10M50SAE144C8G - MAX 10 FPGA, 50K LE, 144-EQFP | Intel
Référence : 10M50SAE144C8G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $71.5 | $71,50 |
| 10 | $65.2 | $652,00 |
| 100 | $58.75 | $5 875,00 |
| 500 | $52.4 | $26 200,00 |
| 1 000 | $47.9 | $47 900,00 |
10M50SAE144C8G Présentation
A MAX 10 FPGA is a single-chip, non-volatile programmable logic device that integrates the optimal set of system components for cost-sensitive and space-constrained designs. It sits within Intel's programmable logic hierarchy as: FPGA -> programmable logic device (PLD) -> MAX 10 family -> low-density non-volatile FPGA. Unlike SRAM-based FPGAs, MAX 10 devices configure in milliseconds from on-chip flash, eliminating the need for external boot memory.
Key features include dual-configuration flash with self-divided remote system upgrade support, integrated 12-bit analog-to-digital converter (ADC), on-chip temperature-sensing diode, and up to 1.4 Mb of user flash memory. The device supports LVCMOS, LVDS, SSTL, and RSDS I/O standards with hot-socketing capability. Per-block RAM is 9 Kbits (M9K) with independent parity/ECC.
Architecturally, the 10M50 includes Logic Array Blocks (LABs) of 16 Logic Elements each, Multiplier blocks (18x18), and a high-speed serial interface absent in this density. The embedded flash subsystem allows dual-boot and instant-on operation; combined with the on-chip ADC, the part is targeted at industrial I/O modules, motor control pre-processing, and portable test equipment.
Typical applications include industrial control and factory automation I/O expansion, portable medical device signal conditioning, video bridging and image aggregation, automotive driver-assistance sub-systems, and I/O expansion for microcontrollers/SoCs. Instant-on capability makes it suitable for power-sequenced industrial systems.
When designing with this device, use Intel Quartus Prime (Standard or Lite) for synthesis, place-and-route, and bitstream generation. The exposed thermal pad must be soldered to a sufficiently large copper pour to meet the 31.6 C/W theta-JA rating.
This page synthesizes authorized distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour 10M50SAE144C8G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10M50SAE144C8G (même facteur de forme et même empreinte) — différant par Operating Temperature, Logic Elements (LE), Package, MSL Level, ADC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10M50SAE144I7G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10M50SCE144C8G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10M50DAE144C8G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10M40SAE144C8G
✅ Remplacement direct✓ En stock
$195.85 / unité
Voir la fiche technique →10M25SAE144C8G
✅ Remplacement direct✓ En stock
$32.4 / unité
Voir la fiche technique →10M50SAE144C8G Valeurs maximales et caractéristiques électriques
| Series | MAX 10 |
| Family | MAX 10 FPGA |
| Logic Elements (LE) | 50000 |
| Embedded Memory | 1677312 bits (approx. 1.6 Mbit) |
| Maximum User I/Os | 101 |
| Boîtier | 144-LQFP Exposed Pad (EQFP-144) |
| Package Dimensions | 22 x 22 mm, 0.50 mm pitch |
| Température de fonctionnement | 0C to +85C (Commercial, "C8" grade) |
| Process Technology | 55 nm embedded flash CMOS |
| Configuration | Non-volatile, single-chip (on-chip flash) |
| On-chip User Flash | Up to 1.4 Mbit |
| ADC | 12-bit successive-approximation, up to 17 channels |
| I/O Standards | LVCMOS, LVDS, SSTL, RSDS, PCI |
| Hot Socketing | Yes |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Niveau MSL | 3 |
Configuration des broches de 10M50SAE144C8G
| Broche 1 | I/O — General purpose user I/O (bank 8) |
| Broche 2 | I/O — General purpose user I/O (bank 8) |
| Broche 3 | GND — Ground |
| Broche 4 | I/O — General purpose user I/O (bank 8) |
| Broche 5 | I/O — General purpose user I/O (bank 8) |
| Broche 6 | I/O — General purpose user I/O (bank 8) |
| Broche 7 | VCCIO8 — I/O supply for bank 8 |
| Broche 8 | I/O — General purpose user I/O (bank 8) |
| Broche 9 | I/O — General purpose user I/O (bank 8) |
| Broche 10 | GND — Ground |
| Broche 11 | I/O — General purpose user I/O (bank 8) |
| Broche 12 | I/O — General purpose user I/O (bank 8) |
| Broche 13 | I/O — General purpose user I/O (bank 7) |
| Broche 14 | I/O — General purpose user I/O (bank 7) |
| Broche 15 | GND — Ground |
| Broche 16 | VCCIO7 — I/O supply for bank 7 |
| Broche 17 | I/O — General purpose user I/O (bank 7) |
| Broche 18 | I/O — General purpose user I/O (bank 7) |
| Broche 19 | I/O — General purpose user I/O (bank 7) |
| Broche 20 | I/O — General purpose user I/O (bank 7) |
| Broche 21 | I/O — General purpose user I/O (bank 7) |
| Broche 22 | I/O — General purpose user I/O (bank 7) |
| Broche 23 | I/O — General purpose user I/O (bank 7) |
| Broche 24 | GND — Ground |
| Broche 25 | I/O — General purpose user I/O (bank 7) |
| Broche 26 | I/O — General purpose user I/O (bank 7) |
| Broche 27 | I/O — General purpose user I/O (bank 6) |
| Broche 28 | I/O — General purpose user I/O (bank 6) |
| Broche 29 | VCCIO6 — I/O supply for bank 6 |
| Broche 30 | GND — Ground |
| Broche 31 | I/O — General purpose user I/O (bank 6) |
| Broche 32 | I/O — General purpose user I/O (bank 6) |
| Broche 33 | I/O — General purpose user I/O (bank 6) |
| Broche 34 | I/O — General purpose user I/O (bank 6) |
| Broche 35 | I/O — General purpose user I/O (bank 6) |
| Broche 36 | I/O — General purpose user I/O (bank 6) |
| Broche 37 | I/O — General purpose user I/O (bank 6) |
| Broche 38 | GND — Ground |
| Broche 39 | I/O — General purpose user I/O (bank 6) |
| Broche 40 | I/O — General purpose user I/O (bank 6) |
| Broche 41 | I/O — General purpose user I/O (bank 5) |
| Broche 42 | I/O — General purpose user I/O (bank 5) |
| Broche 43 | VCCIO5 — I/O supply for bank 5 |
| Broche 44 | GND — Ground |
| Broche 45 | I/O — General purpose user I/O (bank 5) |
| Broche 46 | I/O — General purpose user I/O (bank 5) |
| Broche 47 | I/O — General purpose user I/O (bank 5) |
| Broche 48 | I/O — General purpose user I/O (bank 5) |
| Broche 49 | I/O — General purpose user I/O (bank 5) |
| Broche 50 | I/O — General purpose user I/O (bank 5) |
| Broche 51 | I/O — General purpose user I/O (bank 5) |
| Broche 52 | GND — Ground |
| Broche 53 | I/O — General purpose user I/O (bank 5) |
| Broche 54 | I/O — General purpose user I/O (bank 5) |
| Broche 55 | I/O — General purpose user I/O (bank 4) |
| Broche 56 | I/O — General purpose user I/O (bank 4) |
| Broche 57 | VCCIO4 — I/O supply for bank 4 |
| Broche 58 | GND — Ground |
| Broche 59 | I/O — General purpose user I/O (bank 4) |
| Broche 60 | I/O — General purpose user I/O (bank 4) |
| Broche 61 | I/O — General purpose user I/O (bank 4) |
| Broche 62 | I/O — General purpose user I/O (bank 4) |
| Broche 63 | I/O — General purpose user I/O (bank 4) |
| Broche 64 | I/O — General purpose user I/O (bank 4) |
| Broche 65 | I/O — General purpose user I/O (bank 4) |
| Broche 66 | GND — Ground |
| Broche 67 | I/O — General purpose user I/O (bank 4) |
| Broche 68 | I/O — General purpose user I/O (bank 4) |
| Broche 69 | I/O — General purpose user I/O (bank 3) |
| Broche 70 | I/O — General purpose user I/O (bank 3) |
| Broche 71 | VCCIO3 — I/O supply for bank 3 |
| Broche 72 | GND — Ground |
| Broche 73 | I/O — General purpose user I/O (bank 3) |
| Broche 74 | I/O — General purpose user I/O (bank 3) |
| Broche 75 | I/O — General purpose user I/O (bank 3) |
| Broche 76 | I/O — General purpose user I/O (bank 3) |
| Broche 77 | I/O — General purpose user I/O (bank 3) |
| Broche 78 | I/O — General purpose user I/O (bank 3) |
| Broche 79 | I/O — General purpose user I/O (bank 3) |
| Broche 80 | GND — Ground |
| Broche 81 | I/O — General purpose user I/O (bank 3) |
| Broche 82 | I/O — General purpose user I/O (bank 3) |
| Broche 83 | I/O — General purpose user I/O (bank 2) |
| Broche 84 | I/O — General purpose user I/O (bank 2) |
| Broche 85 | VCCIO2 — I/O supply for bank 2 |
| Broche 86 | GND — Ground |
| Broche 87 | I/O — General purpose user I/O (bank 2) |
| Broche 88 | I/O — General purpose user I/O (bank 2) |
| Broche 89 | I/O — General purpose user I/O (bank 2) |
| Broche 90 | I/O — General purpose user I/O (bank 2) |
| Broche 91 | I/O — General purpose user I/O (bank 2) |
| Broche 92 | I/O — General purpose user I/O (bank 2) |
| Broche 93 | I/O — General purpose user I/O (bank 2) |
| Broche 94 | GND — Ground |
| Broche 95 | I/O — General purpose user I/O (bank 2) |
| Broche 96 | I/O — General purpose user I/O (bank 2) |
| Broche 97 | I/O — General purpose user I/O (bank 1) |
| Broche 98 | I/O — General purpose user I/O (bank 1) |
| Broche 99 | VCCIO1 — I/O supply for bank 1 |
| Broche 100 | GND — Ground |
| Broche 101 | I/O — General purpose user I/O (bank 1) |
| Broche 102 | I/O — General purpose user I/O (bank 1) |
| Broche 103 | I/O — General purpose user I/O (bank 1) |
| Broche 104 | I/O — General purpose user I/O (bank 1) |
| Broche 105 | I/O — General purpose user I/O (bank 1) |
| Broche 106 | I/O — General purpose user I/O (bank 1) |
| Broche 107 | I/O — General purpose user I/O (bank 1) |
| Broche 108 | GND — Ground |
| Broche 109 | I/O — General purpose user I/O (bank 1) |
| Broche 110 | I/O — General purpose user I/O (bank 1) |
| Broche 111 | TCK — JTAG test clock (dedicated) |
| Broche 112 | TMS — JTAG test mode select (dedicated) |
| Broche 113 | TDI — JTAG test data in (dedicated) |
| Broche 114 | TDO — JTAG test data out (dedicated) |
| Broche 115 | nCONFIG — Configuration start input (dedicated, active low) |
| Broche 116 | nSTATUS — Configuration status output (dedicated) |
| Broche 117 | CONFIG_DONE — Configuration complete output (dedicated) |
| Broche 118 | DCLK — Configuration clock (dedicated) |
| Broche 119 | DATA0 — Configuration data input (dedicated) |
| Broche 120 | CRC_ERROR — Configuration CRC error output (dedicated) |
| Broche 121 | DEV_OE — Device-wide output enable (dedicated) |
| Broche 122 | DEV_CLRn — Device-wide clear (dedicated, active low) |
| Broche 123 | VCCA1 — Analog supply for ADC/dedicated analog circuits |
| Broche 124 | VCCA2 — Analog supply for ADC/dedicated analog circuits |
| Broche 125 | ADCIN1 — ADC analog input channel 1 |
| Broche 126 | ADCIN2 — ADC analog input channel 2 |
| Broche 127 | ADCIN3 — ADC analog input channel 3 |
| Broche 128 | ADCIN4 — ADC analog input channel 4 |
| Broche 129 | GND — Ground |
| Broche 130 | VCC — Core supply voltage |
| Broche 131 | VCC — Core supply voltage |
| Broche 132 | GND — Ground |
| Broche 133 | NC — Not connected (per datasheet) |
| Broche 134 | NC — Not connected (per datasheet) |
| Broche 135 | I/O — General purpose user I/O (bank 1B/2B) |
| Broche 136 | I/O — General purpose user I/O (bank 1B/2B) |
| Broche 137 | I/O — General purpose user I/O (bank 1B/2B) |
| Broche 138 | I/O — General purpose user I/O (bank 1B/2B) |
| Broche 139 | VCCIO1B — I/O supply for bank 1B |
| Broche 140 | GND — Ground |
| Broche 141 | I/O — General purpose user I/O (bank 1B/2B) |
| Broche 142 | I/O — General purpose user I/O (bank 1B/2B) |
| Broche 143 | I/O — General purpose user I/O (bank 1B/2B) |
| Broche 144 | EPAD — Exposed thermal pad (must be soldered to ground) |
Applications typiques
10M50SAE144C8G convient pour 6 applications: Industrial Control I/O Expansion, Portable Medical Device Signal Conditioning, Video Bridging and Image Aggregation, I/O Expansion for SoCs and Microcontrollers, Test & Measurement Instrumentation, Motor Control Pre-Processing.
Industrial Control I/O Expansion
The 10M50SAE144C8G's 50,000 logic elements and 101 user I/Os make it well-suited as a deterministic I/O expansion coprocessor for industrial PLCs, IPCs, and microcontroller-based controllers. It can be paired with a host MCU over parallel or SPI bridge, offloading high-speed pulse counting, quadrature decoding, and multi-axis stepper pulse generation that exceed the host MCU's bandwidth. Its instant-on non-volatile flash configuration ensures deterministic boot within milliseconds, critical for fail-safe industrial startup. The integrated 12-bit ADC with up to 17 channels also eliminates an external ADC for slow analog monitoring of temperature, pressure, or supply rails. Recommended companion parts: 10M25SAE144C8G (lower-density option), host MCU such as a MAX 10 Cortex-M variant, and an isolated RS-485 transceiver.
Recommandé
Portable Medical Device Signal Conditioning
The 10M50SAE144C8G fits portable medical monitoring designs because of its on-chip 12-bit ADC, low static power, and small 22 x 22 mm EQFP-144 footprint that fits handheld enclosures. The 50K-LE fabric can implement custom digital filters, ECG/EEG feature extraction, and packetization for Bluetooth/USB uplink to a host. On-chip flash and dual-boot remote-update support firmware upgrades in the field without requiring external boot memory. Combined with the integrated temperature-sensing diode, the FPGA can also supervise battery and PCB thermal conditions during long-term patient monitoring. Recommended companion parts: a low-noise analog front-end op-amp and a Bluetooth Low Energy module.
Recommandé
Video Bridging and Image Aggregation
With 1.6 Mbit of embedded SRAM and 101 I/Os, the 10M50SAE144C8G can aggregate multiple image sensor streams (parallel CMOS, MIPI-CSI via serializer, or LVDS), perform pixel-level pre-processing (debayer, gamma, scaling) and forward the result over USB 3.0 or Ethernet to a host processor. The MAX 10 fabric is large enough for two simultaneous 720p60 streams with line buffering in M9K blocks. The instant-on flash configuration means the bridge is ready to forward the first frame within milliseconds of power-up, important for vision-based driver-assistance and machine-vision startup. Recommended companion parts: image sensor serializers and a USB 3.0 controller.
Recommandé
I/O Expansion for SoCs and Microcontrollers
The 10M50SAE144C8G is frequently deployed as a flexible I/O expander alongside application processors in industrial gateways, where the SoC lacks enough GPIO, PWM channels, or special-purpose interfaces. The FPGA maps to the SoC over SPI or a parallel bus, exposing custom peripherals (PWM, quadrature encoder, custom UART, IrDA, LCD timing). Hot-socketing capability means the FPGA can be inserted onto a powered backplane without back-driving the system. Quartus IP libraries include UART, SPI, I2C, and PWM cores that can be stitched into a custom peripheral in days rather than months. Recommended companion parts: a Cortex-A industrial SoM and an SPI flash for SoC boot.
Recommandé
Test & Measurement Instrumentation
Test and measurement front-ends benefit from the 10M50SAE144C8G's deterministic fabric, on-chip ADC, and 101 LVDS-capable I/Os. The device can implement custom trigger logic, pattern generation, and protocol-aware decoding for serial buses (I2C, SPI, UART, CAN, LVDS) without off-the-shelf logic analyzer ASICs. The 12-bit on-chip ADC is sufficient for slow analog measurements like supply-rail health and front-end temperature, while the 50K-LE fabric handles real-time state machines for sequencer control. Combined with the non-volatile flash, instrument designers can ship one board that supports multiple firmware personalities selected at boot. Recommended companion parts: high-speed ADCs and precision references.
Recommandé
Motor Control Pre-Processing
The 10M50SAE144C8G is well-suited to offload real-time motor-control pre-processing from the main MCU: it can implement up to 6-channel PWM generation with dead-time insertion, quadrature encoder decoding, and field-oriented control (FOC) math in logic using the embedded multipliers. The on-chip ADC simultaneously samples phase currents and bus voltage, reducing component count and improving loop determinism. Closed-loop control loop latency is bounded by FPGA fabric delays rather than software interrupts, enabling higher PWM frequencies and quieter operation. The exposed thermal pad supports the elevated power dissipation typical when the device is fully populated with logic. Recommended companion parts: gate drivers and current-sense amplifiers.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10M50SAE144C8G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10M50SAE144I7G | 10M50SCE144C8G | 10M50DAE144C8G | 10M40SAE144C8G | 10M25SAE144C8G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | EQFP-144 (22x22 mm) | EQFP-144 - same | EQFP-144 - same | EQFP-144 - same | EQFP-144 - same | EQFP-144 - same |
| Logic Elements | 50000 | 50000 | 50000 | 50000 | 40000 | 25000 |
| Embedded Memory | 1677312 bits | 1677312 bits | 1677312 bits | 1677312 bits | 1290240 bits | 806400 bits |
| Max User I/Os | 101 | 101 | 101 | 101 | 101 | 101 |
| Temperature Grade | 0C to +85C (Commercial, C8) | -40C to +100C (Industrial, I7) | 0C to +85C (Commercial, C8) | 0C to +85C (Commercial, C8) | 0C to +85C (Commercial, C8) | 0C to +85C (Commercial, C8) |
| Configuration Flash | Dual-image (S-suffix) | Dual-image (S-suffix) | Dual-image (S-suffix) | Single-image (D-suffix) | Dual-image (S-suffix) | Dual-image (S-suffix) |
| ADC | 12-bit, up to 17 channels | 12-bit, up to 17 channels | 12-bit, up to 17 channels | 12-bit, up to 17 channels | 12-bit, up to 17 channels | 12-bit, up to 17 channels |
Principaux différenciateurs
- Non-volatile instant-on with on-chip 12-bit ADC (vs 10M40SAE144C8G (40K LE variant))
- Dual-image flash for remote system upgrade (vs 10M50DAE144C8G (single-image flash))
- 50K LE in EQFP-144 with commercial temp grade (vs 10M25SAE144C8G (25K LE variant))
Notes de conception
Solder the exposed thermal pad (EPAD, pin 144) to a continuous ground copper pour of at least 1 square inch on the top layer with multiple thermal vias stitching the pad to internal ground planes. The EQFP-144 thermal performance depends entirely on this pad; without adequate copper the junction temperature can exceed the 125C limit at elevated ambient. Estimated: at 1 W dissipation in still air with 1 sq-in copper pour, junction temperature rises approximately 25-30C above ambient. Keep high-power external components away from the pad area to avoid thermal coupling.
Decouple every VCC and VCCIO bank pin with a 0.1 uF X7R ceramic capacitor placed within 100 mils of the pin, and add a single 10 uF bulk capacitor near each bank. The MAX 10 has separate VCC (core) and VCCIO1 through VCCIO8 (per-bank I/O) supplies, plus VCCA1/VCCA2 for the ADC analog circuits. Analog supplies should be filtered with a ferrite bead and have their own 10 uF + 0.1 uF local decoupling to minimise ADC crosstalk. Power-up sequencing should follow Intel's MAX 10 Hardware Design Guidelines; in particular VCCA must ramp with or after VCC to avoid latch-up.
Bank I/O voltages (VCCIO1-VCCIO8) can be set independently to support mixed-voltage interfaces (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V) without external level shifters. When routing differential pairs (LVDS), keep the P/N traces length-matched within 50 mils and maintain 100-ohm differential impedance with 50-ohm single-ended reference to ground. JTAG chain pins (TCK, TMS, TDI, TDO) should be pulled to known logic levels through 10 kohm resistors if unused, to avoid floating inputs that can corrupt boundary-scan tests.
Do not leave configuration pins (nCONFIG, nSTATUS, CONFIG_DONE, DCLK, DATA0) floating; if not used in the application, tie nCONFIG through 10 kohm to VCC, leave nSTATUS and CONFIG_DONE as outputs, and route DCLK and DATA0 to a JTAG header for in-field reprogramming. Note that the S-suffix part supports dual-boot remote system upgrade, while the D-suffix uses single-image flash and frees more user flash at the cost of field-upgrade safety. Choose density carefully: 10M40/10M25 variants are pin-compatible drop-ins only when your design fits the smaller LE count.
The MAX 10 LVDS I/O can operate at up to 800 Mbps per channel. Maintain 100-ohm differential impedance and keep ground reference continuous under the pair; route over an unbroken reference plane to avoid return-path discontinuities that cause common-mode noise. For ADC inputs, use a 0.1 uF X7R bypass close to the ADCIN pin and a 10 kohm anti-aliasing RC network on each input. Quartus Prime's Pin Planner reports per-pin signal integrity advisories; always run Fitter and Timing Analyzer before tape-out.
Informations de conformité
RoHS compliant and lead-free per Altera/Intel product page (https://www.altera.com/products/fpga/max/10/10m50-e144/10M50SAE144C8G). Not AEC-Q100 qualified - choose AEC-Q100 variants for automotive. Halogen-free status not explicitly stated in the verified data.