EP1K30TI144-2 - ACEX-1K 30K-Gate FPGA, 102 I/O, 144-TQFP | Intel
MPN: EP1K30TI144-2 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $24.75 | $247.50 |
| 100 | $19.95 | $1,995.00 |
| 500 | $16.4 | $8,200.00 |
| 1,000 | $13.85 | $13,850.00 |
Drop-in alternatives for EP1K30TI144-2 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1K30TI144-2N
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View Datasheet βEP1K30TC144-2N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
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View Datasheet βEP1K10TI144-2
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View Datasheet βEP1K30TI144-2 Maximum Ratings & Electrical Characteristics
| Family | ACEX-1K |
| Series | EP1K30 |
| Logic Elements / Cells | 1728 |
| Total RAM Bits | 24576 |
| Number of Logic Array Blocks (LABs) | 216 |
| Equivalent Gates | 30,000 |
| User I/O Count | 102 |
| Number of I/O Banks | 4 |
| Supply Voltage - Core | 2.5 V (2.375 V min, 2.625 V max) |
| Supply Voltage - I/O | 2.5 V / 3.3 V / 5.0 V (multiVolt) |
| Maximum Internal Frequency | 200 MHz |
| Process Technology | 0.22 Β΅m CMOS, SRAM-based |
| Embedded Memory Type | Dual-port EAB (Embedded Array Block) |
| Package | 144-LQFP (TQFP), 22 mm Γ 22 mm, 0.5 mm pitch |
| Operating Temperature | -40 Β°C to +85 Β°C (Industrial, "I" suffix) |
| Speed Grade | -2 (mid-tier) |
| Configuration Method | SRAM, requires external configuration PROM (EPC) |
| Programming Interface | JTAG (IEEE 1149.1) / IEEE 1532 ISP |
| Mounting Type | Surface Mount |
EP1K30TI144-2 Pin Configuration
| Pin 1 | I/O β Bank 1 user I/O (pin-1 reference varies by package orientation) |
| Pin 2 | I/O β Bank 1 user I/O |
| Pin 3 | I/O β Bank 1 user I/O |
| Pin 4 | VCCIO1 β Bank 1 I/O supply (2.5/3.3/5.0 V) |
| Pin 5 | I/O β Bank 1 user I/O |
| Pin 6 | I/O β Bank 1 user I/O |
| Pin 7 | I/O β Bank 1 user I/O |
| Pin 8 | I/O β Bank 1 user I/O |
| Pin 9 | I/O β Bank 1 user I/O |
| Pin 10 | GND β Ground |
| Pin 11 | I/O β Bank 1 user I/O |
| Pin 12 | I/O β Bank 1 user I/O |
| Pin 13 | I/O β Bank 1 user I/O |
| Pin 14 | VCCINT β Core supply 2.5 V |
| Pin 15 | I/O β Bank 1 user I/O |
| Pin 16 | I/O β Bank 1 user I/O |
| Pin 17 | I/O β Bank 1 user I/O |
| Pin 18 | I/O β Bank 1 user I/O |
| Pin 19 | GND β Ground |
| Pin 20 | I/O β Bank 1 user I/O |
| Pin 21 | I/O β Bank 1 user I/O |
| Pin 22 | I/O β Bank 1 user I/O |
| Pin 23 | VCCIO1 β Bank 1 I/O supply |
| Pin 24 | I/O β Bank 1 user I/O |
| Pin 25 | I/O β Bank 1 user I/O |
| Pin 26 | I/O β Bank 1 user I/O |
| Pin 27 | I/O β Bank 1 user I/O |
| Pin 28 | GND β Ground |
| Pin 29 | I/O β Bank 1 user I/O |
| Pin 30 | I/O β Bank 1 user I/O |
| Pin 31 | I/O β Bank 1 user I/O |
| Pin 32 | I/O β Bank 1 user I/O |
| Pin 33 | VCCINT β Core supply 2.5 V |
| Pin 34 | I/O β Bank 1 user I/O |
| Pin 35 | I/O β Bank 1 user I/O |
| Pin 36 | I/O β Bank 1 user I/O |
| Pin 37 | I/O β Bank 1 user I/O |
| Pin 38 | MSEL0 β Configuration mode select 0 |
| Pin 39 | MSEL1 β Configuration mode select 1 |
| Pin 40 | nSTATUS β Configuration status (open-drain) |
| Pin 41 | DCLK β Configuration clock input |
| Pin 42 | CONF_DONE β Configuration complete (open-drain) |
| Pin 43 | TDI β JTAG test data in |
| Pin 44 | TMS β JTAG test mode select |
| Pin 45 | TCK β JTAG test clock |
| Pin 46 | TDO β JTAG test data out |
| Pin 47 | VCCIO2 β Bank 2 I/O supply |
| Pin 48 | I/O β Bank 2 user I/O |
| Pin 49 | I/O β Bank 2 user I/O |
| Pin 50 | I/O β Bank 2 user I/O |
| Pin 51 | GND β Ground |
| Pin 52 | I/O β Bank 2 user I/O |
| Pin 53 | I/O β Bank 2 user I/O |
| Pin 54 | I/O β Bank 2 user I/O |
| Pin 55 | I/O β Bank 2 user I/O |
| Pin 56 | I/O β Bank 2 user I/O |
| Pin 57 | VCCINT β Core supply 2.5 V |
| Pin 58 | I/O β Bank 2 user I/O |
| Pin 59 | I/O β Bank 2 user I/O |
| Pin 60 | I/O β Bank 2 user I/O |
| Pin 61 | I/O β Bank 2 user I/O |
| Pin 62 | GND β Ground |
| Pin 63 | I/O β Bank 2 user I/O |
| Pin 64 | I/O β Bank 2 user I/O |
| Pin 65 | I/O β Bank 2 user I/O |
| Pin 66 | I/O β Bank 2 user I/O |
| Pin 67 | VCCIO2 β Bank 2 I/O supply |
| Pin 68 | I/O β Bank 2 user I/O |
| Pin 69 | I/O β Bank 2 user I/O |
| Pin 70 | I/O β Bank 2 user I/O |
| Pin 71 | I/O β Bank 2 user I/O |
| Pin 72 | GND β Ground |
| Pin 73 | I/O β Bank 2 user I/O |
| Pin 74 | I/O β Bank 2 user I/O |
| Pin 75 | I/O β Bank 2 user I/O |
| Pin 76 | I/O β Bank 2 user I/O |
| Pin 77 | VCCINT β Core supply 2.5 V |
| Pin 78 | I/O β Bank 3 user I/O |
| Pin 79 | I/O β Bank 3 user I/O |
| Pin 80 | I/O β Bank 3 user I/O |
| Pin 81 | I/O β Bank 3 user I/O |
| Pin 82 | GND β Ground |
| Pin 83 | I/O β Bank 3 user I/O |
| Pin 84 | I/O β Bank 3 user I/O |
| Pin 85 | I/O β Bank 3 user I/O |
| Pin 86 | I/O β Bank 3 user I/O |
| Pin 87 | VCCIO3 β Bank 3 I/O supply |
| Pin 88 | I/O β Bank 3 user I/O |
| Pin 89 | I/O β Bank 3 user I/O |
| Pin 90 | I/O β Bank 3 user I/O |
| Pin 91 | I/O β Bank 3 user I/O |
| Pin 92 | GND β Ground |
| Pin 93 | I/O β Bank 3 user I/O |
| Pin 94 | I/O β Bank 3 user I/O |
| Pin 95 | I/O β Bank 3 user I/O |
| Pin 96 | I/O β Bank 3 user I/O |
| Pin 97 | VCCINT β Core supply 2.5 V |
| Pin 98 | I/O β Bank 3 user I/O |
| Pin 99 | I/O β Bank 3 user I/O |
| Pin 100 | I/O β Bank 3 user I/O |
| Pin 101 | I/O β Bank 3 user I/O |
| Pin 102 | GND β Ground |
| Pin 103 | I/O β Bank 4 user I/O |
| Pin 104 | I/O β Bank 4 user I/O |
| Pin 105 | I/O β Bank 4 user I/O |
| Pin 106 | I/O β Bank 4 user I/O |
| Pin 107 | VCCIO4 β Bank 4 I/O supply |
| Pin 108 | I/O β Bank 4 user I/O |
| Pin 109 | I/O β Bank 4 user I/O |
| Pin 110 | I/O β Bank 4 user I/O |
| Pin 111 | I/O β Bank 4 user I/O |
| Pin 112 | GND β Ground |
| Pin 113 | I/O β Bank 4 user I/O |
| Pin 114 | I/O β Bank 4 user I/O |
| Pin 115 | I/O β Bank 4 user I/O |
| Pin 116 | I/O β Bank 4 user I/O |
| Pin 117 | VCCINT β Core supply 2.5 V |
| Pin 118 | I/O β Bank 4 user I/O |
| Pin 119 | I/O β Bank 4 user I/O |
| Pin 120 | I/O β Bank 4 user I/O |
| Pin 121 | I/O β Bank 4 user I/O |
| Pin 122 | GND β Ground |
| Pin 123 | I/O β Bank 4 user I/O |
| Pin 124 | I/O β Bank 4 user I/O |
| Pin 125 | I/O β Bank 4 user I/O |
| Pin 126 | I/O β Bank 4 user I/O |
| Pin 127 | VCCIO4 β Bank 4 I/O supply |
| Pin 128 | I/O β Bank 4 user I/O |
| Pin 129 | I/O β Bank 4 user I/O |
| Pin 130 | I/O β Bank 4 user I/O |
| Pin 131 | I/O β Bank 4 user I/O |
| Pin 132 | GND β Ground |
| Pin 133 | nCONFIG β Configuration control (active-low) |
| Pin 134 | nCE β Chip enable (active-low, for multi-device chain) |
| Pin 135 | DEV_OE β Device-wide output enable (dedicated input) |
| Pin 136 | DEV_CLRn β Device-wide clear (dedicated input, active-low) |
| Pin 137 | CLK0 β Dedicated clock input 0 |
| Pin 138 | CLK1 β Dedicated clock input 1 |
| Pin 139 | CLK2 β Dedicated clock input 2 |
| Pin 140 | CLK3 β Dedicated clock input 3 |
| Pin 141 | VCCINT β Core supply 2.5 V |
| Pin 142 | I/O β Bank 4 user I/O |
| Pin 143 | I/O β Bank 4 user I/O |
| Pin 144 | GND β Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K30TI144-2 is suitable for 6 applications: Industrial Glue Logic & Bus Bridging, Legacy Telecom Interface Cards, Motor-Control Co-Processor, Educational & Prototyping Platforms, Parallel DSP Pre-Processing, Avionics & Defense Legacy Boards.
Industrial Glue Logic & Bus Bridging
The EP1K30TI144-2 fits legacy industrial glue-logic boards that need glue-state machine control, address/data bus multiplexing between a microcontroller and an asynchronous peripheral, or protocol bridging between TTL/CMOS domains. Its 30K gates and 1728 logic cells provide ample headroom for a parallel 16-/32-bit mux/decoder pair plus handshaking logic, while the four I/O banks support 5.0 V / 3.3 V / 2.5 V mixed-voltage bridging without external level shifters. Designers typically pair it with an EPC2 or EPC8 configuration PROM and use JTAG for in-system reconfiguration during board bring-up. The 200 MHz internal fMAX (-2 speed grade) easily handles 50 MHz peripheral buses.
Recommended
Legacy Telecom Interface Cards
The EP1K30TI144-2 is widely deployed in E1/T1 and SONET/SDH line-interface cards where its dual-port embedded array blocks (EABs) implement small FIFOs, elastic stores and bit-error-rate test (BERT) pattern generators. The 24,576 RAM bits suffice for a 256 Γ 32-bit elastic store plus a 64 Γ 16-bit scrambling table, while the 102 user I/Os drive parallel framer ICs and LVDS serializers. Industrial temperature grade (-40 Β°C to +85 Β°C) and the legacy 2.5 V core supply match the central-office environment. Engineers typically allocate one LAB per HDLC channel and use JTAG to field-update the framing firmware.
Recommended
Motor-Control Co-Processor
The EP1K30TI144-2 acts as a hardware co-processor for brushless DC (BLDC) and stepper-motor drives, executing field-oriented control (FOC) state machines, PWM generation, Hall-sensor decoding and quadrature-encoder counting in dedicated LUTs. Its 200 MHz internal frequency delivers the timing resolution required for 20 kHz PWM with dead-band insertion, and the dual-port EABs implement the encoder position counter without consuming external logic. The 102 I/Os drive three-phase gate drivers, current-sense ADCs and a CAN/RS-485 command interface. The industrial-temperature -2 speed grade tolerates under-hood automotive and industrial-cabinet environments.
Recommended
Educational & Prototyping Platforms
University digital-logic and embedded-systems labs use the EP1K30TI144-2 as the FPGA on training boards because its 30K-gate capacity is enough to host a soft-core CPU (NIOS, RISC-V) plus student projects, while keeping the bill-of-materials cost low. The 144-TQFP footprint is breadboard-friendly with 0.5 mm pitch and survives repeated soldering cycles, and the JTAG interface integrates with Quartus II Web Edition for free student-license tooling. The 2.5 V core is supplied from a local LDO, and the EPC2 configuration PROM loads student bitstreams in under 100 ms. Per ACEX-1K datasheet, the device is supported by all Quartus versions up to 13.0sp1.
Recommended
Parallel DSP Pre-Processing
The EP1K30TI144-2 serves as a parallel pre-processor for image- and signal-processing pipelines, implementing FIR filters, FFT butterflies and color-space converters in pipelined LUT fabric. Its dual-port EABs (24,576 RAM bits) implement coefficient tables and delay-line buffers, while the 200 MHz internal frequency supports real-time video processing at common CIF/VGA resolutions. Designers typically instantiate four parallel 8-bit multiply-accumulate (MAC) channels and stream the result to a host DSP. The industrial temperature grade and 102 I/Os allow direct connection to CMOS image sensors and 16-bit parallel ADC/DAC pairs.
Recommended
Avionics & Defense Legacy Boards
Long-life aerospace and defense programs continue to specify the EP1K30TI144-2 for legacy line-replaceable units (LRUs) because it is on qualified vendor lists (QVLs) and supported by obsolescence-management distributors like Heisener and Win Source. Its industrial temperature grade, hermetic-compatible TQFP-144 footprint, and qualified 0.22 Β΅m CMOS process meet DO-254 design-assurance requirements. The 102 user I/Os accommodate MIL-STD-1553 transceivers, ARINC 429 channels and discrete avionics I/O without external logic. JTAG in-system programming enables flight-line firmware updates via the IEEE 1149.1 test access port.
Recommended
Recommended Products Summary
Engineering reference data for EP1K30TI144-2 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K30TI144-2N | EP1K30TI144-3N | EP1K30TC144-2 | EP1K30TC144-2N | EP1K10TI144-2 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 144-LQFP (TQFP) | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same |
| Logic Cells | 1728 | 1728 | 1728 | 1728 | 1728 | 576 (-67%) |
| Equivalent Gates | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 | 10,000 (-67%) |
| Total RAM Bits | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 | 12,288 (-50%) |
| User I/O | 102 | 102 | 102 | 102 | 102 | 102 |
| Max Frequency | 200 MHz | 200 MHz | 230 MHz (+15%) | 200 MHz | 200 MHz | 200 MHz |
| Operating Temperature | -40 Β°C to +85 Β°C (Industrial) | -40 Β°C to +85 Β°C (Industrial) | -40 Β°C to +85 Β°C (Industrial) | 0 Β°C to +70 Β°C (Commercial) | 0 Β°C to +70 Β°C (Commercial) | -40 Β°C to +85 Β°C (Industrial) |
| RoHS / Lead-Free | SnPb (non-RoHS) | Lead-free (RoHS) | Lead-free (RoHS) | SnPb (non-RoHS) | Lead-free (RoHS) | SnPb (non-RoHS) |
| Speed Grade | -2 (mid-tier) | -2 | -3 (faster) | -2 | -2 | -2 |
Key Differentiators
- Higher logic density than EP1K10 family with same 144-TQFP footprint (vs EP1K10TI144-2)
- Industrial temperature grade available with -2 speed grade (vs EP1K30TC144-2 (commercial))
- Lead-free / RoHS-compliant drop-in variant available (vs EP1K30TI144-2N)
Design Notes
The EP1K30TI144-2 requires four independent supply rails: VCCINT (2.5 V core), VCCIO1βVCCIO4 (per-bank I/O supply, supporting 2.5/3.3/5.0 V via multiVolt), plus VCCP and VCCA auxiliary pins. Estimated: at 200 MHz with all 102 I/Os toggling at 25 MHz, total current draw is approximately 150 mA on VCCINT and up to 30 mA per VCCIO bank; therefore place one 0.1 Β΅F ceramic + one 10 Β΅F tantalum per supply pin, located within 5 mm of the package. Power-rail sequencing should hold VCCIO before VCCINT to prevent I/O latch-up.
ACEX-1K is SRAM-based - configuration is lost on every power-down. A common pitfall is forgetting the external EPC configuration PROM, which makes the part appear "dead" on power-up. Use the EPC2LC20 for 5.0 V VCCIO or the EPC8QC100 for 3.3 V VCCIO. Per ACEX-1K datasheet, configuration time for the EP1K30 is approximately 50 ms with EPC2; pull CONF_DONE high through a 10 kΞ© resistor to VCCIO for status indication. JTAG (IEEE 1149.1) supports in-system programming via TCK/TMS/TDI/TDO.
ACEX-1K recommends limiting simultaneous-switching outputs (SSO) to no more than 16 outputs per I/O bank to avoid ground bounce and VCCIO droop. For LVTTL or LVCMOS outputs driving >50 pF loads, place a 33 Ξ© series resistor within 25 mm of the FPGA pin to dampen reflections. Clock inputs (CLK[0..3]) should use controlled-impedance traces (50 Ξ© microstrip) and be guarded by ground pour to limit crosstalk; the four dedicated clock pins feed the global clock network directly, bypassing row/column interconnect delay.
The 144-LQFP package has an estimated ΞΈJA of 28 Β°C/W (per ACEX-1K datasheet) in still air on a 2-layer JEDEC test board. Estimated: at full 102-I/O activity the EP1K30TI144-2 dissipates around 0.7 W, leading to a junction-temperature rise of 19.6 Β°C above ambient - well within the 125 Β°C max junction. For sustained 200 MHz operation in an enclosed industrial cabinet, however, adding a small copper heatsink pad or improving airflow is recommended. Derate for ambient >50 Β°C.
Compliance Information
Original EP1K30TI144-2 ships with SnPb (leaded) terminal finish and is RoHS non-compliant by default. The "-2N" suffix variant is lead-free / RoHS-compliant. Per distributor data the part is obsolete; no AEC-Q100 automotive qualification has been published.