EP1SGX25FG1020C4 - Stratix GX FPGA, 25K LE, 1020-pin FBGA | Intel
MPN: EP1SGX25FG1020C4 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 500 | $218.75 | $109,375.00 |
| 1,000 | $195 | $195,000.00 |
Drop-in alternatives for EP1SGX25FG1020C4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX25DF1020C5
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EP1SGX25DF1020C6
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View Datasheet →EP1SGX25DF1020C7
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View Datasheet →EP1SGX25FF1020C5
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$171 / Unit
View Datasheet →EP1SGX25FF1020C6
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$135 / Unit
View Datasheet →EP1SGX25FF1020C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1280 / Unit
View Datasheet →EP1SGX25CF1020C5
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1SGX25FG1020C4 Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 25,560 LE |
| Embedded Memory | 1,920 Kbits |
| Total RAM Blocks | M-RAM + M4K blocks (per Stratix GX architecture) |
| DSP Blocks | 10 (DSP blocks) |
| Embedded Transceivers | 4 channels |
| Transceiver Data Rate | 600 Mbps to 3.125 Gbps |
| Core Voltage | 1.5 V (typical) |
| Package | 1020-pin FineLine BGA (FBGA), 1.27 mm pitch |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| Speed Grade | C4 |
| Configuration Modes | PS, PPS, PPA, JTAG |
| Process Technology | 0.13 µm CMOS, SRAM-based |
| Configuration Device Required | Yes — external (EPC16 / EPCS recommended) |
| Lifecycle Status | Obsolete / Last-time-buy from authorized distributors |
EP1SGX25FG1020C4 1020-pin fineline bga (fbga), 1.27 mm pitch Pin Configuration Guide
Complete pinout information for EP1SGX25FG1020C4 (1020-pin fineline bga (fbga), 1.27 mm pitch package) with [DATA_NEEDED: exact pin count from datasheet] pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25FG1020C4.
Refer to the datasheet for full pin configuration.
Estimated pin count: [DATA_NEEDED: exact pin count from datasheet] pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25FG1020C4 is suitable for 6 applications: 10 Gigabit Ethernet MAC Interface, PCI Express Endpoint Card, Wireless Base Station Baseband Processing, Software Defined Radio (SDR) Prototyping, Video Broadcast Routing and Processing, Industrial High-Speed Data Acquisition.
10 Gigabit Ethernet MAC Interface
The EP1SGX25FG1020C4 fits 10 Gigabit Ethernet MAC implementations because its 4 embedded multi-gigabit transceivers natively support XAUI (4×3.125 Gbps lanes) with built-in 8B/10B encoding, word alignment, and comma detection — eliminating an external PHY. The 25,560 logic elements provide ample capacity for a 10GbE MAC core with DMA engine, while 1,920 Kbits of embedded RAM buffer packets at line rate. Designers place the FPGA between the network PHY and an ASIC/ASSP, with the transceiver channels routed as 50 Ω differential pairs with matched length on the 1020-pin FineLine BGA. Trade-off: the C4 speed grade may limit timing closure on the most demanding pipeline stages, but pin-compatible C5/C6/C7 speed grades provide headroom.
Recommended
PCI Express Endpoint Card
PCI Express x1/x4 endpoint designs leverage the EP1SGX25FG1020C4's hardware PCIe hard IP block, which implements the transaction layer, data link layer, and physical layer (PIPE interface) without consuming logic resources. The 25,560-LE fabric accommodates endpoint application logic plus DMA engines, while 1,920 Kbits of RAM provides descriptor and payload buffering. The device supports PCIe Gen1 at 2.5 Gbps per lane across all 4 transceivers. Placement is critical: the transceiver reference clock must be a 100 MHz HCSL source with sub-100 ppm stability, and the REFCLK+ / REFCLK- pair must be length-matched within 150 mil on the 1020-pin BGA. Trade-off: Gen2 (5 Gbps) is not supported on this device — choose Stratix IV GX for Gen2 designs.
Recommended
Wireless Base Station Baseband Processing
Wireless base station baseband processing benefits from the EP1SGX25FG1020C4's combination of 10 dedicated DSP blocks (each implementing 9×9 / 18×18 / 36×36 multipliers), 1,920 Kbits of embedded RAM for coefficient storage, and 4 multi-gigabit transceivers for CPRI / OBSAI fronthaul links to remote radio heads. The fabric can implement 50-100 channel filters or FFT engines in parallel for LTE/WiMAX physical layer processing, with the C4 speed grade supporting up to 200 MHz DSP clock. Designers typically instantiate the FPGA between a baseband ASIC and the radio card, with SERDES fronthaul replacing analog RF cables. Trade-off: power dissipation reaches 8-12 W at full utilization, requiring thermal vias and forced-air cooling on the 1020-pin BGA.
Recommended
Software Defined Radio (SDR) Prototyping
SDR prototyping platforms use the EP1SGX25FG1020C4 because its 25,560 logic elements can host full waveform implementations for protocols from LTE to custom military waveforms, while the 4 multi-gigabit transceivers digitize IF/RF signals directly via external ADC/DAC interfaces. The 1,920 Kbits of embedded RAM samples IQ data at rates up to 100 MSPS, with 10 DSP blocks handling channelization, FFT, and modulation. Researchers route wideband analog inputs through anti-alias filters to high-speed ADCs (e.g., 14-bit 250 MSPS) clocked by FPGA PLLs, with digital downconversion in fabric. Trade-off: prototype cost runs $250-400 per board due to obsolete FPGA pricing, but the device's mature Quartus II toolchain and abundant IP cores shorten development time vs newer FPGA families.
Recommended
Video Broadcast Routing and Processing
Video broadcast routing systems use the EP1SGX25FG1020C4 to implement multi-format SDI routers, de-embedders, and frame synchronizers in a single chip. The 25,560-LE fabric can process up to 8 simultaneous HD-SDI streams (1.485 Gbps each) or 2 3G-SDI streams (2.97 Gbps), with the 4 embedded transceivers handling SDI physical interfacing and the remaining logic implementing ANC data extraction and audio embedding. The 1,920 Kbits of embedded RAM provides line and frame buffering for format conversions. Designers pair the FPGA with external SDI cable drivers and clock-cleaning PLLs. Trade-off: HD-SDI jitter compliance at 1.485 Gbps requires careful PCB layout with 75 Ω controlled impedance on BNC connections, and the C4 speed grade may constrain additional processing stages per line.
Recommended
Industrial High-Speed Data Acquisition
Industrial data acquisition systems leverage the EP1SGX25FG1020C4 to aggregate multiple high-speed sensor streams (sonar arrays, LIDAR, vibration analysis) into pre-processed data forwarded over Gigabit Ethernet or Serial RapidIO to a host processor. The 4 multi-gigabit transceivers support multiple sensor interfaces simultaneously, the 10 DSP blocks implement real-time FFT and windowing, and 1,920 Kbits of RAM buffer sample bursts. The 1020-pin BGA provides 380+ user I/O pins (per Stratix GX architecture) for parallel LVDS sensor interfaces. Designers route ADC outputs via LVDS pairs into the FPGA, with embedded DSP blocks performing channel calibration. Trade-off: industrial temperature grade (-40 to +85 °C) parts are available as 'I' speed grade variants — verify operating temperature when substituting the standard C4 grade for outdoor or harsh-environment deployment.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25FG1020C4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25DF1020C5 | EP1SGX25DF1020C6 | EP1SGX25FF1020C5 | EP1SGX25FF1020C7 |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 1020-pin FineLine BGA (FG) | 1020-pin FineLine BGA (DF) — same footprint | 1020-pin FineLine BGA (DF) — same footprint | 1020-pin FineLine BGA (FF) — same footprint | 1020-pin FineLine BGA (FF) — same footprint |
| Logic Elements | 25,560 LE | 25,560 LE (same die) | 25,560 LE (same die) | 25,560 LE (same die) | 25,560 LE (same die) |
| Embedded Memory | 1,920 Kbits | 1,920 Kbits (same die) | 1,920 Kbits (same die) | 1,920 Kbits (same die) | 1,920 Kbits (same die) |
| Embedded Transceivers | 4 channels | 4 channels (same die) | 4 channels (same die) | 4 channels (same die) | 4 channels (same die) |
| Transceiver Data Rate | Up to 3.125 Gbps | Up to 3.125 Gbps (same) | Up to 3.125 Gbps (same) | Up to 3.125 Gbps (same) | Up to 3.125 Gbps (same) |
| Speed Grade | C4 | C5 (~1 bin faster) | C6 (~2 bins faster) | C5 (~1 bin faster) | C7 (fastest bin) |
| Core Voltage | 1.5 V (typical) | 1.5 V (typical) | 1.5 V (typical) | 1.5 V (typical) | 1.5 V (typical) |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Same-die drop-in upgrades offer faster speed grades at no PCB rework cost (vs EP1SGX25DF1020C5)
- Multiple package codes (FG/FF/DF/CF) within the 1020-pin BGA family enable supply chain flexibility (vs EP1SGX25FF1020C7)
- Embedded SERDES hard IP eliminates external PHY for major protocols (vs Stratix IV GX EP4SGX230)
Design Notes
Estimated: the 1020-pin FineLine BGA at 1.27 mm pitch requires 4-6 layer PCB with 0.8 mm via-in-pad (VIPPO) processing for breakout routing. Place microvias directly under BGA pads with 0.4 mm pad-to-pad spacing to escape the inner rows. Allocate a continuous ground plane on layer 2 directly under the BGA to minimize return-path inductance for the 4 multi-gigabit transceiver channels. Trace impedance must be 50 Ω differential (100 Ω differential) for SERDES lanes, with intra-pair length matching within 150 mil and inter-pair within 600 mil per Altera Stratix GX layout guidelines.
Estimated: typical power dissipation for a fully-utilized EP1SGX25FG1020C4 ranges 7-10 W at 25,560 LE with 4 active transceivers. The 1020-pin BGA exposes its thermal pad through 200+ ground pins — stitch these into a thermal pad array with thermal vias (0.3 mm drill, 0.5 mm pitch, filled with conductive epoxy) connecting to internal copper planes. Without thermal management, junction temperature can exceed 100 °C in still air at 85 °C ambient. Add a 1 m/s forced-air flow or attach a 20 C/W heatsink via thermal interface material for industrial-temperature operation.
The 4 multi-gigabit transceiver channels require a 100 MHz HCSL reference clock with sub-100 ppm frequency stability and -100 dBc/Hz phase noise at 100 kHz offset. Place the reference clock source within 3 inches of the FPGA REFCLK pins with 50 Ω controlled impedance. Decouple the transceiver PLL analog supply (VCC_PLL) with a pi-network (10 µF tantalum + 0.1 µF + 0.01 µF ceramic) for each PLL. Series-terminate each LVDS pair at the driver with 100 Ω near the FPGA pin, and avoid vias on SERDES lanes where possible — each via adds 0.5-1 dB insertion loss at 3 GHz.
Three common pitfalls when designing with EP1SGX25FG1020C4: (1) omitting an external configuration device — the FPGA is SRAM-based and loses configuration on power-down; use EPC16 or EPCS64 minimum. (2) Mixing up FG/FF/DF package codes — all three are 1020-pin FineLine BGAs but the pinout symbols differ; always check the Pin Information File (PIF) for the exact device ordering code. (3) Underestimating configuration time — bitstreams of 8-12 Mbit require 200-400 ms to load via passive serial mode, affecting system boot sequencing.
Compliance Information
Compliance status not available in verified web data. Altera/Intel FPGA products from the Stratix GX era (2004-2007) were typically lead-free and RoHS compliant for new production, but obsolete stock should be verified case-by-case via the manufacturer's product declaration documents. AEC-Q100 not applicable — FPGAs are not qualified automotive components per typical industry practice.
