A3P600L-FGG484 - 600K Gate Flash FPGA 484-BGA | Microchip
Артикул: A3P600L-FGG484 ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $71.2 | $712,00 |
| 100 | $64.8 | $6.480,00 |
| 500 | $59.4 | $29.700,00 |
| 1.000 | $54.9 | $54.900,00 |
A3P600L-FGG484 Обзор
A flash-based FPGA stores its configuration in on-chip non-volatile flash memory rather than the SRAM cells used by Xilinx and Intel/Altera devices. This means the A3P600L powers up instantly with no external configuration ROM, requires no boot sequencer, and is inherently immune to configuration bitstream interception - a key advantage in secure and radiation-tolerant-adjacent industrial designs. Within the power management hierarchy, the ProASIC3L family sits as the low-power variant of ProASIC3, using 130 nm CMOS flash technology with a 1.2 V to 1.5 V core voltage option.
Key differentiating features include single-chip Live-for-Free operation with zero configuration time, low total cost of ownership (TOC) per Microchip, support for the ARM Cortex-M1 soft processor core, embedded Flash*Freeze technology for near-zero dynamic power standby, and abundant on-chip advanced features including PLLs and block RAM.
Architecturally, each of the 13,824 logic cells contains a look-up table plus registers with rich routing fabric, and the device supports single-ended and differential I/O standards across 235 available user pins in the FBGA-484 bondout. The 130 nm flash process delivers a balance of density, static power, and cost that made ProASIC3L a mainstay in long-lifecycle embedded systems.
Typical applications include industrial automation controllers, communications line cards, medical instrumentation, military/aerospace subsystems requiring instant-on or secure configuration, and test equipment glue logic where reprogrammability and long-term availability matter more than leading-edge density.
When designing with this device, budget the 1.2 V core rail separately from the 2.5 V/3.3 V I/O banks and verify the Flash*Freeze pin sequencing to achieve the low static-power benefit; the 484-ball footprint requires controlled-impedance PCB stack-up and X-ray-inspectable BGA assembly.
This page synthesizes distributor pricing context, drop-in alternatives from the same FGG484 footprint family, and practical design notes not found in the manufacturer datasheet. Pricing shown is as of 2026-08-31 and reflects quoted/order-on-request availability typical for this mature flash FPGA family.
Аналоги без доработки для A3P600L-FGG484 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с A3P600L-FGG484 (тот же форм-фактор и посадочное место) — отличается по Package, RoHS Status, Configuration Memory, Technology, Core Supply Voltage.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
A3P600L-FGG484I
✅ Прямая замена✓ В наличии
$41.35 / шт.
Открыть даташит →A3P600L-1FGG484
✅ Прямая замена✓ В наличии
$30.4 / шт.
Открыть даташит →A3P600L-1FGG484I
✅ Прямая замена✓ В наличии
$17.1 / шт.
Открыть даташит →A3P600-1FGG484
✅ Прямая замена✓ В наличии
$52.4 / шт.
Открыть даташит →A3P600-2FGG484I
✅ Прямая замена✓ В наличии
$31.8 / шт.
Открыть даташит →A3P1000L-1FGG484I
✅ Прямая замена✓ В наличии
$28.8 / шт.
Открыть даташит →A3P600L-FGG484 Максимальные параметры и электрические характеристики
| Family | ProASIC3L |
| Equivalent Gates | 600000 gates |
| Logic Cells / CLBs | 13824 |
| User I/O | 235 |
| Maximum System Frequency | 350 MHz |
| Core Voltage | 1.2 V (1.2 V to 1.5 V supported) |
| Technology | 130 nm CMOS flash |
| Configuration Memory | On-chip flash (non-volatile, single chip) |
| Корпус | FBGA-484 (PBGA484) |
| Package Dimensions | 23 x 23 mm |
| Package Height | 2.23 mm |
| Ball Pitch | 1 mm |
| Тип монтажа | Surface Mount |
| Soft Processor Support | ARM Cortex-M1 |
| Статус RoHS | Green (RoHS compliant per Jotrin listing) |
| Speed Grade Suffix | Standard (no dash number in this ordering code) |
Руководство по цоколевке A3P600L-FGG484 в корпусе 2.23 mm
Цоколевка для A3P600L-FGG484 (корпус 2.23 mm). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для A3P600L-FGG484.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
A3P600L-FGG484 подходит для 6 применениеs: Industrial Automation Controllers, Secure Military and Aerospace Subsystems, Medical Instrumentation, Communications Line Cards, Test and Measurement Equipment, Embedded System Bridge and Glue Logic.
Industrial Automation Controllers
The A3P600L-FGG484 fits industrial PLC I/O scanning, motor-control sequencing, and fieldbus glue logic because its 13,824 logic cells and 235 user I/Os absorb the mixed counter, encoder, and communication functions typical of a controller card, while the on-chip flash configuration survives power cycling in factory environments with no boot device to corrupt. Running at a 1.2 V core, the L variant reduces standby draw in always-on cabinets, and Flash*Freeze mode holds state during idle periods. Placed between a host CPU and isolated I/O banks, it offloads deterministic timing tasks; the trade-off versus a microcontroller is higher unit cost but far greater parallelism and pin count on one FBGA-484 footprint.
Рекомендуется
Secure Military and Aerospace Subsystems
Flash-based configuration makes the A3P600L-FGG484 a natural fit for defense electronics where SRAM FPGA bitstream loading is a liability: there is no external configuration PROM to read out, and the design powers up instantly for mission-critical readiness. The 600K-gate capacity implements sensor interface, bus bridging (MIL-STD-1553-class glue, ARINC-style I/O), and cryptographic helper logic, while 235 I/Os terminate diverse legacy standards across banks. Deploy in conformal-cooled avionics trays using the FBGA-484's 23 x 23 mm footprint to conserve board area; the -1 speed grade variants (A3P600L-1FGG484I) close timing on higher-rate interfaces when the standard grade cannot.
Рекомендуется
Medical Instrumentation
In medical diagnostic equipment - patient-monitor front ends, imaging detector interfaces, and lab analyzers - the A3P600L-FGG484 bridges analog front-end ICs to processors with deterministic timing that software alone cannot guarantee. Its 235 I/Os handle multi-channel sensor arrays, and the 350 MHz system capability covers high-rate data formatting. The flash configuration eliminates boot delays so instruments are ready the moment power is applied, a usability requirement in clinical settings, and single-chip configuration simplifies regulatory traceability of the boot path. Use the 1.2 V core L variant to reduce internal dissipation in sealed enclosures where airflow is limited, and validate I/O bank voltages against the attached sensor rails during schematic review.
Рекомендуется
Communications Line Cards
The A3P600L-FGG484 serves as framing, multiplexing, and backplane-interface glue on telecom and networking line cards. With 13,824 cells and up to 350 MHz internal performance, it implements TDM framing, bit-rate adaptation, and status aggregation between PHYs and network processors, while 235 I/Os terminate multiple low-speed banks toward backplane connectors. Flash configuration allows hot discussion-free reinsertion: the card is active within microseconds of power-good, avoiding the SRAM-FPGA boot window that complicates high-availability redundant systems. Designers should budget the 1.2 V core rail separately and verify the FBGA-484 breakout impedance on thick backplane stack-ups; A3P600L-1FGG484 is the recommended grade when interface timing margins are tight.
Рекомендуется
Test and Measurement Equipment
Bench instruments, ATE channels, and protocol analyzers benefit from the A3P600L-FGG484's reprogrammability: firmware-fielded instruments can gain new measurement modes by reprogramming the same 600K-gate flash fabric, with no configuration PROM swap. The 235 I/Os map directly to channel-card connector fields for pattern generation and acquisition, and deterministic internal timing up to 350 MHz supports capture state machines that a soft real-time MCU cannot sustain. Instant-on flash configuration shortens instrument boot to effectively zero - a documented selling point of ProASIC3 for test systems that cycle power frequently. Pair with precision ADCs and use Flash*Freeze during idle periods to cut instrument standby power.
Рекомендуется
Embedded System Bridge and Glue Logic
For legacy-board life extension, the A3P600L-FGG484 consolidates the PLDs, bus transceivers, address decoders, and watchdog functions that were previously scattered across obsolete CPLDs. Its 600K-gate flash fabric, non-volatile configuration, and 235 I/Os let one FBGA-484 device replace multiple aging parts, cutting BOM risk on end-of-life designs - a common strategy for maintaining products whose original programmable logic is discontinued. Because configuration is on-chip, the replacement board behaves identically at power-up to the original discrete-logic assembly. Verify bank voltage compatibility with the legacy 3.3 V and 2.5 V signals during migration, and reuse the A3P600L-1FGG484 footprint-compatible speed grade if decoded access times need tightening.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для A3P600L-FGG484 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | A3P600L-FGG484I | A3P600L-1FGG484 | A3P600-1FGG484 | A3P1000L-1FGG484I |
|---|---|---|---|---|---|
| Package | FBGA-484 (23 x 23 mm, 1 mm pitch) | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent Gates | 600000 | 600000 | 600000 | 600000 | 1000000 |
| Speed Grade | Standard | Standard | -1 (faster) | -1 (faster) | -1 (faster) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.5 V class (standard core) | 1.2 V |
| Temperature Grade | Commercial (no I suffix) | Industrial | Commercial | Commercial | Industrial |
| Configuration Type | On-chip flash (non-volatile) | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
Ключевые отличия
- Low-power 1.2 V core variant (против A3P600-1FGG484)
- Instant-on secure configuration (против Xilinx Spartan-6 / Intel Cyclone IV equivalents)
- Pin-compatible up-migration path (против A3P1000L-1FGG484I)
Заметки по проектированию
Estimated: budget the 1.2 V core rail independently of the I/O bank rails (2.5 V / 3.3 V as loaded). Because this is the L (low-power) variant, core static power is lower than the standard A3P600, but total dissipation scales with I/O count and toggle rate - run the Microchip Libero power estimator with your actual design before sizing the regulator. Flash*Freeze can hold state at near-zero standby power, but the FRZEN pin sequencing must be respected; treat it as a real design input, not a bonus feature.
The FBGA-484 uses a 1.0 mm ball pitch on a 23 x 23 mm body. Plan escape routing for the outer two rows with via-in-pad or dogleg fans, and reserve inner-row balls for power/ground per the manufacturer bondout. Use at least a 4-layer stack-up with a solid ground plane under the device; controlled-impedance traces are recommended for any bank used above 100 MHz. BGA assembly requires X-ray inspection capability - confirm your contract manufacturer supports 1 mm-pitch 484-ball rework before layout freeze.
Do not treat the ordering code casually: A3P600L-FGG484, A3P600L-FGG484I, and A3P600L-1FGG484 differ in temperature grade and speed grade despite sharing the identical footprint, and sourcing an I-suffixed or -1 part as a 'substitute' changes qualification assumptions. Also remember that although the device is single-chip self-configuring, design changes require Microchip Libero SoC and the correct family fabrication report for your die - verify timing with the actual speed grade before release.
Информация о соответствии
Jotrin listing describes the package as GREEN, indicating lead-free/RoHS-friendly construction. REACH, halogen-free, and conflict-minerals status not stated in provided data.
