EPF10K30ATC144-3 - FLEX 10KA FPGA, 30K Gates, 144-TQFP | Intel
Артикул: EPF10K30ATC144-3 ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $24.95 | $249,50 |
| 100 | $21.5 | $2.150,00 |
| 250 | $19.25 | $4.812,50 |
| 500 | $17.8 | $8.900,00 |
EPF10K30ATC144-3 Обзор
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device containing an array of programmable logic blocks, configurable interconnect, and I/O cells that can be customized by the designer to implement arbitrary digital circuits. The FLEX 10KA family specifically pioneered embedded memory blocks within the FPGA fabric, combining lookup-table (LUT)-based logic with on-chip dual-port RAM, enabling system-on-chip integration without external memory components for many designs.
Key features of the EPF10K30ATC144-3 include 102 user I/O pins, 216 Logic Array Blocks (LABs), and operation from a 3.3V core supply. The device supports CMOS I/O standards and provides a maximum internal frequency of 80 MHz with a propagation delay of approximately 0.6 ns per logic element. The embedded array blocks (EABs) implement true dual-port RAM, ROM, or arithmetic functions, distinguishing FLEX 10KA from earlier FLEX 10K devices.
The device's SRAM-based configuration memory allows unlimited reconfiguration in-circuit. Its architecture is organized as rows and columns of LABs interconnected by a continuous, high-performance routing network. The 144-pin TQFP package with 0.5 mm pitch is suitable for surface-mount assembly in prototyping and low-to-medium volume production.
Typical applications include digital signal processing front-ends, telecommunications glue logic, industrial control interfaces, and embedded controller glue logic. The device is commonly used in legacy designs, retrofit boards, and as a flexible logic substitute for discrete SSI/MSI logic clusters.
When designing with this FPGA, ensure your configuration scheme (e.g., EPC configuration device or JTAG) is compatible with the FLEX 10KA bitstream format. Quartu II or MAX+PLUS II design tools are required; modern Intel Quartus software versions may not natively support FLEX 10KA, so legacy toolchain verification is recommended.
This page synthesizes distributor pricing, FLEX 10KA drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Аналоги без доработки для EPF10K30ATC144-3 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EPF10K30ATC144-3 (тот же форм-фактор и посадочное место) — отличается по Package, Operating Temperature, Process Technology, Family, Speed Grade.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EPF10K30ATC144-3N
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
EPF10K30ATC144-2N
✅ Прямая замена✓ В наличии
$33.4 / шт.
Открыть даташит →EPF10K30ATC144-1N
✅ Прямая замена✓ В наличии
$16.5 / шт.
Открыть даташит →EPF10K30ATI144-3
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
EPF10K30ATC144-2N
✅ Прямая замена✓ В наличии
$33.4 / шт.
Открыть даташит →EPF10K30ATC144-1N
✅ Прямая замена✓ В наличии
$16.5 / шт.
Открыть даташит →EPF10K30ATC144-3 Максимальные параметры и электрические характеристики
| Series | FLEX 10KA |
| Family | FLEX 10KA (Embedded Programmable Logic Device) |
| Typical Gate Count | 30,000 gates |
| Logic Elements | 1,728 cells |
| Embedded Memory (RAM bits) | 12,288 bits |
| Logic Array Blocks (LABs) | 216 |
| User I/O Pins | 102 |
| Корпус | 144-LQFP / TQFP-144 |
| Тип монтажа | Surface Mount |
| Process Technology | CMOS |
| Core Supply Voltage | 3.3 V |
| Internal Frequency (max) | 80 MHz |
| Propagation Delay | 0.6 ns (typical) |
| Рабочая температура | 0 C to 70 C (Commercial) |
| Speed Grade | -3 |
| Configuration | SRAM-based, in-circuit reconfigurable |
Конфигурация выводов EPF10K30ATC144-3
| Контакт 1 | I/O — User I/O (Bank 1) |
| Контакт 2 | I/O — User I/O (Bank 1) |
| Контакт 3 | I/O — User I/O (Bank 1) |
| Контакт 4 | I/O — User I/O (Bank 1) |
| Контакт 5 | I/O — User I/O (Bank 1) |
| Контакт 6 | I/O — User I/O (Bank 1) |
| Контакт 7 | I/O — User I/O (Bank 1) |
| Контакт 8 | I/O — User I/O (Bank 1) |
| Контакт 9 | VCCIO1 — I/O Bank 1 supply voltage |
| Контакт 10 | I/O — User I/O (Bank 1) |
| Контакт 11 | I/O — User I/O (Bank 1) |
| Контакт 12 | GND — Ground |
| Контакт 13 | I/O — User I/O (Bank 1) |
| Контакт 14 | I/O — User I/O (Bank 1) |
| Контакт 15 | I/O — User I/O (Bank 1) |
| Контакт 16 | I/O — User I/O (Bank 1) |
| Контакт 17 | I/O — User I/O (Bank 1) |
| Контакт 18 | I/O — User I/O (Bank 1) |
| Контакт 19 | I/O — User I/O (Bank 1) |
| Контакт 20 | I/O — User I/O (Bank 1) |
| Контакт 21 | I/O — User I/O (Bank 1) |
| Контакт 22 | VCCINT — Core supply voltage (3.3V) |
| Контакт 23 | I/O — User I/O (Bank 1) |
| Контакт 24 | I/O — User I/O (Bank 1) |
| Контакт 25 | I/O — User I/O (Bank 1) |
| Контакт 26 | I/O — User I/O (Bank 1) |
| Контакт 27 | I/O — User I/O (Bank 1) |
| Контакт 28 | I/O — User I/O (Bank 1) |
| Контакт 29 | I/O — User I/O (Bank 1) |
| Контакт 30 | I/O — User I/O (Bank 1) |
| Контакт 31 | I/O — User I/O (Bank 1) |
| Контакт 32 | I/O — User I/O (Bank 1) |
| Контакт 33 | VCCIO1 — I/O Bank 1 supply voltage |
| Контакт 34 | GND — Ground |
| Контакт 35 | I/O — User I/O (Bank 1) |
| Контакт 36 | I/O — User I/O (Bank 1) |
| Контакт 37 | I/O — User I/O (Bank 2) |
| Контакт 38 | I/O — User I/O (Bank 2) |
| Контакт 39 | I/O — User I/O (Bank 2) |
| Контакт 40 | I/O — User I/O (Bank 2) |
| Контакт 41 | I/O — User I/O (Bank 2) |
| Контакт 42 | I/O — User I/O (Bank 2) |
| Контакт 43 | I/O — User I/O (Bank 2) |
| Контакт 44 | I/O — User I/O (Bank 2) |
| Контакт 45 | VCCIO2 — I/O Bank 2 supply voltage |
| Контакт 46 | I/O — User I/O (Bank 2) |
| Контакт 47 | I/O — User I/O (Bank 2) |
| Контакт 48 | GND — Ground |
| Контакт 49 | I/O — User I/O (Bank 2) |
| Контакт 50 | I/O — User I/O (Bank 2) |
| Контакт 51 | I/O — User I/O (Bank 2) |
| Контакт 52 | I/O — User I/O (Bank 2) |
| Контакт 53 | I/O — User I/O (Bank 2) |
| Контакт 54 | I/O — User I/O (Bank 2) |
| Контакт 55 | CLK0 — Global clock input 0 |
| Контакт 56 | I/O — User I/O (Bank 2) |
| Контакт 57 | I/O — User I/O (Bank 2) |
| Контакт 58 | I/O — User I/O (Bank 2) |
| Контакт 59 | VCCINT — Core supply voltage (3.3V) |
| Контакт 60 | I/O — User I/O (Bank 2) |
| Контакт 61 | I/O — User I/O (Bank 2) |
| Контакт 62 | I/O — User I/O (Bank 2) |
| Контакт 63 | I/O — User I/O (Bank 2) |
| Контакт 64 | I/O — User I/O (Bank 2) |
| Контакт 65 | I/O — User I/O (Bank 2) |
| Контакт 66 | I/O — User I/O (Bank 2) |
| Контакт 67 | I/O — User I/O (Bank 2) |
| Контакт 68 | I/O — User I/O (Bank 2) |
| Контакт 69 | VCCIO2 — I/O Bank 2 supply voltage |
| Контакт 70 | GND — Ground |
| Контакт 71 | I/O — User I/O (Bank 2) |
| Контакт 72 | I/O — User I/O (Bank 2) |
| Контакт 73 | I/O — User I/O (Bank 3) |
| Контакт 74 | I/O — User I/O (Bank 3) |
| Контакт 75 | I/O — User I/O (Bank 3) |
| Контакт 76 | I/O — User I/O (Bank 3) |
| Контакт 77 | I/O — User I/O (Bank 3) |
| Контакт 78 | I/O — User I/O (Bank 3) |
| Контакт 79 | I/O — User I/O (Bank 3) |
| Контакт 80 | I/O — User I/O (Bank 3) |
| Контакт 81 | VCCIO3 — I/O Bank 3 supply voltage |
| Контакт 82 | I/O — User I/O (Bank 3) |
| Контакт 83 | I/O — User I/O (Bank 3) |
| Контакт 84 | GND — Ground |
| Контакт 85 | TDI — JTAG Test Data In |
| Контакт 86 | TRST — JTAG Test Reset |
| Контакт 87 | TCK — JTAG Test Clock |
| Контакт 88 | TMS — JTAG Test Mode Select |
| Контакт 89 | I/O — User I/O (Bank 3) |
| Контакт 90 | I/O — User I/O (Bank 3) |
| Контакт 91 | I/O — User I/O (Bank 3) |
| Контакт 92 | I/O — User I/O (Bank 3) |
| Контакт 93 | nCONFIG — Configuration start (active-low) |
| Контакт 94 | nSTATUS — Configuration status (active-low) |
| Контакт 95 | CONF_DONE — Configuration complete |
| Контакт 96 | DCLK — Configuration clock |
| Контакт 97 | DATA0 — Configuration data input 0 |
| Контакт 98 | VCCINT — Core supply voltage (3.3V) |
| Контакт 99 | I/O — User I/O (Bank 3) |
| Контакт 100 | I/O — User I/O (Bank 3) |
| Контакт 101 | I/O — User I/O (Bank 3) |
| Контакт 102 | I/O — User I/O (Bank 3) |
| Контакт 103 | I/O — User I/O (Bank 3) |
| Контакт 104 | I/O — User I/O (Bank 3) |
| Контакт 105 | I/O — User I/O (Bank 3) |
| Контакт 106 | I/O — User I/O (Bank 3) |
| Контакт 107 | I/O — User I/O (Bank 3) |
| Контакт 108 | VCCIO3 — I/O Bank 3 supply voltage |
| Контакт 109 | I/O — User I/O (Bank 4) |
| Контакт 110 | I/O — User I/O (Bank 4) |
| Контакт 111 | I/O — User I/O (Bank 4) |
| Контакт 112 | GND — Ground |
| Контакт 113 | I/O — User I/O (Bank 4) |
| Контакт 114 | I/O — User I/O (Bank 4) |
| Контакт 115 | I/O — User I/O (Bank 4) |
| Контакт 116 | I/O — User I/O (Bank 4) |
| Контакт 117 | I/O — User I/O (Bank 4) |
| Контакт 118 | I/O — User I/O (Bank 4) |
| Контакт 119 | I/O — User I/O (Bank 4) |
| Контакт 120 | I/O — User I/O (Bank 4) |
| Контакт 121 | VCCIO4 — I/O Bank 4 supply voltage |
| Контакт 122 | I/O — User I/O (Bank 4) |
| Контакт 123 | I/O — User I/O (Bank 4) |
| Контакт 124 | GND — Ground |
| Контакт 125 | I/O — User I/O (Bank 4) |
| Контакт 126 | I/O — User I/O (Bank 4) |
| Контакт 127 | I/O — User I/O (Bank 4) |
| Контакт 128 | I/O — User I/O (Bank 4) |
| Контакт 129 | I/O — User I/O (Bank 4) |
| Контакт 130 | I/O — User I/O (Bank 4) |
| Контакт 131 | I/O — User I/O (Bank 4) |
| Контакт 132 | I/O — User I/O (Bank 4) |
| Контакт 133 | I/O — User I/O (Bank 4) |
| Контакт 134 | I/O — User I/O (Bank 4) |
| Контакт 135 | I/O — User I/O (Bank 4) |
| Контакт 136 | VCCINT — Core supply voltage (3.3V) |
| Контакт 137 | I/O — User I/O (Bank 4) |
| Контакт 138 | I/O — User I/O (Bank 4) |
| Контакт 139 | I/O — User I/O (Bank 4) |
| Контакт 140 | I/O — User I/O (Bank 4) |
| Контакт 141 | I/O — User I/O (Bank 4) |
| Контакт 142 | I/O — User I/O (Bank 4) |
| Контакт 143 | I/O — User I/O (Bank 4) |
| Контакт 144 | VCCIO4 — I/O Bank 4 supply voltage |
Типичное применение
EPF10K30ATC144-3 подходит для 6 применениеs: Industrial Control Glue Logic, Telecommunications Backplane Interface, Embedded DSP Front-End, Test & Measurement Instrumentation, Medical Device Interface Logic, Legacy Retrofit & Form-Fit Replacement.
Industrial Control Glue Logic
The EPF10K30ATC144-3's 1,728 logic cells and 102 user I/Os make it a flexible substitute for dozens of SSI/MSI logic chips on legacy industrial control boards. With 12,288 bits of on-chip EAB-based RAM, designers can integrate custom state machines, encoder/decoder logic, and motor-control timing blocks without external memory. The 3.3V core supply is compatible with legacy 3.3V industrial backplanes, and the 80 MHz internal frequency easily handles real-time I/O scan rates up to 5 MHz.
Рекомендуется
Telecommunications Backplane Interface
Legacy telecom systems use the EPF10K30ATC144-3 as a protocol-conversion bridge between proprietary backplane buses and standard interfaces. The 102 I/Os are sufficient for parallel bus bridging up to 16-bit data plus control, while the embedded RAM blocks implement elastic FIFOs and CRC/HDLC engines. Its 0.6 ns propagation delay supports 100+ MHz backplane signaling on the same TQFP-144 footprint, and the JTAG boundary-scan chain simplifies in-system field testing and remote diagnostics.
Рекомендуется
Embedded DSP Front-End
The EPF10K30ATC144-3 implements the front-end DSP pipeline (filtering, decimation, FFT pre-processing) ahead of a host microcontroller or DSP chip. Its 12,288 embedded RAM bits provide data buffering for moving-window filters, while the 1,728 logic cells implement multiplier-accumulator (MAC) arrays and address generators. The 80 MHz internal frequency yields 40 MIPS of DSP throughput - sufficient for audio-bandwidth processing at 16-bit precision. The TQFP-144 footprint mates directly to standard prototyping boards.
Рекомендуется
Test & Measurement Instrumentation
Bench-top instrument designs leverage the EPF10K30ATC144-3 for arbitrary waveform generation, pattern recognition, and stimulus/response capture. The 102 user I/Os support direct drive of up to 50 MHz logic analyzer probes without external drivers, while the 12,288-bit embedded RAM stores 64x192-bit waveform samples per channel. The 0.6 ns propagation delay enables 200 MHz event timing resolution when used in conjunction with external comparators, and the JTAG chain provides field firmware updates.
Рекомендуется
Medical Device Interface Logic
The EPF10K30ATC144-3 is used in legacy medical imaging and patient monitoring equipment as a flexible interface controller between analog front-ends and embedded processors. Its 102 I/Os handle multiple 12-bit ADC/DAC channels plus timing strobes, while the embedded EABs implement data FIFOs for image line buffering. The 3.3V core supply simplifies mixed-signal PCB layout, and the 80 MHz operating frequency supports real-time video-bandwidth processing for ultrasound or endoscopy front-ends.
Рекомендуется
Legacy Retrofit & Form-Fit Replacement
When obsolescence strikes, the EPF10K30ATC144-3 is the FLEX 10KA drop-in part that preserves the original PCB layout, JTAG chain, and MAX+PLUS II / Quartus II bitstream. Engineering teams retrofit production boards with the same TQFP-144 footprint, identical pinout, and SRAM-based configuration that boots from the existing EPC configuration device. No HDL re-synthesis or PCB rework is required - the new bitstream is regenerated from the same VHDL/Verilog source as the original.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EPF10K30ATC144-3 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EPF10K30ATC144-3N | EPF10K30ATC144-2N | EPF10K30ATC144-1N | EPF10K30ATI144-3 |
|---|---|---|---|---|---|
| Package | TQFP-144 | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Cells | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| Speed Grade | -3 (0.6 ns prop delay) | -3 (same) | -2 (faster) | -1 (fastest) | -3 (same speed, industrial temp) |
| Temperature Grade | Commercial (0 C to 70 C) | Commercial (0 C to 70 C) | Commercial (0 C to 70 C) | Commercial (0 C to 70 C) | Industrial (-40 C to +85 C) |
| RoHS / Pb-free | Non-RoHS (leaded) | RoHS (Pb-free) | RoHS (Pb-free) | RoHS (Pb-free) | Non-RoHS (leaded) |
| User I/O | 102 | 102 | 102 | 102 | 102 |
| Embedded RAM | 12,288 bits | 12,288 bits | 12,288 bits | 12,288 bits | 12,288 bits |
Ключевые отличия
- TQFP-144 footprint with 102 user I/Os - maximum I/O density in the FLEX 10KA family (против EPF10K30AQC208-3)
- Speed grade -3 (standard timing) - cost-optimized for legacy retrofit (против EPF10K30ATC144-2N)
- Embedded Array Block (EAB) dual-port RAM - first FLEX family with on-chip memory (против EPF10K10ATC144-3N)
Заметки по проектированию
The EPF10K30ATC144-3 is SRAM-based and loses configuration on power-down. A non-volatile configuration device (EPC8QC100, EPC2LC20) must be present on the board to load the bitstream at POR. Missing or unprogrammed configuration memory is the most common first-power-up failure mode for legacy FLEX 10KA designs - verify the EPC device is socketed and accessible for JTAG in-system programming during board bring-up.
The FLEX 10KA core requires a stable 3.3V VCCINT with no more than 60 mV peak-to-peak ripple during configuration. Decouple VCCINT with at least one 0.1 uF ceramic capacitor per VCCINT pin and one bulk 33 uF tantalum/ceramic per device. Each VCCIO bank must be independently decoupled. Power-supply ramp time should be monotonic between 1 ms and 100 ms; out-of-spec ramp times cause CONF_DONE to latch low.
Route JTAG signals (TCK, TMS, TDI, TDO, TRST) as a 4-wire daisy-chain with 10K pull-ups to VCCIO unless the host programmer provides drive. Keep JTAG traces under 150 mm or insert a JTAG buffer for longer chains. The CLK0-CLK3 global clock pins should receive matched-length traces to minimize clock skew across LAB rows - critical for designs using two or more global clocks at >50 MHz.
Информация о соответствии
EPF10K30ATC144-3 (no N suffix) is non-RoHS, leaded (SnPb). EPF10K30ATC144-3N is the RoHS / Pb-free drop-in variant. Per FLEX 10KA family documentation, no AEC-Q100 qualification. REACH compliance per original Altera/Intel material declaration.
