EP1SGX25FF1020C5N - 25,660 Logic Elements Stratix GX FPGA | Intel
MPN: EP1SGX25FF1020C5N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 5 | $1790 | $8,950.00 |
| 10 | $1720 | $17,200.00 |
| 25 | $1655 | $41,375.00 |
| 100 | $1580 | $158,000.00 |
Drop-in alternatives for EP1SGX25FF1020C5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1SGX25FF1020C5N Maximum Ratings & Electrical Characteristics
| Series | Stratix GX |
| Family | Stratix GX (Stratix I GX) |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements / Cells | 25,660 |
| Logic Array Blocks (LABs) | 2,566 |
| User I/Os | 607 |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.5 V |
| Operating Temperature | 0 °C to 85 °C (commercial) |
| Package Type | FC-FBGA-1020 (Flip-Chip Fine-pitch BGA) |
| Package Size | 33 x 33 mm |
| Ball Pitch | 1.0 mm |
| Lead Free | Yes (per datasheet snippet) |
| Logic Family | CMOS |
| Speed Grade | C5 (approx. 500 MHz internal clock) |
| Mounting Type | Surface Mount |
EP1SGX25FF1020C5N 33 x 33 mm Pin Configuration Guide
Complete pinout information for EP1SGX25FF1020C5N (33 x 33 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25FF1020C5N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25FF1020C5N is suitable for 6 applications: 1G/10G Ethernet Line Card, PCI Express Endpoint / Root Port, SONET/SDH Framer and Mapper, Backplane Aggregation Switch, Broadcast Video Router, High-Speed Serial Bridge / ASIC Prototyping.
1G/10G Ethernet Line Card
The EP1SGX25FF1020C5N's integrated SERDES channels rated up to 3.125 Gbps make it a strong fit for 1G Ethernet MAC-PHY bridge designs and aggregated 10G uplink prototype cards. With 25,660 logic elements, designers can implement multiple MAC cores plus a switch fabric in a single chip, eliminating external glue logic. The 607 user I/Os route high-density parallel backplanes alongside the serial links. Unlike the Stratix II GX 'DF' variant, this part consumes more power per SERDES lane but offers proven Quartus II IP for SGMII, XAUI, and SPI-4.2 interfaces typical of legacy 1G-to-10G aggregation switches.
Recommended
PCI Express Endpoint / Root Port
The EP1SGX25FF1020C5N integrates the Altera SLOPCIe hard IP block alongside multi-gigabit SERDES, enabling a single-chip PCIe Gen1 (2.5 Gbps) root-port or endpoint with up to 4 lanes. Its 25,660 logic elements accommodate a x4 PCIe TLP layer plus device-level application logic, while the 607 user I/Os expose local-bus and memory interfaces. Engineers used this device on AMC cards and AdvancedTCA backplanes where PCIe was the host interconnect; the C5 speed grade provides comfortable timing margin for 250 MHz local-bus bridges.
Recommended
SONET/SDH Framer and Mapper
Carrier-grade OC-48/STM-16 (2.488 Gbps) framer designs map cleanly onto the EP1SGX25FF1020C5N: the SERDES drives the optical transceiver directly, while the 25,660 logic elements implement the SONET/SDH section, line, and path overhead processing plus payload mapping. The 1.5 V core supply and commercial temperature range (0-85 °C) match typical indoor central-office equipment operating envelopes. This FPGA family was a workhorse for the OC-48 generation of metro Ethernet and MSPP platforms.
Recommended
Backplane Aggregation Switch
Backplane aggregation switches with multiple 3.125 Gbps SERDES lanes feeding an external switching ASIC benefit from the EP1SGX25FF1020C5N's combination of transceiver channels, 25,660 logic elements, and 607 I/Os. The FPGA implements the port-side MAC, rate-matching FIFOs, and link-training state machines that bridge the backplane SERDES to the switching fabric. The 33 x 33 mm FC-FBGA-1020 footprint gives sufficient PCB area for high-density impedance-controlled routing on standard FR-4 backplanes.
Recommended
Broadcast Video Router
Broadcast-grade SDI (SMPTE 259M/292M) routers and DVB-ASI cross-point switches used the EP1SGX25FF1020C5N because the device can host dozens of SDI serializer/deserializer channels alongside switching matrix logic. The 607 user I/Os expose parallel video buses to external PHYs, while internal TriMatrix memory buffers line-rate video streams. Commercial temperature grading suits studio environments. Compared to an ASIC, the FPGA-based implementation allowed rapid reconfiguration of routing tables as broadcast standards evolved.
Recommended
High-Speed Serial Bridge / ASIC Prototyping
ASIC prototyping teams leveraged the EP1SGX25FF1020C5N's SERDES, PCI Express hard IP, and 25,660 logic elements as a verification vehicle for ASICs that integrated the same SERDES macros. The 1020-ball FC-FBGA-1020 footprint gave ample pin budget to probe internal ASIC signals, and Quartus II design flow allowed quick iterations. Engineers paired this FPGA with off-the-shelf PHY evaluation boards to validate chip-to-chip and backplane links before taping out the ASIC.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25FF1020C5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25FF1020C5L | EP1SGX25FF1020C5ES | EP1SGX25FF1020C5 | EP1SGX25FF1020C4 | EP1SGX25F1020C6 | EP1SGX25FF1020 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FC-FBGA-1020 (33x33 mm, 1 mm pitch) | FC-FBGA-1020 - same | FC-FBGA-1020 - same | FC-FBGA-1020 - same | FC-FBGA-1020 - same | FC-FBGA-1020 - same | FC-FBGA-1020 - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Speed Grade | C5 | C5L (low-voltage) | C5ES (engineering sample) | C5 (legacy leaded) | C4 (slower) | C6 (slower) | Unspecified |
| User I/Os | 607 | 607 | 607 | 607 | 607 | 607 | 607 |
| LABs | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 |
| Core Voltage | 1.5 V | 1.5 V (low-voltage) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 °C to 85 °C (commercial) | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C |
| Lead Free | Yes (N suffix) | Yes | Yes | No (legacy leaded) | Yes | Yes | [DATA_NEEDED] |
Key Differentiators
- Highest-density Stratix I GX with integrated SERDES (vs EP1SGX25FF1020C5)
- C5 speed grade provides the fastest Fmax of the FF1020 family (vs EP1SGX25FF1020C4)
- Largest package code FF1020 with 607 user I/Os (vs EP1SGX25F672C7N)
- Stratix I GX is the transceiver-optimized variant (vs EP1S25F1020C5N)
Design Notes
The FC-FBGA-1020 package requires a 1 mm pitch land pattern with 0.6 mm pad diameter and a 33 x 33 mm board footprint. Follow the Stratix GX Hardware Reference Manual for via-in-pad or microvia construction because conventional through-hole vias under a 1 mm pitch BGA will not yield acceptable assembly yields. Microvia or stacked-via PCB technology is strongly recommended for any board that goes into volume production.
The 1.5 V core supply is sourced from the external VCCINT rail; on-die regulators generate the SRAM and PLL internal voltages. The Stratix GX power calculator (available with Quartus II) should be used to estimate worst-case ICCINT for 90 % utilization SERDES-on workloads. Estimated: at full SERDES utilization across 16 channels and 25,660 logic elements, expect 8-12 W on VCCINT plus another 4-6 W on VCCIO, requiring at least a 4-layer PCB with a solid power plane and bulk decoupling within 1 cm of the BGA.
The 33 x 33 mm FC-FBGA-1020 package has a published theta-JA of approximately 8 °C/W with a 1 oz copper heatsink plate, so a 15 W workload yields a 120 °C junction temperature rise above 25 °C ambient - this exceeds the 85 °C commercial limit. Either derate the SERDES channel count, attach a heat spreader, or use forced-air cooling. Estimated: at 15 W dissipation and no airflow, junction temperature rises to ~145 °C, well above the absolute maximum of 125 °C - thermal shutdown becomes a real risk.
Route the multi-gigabit SERDES differential pairs with 100 ohm differential impedance, 8-12 mil trace width, and matched length to within 5 mils across a P and N. Place AC-coupling capacitors (0.01 uF X7R) at the FPGA pin-side of each transmit pair, never on the receive side. Avoid routing SERDES traces over power-plane splits; reference each pair to a continuous ground plane for the entire length.
Common pitfalls include: omitting the JTAG chain on MSEL pin configuration (Stratix I GX defaults to fast passive parallel mode), failing to provide all VCCINT/VCCIO power pins (each must be tied to its own rail), and using the wrong Quartus II device library (the Stratix I GX library is required, not the Stratix I non-GX library). Designers migrating from Stratix II GX must regenerate configuration bitstreams because the bitstream format differs.
Compliance Information
RoHS compliance inferred from the 'N' suffix (Altera/Intel nomenclature for lead-free finish). Per datasheet snippet: 'Lead Free' is explicitly noted. REACH, halogen-free, and conflict-mineral statements are not present in the verified web data and are marked as unknown.
