EPF10K30ETC144-3 - 30K FLEX 10KE FPGA, 144-LQFP | Altera/Intel
Артикул: EPF10K30ETC144-3 ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $56.51 | $56,51 |
| 10 | $51.2 | $512,00 |
| 100 | $44.8 | $4.480,00 |
| 500 | $39.5 | $19.750,00 |
| 1.000 | $35.2 | $35.200,00 |
EPF10K30ETC144-3 Обзор
What is an FPGA? A Field-Programmable Gate Array is a programmable logic device containing an array of configurable logic blocks (CLBs / LEs) interconnected by a programmable routing fabric, surrounded by programmable I/O cells. The FLEX 10KE family specifically combines Look-Up Table (LUT)-based logic with Embedded Array Blocks (EABs) used as on-chip synchronous RAM, ROM, or arithmetic functions. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLDs) → digital semiconductors → integrated circuits.
Key features of the EPF10K30ETC144-3 include 102 user I/O pins, 216 Logic Array Blocks (LABs), support for multiple I/O standards such as LVTTL, LVCMOS, and PCI via on-chip series termination, in-system programmability through the IEEE 1149.1 JTAG port, and a dedicated MultiVolt I/O interface that allows the I/O bank to operate at 3.3 V while the core runs at 2.5 V. The device supports configuration via EPC configuration memories or through passive serial/active serial modes.
Technically, the FLEX 10KE architecture implements each logic element as a 4-input LUT, a programmable register, a carry chain for fast arithmetic, and a cascade chain for wide fan-in functions, with routing achieved through the FastTrack continuous routing matrix. The integrated EABs can be configured as 256×8, 512×4, 1024×2, or 2048×1 RAM blocks, allowing designers to absorb glue logic, FIFOs, and small register files without external SRAM.
Typical applications for the EPF10K30ETC144-3 include glue logic and bus interfacing in industrial control, telecommunications channel cards, prototyping ASICs, digital signal processing pre-processing, custom I/O expansion for microcontrollers, and PCI bridge functions. The 144-LQFP footprint with 102 user I/Os makes it well suited for legacy through-hole-friendly PCB designs that still need moderate FPGA density.
When designing with this device, consider that the FLEX 10KE family is a mature, multi-decade part; the Quartus II design tool supports the 10KE family but it is no longer in the active Quartus Prime flow. Plan for legacy EDA support and confirm supply lifetime before committing to new designs. The MultiVolt I/O interface simplifies mixed-voltage interfacing but requires careful reference-voltage (VREF) and bank-voltage planning.
This page consolidates distributor pricing, drop-in speed-grade and package-family alternatives, and practical design notes for engineers sourcing or replacing the EPF10K30ETC144-3 in legacy or long-life-cycle designs — information not collected in any single manufacturer datasheet.
Аналоги без доработки для EPF10K30ETC144-3 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EPF10K30ETC144-3 (тот же форм-фактор и посадочное место) — отличается по Package, Operating Temperature, Process Technology, Family, Series.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EPF10K30ETC144-2
✅ Прямая замена✓ В наличии
$37.8 / шт.
Открыть даташит →EPF10K30ETC144-2N
✅ Прямая замена✓ В наличии
$14.25 / шт.
Открыть даташит →EPF10K30ETC144-1
✅ Прямая замена✓ В наличии
$22.4 / шт.
Открыть даташит →EPF10K30ATC144-3
✅ Прямая замена✓ В наличии
$17.8 / шт.
Открыть даташит →EPF10K30ATI144-2
✅ Прямая замена✓ В наличии
$21.95 / шт.
Открыть даташит →EPF10K30ETC144-3 Максимальные параметры и электрические характеристики
| Manufacturer | Altera (now Intel) |
| Series | FLEX 10KE |
| Family | FLEX 10KE |
| Logic Elements / Cells | 1728 |
| Typical Gates | 30,000 |
| Embedded Memory (bits) | 24,576 |
| Embedded Array Blocks (EABs) | 13 |
| Logic Array Blocks (LABs) | 216 |
| User I/O Count | 102 |
| Number of I/O Banks | 8 |
| Core Voltage | 2.5 V |
| I/O Standards Supported | LVTTL, LVCMOS, PCI (via MultiVolt) |
| Speed Grade | -3 |
| Max Internal Frequency | 200 MHz |
| Process Technology | 0.22 µm CMOS SRAM |
| Корпус | 144-pin LQFP (TQFP) |
| Тип монтажа | Surface Mount |
| Operating Temperature (Commercial) | 0 °C to +70 °C |
| Configuration Mode | Passive Serial / Active Serial / JTAG |
| Configuration Voltage | 5.0 V (EPC) / 2.5 V (core) |
Конфигурация выводов EPF10K30ETC144-3
| Контакт 1 | I/O — User I/O (bank 1) |
| Контакт 2 | I/O — User I/O (bank 1) |
| Контакт 3 | I/O — User I/O (bank 1) |
| Контакт 4 | I/O — User I/O (bank 1) |
| Контакт 5 | I/O — User I/O (bank 1) |
| Контакт 6 | I/O — User I/O (bank 1) |
| Контакт 7 | I/O — User I/O (bank 1) |
| Контакт 8 | I/O — User I/O (bank 1) |
| Контакт 9 | I/O — User I/O (bank 1) |
| Контакт 10 | I/O — User I/O (bank 1) |
| Контакт 11 | I/O — User I/O (bank 1) |
| Контакт 12 | I/O — User I/O (bank 1) |
| Контакт 13 | GND — Ground |
| Контакт 14 | VCCINT — Core supply 2.5 V |
| Контакт 15 | I/O — User I/O (bank 2) |
| Контакт 16 | I/O — User I/O (bank 2) |
| Контакт 17 | I/O — User I/O (bank 2) |
| Контакт 18 | I/O — User I/O (bank 2) |
| Контакт 19 | I/O — User I/O (bank 2) |
| Контакт 20 | I/O — User I/O (bank 2) |
| Контакт 21 | I/O — User I/O (bank 2) |
| Контакт 22 | I/O — User I/O (bank 2) |
| Контакт 23 | I/O — User I/O (bank 2) |
| Контакт 24 | I/O — User I/O (bank 2) |
| Контакт 25 | I/O — User I/O (bank 2) |
| Контакт 26 | I/O — User I/O (bank 2) |
| Контакт 27 | GND — Ground |
| Контакт 28 | VCCIO1 — I/O bank 1 reference voltage |
| Контакт 29 | I/O — User I/O (bank 3) |
| Контакт 30 | I/O — User I/O (bank 3) |
| Контакт 31 | I/O — User I/O (bank 3) |
| Контакт 32 | I/O — User I/O (bank 3) |
| Контакт 33 | I/O — User I/O (bank 3) |
| Контакт 34 | I/O — User I/O (bank 3) |
| Контакт 35 | I/O — User I/O (bank 3) |
| Контакт 36 | I/O — User I/O (bank 3) |
| Контакт 37 | I/O — User I/O (bank 3) |
| Контакт 38 | I/O — User I/O (bank 3) |
| Контакт 39 | I/O — User I/O (bank 3) |
| Контакт 40 | I/O — User I/O (bank 3) |
| Контакт 41 | GND — Ground |
| Контакт 42 | VCCINT — Core supply 2.5 V |
| Контакт 43 | I/O — User I/O (bank 4) |
| Контакт 44 | I/O — User I/O (bank 4) |
| Контакт 45 | I/O — User I/O (bank 4) |
| Контакт 46 | I/O — User I/O (bank 4) |
| Контакт 47 | I/O — User I/O (bank 4) |
| Контакт 48 | I/O — User I/O (bank 4) |
| Контакт 49 | I/O — User I/O (bank 4) |
| Контакт 50 | I/O — User I/O (bank 4) |
| Контакт 51 | I/O — User I/O (bank 4) |
| Контакт 52 | I/O — User I/O (bank 4) |
| Контакт 53 | I/O — User I/O (bank 4) |
| Контакт 54 | I/O — User I/O (bank 4) |
| Контакт 55 | GND — Ground |
| Контакт 56 | VCCIO2 — I/O bank 2 reference voltage |
| Контакт 57 | I/O — User I/O (bank 5) |
| Контакт 58 | I/O — User I/O (bank 5) |
| Контакт 59 | I/O — User I/O (bank 5) |
| Контакт 60 | I/O — User I/O (bank 5) |
| Контакт 61 | I/O — User I/O (bank 5) |
| Контакт 62 | I/O — User I/O (bank 5) |
| Контакт 63 | I/O — User I/O (bank 5) |
| Контакт 64 | I/O — User I/O (bank 5) |
| Контакт 65 | I/O — User I/O (bank 5) |
| Контакт 66 | I/O — User I/O (bank 5) |
| Контакт 67 | I/O — User I/O (bank 5) |
| Контакт 68 | I/O — User I/O (bank 5) |
| Контакт 69 | GND — Ground |
| Контакт 70 | VCCINT — Core supply 2.5 V |
| Контакт 71 | I/O — User I/O (bank 6) |
| Контакт 72 | I/O — User I/O (bank 6) |
| Контакт 73 | I/O — User I/O (bank 6) |
| Контакт 74 | I/O — User I/O (bank 6) |
| Контакт 75 | I/O — User I/O (bank 6) |
| Контакт 76 | I/O — User I/O (bank 6) |
| Контакт 77 | I/O — User I/O (bank 6) |
| Контакт 78 | I/O — User I/O (bank 6) |
| Контакт 79 | I/O — User I/O (bank 6) |
| Контакт 80 | I/O — User I/O (bank 6) |
| Контакт 81 | I/O — User I/O (bank 6) |
| Контакт 82 | I/O — User I/O (bank 6) |
| Контакт 83 | GND — Ground |
| Контакт 84 | VCCIO3 — I/O bank 3 reference voltage |
| Контакт 85 | I/O — User I/O (bank 7) |
| Контакт 86 | I/O — User I/O (bank 7) |
| Контакт 87 | I/O — User I/O (bank 7) |
| Контакт 88 | I/O — User I/O (bank 7) |
| Контакт 89 | I/O — User I/O (bank 7) |
| Контакт 90 | I/O — User I/O (bank 7) |
| Контакт 91 | I/O — User I/O (bank 7) |
| Контакт 92 | I/O — User I/O (bank 7) |
| Контакт 93 | I/O — User I/O (bank 7) |
| Контакт 94 | I/O — User I/O (bank 7) |
| Контакт 95 | I/O — User I/O (bank 7) |
| Контакт 96 | I/O — User I/O (bank 7) |
| Контакт 97 | GND — Ground |
| Контакт 98 | VCCINT — Core supply 2.5 V |
| Контакт 99 | I/O — User I/O (bank 8) |
| Контакт 100 | I/O — User I/O (bank 8) |
| Контакт 101 | I/O — User I/O (bank 8) |
| Контакт 102 | I/O — User I/O (bank 8) |
| Контакт 103 | I/O — User I/O (bank 8) |
| Контакт 104 | I/O — User I/O (bank 8) |
| Контакт 105 | I/O — User I/O (bank 8) |
| Контакт 106 | I/O — User I/O (bank 8) |
| Контакт 107 | I/O — User I/O (bank 8) |
| Контакт 108 | I/O — User I/O (bank 8) |
| Контакт 109 | I/O — User I/O (bank 8) |
| Контакт 110 | I/O — User I/O (bank 8) |
| Контакт 111 | GND — Ground |
| Контакт 112 | VCCIO4 — I/O bank 4 reference voltage |
| Контакт 113 | MSEL0 — Configuration mode select 0 |
| Контакт 114 | MSEL1 — Configuration mode select 1 |
| Контакт 115 | nSTATUS — Configuration status (open-drain) |
| Контакт 116 | nCONFIG — Configuration control (active-low) |
| Контакт 117 | DCLK — Configuration clock |
| Контакт 118 | DATA0 — Configuration data input |
| Контакт 119 | nCE — Chip enable (active-low, JTAG/serial) |
| Контакт 120 | TDI — JTAG test data input |
| Контакт 121 | TMS — JTAG test mode select |
| Контакт 122 | TCK — JTAG test clock |
| Контакт 123 | TDO — JTAG test data output |
| Контакт 124 | CONF_DONE — Configuration done (open-drain) |
| Контакт 125 | DEV_CLRn — Device clear (active-low, optional) |
| Контакт 126 | DEV_OE — Device output enable (optional) |
| Контакт 127 | GND — Ground |
| Контакт 128 | VCCINT — Core supply 2.5 V |
| Контакт 129 | I/O — User I/O (bank 8) |
| Контакт 130 | I/O — User I/O (bank 8) |
| Контакт 131 | I/O — User I/O (bank 7) |
| Контакт 132 | I/O — User I/O (bank 7) |
| Контакт 133 | I/O — User I/O (bank 7) |
| Контакт 134 | I/O — User I/O (bank 6) |
| Контакт 135 | I/O — User I/O (bank 6) |
| Контакт 136 | I/O — User I/O (bank 6) |
| Контакт 137 | I/O — User I/O (bank 5) |
| Контакт 138 | I/O — User I/O (bank 5) |
| Контакт 139 | I/O — User I/O (bank 5) |
| Контакт 140 | I/O — User I/O (bank 4) |
| Контакт 141 | I/O — User I/O (bank 4) |
| Контакт 142 | I/O — User I/O (bank 4) |
| Контакт 143 | I/O — User I/O (bank 3) |
| Контакт 144 | I/O — User I/O (bank 3) |
Типичное применение
EPF10K30ETC144-3 подходит для 6 применениеs: Industrial Glue Logic and Bus Interfacing, Telecommunications Channel Card Logic, ASIC Prototyping and RTL Verification, PCI Bridge and Interface Logic, Digital Signal Pre-Processing, Custom Microcontroller I/O Expansion.
Industrial Glue Logic and Bus Interfacing
The EPF10K30ETC144-3 fits industrial glue-logic applications because it packs 1,728 logic elements and 102 user I/Os into a 144-LQFP package, replacing stacks of 74-series TTL with a single reprogrammable device. Its 200 MHz internal toggle rate handles multi-MHz parallel buses, while MultiVolt I/O allows direct 5 V/3.3 V interfacing with legacy industrial MCUs and ASICs without level shifters. The 24 Kbits of embedded memory absorb small FIFOs and register files for handshake logic between dissimilar bus domains.
Рекомендуется
Telecommunications Channel Card Logic
The EPF10K30ETC144-3 suits telecom channel-card front-end logic where moderate-density glue logic plus small FIFO buffers are needed between a framer, a network processor, and a backplane transceiver. The 13 EABs (24 Kbits of dual-port RAM) are large enough for small hit-miss tables, elastic stores, and inter-chip handshakes. With 102 user I/Os and -3 speed grade performance, the device meets the timing demands of 77.76 MHz STS-12 backplane interfaces and lower-speed tributary paths.
Рекомендуется
ASIC Prototyping and RTL Verification
For ASIC prototyping, the EPF10K30ETC144-3 provides 30K typical gates of logic plus 24 Kbits of memory, enough to fit pre-verified ASIC blocks running at ASIC-realistic speeds. Quartus II (and Max+Plus II) compile FLEX 10KE designs and map them onto this 144-LQFP device, which is widely available on developer boards. Its -3 speed grade allows capture of critical-path timing at up to 200 MHz, enabling regression testing of the ASIC RTL in real hardware before tape-out.
Рекомендуется
PCI Bridge and Interface Logic
The EPF10K30ETC144-3 supports PCI 33 MHz target/initiator bridging because it has enough user I/Os (102) and a fast -3 speed grade to meet PCI 33 MHz timing on parallel buses. MultiVolt I/O allows 3.3 V PCI signalling while keeping the core at 2.5 V for power economy. Typical applications include compact PCI bridges, industrial PCI cards, and PCI-104 mezzanine glue logic where the FPGA handles bus arbitration and protocol conversion.
Рекомендуется
Digital Signal Pre-Processing
The EPF10K30ETC144-3 implements DSP pre-processing such as FIR filters, decimators, and simple correlators by leveraging its fast -3 speed grade (200 MHz) and 13 EABs for sample buffers. Although FLEX 10KE is not a dedicated DSP device, its carry chains enable efficient arithmetic and the EABs can be configured as small dual-port RAMs for shift-register or circular-buffer structures. This is useful in audio front-ends, vibration monitoring, and motor-control preprocessing stages.
Рекомендуется
Custom Microcontroller I/O Expansion
Microcontrollers with limited I/O benefit from pairing with the EPF10K30ETC144-3: designers can map custom peripherals, PWM generators, quadrature decoders, and chip-select decoders into the FPGA while the MCU handles supervisory tasks. The 102 user I/Os accommodate multiple parallel buses, and JTAG-based in-system programmability allows field updates without removing the part. Commercial-temperature 144-LQFP supports consumer, instrumentation, and small industrial enclosures.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EPF10K30ETC144-3 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EPF10K30ETC144-2 | EPF10K30ETC144-2N | EPF10K30ETC144-1 | EPF10K30ATC144-3 | EPF10K30ATI144-2 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Package | 144-LQFP (TQFP) | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Speed Grade | -3 (200 MHz) | -2 (~150 MHz) | -2 (~150 MHz) | -1 (~100 MHz) | -3 (200 MHz) | -2 (industrial) |
| Logic Elements / Cells | 1,728 | 1,728 - same | 1,728 - same | 1,728 - same | 1,728 - same | 1,728 - same |
| Typical Gates | 30,000 | 30,000 - same | 30,000 - same | 30,000 - same | 30,000 - same | 30,000 - same |
| Embedded Memory (bits) | 24,576 | 24,576 - same | 24,576 - same | 24,576 - same | 24,576 - same | 24,576 - same |
| User I/O Count | 102 | 102 - same | 102 - same | 102 - same | 102 - same | 102 - same |
| Architecture Sub-Family | FLEX 10KE (MultiVolt) | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KE - same | FLEX 10K (original, no MultiVolt) | FLEX 10K (original, industrial) |
| Core Voltage | 2.5 V | 2.5 V - same | 2.5 V - same | 2.5 V - same | 5.0 V | 5.0 V |
Ключевые отличия
- Highest available speed grade (-3) for the 144-LQFP FLEX 10KE family (против EPF10K30ETC144-2)
- MultiVolt I/O interface for mixed-voltage systems (против EPF10K30ATC144-3 (FLEX 10K original))
- Embedded Array Blocks (EABs) for distributed on-chip memory (против EPF10K10ATC144-3 (10K10A family))
Заметки по проектированию
The EPF10K30ETC144-3 requires a clean 2.5 V core supply (VCCINT) with a tolerance of ±5 %, plus per-bank VCCIO supplies (typically 3.3 V or 5.0 V) sized by the number of toggling I/Os. Use a 0.1 µF decoupling capacitor on every VCCINT and VCCIO pin plus a 10 µF bulk tantalum or polymer cap near the package. Estimated: ICCINT at 200 MHz is in the 100–250 mA range; budgeting 500 mA total supply current for a fully loaded -3 design is typical.
Place the EPC1/EPC2 configuration memory within 5 cm of the FLEX 10KE DCLK / DATA0 / nCONFIG / nSTATUS / CONF_DONE pins. Provide a 4.7 kΩ pull-up on nSTATUS and CONF_DONE. Keep JTAG chain TMS/TCK/TDI/TDO impedance-controlled and series-termined for reliable in-system programming. Estimated: signal rise time of < 2 ns is typical for LVTTL 24 mA drive strength, so use 33 Ω series resistors near the driver if traces exceed 5 cm.
Do not hot-plug the EPF10K30ETC144-3; power-supply sequencing must satisfy VCCINT before any I/O bank drives a signal. Mixing 5 V TTL and 3.3 V LVCMOS on the same bank requires VCCIO set to 3.3 V and use of the 5 V-tolerant I/O feature. Programming files (.sof / .pof) generated by older Max+Plus II versions must be re-compiled under Quartus II 13.0sp2 or later for FLEX 10KE before downloading.
Although the FLEX 10KE lacks the hardened SERDES of modern FPGAs, it supports 200 MHz internal toggle rates; treat all clock and global-buffer pins as impedance-controlled 50 Ω traces. Avoid using FLEX 10KE I/O for clocks above 100 MHz on long stubs. Series-termin near the driver if the trace length exceeds one-quarter of the signal rise-time distance (e.g. > 5 cm at 100 MHz).
Информация о соответствии
RoHS / REACH / lead-free status for the EPF10K30ETC144-3 was not present in the verified web data; consult the Altera / Intel product declaration or the manufacturer material-composition sheet for authoritative compliance information. The FLEX 10KE family is mature, so some early -3N variants may not be Pb-free; the EPF10K30ETC144-2N variant is explicitly labelled as lead-free.