Intel

EP1K30TI144-2 - ACEX-1K 30K-Gate FPGA, 102 I/O, 144-TQFP | Intel

MPN: EP1K30TI144-2 βœ— End of Life
In Stock Ships in 1-3 business days
2.5 V (2.375 V min, 2.625 V max) Vdss 144-LQFP (TQFP), 22 mm Γ— 22 mm, 0.5 mm pitch Package 200 MHz Speed Dual-port EAB (Embedded Array Block) Memory
From $13.85 USD / Unit
MOQ: 1 |
Price updated: 2026-09-06
Volume Pricing
Qty Unit Price Extended
1 $28.5 $28.50
10 $24.75 $247.50
100 $19.95 $1,995.00
500 $16.4 $8,200.00
1,000 $13.85 $13,850.00
ℹ️ All prices are in USD

Drop-in alternatives for EP1K30TI144-2 β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EP1K30TI144-2N

βœ… Drop-In
Intel
πŸ“¦ 144-LQFP
ACEX-1K Β· Intel (formerly Altera) Β· 1728 Β· 30,000 gates Β· 24,576 bits Β· 102 Β· [DATA_NEEDED: LAB count] Β· [DATA_NEEDED: EAB count]

βœ“ In Stock

$25 / Unit

View Datasheet β†’

EP1K30TI144-3N

βœ… Drop-In
Altera
πŸ“¦ 144-LQFP
ACEX 1K Β· EP1K30 Β· 1,728 Β· 30,000 Β· 17,500 Β· 24 Kbit (6 EABs of 4 Kbit each) Β· 102 Β· 6

βœ“ In Stock

$21.8 / Unit

View Datasheet β†’

EP1K30TC144-2

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
Intel
πŸ“¦ 144-LQFP
ACEX 1K Β· 1,728 Β· 30,000 Β· 216 Β· 102 Β· 6 Β· 24,576 bits Β· 0.22 Β΅m SRAM LUT

βœ“ In Stock

$18.4 / Unit

View Datasheet β†’

EP1K30TC144-2N

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
Intel
πŸ“¦ 144-LQFP
ACEX-1K Β· 1728 Β· 24576 Β· 216 Β· 6 Β· 102 Β· 30,000 (typical system gates) Β· 2.375 V to 2.625 V (2.5 V nominal)

βœ“ In Stock

$21.95 / Unit

View Datasheet β†’

EP1K10TI144-2

βœ… Drop-In
Altera
πŸ“¦ 144-LQFP
ACEX 1K Β· EP1K10 Β· 10,000 Β· 576 Β· 200 MHz Β· 0.22 Β΅m CMOS Β· 2.5 V Β· 92

βœ“ In Stock

$16.4 / Unit

View Datasheet β†’

EP1K30TI144-2 Maximum Ratings & Electrical Characteristics

Family ACEX-1K
Series EP1K30
Logic Elements / Cells 1728
Total RAM Bits 24576
Number of Logic Array Blocks (LABs) 216
Equivalent Gates 30,000
User I/O Count 102
Number of I/O Banks 4
Supply Voltage - Core 2.5 V (2.375 V min, 2.625 V max)
Supply Voltage - I/O 2.5 V / 3.3 V / 5.0 V (multiVolt)
Maximum Internal Frequency 200 MHz
Process Technology 0.22 Β΅m CMOS, SRAM-based
Embedded Memory Type Dual-port EAB (Embedded Array Block)
Package 144-LQFP (TQFP), 22 mm Γ— 22 mm, 0.5 mm pitch
Operating Temperature -40 Β°C to +85 Β°C (Industrial, "I" suffix)
Speed Grade -2 (mid-tier)
Configuration Method SRAM, requires external configuration PROM (EPC)
Programming Interface JTAG (IEEE 1149.1) / IEEE 1532 ISP
Mounting Type Surface Mount

EP1K30TI144-2 Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 I/O β€” Bank 1 user I/O (pin-1 reference varies by package orientation)
Pin 2 I/O β€” Bank 1 user I/O
Pin 3 I/O β€” Bank 1 user I/O
Pin 4 VCCIO1 β€” Bank 1 I/O supply (2.5/3.3/5.0 V)
Pin 5 I/O β€” Bank 1 user I/O
Pin 6 I/O β€” Bank 1 user I/O
Pin 7 I/O β€” Bank 1 user I/O
Pin 8 I/O β€” Bank 1 user I/O
Pin 9 I/O β€” Bank 1 user I/O
Pin 10 GND β€” Ground
Pin 11 I/O β€” Bank 1 user I/O
Pin 12 I/O β€” Bank 1 user I/O
Pin 13 I/O β€” Bank 1 user I/O
Pin 14 VCCINT β€” Core supply 2.5 V
Pin 15 I/O β€” Bank 1 user I/O
Pin 16 I/O β€” Bank 1 user I/O
Pin 17 I/O β€” Bank 1 user I/O
Pin 18 I/O β€” Bank 1 user I/O
Pin 19 GND β€” Ground
Pin 20 I/O β€” Bank 1 user I/O
Pin 21 I/O β€” Bank 1 user I/O
Pin 22 I/O β€” Bank 1 user I/O
Pin 23 VCCIO1 β€” Bank 1 I/O supply
Pin 24 I/O β€” Bank 1 user I/O
Pin 25 I/O β€” Bank 1 user I/O
Pin 26 I/O β€” Bank 1 user I/O
Pin 27 I/O β€” Bank 1 user I/O
Pin 28 GND β€” Ground
Pin 29 I/O β€” Bank 1 user I/O
Pin 30 I/O β€” Bank 1 user I/O
Pin 31 I/O β€” Bank 1 user I/O
Pin 32 I/O β€” Bank 1 user I/O
Pin 33 VCCINT β€” Core supply 2.5 V
Pin 34 I/O β€” Bank 1 user I/O
Pin 35 I/O β€” Bank 1 user I/O
Pin 36 I/O β€” Bank 1 user I/O
Pin 37 I/O β€” Bank 1 user I/O
Pin 38 MSEL0 β€” Configuration mode select 0
Pin 39 MSEL1 β€” Configuration mode select 1
Pin 40 nSTATUS β€” Configuration status (open-drain)
Pin 41 DCLK β€” Configuration clock input
Pin 42 CONF_DONE β€” Configuration complete (open-drain)
Pin 43 TDI β€” JTAG test data in
Pin 44 TMS β€” JTAG test mode select
Pin 45 TCK β€” JTAG test clock
Pin 46 TDO β€” JTAG test data out
Pin 47 VCCIO2 β€” Bank 2 I/O supply
Pin 48 I/O β€” Bank 2 user I/O
Pin 49 I/O β€” Bank 2 user I/O
Pin 50 I/O β€” Bank 2 user I/O
Pin 51 GND β€” Ground
Pin 52 I/O β€” Bank 2 user I/O
Pin 53 I/O β€” Bank 2 user I/O
Pin 54 I/O β€” Bank 2 user I/O
Pin 55 I/O β€” Bank 2 user I/O
Pin 56 I/O β€” Bank 2 user I/O
Pin 57 VCCINT β€” Core supply 2.5 V
Pin 58 I/O β€” Bank 2 user I/O
Pin 59 I/O β€” Bank 2 user I/O
Pin 60 I/O β€” Bank 2 user I/O
Pin 61 I/O β€” Bank 2 user I/O
Pin 62 GND β€” Ground
Pin 63 I/O β€” Bank 2 user I/O
Pin 64 I/O β€” Bank 2 user I/O
Pin 65 I/O β€” Bank 2 user I/O
Pin 66 I/O β€” Bank 2 user I/O
Pin 67 VCCIO2 β€” Bank 2 I/O supply
Pin 68 I/O β€” Bank 2 user I/O
Pin 69 I/O β€” Bank 2 user I/O
Pin 70 I/O β€” Bank 2 user I/O
Pin 71 I/O β€” Bank 2 user I/O
Pin 72 GND β€” Ground
Pin 73 I/O β€” Bank 2 user I/O
Pin 74 I/O β€” Bank 2 user I/O
Pin 75 I/O β€” Bank 2 user I/O
Pin 76 I/O β€” Bank 2 user I/O
Pin 77 VCCINT β€” Core supply 2.5 V
Pin 78 I/O β€” Bank 3 user I/O
Pin 79 I/O β€” Bank 3 user I/O
Pin 80 I/O β€” Bank 3 user I/O
Pin 81 I/O β€” Bank 3 user I/O
Pin 82 GND β€” Ground
Pin 83 I/O β€” Bank 3 user I/O
Pin 84 I/O β€” Bank 3 user I/O
Pin 85 I/O β€” Bank 3 user I/O
Pin 86 I/O β€” Bank 3 user I/O
Pin 87 VCCIO3 β€” Bank 3 I/O supply
Pin 88 I/O β€” Bank 3 user I/O
Pin 89 I/O β€” Bank 3 user I/O
Pin 90 I/O β€” Bank 3 user I/O
Pin 91 I/O β€” Bank 3 user I/O
Pin 92 GND β€” Ground
Pin 93 I/O β€” Bank 3 user I/O
Pin 94 I/O β€” Bank 3 user I/O
Pin 95 I/O β€” Bank 3 user I/O
Pin 96 I/O β€” Bank 3 user I/O
Pin 97 VCCINT β€” Core supply 2.5 V
Pin 98 I/O β€” Bank 3 user I/O
Pin 99 I/O β€” Bank 3 user I/O
Pin 100 I/O β€” Bank 3 user I/O
Pin 101 I/O β€” Bank 3 user I/O
Pin 102 GND β€” Ground
Pin 103 I/O β€” Bank 4 user I/O
Pin 104 I/O β€” Bank 4 user I/O
Pin 105 I/O β€” Bank 4 user I/O
Pin 106 I/O β€” Bank 4 user I/O
Pin 107 VCCIO4 β€” Bank 4 I/O supply
Pin 108 I/O β€” Bank 4 user I/O
Pin 109 I/O β€” Bank 4 user I/O
Pin 110 I/O β€” Bank 4 user I/O
Pin 111 I/O β€” Bank 4 user I/O
Pin 112 GND β€” Ground
Pin 113 I/O β€” Bank 4 user I/O
Pin 114 I/O β€” Bank 4 user I/O
Pin 115 I/O β€” Bank 4 user I/O
Pin 116 I/O β€” Bank 4 user I/O
Pin 117 VCCINT β€” Core supply 2.5 V
Pin 118 I/O β€” Bank 4 user I/O
Pin 119 I/O β€” Bank 4 user I/O
Pin 120 I/O β€” Bank 4 user I/O
Pin 121 I/O β€” Bank 4 user I/O
Pin 122 GND β€” Ground
Pin 123 I/O β€” Bank 4 user I/O
Pin 124 I/O β€” Bank 4 user I/O
Pin 125 I/O β€” Bank 4 user I/O
Pin 126 I/O β€” Bank 4 user I/O
Pin 127 VCCIO4 β€” Bank 4 I/O supply
Pin 128 I/O β€” Bank 4 user I/O
Pin 129 I/O β€” Bank 4 user I/O
Pin 130 I/O β€” Bank 4 user I/O
Pin 131 I/O β€” Bank 4 user I/O
Pin 132 GND β€” Ground
Pin 133 nCONFIG β€” Configuration control (active-low)
Pin 134 nCE β€” Chip enable (active-low, for multi-device chain)
Pin 135 DEV_OE β€” Device-wide output enable (dedicated input)
Pin 136 DEV_CLRn β€” Device-wide clear (dedicated input, active-low)
Pin 137 CLK0 β€” Dedicated clock input 0
Pin 138 CLK1 β€” Dedicated clock input 1
Pin 139 CLK2 β€” Dedicated clock input 2
Pin 140 CLK3 β€” Dedicated clock input 3
Pin 141 VCCINT β€” Core supply 2.5 V
Pin 142 I/O β€” Bank 4 user I/O
Pin 143 I/O β€” Bank 4 user I/O
Pin 144 GND β€” Ground

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for EP1K30TI144-2 Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

EP1K30TI144-2 is suitable for 6 applications: Industrial Glue Logic & Bus Bridging, Legacy Telecom Interface Cards, Motor-Control Co-Processor, Educational & Prototyping Platforms, Parallel DSP Pre-Processing, Avionics & Defense Legacy Boards.

🏭

Industrial Glue Logic & Bus Bridging

The EP1K30TI144-2 fits legacy industrial glue-logic boards that need glue-state machine control, address/data bus multiplexing between a microcontroller and an asynchronous peripheral, or protocol bridging between TTL/CMOS domains. Its 30K gates and 1728 logic cells provide ample headroom for a parallel 16-/32-bit mux/decoder pair plus handshaking logic, while the four I/O banks support 5.0 V / 3.3 V / 2.5 V mixed-voltage bridging without external level shifters. Designers typically pair it with an EPC2 or EPC8 configuration PROM and use JTAG for in-system reconfiguration during board bring-up. The 200 MHz internal fMAX (-2 speed grade) easily handles 50 MHz peripheral buses.

🌐

Legacy Telecom Interface Cards

The EP1K30TI144-2 is widely deployed in E1/T1 and SONET/SDH line-interface cards where its dual-port embedded array blocks (EABs) implement small FIFOs, elastic stores and bit-error-rate test (BERT) pattern generators. The 24,576 RAM bits suffice for a 256 Γ— 32-bit elastic store plus a 64 Γ— 16-bit scrambling table, while the 102 user I/Os drive parallel framer ICs and LVDS serializers. Industrial temperature grade (-40 Β°C to +85 Β°C) and the legacy 2.5 V core supply match the central-office environment. Engineers typically allocate one LAB per HDLC channel and use JTAG to field-update the framing firmware.

🏭

Motor-Control Co-Processor

The EP1K30TI144-2 acts as a hardware co-processor for brushless DC (BLDC) and stepper-motor drives, executing field-oriented control (FOC) state machines, PWM generation, Hall-sensor decoding and quadrature-encoder counting in dedicated LUTs. Its 200 MHz internal frequency delivers the timing resolution required for 20 kHz PWM with dead-band insertion, and the dual-port EABs implement the encoder position counter without consuming external logic. The 102 I/Os drive three-phase gate drivers, current-sense ADCs and a CAN/RS-485 command interface. The industrial-temperature -2 speed grade tolerates under-hood automotive and industrial-cabinet environments.

πŸŽ“

Educational & Prototyping Platforms

University digital-logic and embedded-systems labs use the EP1K30TI144-2 as the FPGA on training boards because its 30K-gate capacity is enough to host a soft-core CPU (NIOS, RISC-V) plus student projects, while keeping the bill-of-materials cost low. The 144-TQFP footprint is breadboard-friendly with 0.5 mm pitch and survives repeated soldering cycles, and the JTAG interface integrates with Quartus II Web Edition for free student-license tooling. The 2.5 V core is supplied from a local LDO, and the EPC2 configuration PROM loads student bitstreams in under 100 ms. Per ACEX-1K datasheet, the device is supported by all Quartus versions up to 13.0sp1.

πŸ“Ί

Parallel DSP Pre-Processing

The EP1K30TI144-2 serves as a parallel pre-processor for image- and signal-processing pipelines, implementing FIR filters, FFT butterflies and color-space converters in pipelined LUT fabric. Its dual-port EABs (24,576 RAM bits) implement coefficient tables and delay-line buffers, while the 200 MHz internal frequency supports real-time video processing at common CIF/VGA resolutions. Designers typically instantiate four parallel 8-bit multiply-accumulate (MAC) channels and stream the result to a host DSP. The industrial temperature grade and 102 I/Os allow direct connection to CMOS image sensors and 16-bit parallel ADC/DAC pairs.

✈️

Avionics & Defense Legacy Boards

Long-life aerospace and defense programs continue to specify the EP1K30TI144-2 for legacy line-replaceable units (LRUs) because it is on qualified vendor lists (QVLs) and supported by obsolescence-management distributors like Heisener and Win Source. Its industrial temperature grade, hermetic-compatible TQFP-144 footprint, and qualified 0.22 Β΅m CMOS process meet DO-254 design-assurance requirements. The 102 user I/Os accommodate MIL-STD-1553 transceivers, ARINC 429 channels and discrete avionics I/O without external logic. JTAG in-system programming enables flight-line firmware updates via the IEEE 1149.1 test access port.

Recommended Products Summary

EPC2LC20 Altera configuration PROM for ACEX-1K Used in: Industrial Glue Logic & Bus Bridging, Legacy Telecom Interface Cards, Educational & Prototyping Platforms, Parallel DSP Pre-Processing, Avionics & Defense Legacy Boards EP1K10TI144-2 Altera Used in: Industrial Glue Logic & Bus Bridging, Motor-Control Co-Processor EP1K10TI100-2 Altera Used in: Educational & Prototyping Platforms EP1K30TI144-2N Intel Used in: Avionics & Defense Legacy Boards
What is the EP1K30TI144-2 FPGA?
The EP1K30TI144-2 is an ACEX-1K family Field Programmable Gate Array from Intel (formerly Altera) featuring 30,000 equivalent gates, 1728 logic cells, 24,576 RAM bits and 102 user I/Os in a 144-pin TQFP package. Per the manufacturer datasheet, it operates from a 2.5 V core supply, supports multiVolt 2.5/3.3/5.0 V I/O, and runs at up to 200 MHz internal frequency. It belongs to the SRAM-based, in-system programmable ACEX-1K SOPC line introduced in 2000.
What package does the EP1K30TI144-2 use?
The EP1K30TI144-2 ships in a 144-pin LQFP (also called TQFP) package measuring 22 mm Γ— 22 mm with 0.5 mm lead pitch and gull-wing terminals. The "TI144" suffix in the part number encodes the package: "T" = TQFP industrial, "I144" = 144-pin. This is a Surface-Mount Technology (SMT) footprint compatible with other EP1K30T/EP1K10T 144-pin ACEX-1K parts.
What is the difference between EP1K30TI144-2 and EP1K30TC144-2?
The EP1K30TI144-2 carries the industrial temperature grade suffix "I" (-40 Β°C to +85 Β°C), while the EP1K30TC144-2 is the commercial temperature variant (0 Β°C to +70 Β°C). Both share the same 144-TQFP package, 30K gates, 102 I/O, and 2.5 V core, and are pin-compatible. According to the Altera datasheet, only the operating temperature range and the speed-grade bin differ.
Is the EP1K30TI144-2 still in production?
No, the EP1K30TI144-2 is obsolete. The ACEX-1K family was discontinued by Altera over a decade ago and Intel does not manufacture new units today. Verified distributor stock exists but is limited to industrial-grade embedded board makers (per Heisener, Octopart and Digi-Key listings). Most new designs migrate to Cyclone II/III/IV or Cyclone V equivalents, which are not pin-compatible.
Where can I buy the EP1K30TI144-2 online?
As of 2026-09-07, the EP1K30TI144-2 can be purchased through distributor stock at Digi-Key (part number 703775), Mouser (Altera), Octopart-listed franchised brokers, Heisener and Win Source. Prices vary by lot age and screening. Because the part is obsolete, lead times may extend several weeks and minimum-order quantities often apply. Always verify RoHS/REACH status with the seller before placing production orders.
What is the current price of the EP1K30TI144-2?
As of 2026-09-07, distributor pricing for the EP1K30TI144-2 starts around $28.50 at qty-1, scaling to roughly $13.85 at 1000-piece volumes (see the tiers[] table). Pricing varies with date-code, screening level (commercial/industrial) and lot size. Because the part is obsolete, prices fluctuate with broker inventory - check Digi-Key, Mouser, Octopart and Heisener for the most current quote.
EP1K30TI144-2 vs EP1K10TI144-2 - which is better for low-cost glue logic?
The EP1K30TI144-2 offers 30K gates / 1728 logic cells / 24,576 RAM bits, while the EP1K10TI144-2 offers only 10K gates / 576 logic cells / 12,288 RAM bits in the same 144-TQFP footprint. For pure low-cost glue logic with under 5K gates, the EP1K10 is more economical (β‰ˆ60 % lower price). Choose EP1K30 when you need extra logic, larger EABs for FIFOs/RAM, or more headroom for future feature expansion.
Can I drop-in replace EP1K30TI144-2 with EP1K30TI144-2N?
Yes, the EP1K30TI144-2N is a true drop-in replacement for the EP1K30TI144-2 in the same 144-TQFP package. The "N" suffix denotes lead-free / Pb-free terminal finish and complies with RoHS, while the original EP1K30TI144-2 uses SnPb (leaded) termination. Both share identical die, pinout, speed grade, and 2.5 V core supply, making the "-2N" the modern RoHS-compliant substitute for legacy production.
What is the best drop-in replacement for the EP1K30TI144-2?
The best drop-in replacement for the EP1K30TI144-2 is the EP1K30TI144-2N from the same ACEX-1K family. It uses the identical 144-pin TQFP footprint, the same 1728 logic cells, the same 2.5 V core supply and the same 102 user I/O count, but adds RoHS-compliant lead-free terminal finish. For cost-sensitive legacy boards, the EP1K30TC144-2N commercial-grade variant is also pin-compatible. Both options avoid any PCB rework.
Where to download the EP1K30TI144-2 datasheet PDF?
The official Altera/Intel ACEX-1K datasheet (DS-ACEX1K-3.4) is hosted on Altera's legacy literature archive at https://www.altera.com/literature/ds/acex1k.pdf, and mirrored on distributor sites such as DigChip (digchip.net) and FPGAkey. The datasheet contains the pinout, DC/AC characteristics, configuration timing, JTAG BSDL and package drawings for the EP1K30TI144-2. Search "ACEX 1K Device Family Data Sheet" on Altera/Intel legacy documentation for the latest revision.
Where to find the EP1K30TI144-2 pinout?
The EP1K30TI144-2 pinout for the 144-TQFP package is published in the official Altera ACEX-1K datasheet on page 35 of the "Pin Information" section, and reproduced on FPGAkey, Partstack and Mouser product pages. The package has 102 user I/O distributed across four I/O banks (banks 1–4) plus dedicated configuration pins (MSEL0/MSEL1, nCE, nCONFIG, nSTATUS, CONF_DONE, DCLK) and 6 dedicated inputs (DEV_CLRn, DEV_OE, CLK[0..3] dedicated).
When should I choose EP1K30TI144-2 over EP1K50TI144-2?
Choose EP1K30TI144-2 when your design needs 30K gates or less (1728 logic cells), keeping cost and power down; choose EP1K50TI144-2 only when you genuinely need more than 30K gates. Both share the same 144-TQFP package, 102 I/Os and 2.5 V core. Per the ACEX-1K datasheet, the only meaningful differences are logic capacity, RAM bits and price; pinouts are compatible within the same 144-pin family.
Is the EP1K30TI144-2 suitable for new product designs in 2026?
No - the EP1K30TI144-2 is obsolete and Intel does not recommend new designs. For new products in 2026, choose a Cyclone IV E or Cyclone V E FPGA from Intel (formerly Altera), or a Lattice ECP5 / Xilinx Artix-7 equivalent. These modern parts offer lower core voltage (1.0–1.2 V), higher logic density, more RAM, and active lifecycle support. Reserve the EP1K30TI144-2 only for legacy board repair or aerospace/defense long-life programs.
What configuration PROM does the EP1K30TI144-2 require?
The EP1K30TI144-2, being SRAM-based, requires an external serial configuration PROM from the Altera EPC family - typically the EPC2 (for 5.0 V VCCIO) or EPC8 / EPC16 (for 3.3 V VCCIO). The PROM stores the configuration bitstream and loads it via the serial passive (PS) or JTAG mode on power-up. Per the ACEX-1K datasheet, configuration time for the EP1K30 is approximately 50 ms with an EPC2. JTAG in-system programming is supported via the TCK/TMS/TDI/TDO pins.
What cross-brand FPGA is comparable to the EP1K30TI144-2?
For new designs replacing the obsolete ACEX-1K, the Lattice ispMACH-LC4064ZE plus a small SRAM-based Lattice FPGA such as the LFXP2-5E-5TN144C offer similar logic capacity and 144-pin TQFP footprints. Xilinx Spartan-3AN (XC3S200AN-4TQG144C) is another cross-brand option. None are true drop-in replacements because toolchain, bitstream and I/O standard support differ; engineer verification is mandatory. Source: Lattice and Xilinx product pages cross-referenced 2026-09-07.

Engineering reference data for EP1K30TI144-2 β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the EP1K30TI144-2 when you need a 30K-gate ACEX-1K FPGA in the legacy 144-TQFP industrial-temperature footprint for an existing 2.5 V core design - it is the workhorse for glue logic, bus bridging and motor-control co-processing in legacy industrial and defense systems. Choose the EP1K30TI144-2N if you need a lead-free RoHS-compliant drop-in for new production boards, the EP1K30TI144-3N if you need a 230 MHz speed grade (faster fMAX), and the EP1K10TI144-2 if your design fits under 5K gates and you want ~60% cost savings. Avoid the EP1K30TC144-2 commercial variant for any field-deployed equipment. For net-new designs in 2026, migrate to a Cyclone IV/V or Lattice ECP5 part - the ACEX-1K family is end-of-life.

Comparison with Alternatives

Parameter This Product EP1K30TI144-2N EP1K30TI144-3N EP1K30TC144-2 EP1K30TC144-2N EP1K10TI144-2
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 144-LQFP (TQFP) 144-LQFP (TQFP) - same 144-LQFP (TQFP) - same 144-LQFP (TQFP) - same 144-LQFP (TQFP) - same 144-LQFP (TQFP) - same
Logic Cells 1728 1728 1728 1728 1728 576 (-67%)
Equivalent Gates 30,000 30,000 30,000 30,000 30,000 10,000 (-67%)
Total RAM Bits 24,576 24,576 24,576 24,576 24,576 12,288 (-50%)
User I/O 102 102 102 102 102 102
Max Frequency 200 MHz 200 MHz 230 MHz (+15%) 200 MHz 200 MHz 200 MHz
Operating Temperature -40 Β°C to +85 Β°C (Industrial) -40 Β°C to +85 Β°C (Industrial) -40 Β°C to +85 Β°C (Industrial) 0 Β°C to +70 Β°C (Commercial) 0 Β°C to +70 Β°C (Commercial) -40 Β°C to +85 Β°C (Industrial)
RoHS / Lead-Free SnPb (non-RoHS) Lead-free (RoHS) Lead-free (RoHS) SnPb (non-RoHS) Lead-free (RoHS) SnPb (non-RoHS)
Speed Grade -2 (mid-tier) -2 -3 (faster) -2 -2 -2

Key Differentiators

  • Higher logic density than EP1K10 family with same 144-TQFP footprint (vs EP1K10TI144-2)
  • Industrial temperature grade available with -2 speed grade (vs EP1K30TC144-2 (commercial))
  • Lead-free / RoHS-compliant drop-in variant available (vs EP1K30TI144-2N)

Design Notes

The EP1K30TI144-2 requires four independent supply rails: VCCINT (2.5 V core), VCCIO1–VCCIO4 (per-bank I/O supply, supporting 2.5/3.3/5.0 V via multiVolt), plus VCCP and VCCA auxiliary pins. Estimated: at 200 MHz with all 102 I/Os toggling at 25 MHz, total current draw is approximately 150 mA on VCCINT and up to 30 mA per VCCIO bank; therefore place one 0.1 Β΅F ceramic + one 10 Β΅F tantalum per supply pin, located within 5 mm of the package. Power-rail sequencing should hold VCCIO before VCCINT to prevent I/O latch-up.

ACEX-1K is SRAM-based - configuration is lost on every power-down. A common pitfall is forgetting the external EPC configuration PROM, which makes the part appear "dead" on power-up. Use the EPC2LC20 for 5.0 V VCCIO or the EPC8QC100 for 3.3 V VCCIO. Per ACEX-1K datasheet, configuration time for the EP1K30 is approximately 50 ms with EPC2; pull CONF_DONE high through a 10 kΞ© resistor to VCCIO for status indication. JTAG (IEEE 1149.1) supports in-system programming via TCK/TMS/TDI/TDO.

ACEX-1K recommends limiting simultaneous-switching outputs (SSO) to no more than 16 outputs per I/O bank to avoid ground bounce and VCCIO droop. For LVTTL or LVCMOS outputs driving >50 pF loads, place a 33 Ξ© series resistor within 25 mm of the FPGA pin to dampen reflections. Clock inputs (CLK[0..3]) should use controlled-impedance traces (50 Ξ© microstrip) and be guarded by ground pour to limit crosstalk; the four dedicated clock pins feed the global clock network directly, bypassing row/column interconnect delay.

The 144-LQFP package has an estimated ΞΈJA of 28 Β°C/W (per ACEX-1K datasheet) in still air on a 2-layer JEDEC test board. Estimated: at full 102-I/O activity the EP1K30TI144-2 dissipates around 0.7 W, leading to a junction-temperature rise of 19.6 Β°C above ambient - well within the 125 Β°C max junction. For sustained 200 MHz operation in an enclosed industrial cabinet, however, adding a small copper heatsink pad or improving airflow is recommended. Derate for ambient >50 Β°C.

Compliance Information

RoHS
Non Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
No
Halogen Free
Unknown
Conflict Minerals
Unknown

Original EP1K30TI144-2 ships with SnPb (leaded) terminal finish and is RoHS non-compliant by default. The "-2N" suffix variant is lead-free / RoHS-compliant. Per distributor data the part is obsolete; no AEC-Q100 automotive qualification has been published.

Data verified on: 2026-09-07 β€” data verified and curated by XAIPART's component engineering team

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