A3P600L-FGG484 - 600K Gate Flash FPGA 484-BGA | Microchip
MPN: A3P600L-FGG484 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $71.2 | $712.00 |
| 100 | $64.8 | $6,480.00 |
| 500 | $59.4 | $29,700.00 |
| 1,000 | $54.9 | $54,900.00 |
Drop-in alternatives for A3P600L-FGG484 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3P600L-FGG484I
✅ Drop-In✓ In Stock
$41.35 / Unit
View Datasheet →A3P600L-1FGG484
✅ Drop-In✓ In Stock
$30.4 / Unit
View Datasheet →A3P600L-1FGG484I
✅ Drop-In✓ In Stock
$17.1 / Unit
View Datasheet →A3P600-1FGG484
✅ Drop-In✓ In Stock
$52.4 / Unit
View Datasheet →A3P600-2FGG484I
✅ Drop-In✓ In Stock
$31.8 / Unit
View Datasheet →A3P1000L-1FGG484I
✅ Drop-In✓ In Stock
$28.8 / Unit
View Datasheet →A3P600L-FGG484 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3L |
| Equivalent Gates | 600000 gates |
| Logic Cells / CLBs | 13824 |
| User I/O | 235 |
| Maximum System Frequency | 350 MHz |
| Core Voltage | 1.2 V (1.2 V to 1.5 V supported) |
| Technology | 130 nm CMOS flash |
| Configuration Memory | On-chip flash (non-volatile, single chip) |
| Package | FBGA-484 (PBGA484) |
| Package Dimensions | 23 x 23 mm |
| Package Height | 2.23 mm |
| Ball Pitch | 1 mm |
| Mounting Type | Surface Mount |
| Soft Processor Support | ARM Cortex-M1 |
| RoHS Status | Green (RoHS compliant per Jotrin listing) |
| Speed Grade Suffix | Standard (no dash number in this ordering code) |
A3P600L-FGG484 2.23 mm Pin Configuration Guide
Complete pinout information for A3P600L-FGG484 (2.23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P600L-FGG484.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P600L-FGG484 is suitable for 6 applications: Industrial Automation Controllers, Secure Military and Aerospace Subsystems, Medical Instrumentation, Communications Line Cards, Test and Measurement Equipment, Embedded System Bridge and Glue Logic.
Industrial Automation Controllers
The A3P600L-FGG484 fits industrial PLC I/O scanning, motor-control sequencing, and fieldbus glue logic because its 13,824 logic cells and 235 user I/Os absorb the mixed counter, encoder, and communication functions typical of a controller card, while the on-chip flash configuration survives power cycling in factory environments with no boot device to corrupt. Running at a 1.2 V core, the L variant reduces standby draw in always-on cabinets, and Flash*Freeze mode holds state during idle periods. Placed between a host CPU and isolated I/O banks, it offloads deterministic timing tasks; the trade-off versus a microcontroller is higher unit cost but far greater parallelism and pin count on one FBGA-484 footprint.
Recommended
Secure Military and Aerospace Subsystems
Flash-based configuration makes the A3P600L-FGG484 a natural fit for defense electronics where SRAM FPGA bitstream loading is a liability: there is no external configuration PROM to read out, and the design powers up instantly for mission-critical readiness. The 600K-gate capacity implements sensor interface, bus bridging (MIL-STD-1553-class glue, ARINC-style I/O), and cryptographic helper logic, while 235 I/Os terminate diverse legacy standards across banks. Deploy in conformal-cooled avionics trays using the FBGA-484's 23 x 23 mm footprint to conserve board area; the -1 speed grade variants (A3P600L-1FGG484I) close timing on higher-rate interfaces when the standard grade cannot.
Recommended
Medical Instrumentation
In medical diagnostic equipment - patient-monitor front ends, imaging detector interfaces, and lab analyzers - the A3P600L-FGG484 bridges analog front-end ICs to processors with deterministic timing that software alone cannot guarantee. Its 235 I/Os handle multi-channel sensor arrays, and the 350 MHz system capability covers high-rate data formatting. The flash configuration eliminates boot delays so instruments are ready the moment power is applied, a usability requirement in clinical settings, and single-chip configuration simplifies regulatory traceability of the boot path. Use the 1.2 V core L variant to reduce internal dissipation in sealed enclosures where airflow is limited, and validate I/O bank voltages against the attached sensor rails during schematic review.
Recommended
Communications Line Cards
The A3P600L-FGG484 serves as framing, multiplexing, and backplane-interface glue on telecom and networking line cards. With 13,824 cells and up to 350 MHz internal performance, it implements TDM framing, bit-rate adaptation, and status aggregation between PHYs and network processors, while 235 I/Os terminate multiple low-speed banks toward backplane connectors. Flash configuration allows hot discussion-free reinsertion: the card is active within microseconds of power-good, avoiding the SRAM-FPGA boot window that complicates high-availability redundant systems. Designers should budget the 1.2 V core rail separately and verify the FBGA-484 breakout impedance on thick backplane stack-ups; A3P600L-1FGG484 is the recommended grade when interface timing margins are tight.
Recommended
Test and Measurement Equipment
Bench instruments, ATE channels, and protocol analyzers benefit from the A3P600L-FGG484's reprogrammability: firmware-fielded instruments can gain new measurement modes by reprogramming the same 600K-gate flash fabric, with no configuration PROM swap. The 235 I/Os map directly to channel-card connector fields for pattern generation and acquisition, and deterministic internal timing up to 350 MHz supports capture state machines that a soft real-time MCU cannot sustain. Instant-on flash configuration shortens instrument boot to effectively zero - a documented selling point of ProASIC3 for test systems that cycle power frequently. Pair with precision ADCs and use Flash*Freeze during idle periods to cut instrument standby power.
Recommended
Embedded System Bridge and Glue Logic
For legacy-board life extension, the A3P600L-FGG484 consolidates the PLDs, bus transceivers, address decoders, and watchdog functions that were previously scattered across obsolete CPLDs. Its 600K-gate flash fabric, non-volatile configuration, and 235 I/Os let one FBGA-484 device replace multiple aging parts, cutting BOM risk on end-of-life designs - a common strategy for maintaining products whose original programmable logic is discontinued. Because configuration is on-chip, the replacement board behaves identically at power-up to the original discrete-logic assembly. Verify bank voltage compatibility with the legacy 3.3 V and 2.5 V signals during migration, and reuse the A3P600L-1FGG484 footprint-compatible speed grade if decoded access times need tightening.
Recommended
Recommended Products Summary
Engineering reference data for A3P600L-FGG484 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P600L-FGG484I | A3P600L-1FGG484 | A3P600-1FGG484 | A3P1000L-1FGG484I |
|---|---|---|---|---|---|
| Package | FBGA-484 (23 x 23 mm, 1 mm pitch) | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent Gates | 600000 | 600000 | 600000 | 600000 | 1000000 |
| Logic Cells | 13824 | 13824 | 13824 | 13824 | [DATA_NEEDED] |
| Speed Grade | Standard | Standard | -1 (faster) | -1 (faster) | -1 (faster) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.5 V class (standard core) | 1.2 V |
| Temperature Grade | Commercial (no I suffix) | Industrial | Commercial | Commercial | Industrial |
| Configuration Type | On-chip flash (non-volatile) | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
Key Differentiators
- Low-power 1.2 V core variant (vs A3P600-1FGG484)
- Instant-on secure configuration (vs Xilinx Spartan-6 / Intel Cyclone IV equivalents)
- Pin-compatible up-migration path (vs A3P1000L-1FGG484I)
Design Notes
Estimated: budget the 1.2 V core rail independently of the I/O bank rails (2.5 V / 3.3 V as loaded). Because this is the L (low-power) variant, core static power is lower than the standard A3P600, but total dissipation scales with I/O count and toggle rate - run the Microchip Libero power estimator with your actual design before sizing the regulator. Flash*Freeze can hold state at near-zero standby power, but the FRZEN pin sequencing must be respected; treat it as a real design input, not a bonus feature.
The FBGA-484 uses a 1.0 mm ball pitch on a 23 x 23 mm body. Plan escape routing for the outer two rows with via-in-pad or dogleg fans, and reserve inner-row balls for power/ground per the manufacturer bondout. Use at least a 4-layer stack-up with a solid ground plane under the device; controlled-impedance traces are recommended for any bank used above 100 MHz. BGA assembly requires X-ray inspection capability - confirm your contract manufacturer supports 1 mm-pitch 484-ball rework before layout freeze.
Do not treat the ordering code casually: A3P600L-FGG484, A3P600L-FGG484I, and A3P600L-1FGG484 differ in temperature grade and speed grade despite sharing the identical footprint, and sourcing an I-suffixed or -1 part as a 'substitute' changes qualification assumptions. Also remember that although the device is single-chip self-configuring, design changes require Microchip Libero SoC and the correct family fabrication report for your die - verify timing with the actual speed grade before release.
Compliance Information
Jotrin listing describes the package as GREEN, indicating lead-free/RoHS-friendly construction. REACH, halogen-free, and conflict-minerals status not stated in provided data.
