EP1SGX25FG672C7 - Stratix GX FPGA, 25K LE, 672-BGA | Altera
Артикул: EP1SGX25FG672C7 ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $168 | $1.680,00 |
| 100 | $149.5 | $14.950,00 |
| 500 | $132 | $66.000,00 |
| 1.000 | $118 | $118.000,00 |
EP1SGX25FG672C7 Обзор
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic functionality is defined by user configuration rather than fixed at the factory. Stratix GX FPGAs sit at the top of Altera's high-performance hierarchy (Stratix GX -> Stratix series -> high-density FPGA -> programmable logic device -> integrated circuit), combining LUT-based fabric with embedded 18x18 multipliers, M4K/M-RAM memory blocks, PLLs, and hardened transceivers to accelerate both logic and serial-protocol workloads.
Key features of the EP1SGX25FG672C7 include 455 user I/O pins, embedded 3.125 Gbps multi-gigabit transceivers, dedicated DSP blocks, four PLLs, and 25660 logic elements. The device is built on a 1.5 V core with 0.13-micron process technology, and the speed grade 7 indicates the slowest commercial speed bin. Its 672-pin FineLine BGA package offers high I/O density while keeping board-routing complexity manageable for prototyping and production.
Typical applications include high-speed serial interface bridging (PCI Express, Serial RapidIO, Fibre Channel), baseband and channel-card processing in wireless infrastructure, medical imaging front-ends, and high-throughput storage and networking line cards. The integrated transceivers eliminate the need for external PHY chips in many designs, reducing BOM cost and board area.
When designing with this FPGA, ensure your power-sequencing network follows the Stratix GX PowerPlay guidelines and that JTAG, MSEL configuration pins, and decoupling are placed per the pin-out guidelines. Confirm Quartus II version support for this device revision before starting firmware development.
Аналоги без доработки для EP1SGX25FG672C7 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP1SGX25FG672C7 (тот же форм-фактор и посадочное место) — отличается по Operating Temperature, Package, Speed Grade, Process Technology, Family.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP1SGX25FG1020C4
✅ Прямая замена✓ В наличии
$195 / шт.
Открыть даташит →EP1SGX25FF1020C5N
✅ Прямая замена✓ В наличии
$1580 / шт.
Открыть даташит →EP1SGX25FF800C5N
✅ Прямая замена✓ В наличии
$1175 / шт.
Открыть даташит →EP1SGX25DF672C7
✅ Прямая замена✓ В наличии
$125.4 / шт.
Открыть даташит →EP1SGX25CF672C7
✅ Прямая замена✓ В наличии
$340 / шт.
Открыть даташит →EP1SGX25F672C7
✅ Прямая замена✓ В наличии
$210 / шт.
Открыть даташит →EP1SGX25FG672C7 Максимальные параметры и электрические характеристики
| Family | Stratix GX |
| Series | Stratix |
| Logic Elements (LE) | 25,660 |
| Total RAM Bits | 1,944,576 bits |
| User I/O Pins | 455 |
| Embedded Transceivers | Yes (multi-gigabit, up to 3.125 Gbps) |
| PLLs | 4 |
| Global Clocks | 16 |
| Корпус | 672-pin FineLine BGA (FG672) |
| Рабочая температура | 0C to +85C (commercial, speed grade C7) |
| Core Voltage | 1.5 V |
| Process Technology | 0.13 micron |
| Тип монтажа | Surface Mount |
| Speed Grade | 7 (commercial) |
| Configuration Method | SRAM-based, JTAG/AS/PS supported |
| Статус жизненного цикла | Obsolete (per Altera/Intel product discontinuance notices) |
Руководство по цоколевке EP1SGX25FG672C7 в корпусе 672-pin fineline bga (fg672)
Цоколевка для EP1SGX25FG672C7 (корпус 672-pin fineline bga (fg672)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для EP1SGX25FG672C7.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
EP1SGX25FG672C7 подходит для 6 применениеs: PCI Express Endpoint Card, Serial RapidIO Switch / Bridge, Wireless Baseband Channel Card, Medical Imaging Front-End, Fibre Channel Host Bus Adapter, Industrial Camera / Image Processing.
PCI Express Endpoint Card
The EP1SGX25FG672C7 is well-suited for PCI Express endpoint designs because its integrated multi-gigabit transceivers operate up to 3.125 Gbps, matching PCIe Gen1 signaling rates. The Altera PCIe hard-IP core maps cleanly to this device, providing x1/x4/x8 link training, transaction layer, and DMA engines. With 25,660 logic elements and 1,944,576 RAM bits, the device has ample fabric for application logic while leaving dedicated transceiver channels for the SERDES. Engineers use it in test cards, instrumentation endpoints, and embedded PCIe peripherals.
Рекомендуется
Serial RapidIO Switch / Bridge
The EP1SGX25FG672C7 supports Serial RapidIO (SRIO) physical interfaces through its transceivers and SRIO IP core, making it useful for DSP farm interconnects, baseband card-to-card links, and backplane bridging. With 4 PLLs and multiple transceiver channels, multiple SRIO lanes can be instantiated on a single device. The 25,660 LE fabric comfortably accommodates the protocol stack plus payload processing. This part is widely deployed in legacy telecom and aerospace control systems.
Рекомендуется
Wireless Baseband Channel Card
In wireless base station channel cards, the EP1SGX25FG672C7 provides DSP blocks and embedded multipliers for baseband processing (FFT, FEC, equalization), plus high-speed transceivers for CPRI/OBSAI links to the radio unit. The 455 user I/O pins allow interfacing with ADCs, DACs, and DSP coprocessors. Operating at 1.5 V core with commercial 0-85C junction range, it suits indoor BTS chassis. Designers leverage Altera's DSP Builder and FIR compiler IP for rapid implementation.
Рекомендуется
Medical Imaging Front-End
The EP1SGX25FG672C7 fits medical imaging front-ends (ultrasound beamformers, MRI digitizers) because its parallel fabric processes high-rate ADC data while transceivers stream processed channels downstream. The 1,944,576 bits of block RAM hold line/frame buffers without external SRAM. Operating temperature 0-85C matches hospital equipment environments. Legacy ultrasound and imaging OEMs still maintain firmware for this family due to its deterministic latency and validated IP cores.
Рекомендуется
Fibre Channel Host Bus Adapter
The EP1SGX25FG672C7 supports 1G/2G Fibre Channel through its embedded transceivers, enabling 1-2 Gbps Fibre Channel HBAs used in storage area networks. Hard or soft FC IP cores implement the FC protocol stack, while the FPGA fabric handles DMA, command queuing, and host interface logic (PCI or local bus). With 25,660 LEs, multiple FC ports can be supported on a single device. Production Fibre Channel HBA designs used this part extensively before ASIC integration.
Рекомендуется
Industrial Camera / Image Processing
The EP1SGX25FG672C7 is used in high-speed industrial machine-vision cameras where multi-gigabit transceivers stream uncompressed video (CoaXPress, Camera Link HS) and the 25,660 LEs run real-time pixel processing pipelines. The 672-ball BGA provides 455 user I/O for sensor interfaces, DDR memory controllers, and Ethernet MACs. Its commercial temperature grade and 1.5 V core suit fan-cooled factory-floor enclosures. Designers integrate Altera's VIP and video IP suites for low-latency frame processing.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP1SGX25FG672C7 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP1SGX25FG1020C4 | EP1SGX25FF1020C5N | EP1SGX25FF800C5N | EP1SGX25DF672C7 | EP1SGX25CF672C7 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | FG672 (FineLine BGA-672) | FG1020 (FBGA-1020) | FF1020 (FBGA-1020) | FF800 (FBGA-800) | DF672 (BGA-672) | CF672 (BBGA-672) |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Speed Grade | 7 | 4 | 5 | 5 | 7 | 7 |
| Transceiver Speed | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Ключевые отличия
- Higher transceiver count than EP1SGX10 family (против EP1SGX10CF672C7)
- More user I/O than EP1S25 / EP1S10 families (против EP1S25F672C7)
- Stratix GX variant adds embedded SERDES to base Stratix (против EP1S40F1020C7)
Заметки по проектированию
Stratix GX devices require multiple supply rails: 1.5 V VCCINT for core logic, 3.3 V VCCIO for I/O banks, and dedicated PLL analog supplies (VCC_PLL) that must be filtered and decoupled per the Stratix GX handbook. Power sequencing matters - VCCINT must ramp before or simultaneously with VCCIO to avoid latch-up. Use Altera's PowerPlay Early Power Estimator (EPE) before PCB layout to size regulators correctly.
Route transceiver channels with controlled-impedance differential pairs (100 ohm diff typical) and keep via count minimal. Decoupling capacitors (0.1 uF, 0.01 uF, 10 uF) must be placed within 100 mils of each power pin. For 672-ball FineLine BGA, fan-out uses microvias or dog-bone pattern; ensure your fab supports the BGA pitch (typically 1.0 mm) used in the FG672 package.
Do not leave MSEL[2:0] floating - tie them to VCCIO or GND via 1 kohm to select configuration mode (AS, PS, JTAG). Unused user I/O pins should be left floating or driven, but not pulled - per the Stratix GX handbook. Confirmed JTAG pin (TCK, TMS, TDI, TDO) routing must avoid crosstalk from switching I/O; a 33 ohm series resistor on TCK is recommended.
Estimated: at full transceiver utilization (all channels active at 3.125 Gbps with toggling logic at 200 MHz), the EP1SGX25FG672C7 dissipates approximately 5-8 W. The FineLine BGA package provides thermal resistance around 15-20 C/W with proper PCB thermal via array under the exposed pad - design with at least 6 thermal vias per bank for adequate heat spreading.
Информация о соответствии
RoHS/REACH status not explicitly listed in verified web data; Altera-era Stratix GX family generally pre-dates strict RoHS mandates, so many variants are non-compliant. Conflict-minerals compliance inferred from Intel/Altera standard CMRT filings.
