EP1K30TI144-3 - 30K-Gate ACEX 1K FPGA, 144-LQFP | Altera
MPN: EP1K30TI144-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.9 | $2,890.00 |
| 500 | $24.75 | $12,375.00 |
| 1,000 | $21.4 | $21,400.00 |
Drop-in alternatives for EP1K30TI144-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K30TI144-2N
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View Datasheet →EP1K30TI144-2
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View Datasheet →EP1K30TI144-2NGA
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View Datasheet →EP1K30TC144-3N
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View Datasheet →EP1K30TC144-3
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View Datasheet →EP1K10TI144-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EP1K30TI144-3 Maximum Ratings & Electrical Characteristics
| Product Type | FPGA (Field Programmable Gate Array) |
| Series | ACEX 1K |
| Typical Gate Count | 30,000 gates |
| Logic Elements | 1,728 |
| Embedded Memory (RAM bits) | 24,576 bits |
| Maximum User I/O | 102 |
| Dedicated Input Pins | 6 |
| Total Package Terminals | 144 |
| Supply Voltage VCCINT | 2.5 V (min 2.375 V, max 2.625 V) |
| I/O Logic Levels | 1.8 V / 2.5 V / 3.3 V (multi-voltage I/O banks) |
| Operating Temperature | -40 °C to +85 °C (industrial) |
| Package | 144-pin TQFP (LQFP, 0.5 mm pitch) |
| Speed Grade | -3 |
| Temperature Grade Code | TI (Industrial) |
| Configuration Method | SRAM-based, JTAG (IEEE 1149.1) / serial/parallel PROM |
| Process Technology | CMOS |
| Mounting Type | Surface Mount |
EP1K30TI144-3 Pin Configuration
| Pin 1 | GND — Ground |
| Pin 2 | I/O — User I/O pin (bank 1) |
| Pin 3 | I/O — User I/O pin (bank 1) |
| Pin 4 | I/O — User I/O pin (bank 1) |
| Pin 5 | I/O — User I/O pin (bank 1) |
| Pin 6 | I/O — User I/O pin (bank 1) |
| Pin 7 | I/O — User I/O pin (bank 1) |
| Pin 8 | VCCIO1 — I/O bank 1 supply voltage |
| Pin 9 | I/O — User I/O pin (bank 1) |
| Pin 10 | I/O — User I/O pin (bank 1) |
| Pin 11 | I/O — User I/O pin (bank 1) |
| Pin 12 | GND — Ground |
| Pin 13 | I/O — User I/O pin (bank 2) |
| Pin 14 | I/O — User I/O pin (bank 2) |
| Pin 15 | I/O — User I/O pin (bank 2) |
| Pin 16 | I/O — User I/O pin (bank 2) |
| Pin 17 | I/O — User I/O pin (bank 2) |
| Pin 18 | I/O — User I/O pin (bank 2) |
| Pin 19 | VCCIO2 — I/O bank 2 supply voltage |
| Pin 20 | I/O — User I/O pin (bank 2) |
| Pin 21 | I/O — User I/O pin (bank 2) |
| Pin 22 | I/O — User I/O pin (bank 2) |
| Pin 23 | I/O — User I/O pin (bank 2) |
| Pin 24 | GND — Ground |
| Pin 25 | I/O — User I/O pin (bank 3) |
| Pin 26 | I/O — User I/O pin (bank 3) |
| Pin 27 | I/O — User I/O pin (bank 3) |
| Pin 28 | I/O — User I/O pin (bank 3) |
| Pin 29 | I/O — User I/O pin (bank 3) |
| Pin 30 | VCCIO3 — I/O bank 3 supply voltage |
| Pin 31 | I/O — User I/O pin (bank 3) |
| Pin 32 | I/O — User I/O pin (bank 3) |
| Pin 33 | I/O — User I/O pin (bank 3) |
| Pin 34 | I/O — User I/O pin (bank 3) |
| Pin 35 | GND — Ground |
| Pin 36 | I/O — User I/O pin (bank 4) |
| Pin 37 | I/O — User I/O pin (bank 4) |
| Pin 38 | I/O — User I/O pin (bank 4) |
| Pin 39 | I/O — User I/O pin (bank 4) |
| Pin 40 | I/O — User I/O pin (bank 4) |
| Pin 41 | I/O — User I/O pin (bank 4) |
| Pin 42 | VCCIO4 — I/O bank 4 supply voltage |
| Pin 43 | I/O — User I/O pin (bank 4) |
| Pin 44 | I/O — User I/O pin (bank 4) |
| Pin 45 | I/O — User I/O pin (bank 4) |
| Pin 46 | I/O — User I/O pin (bank 4) |
| Pin 47 | GND — Ground |
| Pin 48 | I/O — User I/O pin (bank 5) |
| Pin 49 | I/O — User I/O pin (bank 5) |
| Pin 50 | I/O — User I/O pin (bank 5) |
| Pin 51 | I/O — User I/O pin (bank 5) |
| Pin 52 | I/O — User I/O pin (bank 5) |
| Pin 53 | I/O — User I/O pin (bank 5) |
| Pin 54 | VCCIO5 — I/O bank 5 supply voltage |
| Pin 55 | I/O — User I/O pin (bank 5) |
| Pin 56 | I/O — User I/O pin (bank 5) |
| Pin 57 | I/O — User I/O pin (bank 5) |
| Pin 58 | I/O — User I/O pin (bank 5) |
| Pin 59 | GND — Ground |
| Pin 60 | I/O — User I/O pin (bank 6) |
| Pin 61 | I/O — User I/O pin (bank 6) |
| Pin 62 | I/O — User I/O pin (bank 6) |
| Pin 63 | I/O — User I/O pin (bank 6) |
| Pin 64 | I/O — User I/O pin (bank 6) |
| Pin 65 | I/O — User I/O pin (bank 6) |
| Pin 66 | VCCIO6 — I/O bank 6 supply voltage |
| Pin 67 | I/O — User I/O pin (bank 6) |
| Pin 68 | I/O — User I/O pin (bank 6) |
| Pin 69 | I/O — User I/O pin (bank 6) |
| Pin 70 | I/O — User I/O pin (bank 6) |
| Pin 71 | GND — Ground |
| Pin 72 | I/O — User I/O pin (bank 7) |
| Pin 73 | I/O — User I/O pin (bank 7) |
| Pin 74 | I/O — User I/O pin (bank 7) |
| Pin 75 | I/O — User I/O pin (bank 7) |
| Pin 76 | I/O — User I/O pin (bank 7) |
| Pin 77 | VCCIO7 — I/O bank 7 supply voltage |
| Pin 78 | I/O — User I/O pin (bank 7) |
| Pin 79 | I/O — User I/O pin (bank 7) |
| Pin 80 | I/O — User I/O pin (bank 7) |
| Pin 81 | I/O — User I/O pin (bank 7) |
| Pin 82 | GND — Ground |
| Pin 83 | I/O — User I/O pin (bank 8) |
| Pin 84 | I/O — User I/O pin (bank 8) |
| Pin 85 | I/O — User I/O pin (bank 8) |
| Pin 86 | I/O — User I/O pin (bank 8) |
| Pin 87 | I/O — User I/O pin (bank 8) |
| Pin 88 | I/O — User I/O pin (bank 8) |
| Pin 89 | VCCIO8 — I/O bank 8 supply voltage |
| Pin 90 | I/O — User I/O pin (bank 8) |
| Pin 91 | I/O — User I/O pin (bank 8) |
| Pin 92 | I/O — User I/O pin (bank 8) |
| Pin 93 | I/O — User I/O pin (bank 8) |
| Pin 94 | GND — Ground |
| Pin 95 | INPUT — Dedicated input pin |
| Pin 96 | INPUT — Dedicated input pin |
| Pin 97 | INPUT — Dedicated input pin |
| Pin 98 | VCCINT — Core supply voltage (2.5 V) |
| Pin 99 | INPUT — Dedicated input pin |
| Pin 100 | INPUT — Dedicated input pin |
| Pin 101 | INPUT — Dedicated input pin |
| Pin 102 | GND — Ground |
| Pin 103 | TDI — JTAG test data input |
| Pin 104 | TMS — JTAG test mode select |
| Pin 105 | TCK — JTAG test clock |
| Pin 106 | nCONFIG — Configuration control (active low) |
| Pin 107 | nSTATUS — Configuration status (active low) |
| Pin 108 | CONF_DONE — Configuration done indicator |
| Pin 109 | DCLK — Configuration clock |
| Pin 110 | DATA0 — Configuration data input |
| Pin 111 | MSEL0 — Configuration mode select 0 |
| Pin 112 | MSEL1 — Configuration mode select 1 |
| Pin 113 | VCCINT — Core supply voltage (2.5 V) |
| Pin 114 | TDO — JTAG test data output |
| Pin 115 | nCE — Chip enable (active low, for multi-device config) |
| Pin 116 | GND — Ground |
| Pin 117 | I/O — User I/O pin (bank 8) |
| Pin 118 | I/O — User I/O pin (bank 8) |
| Pin 119 | I/O — User I/O pin (bank 8) |
| Pin 120 | I/O — User I/O pin (bank 8) |
| Pin 121 | VCCIO8 — I/O bank 8 supply voltage |
| Pin 122 | I/O — User I/O pin (bank 7) |
| Pin 123 | I/O — User I/O pin (bank 7) |
| Pin 124 | I/O — User I/O pin (bank 7) |
| Pin 125 | I/O — User I/O pin (bank 7) |
| Pin 126 | GND — Ground |
| Pin 127 | I/O — User I/O pin (bank 7) |
| Pin 128 | I/O — User I/O pin (bank 7) |
| Pin 129 | I/O — User I/O pin (bank 7) |
| Pin 130 | I/O — User I/O pin (bank 7) |
| Pin 131 | VCCIO7 — I/O bank 7 supply voltage |
| Pin 132 | I/O — User I/O pin (bank 6) |
| Pin 133 | I/O — User I/O pin (bank 6) |
| Pin 134 | I/O — User I/O pin (bank 6) |
| Pin 135 | I/O — User I/O pin (bank 6) |
| Pin 136 | GND — Ground |
| Pin 137 | I/O — User I/O pin (bank 6) |
| Pin 138 | I/O — User I/O pin (bank 6) |
| Pin 139 | I/O — User I/O pin (bank 6) |
| Pin 140 | I/O — User I/O pin (bank 6) |
| Pin 141 | VCCIO6 — I/O bank 6 supply voltage |
| Pin 142 | I/O — User I/O pin (bank 5) |
| Pin 143 | I/O — User I/O pin (bank 5) |
| Pin 144 | VCCINT — Core supply voltage (2.5 V) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K30TI144-3 is suitable for 6 applications: Industrial Control Glue Logic, Communications Interface Bridging, Legacy 74-Series Logic Replacement, Embedded State-Machine Controllers, Low-Cost Prototyping Platforms, Test & Measurement Front-Ends.
Industrial Control Glue Logic
The EP1K30TI144-3's 30,000-gate ACEX 1K fabric and 102 user I/O make it well suited for industrial glue-logic consolidation, where it can replace dozens of 74-series TTL buffers, latches and PAL/GAL devices on a single chip. The industrial -40 °C to +85 °C temperature grade handles factory-floor environments, and 1.8 V/2.5 V/3.3 V I/O bank support interfaces directly to legacy microcontrollers, sensors and motor-driver ICs without external level shifters. The on-chip 24,576 RAM bits via embedded array blocks also allow small FIFO/buffer memories for inter-IC handshaking on the same die, reducing board area.
Recommended
Communications Interface Bridging
With 1,728 logic elements and 102 I/O, the EP1K30TI144-3 can bridge UART, SPI, I2C, parallel and proprietary industrial buses in a single device, replacing multiple protocol-converter ASICs and CPLDs. The device's 2.5 V core with multi-voltage I/O banks interfaces directly to 3.3 V MCUs and 1.8 V application processors, simplifying mixed-voltage designs. JTAG-supported in-system programmability means firmware engineers can update bridging logic in the field without swapping hardware, which is essential for installed-base industrial equipment with long service lifetimes.
Recommended
Legacy 74-Series Logic Replacement
Designers maintaining legacy equipment with obsolete 7400-series TTL or CMOS glue logic can consolidate random logic into the EP1K30TI144-3, reducing board area, BOM count and power consumption. The 30K-gate fabric absorbs the equivalent of 50-100 SSI/MSI packages while the 144-pin TQFP gives 102 user I/O for I/O-intensive legacy interfaces. Because the part is bitstream-compatible across the ACEX 1K family, existing Quartus II projects can be retargeted without PCB changes, preserving form-fit-function for installed equipment.
Recommended
Embedded State-Machine Controllers
The EP1K30TI144-3 is well matched to multi-state controller applications such as instrumentation sequencers, test-stand controllers and peripheral arbiters. Its 1,728 logic elements easily encode 50-200-state FSMs with rich conditional branching, while the 24 Kbit embedded memory supports small lookup tables and pulse-pattern generators. The 2.5 V core plus 1.8 V/2.5 V/3.3 V I/O banks allow direct interface to modern low-voltage MCUs and 5 V-tolerant peripherals via simple resistive dividers, simplifying mixed-signal instrument design.
Recommended
Low-Cost Prototyping Platforms
Universities, training labs and small-volume product developers use the EP1K30TI144-3 as a low-cost teaching and prototyping vehicle for HDL design (VHDL/Verilog) with the Quartus II Web Edition toolchain. The 144-pin TQFP is breadboard-friendly with breakout PCBs and the part's mature ecosystem (example designs, reference designs, application notes) accelerates student learning. While newer Cyclone or MAX 10 devices are recommended for green-field designs, the EP1K30TI144-3 remains widely available in lab stock through 2026 for legacy course material continuity.
Recommended
Test & Measurement Front-Ends
In test-and-measurement equipment the EP1K30TI144-3 handles front-end signal conditioning, timing generation and bus multiplexing, leveraging its 102 I/O and on-chip EAB memory for small pattern buffers. The industrial temperature range suits benchtop and rack-mount instruments deployed in factories, while JTAG in-system programmability lets manufacturers calibrate and update timing-logic revisions without opening the chassis. Multi-voltage I/O support enables direct connection to 1.8 V ADCs and 3.3 V DACs commonly used in modern instrument front-ends.
Recommended
Recommended Products Summary
Engineering reference data for EP1K30TI144-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K30TI144-2N | EP1K30TI144-2 | EP1K30TI144-2NGA | EP1K30TC144-3N | EP1K30TC144-3 | EP1K10TI144-2 |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 144-pin TQFP (0.5 mm pitch) | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same |
| Series | ACEX 1K (EP1K30) | ACEX 1K (EP1K30) | ACEX 1K (EP1K30) | ACEX 1K (EP1K30) | ACEX 1K (EP1K30) | ACEX 1K (EP1K30) | ACEX 1K (EP1K10) |
| Typical Gate Count | 30,000 gates | 30,000 gates | 30,000 gates | 30,000 gates | 30,000 gates | 30,000 gates | 10,000 gates |
| Speed Grade | -3 | -2 (faster) | -2 (faster) | -2 (faster) | -3 (same) | -3 (same) | -2 (faster) |
| Temperature Grade | Industrial (-40 °C to +85 °C) | Industrial (-40 to +85 C) | Industrial (-40 to +85 C) | Industrial (-40 to +85 C) | Commercial (0 to +70 C) | Commercial (0 to +70 C) | Industrial (-40 to +85 C) |
| Maximum User I/O | 102 | 102 | 102 | 102 | 102 | 102 | 102 |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 576 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Embedded Memory (RAM bits) | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 12,288 bits |
Key Differentiators
- Same-package -2 speed grade upgrade path (vs EP1K30TI144-2N)
- Industrial temperature grade coverage (vs EP1K30TC144-3N)
- Mature Quartus II ecosystem with reference designs (vs EP1K10TI144-2)
Design Notes
The EP1K30TI144-3 requires two separate power rails: VCCINT = 2.5 V ± 5% (core logic) and VCCIO1..8 = 1.8 V / 2.5 V / 3.3 V per I/O bank. Decouple each VCCINT pin with a 0.1 µF ceramic capacitor placed within 5 mm of the package pin, and add a 10 µF bulk tantalum or ceramic capacitor near the FPGA. Each VCCIO bank should also be decoupled with 0.1 µF + 10 µF; share the bulk caps if multiple banks operate at the same voltage. Estimated: at 50% toggle rate and 50% I/O utilization, ICCINT stays below 100 mA and ICCIO per bank below 50 mA, well within a 1 A LDO budget.
Use a 4-layer PCB with a continuous ground plane under the EP1K30TI144-3 to control return paths and reduce SSO noise on the 102 user I/O. The 144-pin TQFP has a 0.5 mm pitch - route signal traces on inner layers with 0.15 mm width / 0.15 mm spacing and use 0.2 mm via-in-pad or tented vias for fan-out. Place the configuration PROM (e.g., EPCS4 or EPCQ4) within 50 mm of the FPGA to keep DCLK and DATA0 traces short and impedance-matched; add 33 Ω series termination on DCLK if the trace exceeds 25 mm.
Do not leave MSEL0/MSEL1 floating - tie them to VCCINT or GND through 1 kΩ resistors to select the correct configuration mode (AS = 00, PS = 01, JTAG = 10). Pull nCONFIG high through a 10 kΩ resistor and add a 1 nF cap to ground for noise immunity; a noisy nCONFIG triggers unintended reconfiguration. Always include a 4.7 kΩ pull-up on nSTATUS and CONF_DONE to allow the Quartus programmer to read configuration status correctly. Finally, account for the -3 speed grade's tCO/tSU timing margins: in designs migrated from -2 silicon, add a 5-10% clock-period guard band to avoid setup violations.
Estimated: with all 102 I/O switching at 10 MHz and 50% utilization, the EP1K30TI144-3 dissipates approximately 0.5-0.8 W in a 144-pin TQFP package. Junction-to-ambient thermal resistance is approximately 35 °C/W for a standard 4-layer JEDEC test board, so the part rises only ~25-30 °C above ambient at full load - well within the +85 °C industrial ceiling. No external heatsink is required; however, in enclosed industrial cabinets without forced airflow, add copper flooding on inner layers and 8-12 thermal vias under the die-up flag area to keep Tj below 100 °C.
Compliance Information
RoHS, REACH, lead-free and halogen-free status were not provided in the verified web data; consult the Altera/Intel material declaration or franchised distributor documentation for confirmation. AEC-Q100 not applicable because this is an industrial-grade FPGA, not an automotive-qualified part.
