | 104,000 |
| Embedded Memory Bits | 8,641,536 (8.5 Mb) |
| DSP Blocks / 18x19 Multipliers | 156 |
| User I/O Count | 284 |
| Transceivers | 6 channels, up to 12.5 Gbps |
| PCIe Hard IP | 1 x PCIe Gen2 (x1/x2/x4) |
| LVDS SERDES | Up to 1.4 Gbps |
| External Memory Interface | DDR3/DDR3L/LPDDR2 up to 3.0 Gbps |
| Process Node | 20 nm TSMC |
| Core Voltage | 1.0 V |
| Auxiliary Voltage | 0.9 V |
| Package | 780-ball FCBGA (F780) |
| Operating Temperature | -40C to +100C (industrial) |
| RoHS Status | Compliant |
| Configuration Mode | FPP and AS |
10CX105YF780E6G 780-ball fcbga (f780) Pin Configuration Guide
Complete pinout information for 10CX105YF780E6G (780-ball fcbga (f780) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CX105YF780E6G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CX105YF780E6G is suitable for 7 applications: Industrial Machine Vision over 10 GbE, Wireless Backhaul Baseband Preprocessing, PCIe Endpoint Card (Gen2 x4), Broadcast Video Processing (12G-SDI / HDMI 2.0), ASIC Prototyping Platform, Industrial IoT Edge Gateway, Test & Measurement Instrumentation.
Industrial Machine Vision over 10 GbE
The 10CX105YF780E6G's six 12.5 Gbps transceivers enable a single-chip 10GBASE-R interface for high-speed industrial cameras and machine-vision frame grabbers. Its 104K LE fabric can host 4K/8K image-processing pipelines while the 8.5 Mb embedded SRAM absorbs line buffers without external memory. Unlike Spartan-6, the part supports 10G natively, eliminating an external PHY and saving roughly 3 W of board power in a vision head.
Recommended
Wireless Backhaul Baseband Preprocessing
In small-cell and 5G FWA backhaul units, the 10CX105YF780E6G serves as a baseband preprocessing engine with CPRI/eCPRI fronthaul links via its 12.5 Gbps transceivers. The hardened PCIe Gen2 block interfaces to a baseband SoC, while the 156 DSP blocks accelerate FFT and channel-estimation kernels. Compared to a Cyclone V SoC, this part delivers roughly 2x the DSP throughput per Watt, reducing cooling in sealed outdoor enclosures.
Recommended
PCIe Endpoint Card (Gen2 x4)
The 10CX105YF780E6G's integrated PCIe Gen2 hard IP block allows direct connection to a host CPU as a PCIe x1/x2/x4 endpoint without an external bridge ASIC. Designers implement DMA engines, custom drivers, and protocol accelerators in the 104K LE fabric, achieving 2 GB/5G sustained throughput over a Gen2 x4 link. The 780-FCBGA package exposes all PCIe lanes and side-band signals, simplifying PCB routing.
Recommended
Broadcast Video Processing (12G-SDI / HDMI 2.0)
For broadcast routers and video processing, the 10CX105YF780E6G's high-speed transceivers can drive 12G-SDI links at 11.88 Gbps for uncompressed 4K UHD transport. Its 8.5 Mb embedded SRAM holds chroma-key buffers and frame-sync FIFOs. The 156 DSP blocks accelerate scaling, blending, and overlay operations in real time. The 1.0 V core and 0.9 V aux supply keep board power under 8 W for a fully loaded 4K pipeline.
Recommended
ASIC Prototyping Platform
Designers use the 10CX105YF780E6G to prototype mid-complexity ASICs in a single chip, taking advantage of 104K LE plus 6 transceivers at 12.5 Gbps for fast bring-up. The hardened PCIe block and DDR3 controller remove ambiguity from prototype I/O. Compared to ASIC NRE, a single FPGA prototype at USD 580-720 list price avoids $1M+ mask costs for sub-100K-gate designs.
Recommended
Industrial IoT Edge Gateway
Edge gateways in industrial IoT benefit from the 10CX105YF780E6G's mix of logic density, transceivers for fieldbus (EtherCAT, PROFINET) over MII/RGMII, and hardware floating-point DSP for analytics. The PCIe block attaches to an ARM SoC over M.2 form factors, while the embedded SRAM buffers time-critical control loops. Industrial -40C to +100C operation supports outdoor DIN-rail mounting.
Recommended
Test & Measurement Instrumentation
In T&M equipment (logic analyzers, protocol exercisers, BERT testers), the 10CX105YF780E6G provides the transceivers and DSP for high-speed pattern generation and error injection. Its 284 user I/O and 156 multipliers support 8+ channel simultaneous acquisition at sample rates beyond 1 Gsps when paired with high-speed ADCs over LVDS. The Cyclone 10 GX architecture is well-supported by Quartus Prime for rapid instrument design cycles.
Recommended
Recommended Products Summary
Engineering reference data for 10CX105YF780E6G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CX105YF780E5G | 10CX105YF780I6G | 10CX105YF780I5G | 10CX105YU484E6G |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-ball FCBGA (F780) | 780-ball FCBGA (F780) - same | 780-ball FCBGA (F780) - same | 780-ball FCBGA (F780) - same | 484-ball UBGA (U484) - smaller footprint |
| Logic Elements (LE) | 104,000 | 104,000 | 104,000 | 104,000 | 104,000 |
| Speed Grade | -6 (commercial) | -5 (commercial) | -6 (industrial) | -5 (industrial) | -6 (commercial) |
| Operating Temperature | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| User I/O Count | 284 | 284 | 284 | 284 | [DATA_NEEDED] |
| Transceiver Rate | 12.5 Gbps | [DATA_NEEDED] | 12.5 Gbps | [DATA_NEEDED] | [DATA_NEEDED] |
| PCIe Hard IP | 1 x PCIe Gen2 | 1 x PCIe Gen2 | 1 x PCIe Gen2 | 1 x PCIe Gen2 | 1 x PCIe Gen2 |
| Embedded Memory | 8,641,536 bits | 8,641,536 bits | 8,641,536 bits | 8,641,536 bits | 8,641,536 bits |
| Price (qty 100, USD) | 615.00 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest density Cyclone 10 GX member in F780 package (vs 10CX085YF672E5G)
- Industrial temperature option in same F780 footprint (vs 10CX105YF780I6G)
- 780-ball FCBGA package provides 284 user I/O (vs 10CX105YU484E6G)
- Cyclone 10 GX fabric with 12.5 Gbps transceivers at 20 nm (vs Xilinx Artix-7 XC7A100T)
Design Notes
The 6 transceivers in the 10CX105YF780E6G operate at up to 12.5 Gbps and require controlled-impedance routing with target differential impedance of 100 ohm +/- 10%. Use a stackup with at least 4 layers and dedicate stripline layers to high-speed serial lanes. Reference plane continuity under transceiver channels is critical; missing reference pours cause ISI and link errors at 10G.
Power-rail decoupling for the 10CX105YF780E6G follows the Intel Cyclone 10 GX Pin Connection Guidelines: place 0.1uF + 10uF ceramics on every VCC/VCCPT/VCCAUX/VCCIO ball, with vias connecting to a continuous ground plane. Power-on reset (POR) sequencing requires VCCIO, VCCPT, and VCC to ramp together within 100 ms; out-of-sequence ramp triggers configuration failure.
The 780-ball FCBGA package has 1.0 mm ball pitch and requires microvia or stacked-via PCB fabrication for breakout routing. Fanout should use a dog-bone or via-in-pad pattern with the manufacturer-recommended 0.4 mm via diameter. Reserve top and bottom layers for high-speed routing while inner stripline layers carry slow control and user I/O.
Common mistakes when designing with the 10CX105YF780E6G: (1) omitting the JTAG pull-up resistors on TCK/TMS/TDO; (2) using 1.8V VCCIO with 3.3V configuration memory - check EPCQ memory VCC rail; (3) ignoring MSL3 moisture sensitivity requires bake before reflow if the package has been exposed for more than 168 hours; (4) mixing E6 (commercial) and I6 (industrial) parts across a board causes timing variation. Always confirm device variant before PCB assembly.
Estimated: at maximum junction temperature 100C, with a typical 0.9 W quiescent and 6 transceivers at 12.5 Gbps carrying traffic, total power is approximately 4-5 W for the FCBGA package. The 780-FCBGA thermal resistance theta_JC is roughly 0.4 C/W when the die is bonded to the substrate, but overall board cooling requires at least 6 cm^2 of copper pour or a heatsink for sealed enclosures.
Compliance Information
RoHS and REACH compliance per Altera/Intel product page. AEC-Q100 not applicable for this commercial-grade FPGA; choose industrial (I6/I5) variants for harsh environments.
