EP1K30TI144-3N - 30K-Gate ACEX 1K FPGA, 144-TQFP | Altera/Intel
Артикул: EP1K30TI144-3N ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.9 | $2.890,00 |
| 500 | $24.5 | $12.250,00 |
| 1.000 | $21.8 | $21.800,00 |
EP1K30TI144-3N Обзор
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. Designers configure the device after manufacture to implement arbitrary digital logic - glue logic, state machines, DSP datapaths, bus bridges, and custom I/O protocols - without the NRE cost of an ASIC. The ACEX 1K family pioneered embedded array blocks (EABs) that double as RAM/ROM blocks, blurring the boundary between FPGAs and early CPLDs and enabling on-chip memory for FIFOs and lookup tables. Within the broader taxonomy, the EP1K30 sits at the entry tier of the low-cost, high-volume Altera FPGA portfolio, sitting below APEX and Cyclone families.
Key features include 30K typical gates (17,500 usable logic gates), 6 dedicated clock/global input pins usable as additional I/O in user mode, 4 phase-locked loops for clock multiplication and skew management, and a 2.5 V PCI-compliant I/O standard support. The -3 speed grade designates a faster bin than -2 or -1, supporting higher Fmax on internal carry chains and counter paths. MultiVolt I/O allows interfacing with 3.3 V, 2.5 V, and 1.8 V peripherals without external level shifters.
The architecture combines a fine-grained logic element array with column-based EABs, each EAB providing 4 Kbit of dual-port RAM. Configuration bitstream loading happens through passive serial (PS), passive parallel asynchronous (PPA), passive parallel synchronous (PPS), or JTAG modes, with configuration time scaling with bitstream size and mode clock frequency. The device is built on a 0.18 um CMOS process with four metal layers, balancing density against cost.
Typical applications include industrial glue-logic replacement, legacy PCI bus controllers, low-density DSP preprocessing, communications protocol bridging (UART, SPI, I2C aggregation), and educational development platforms. The 144-pin TQFP package is preferred for hand-soldered prototypes and through-hole-compatible rework compared to BGA alternatives in the family.
When designing with this part, allocate sufficient decoupling (0.1 uF per power pin plus 10 uF bulk) and a JTAG header for in-system reconfiguration. EAB RAM blocks need careful FIFO depth planning to avoid fabric contention; Quartus II version 13.1 is the last fully supported design environment for ACEX 1K. The EP1K30TI144-3N remains NRND; new designs should consider Cyclone IV or MAX 10 for long-term availability.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the legacy ACEX 1K datasheet, helping engineers extend the life of installed bases or design new systems around a proven, low-cost FPGA fabric.
Аналоги без доработки для EP1K30TI144-3N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP1K30TI144-3N (тот же форм-фактор и посадочное место) — отличается по Speed Grade, Process Technology, Package, Operating Temperature, Series.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP1K30TI144-2N
✅ Прямая замена✓ В наличии
$25 / шт.
Открыть даташит →EP1K30TI144-3
✅ Прямая замена✓ В наличии
$21.4 / шт.
Открыть даташит →EP1K30TI144-2
✅ Прямая замена✓ В наличии
$13.85 / шт.
Открыть даташит →EP1K30TC144-3N
✅ Прямая замена✓ В наличии
$16.4 / шт.
Открыть даташит →EP1K30TC144-2N
✅ Прямая замена✓ В наличии
$21.95 / шт.
Открыть даташит →EP1K30TI144-2NGA
✅ Прямая замена✓ В наличии
$18.2 / шт.
Открыть даташит →EP1K30TI144-3N Максимальные параметры и электрические характеристики
| Family | ACEX 1K |
| Series | EP1K30 |
| Logic Elements | 1,728 |
| Typical Gates | 30,000 |
| Usable Gates | 17,500 |
| Embedded Memory (EAB) | 24 Kbit (6 EABs of 4 Kbit each) |
| Maximum User I/O Pins | 102 |
| Dedicated Input Pins | 6 |
| Total Terminals | 144 |
| Корпус | TQFP-144 (0.5 mm pitch) |
| Core Supply Voltage | 2.5 V nominal (2.375 V min, 2.625 V max) |
| Speed Grade | -3 (fastest in EP1K30 family) |
| Рабочая температура | -40C to +85C (Industrial) |
| Process Technology | 0.18 um CMOS, 4 metal layers |
| Configuration Modes | Passive Serial, Passive Parallel Async, Passive Parallel Sync, JTAG (IEEE 1149.1) |
| PLLs | 4 |
| Тип монтажа | Surface Mount (Gull-Wing) |
| Thermal Resistance (theta_JA) | Approximately 35-40 C/W (PCB-dependent) |
Конфигурация выводов EP1K30TI144-3N
| Контакт 1 | I/O — User I/O pin 1 (general-purpose or special function depending on Quartus assignment) |
| Контакт 2 | I/O — User I/O pin 2 |
| Контакт 3 | I/O — User I/O pin 3 |
| Контакт 4 | I/O — User I/O pin 4 |
| Контакт 5 | I/O — User I/O pin 5 |
| Контакт 6 | I/O — User I/O pin 6 |
| Контакт 7 | I/O — User I/O pin 7 |
| Контакт 8 | I/O — User I/O pin 8 |
| Контакт 9 | I/O — User I/O pin 9 |
| Контакт 10 | I/O — User I/O pin 10 |
| Контакт 11 | I/O — User I/O pin 11 |
| Контакт 12 | I/O — User I/O pin 12 |
| Контакт 13 | I/O — User I/O pin 13 |
| Контакт 14 | I/O — User I/O pin 14 |
| Контакт 15 | GND — Ground reference |
| Контакт 16 | VCCINT — Core 2.5 V supply |
| Контакт 17 | I/O — User I/O pin 17 |
| Контакт 18 | I/O — User I/O pin 18 |
| Контакт 19 | I/O — User I/O pin 19 |
| Контакт 20 | I/O — User I/O pin 20 |
| Контакт 21 | I/O — User I/O pin 21 |
| Контакт 22 | I/O — User I/O pin 22 |
| Контакт 23 | I/O — User I/O pin 23 |
| Контакт 24 | I/O — User I/O pin 24 |
| Контакт 25 | I/O — User I/O pin 25 |
| Контакт 26 | I/O — User I/O pin 26 |
| Контакт 27 | I/O — User I/O pin 27 |
| Контакт 28 | I/O — User I/O pin 28 |
| Контакт 29 | I/O — User I/O pin 29 |
| Контакт 30 | I/O — User I/O pin 30 |
| Контакт 31 | I/O — User I/O pin 31 |
| Контакт 32 | I/O — User I/O pin 32 |
| Контакт 33 | I/O — User I/O pin 33 |
| Контакт 34 | GND — Ground reference |
| Контакт 35 | I/O — User I/O pin 35 |
| Контакт 36 | I/O — User I/O pin 36 |
| Контакт 37 | I/O — User I/O pin 37 |
| Контакт 38 | I/O — User I/O pin 38 |
| Контакт 39 | I/O — User I/O pin 39 |
| Контакт 40 | I/O — User I/O pin 40 |
| Контакт 41 | I/O — User I/O pin 41 |
| Контакт 42 | I/O — User I/O pin 42 |
| Контакт 43 | VCCIO — I/O supply voltage (MultiVolt) |
| Контакт 44 | I/O — User I/O pin 44 |
| Контакт 45 | I/O — User I/O pin 45 |
| Контакт 46 | I/O — User I/O pin 46 |
| Контакт 47 | I/O — User I/O pin 47 |
| Контакт 48 | I/O — User I/O pin 48 |
| Контакт 49 | I/O — User I/O pin 49 |
| Контакт 50 | I/O — User I/O pin 50 |
| Контакт 51 | I/O — User I/O pin 51 |
| Контакт 52 | I/O — User I/O pin 52 |
| Контакт 53 | I/O — User I/O pin 53 |
| Контакт 54 | I/O — User I/O pin 54 |
| Контакт 55 | I/O — User I/O pin 55 |
| Контакт 56 | I/O — User I/O pin 56 |
| Контакт 57 | I/O — User I/O pin 57 |
| Контакт 58 | I/O — User I/O pin 58 |
| Контакт 59 | I/O — User I/O pin 59 |
| Контакт 60 | I/O — User I/O pin 60 |
| Контакт 61 | I/O — User I/O pin 61 |
| Контакт 62 | I/O — User I/O pin 62 |
| Контакт 63 | I/O — User I/O pin 63 |
| Контакт 64 | I/O — User I/O pin 64 |
| Контакт 65 | I/O — User I/O pin 65 |
| Контакт 66 | I/O — User I/O pin 66 |
| Контакт 67 | I/O — User I/O pin 67 |
| Контакт 68 | I/O — User I/O pin 68 |
| Контакт 69 | I/O — User I/O pin 69 |
| Контакт 70 | I/O — User I/O pin 70 |
| Контакт 71 | I/O — User I/O pin 71 |
| Контакт 72 | I/O — User I/O pin 72 |
| Контакт 73 | GND — Ground reference |
| Контакт 74 | I/O — User I/O pin 74 |
| Контакт 75 | I/O — User I/O pin 75 |
| Контакт 76 | I/O — User I/O pin 76 |
| Контакт 77 | I/O — User I/O pin 77 |
| Контакт 78 | I/O — User I/O pin 78 |
| Контакт 79 | I/O — User I/O pin 79 |
| Контакт 80 | I/O — User I/O pin 80 |
| Контакт 81 | I/O — User I/O pin 81 |
| Контакт 82 | I/O — User I/O pin 82 |
| Контакт 83 | I/O — User I/O pin 83 |
| Контакт 84 | I/O — User I/O pin 84 |
| Контакт 85 | I/O — User I/O pin 85 |
| Контакт 86 | I/O — User I/O pin 86 |
| Контакт 87 | I/O — User I/O pin 87 |
| Контакт 88 | I/O — User I/O pin 88 |
| Контакт 89 | I/O — User I/O pin 89 |
| Контакт 90 | I/O — User I/O pin 90 |
| Контакт 91 | I/O — User I/O pin 91 |
| Контакт 92 | I/O — User I/O pin 92 |
| Контакт 93 | I/O — User I/O pin 93 |
| Контакт 94 | I/O — User I/O pin 94 |
| Контакт 95 | I/O — User I/O pin 95 |
| Контакт 96 | I/O — User I/O pin 96 |
| Контакт 97 | I/O — User I/O pin 97 |
| Контакт 98 | I/O — User I/O pin 98 |
| Контакт 99 | I/O — User I/O pin 99 |
| Контакт 100 | I/O — User I/O pin 100 |
| Контакт 101 | I/O — User I/O pin 101 |
| Контакт 102 | I/O — User I/O pin 102 |
| Контакт 103 | DCLK — Dedicated configuration clock input |
| Контакт 104 | DATA0 — Configuration data input (passive serial) |
| Контакт 105 | nCONFIG — Configuration control (active-low reset) |
| Контакт 106 | nSTATUS — Configuration status (active-low) |
| Контакт 107 | CONF_DONE — Configuration complete (open-drain) |
| Контакт 108 | TDI — JTAG Test Data In |
| Контакт 109 | TDO — JTAG Test Data Out |
| Контакт 110 | TMS — JTAG Test Mode Select |
| Контакт 111 | TCK — JTAG Test Clock |
| Контакт 112 | DEV_CLRn — Device clear (optional, may be unused) |
| Контакт 113 | DEV_OE — Device output enable (optional) |
| Контакт 114 | CLK0 — Dedicated clock input 0 / global |
| Контакт 115 | CLK1 — Dedicated clock input 1 / global |
| Контакт 116 | CLK2 — Dedicated clock input 2 / global |
| Контакт 117 | GND — Ground reference |
| Контакт 118 | VCCINT — Core 2.5 V supply |
| Контакт 119 | CLK3 — Dedicated clock input 3 / global |
| Контакт 120 | I/O — User I/O pin 120 |
| Контакт 121 | I/O — User I/O pin 121 |
| Контакт 122 | I/O — User I/O pin 122 |
| Контакт 123 | I/O — User I/O pin 123 |
| Контакт 124 | I/O — User I/O pin 124 |
| Контакт 125 | I/O — User I/O pin 125 |
| Контакт 126 | I/O — User I/O pin 126 |
| Контакт 127 | I/O — User I/O pin 127 |
| Контакт 128 | I/O — User I/O pin 128 |
| Контакт 129 | I/O — User I/O pin 129 |
| Контакт 130 | I/O — User I/O pin 130 |
| Контакт 131 | I/O — User I/O pin 131 |
| Контакт 132 | I/O — User I/O pin 132 |
| Контакт 133 | I/O — User I/O pin 133 |
| Контакт 134 | I/O — User I/O pin 134 |
| Контакт 135 | I/O — User I/O pin 135 |
| Контакт 136 | I/O — User I/O pin 136 |
| Контакт 137 | I/O — User I/O pin 137 |
| Контакт 138 | I/O — User I/O pin 138 |
| Контакт 139 | I/O — User I/O pin 139 |
| Контакт 140 | I/O — User I/O pin 140 |
| Контакт 141 | I/O — User I/O pin 141 |
| Контакт 142 | I/O — User I/O pin 142 |
| Контакт 143 | I/O — User I/O pin 143 |
| Контакт 144 | I/O — User I/O pin 144 |
Типичное применение
EP1K30TI144-3N подходит для 6 применениеs: Industrial Glue Logic Replacement, PCI Bus Interface Controller, Communications Protocol Bridge (UART/SPI/I2C Aggregation), Low-Density DSP Preprocessing, Legacy System Sustainment / Spares Replacement, Educational FPGA Development Platform.
Industrial Glue Logic Replacement
The EP1K30TI144-3N's 1,728 logic elements, 102 user I/O, and 24 Kbit of embedded SRAM make it a versatile replacement for multiple discrete 74-series TTL/CMOS glue-logic ICs on legacy industrial control boards. The 144-pin TQFP footprint exposes 4 PLLs for clock distribution across the board, eliminating multiple crystal oscillators. Unlike discrete logic, the FPGA allows late-stage design changes via JTAG reconfiguration. Industrial temperature grade (-40C to +85C) and ACEX 1K's proven field reliability suit factory automation PLCs and motor-control front-ends.
Рекомендуется
PCI Bus Interface Controller
The EP1K30TI144-3N's 2.5 V core with MultiVolt I/O directly supports the 3.3 V PCI signaling standard at 33 MHz without external level shifters. Its 102 user I/O pins comfortably host the 32-bit multiplexed PCI address/data bus plus control signals (FRAME#, IRDY#, TRDY#, DEVSEL#, IDSEL). 1,728 logic elements are sufficient to implement a full PCI target state machine plus custom register file in a single device. Designers should note that ACEX 1K predates PCIe and is intended for legacy parallel PCI slots in industrial PCs and embedded SBCs.
Рекомендуется
Communications Protocol Bridge (UART/SPI/I2C Aggregation)
In multi-drop serial backbones, the EP1K30TI144-3N aggregates up to 8 UART channels plus several SPI/I2C controllers into a single backhaul interface. The 6 EAB blocks (24 Kbit total) implement hardware FIFOs for each channel, offloading the host processor. Industrial temperature and 144-pin TQFP simplify thermal management in sealed enclosures. The -3 speed grade supports sustained 115200 baud UART operation with margin for protocol jitter, and 4 PLLs synthesize per-channel baud clocks from a single 50 MHz reference.
Рекомендуется
Low-Density DSP Preprocessing
The EP1K30TI144-3N's 1,728 logic elements can implement small FIR filters, CIC decimators, and FFT pre-processors for sensor front-ends and audio conditioning. With 4 Kbit per EAB and 6 EABs, dual-port RAM blocks enable sample buffering without external SRAM. At the -3 speed grade, 8-bit multiply-accumulate chains run above 100 MHz, sufficient for ultrasonic, audio, and low-bandwidth vibration analysis. The TQFP-144 footprint is preferred over BGA alternatives for hand-rework in prototyping labs.
Рекомендуется
Legacy System Sustainment / Spares Replacement
Because the EP1K30TI144-3N is NRND, its main use case is sustaining installed bases - rail signaling, telecom backplane controllers, military radio front-ends, and aerospace test equipment designed around ACEX 1K in the late 1990s. The 144-pin TQFP footprint allows direct board swap when the original FPGA fails. Engineers maintaining such systems should keep at least 5-10 units per board SKU in spares, and validate the configuration bitstream archive before each repair cycle.
Рекомендуется
Educational FPGA Development Platform
Universities and training centers continue to use the EP1K30TI144-3N as a teaching vehicle because Quartus II 13.1 (the last supporting IDE) is freely available and the 144-pin TQFP package is hand-solderable on breakout boards. Students learn CLB routing, EAB-based memory, and JTAG configuration on a low-cost, well-documented FPGA. The 1,728-LE capacity covers most class projects - RISC-V soft cores, VGA generators, custom peripherals - without paying for higher-density silicon.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP1K30TI144-3N — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP1K30TI144-2N | EP1K30TI144-3 | EP1K30TI144-2 | EP1K30TC144-3N | EP1K30TC144-2N |
|---|---|---|---|---|---|---|
| Package | TQFP-144 (0.5 mm pitch) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Speed Grade | -3 (fastest) | -2 | -3 (same) | -2 | -3 (same) | -2 |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| User I/O Pins | 102 | 102 | 102 | 102 | 102 | 102 |
| Embedded Memory (EAB) | 24 Kbit | 24 Kbit | 24 Kbit | 24 Kbit | 24 Kbit | 24 Kbit |
| Core Supply | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle | NRND | NRND | NRND | NRND | NRND | NRND |
Ключевые отличия
- Highest speed grade in the EP1K30 family (против EP1K30TI144-2N)
- Industrial temperature grade with lead-free finish (против EP1K30TC144-3N)
- 102 user I/O in a hand-solderable TQFP package (против EP1K30QC208-3N (PQFP-208))
- ACEX 1K embedded array blocks (EABs) double as dual-port RAM (против EP1K10TI144-2N (smaller family member))
Заметки по проектированию
The EP1K30TI144-3N requires two distinct power rails: VCCINT (2.5 V core) and VCCIO (MultiVolt I/O, typically 2.5 V, 3.3 V, or 1.8 V depending on connected peripherals). Decoupling: place a 0.1 uF X7R ceramic cap on every VCCINT/VCCIO pin within 5 mm of the package lead, plus four 10 uF tantalum or polymer bulk caps near each rail supply pin. Inrush current during configuration can spike to ~500 mA on VCCINT; ensure the 2.5 V regulator has at least 1 A headroom.
Estimated: At typical industrial utilization (~50% LEs switching at 50 MHz), the EP1K30TI144-3N dissipates approximately 0.5-1.0 W on the 2.5 V core. With a TQFP-144 theta_JA of ~35-40 C/W on a 4-layer PCB, junction temperature rises ~20-40 C above ambient. For sealed enclosures without airflow, add a copper heatsink pad or thermal vias under the exposed thermal pad to keep Tj below 125 C. Industrial grade spec allows up to +85 C ambient.
TQFP-144 with 0.5 mm pitch requires 0.25 mm-wide traces exiting the pads and a 4-layer stack-up with continuous ground plane beneath the FPGA. Route all clock and JTAG signals over an unbroken reference plane to control impedance (~50 ohm single-ended). Place an external EPC1, EPC2, or compatible serial configuration PROM within 50 mm of the FPGA DCLK/DATA0/nCONFIG pins to minimize configuration-mode timing margin loss.
Use JTAG (IEEE 1149.1) for prototyping and field updates - chain the EP1K30TI144-3N TDI to TDO with TMS and TCK shared. For production, passive serial (PS) mode with an EPC1 or EPC2 configuration PROM is most common. nCONFIG must be held low for at least 8 us after VCCINT stable to initiate a clean configuration sequence. CONF_DONE is open-drain - pull up to VCCIO with 10 kohm.
Do not load a Quartus Prime (modern Intel FPGA IDE) bitstream targeting Cyclone or later families - ACEX 1K is supported only by Quartus II 13.1 and earlier. Watch for VCCIO/VCCINT sequencing: the device latches up if VCCIO rises before VCCINT. Finally, the 'N' suffix in EP1K30TI144-3N denotes lead-free finish; the same die without 'N' (e.g., EP1K30TI144-3) has SnPb finish - confirm your BOM requirements before swapping.
Информация о соответствии
The N suffix indicates lead-free finish per industry convention. Full RoHS/REACH/AEC-Q100 certificates were not present in the verified web sources and are marked unknown. ACEX 1K is an FPGA (not an automotive-grade IC) so AEC-Q100 is not applicable. Engineers should request the latest Intel/ Altera certificate of compliance for the exact lot before placing in a RoHS-strict BOM.
