EPF10K30ETI144-3 - 30K FLEX-10KE FPGA 102 I/O | Intel / Altera
Артикул: EPF10K30ETI144-3 ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $49.5 | $49,50 |
| 10 | $44.2 | $442,00 |
| 100 | $38.9 | $3.890,00 |
| 500 | $33.5 | $16.750,00 |
| 1.000 | $29.8 | $29.800,00 |
EPF10K30ETI144-3 Обзор
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that the user can re-program after manufacture to implement arbitrary digital logic. In the broader semiconductor taxonomy, an FPGA sits below ASICs and ASSPs in volume efficiency but above discrete glue logic in integration density, making it the optimal choice for prototyping, low-volume production, and time-to-market-critical designs. The FLEX-10KE family in particular pioneered embedded array block (EAB) memory, blending distributed logic and dedicated RAM in the same fabric.
Key features of the EPF10K30ETI144-3 include 102 user I/Os routed to four I/O banks, JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface, multi-volt I/O support for interfacing to 5.0 V, 3.3 V and 2.5 V buses, and SRAM-based configuration memory allowing unlimited reconfigurations in the field. The 12.5 ns speed grade (the '-3' suffix) is the mid-tier option in the FLEX-10KE family, trading absolute speed for cost savings versus the -4 grade.
Architecturally, the device pairs 1728 logic elements across 216 LABs with embedded array blocks (EABs) providing true dual-port and single-port RAM of up to 24,576 bits. Each LAB contains 8 logic elements and local interconnect, while FastTrack Interconnect provides predictable delay across rows and columns. The 144-pin LQFP (1.6 mm height) is the most popular low-density FLEX-10KE package, balancing pin access with hand-solder-friendly lead pitch.
Typical applications include industrial control logic, telecom glue logic, networking bridges and protocol converters, PCI bridge and bus interface glue, DSP co-processing front-ends, and legacy 5 V system retrofits. The wide I/O count makes the part equally suitable for prototyping ASIC designs before mask commitment.
When designing with this device, route all four I/O bank reference voltages (VCCIO pins) and observe the 2.5 V/3.3 V core supply sequencing requirements. JTAG configuration is recommended for production because it allows fast in-system updates and supports read-back verification.
This page synthesizes distributor pricing, same-package FLEX-10KE alternatives, and design notes not found in the manufacturer datasheet.
Аналоги без доработки для EPF10K30ETI144-3 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EPF10K30ETI144-3 (тот же форм-фактор и посадочное место) — отличается по Operating Temperature, Package, Process Technology, Family, Configuration Method.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EPF10K30ETI144-2N
✅ Прямая замена✓ В наличии
$23.4 / шт.
Открыть даташит →EPF10K30ETI144-2
✅ Прямая замена✓ В наличии
$41.5 / шт.
Открыть даташит →EPF10K30ETC144-3
✅ Прямая замена✓ В наличии
$35.2 / шт.
Открыть даташит →EPF10K30ETC144-3N
✅ Прямая замена✓ В наличии
$26.75 / шт.
Открыть даташит →EPF10K30ETC144-2N
✅ Прямая замена✓ В наличии
$14.25 / шт.
Открыть даташит →EPF10K30ETC144-2
✅ Прямая замена✓ В наличии
$37.8 / шт.
Открыть даташит →EPF10K30ETI144-3 Максимальные параметры и электрические характеристики
| Series | FLEX-10KE |
| Family | FLEX-10KE Embedded Programmable Logic Device |
| Logic Elements | 1728 |
| Logic Array Blocks (LABs) | 216 |
| Embedded RAM | 24,576 bits |
| Embedded Array Blocks (EABs) | 6 |
| Maximum User I/O | 102 |
| Maximum Equivalent Gates | 119,000 |
| Pin-to-Pin Delay (Speed Grade) | 12.5 ns |
| Supply Voltage (Core) | 2.5 V / 3.3 V |
| I/O Voltage Tolerance | 5.0 V / 3.3 V / 2.5 V (multi-volt) |
| Рабочая температура | -40C to +85C (Industrial) |
| Корпус | 144-LQFP (LFQFP) |
| Package Height | 1.6 mm |
| Lead Finish | Tin/Lead (Sn/Pb) |
| Тип монтажа | Surface Mount (Gull Wing) |
| Configuration Method | SRAM (volatile) + JTAG IEEE 1149.1 |
| Статус RoHS | Non-Compliant (Sn/Pb lead finish) |
Конфигурация выводов EPF10K30ETI144-3
| Контакт 1 | I/O — User I/O pin (Bank 1) |
| Контакт 2 | I/O — User I/O pin (Bank 1) |
| Контакт 3 | I/O — User I/O pin (Bank 1) |
| Контакт 4 | I/O — User I/O pin (Bank 1) |
| Контакт 5 | I/O — User I/O pin (Bank 1) |
| Контакт 6 | I/O — User I/O pin (Bank 1) |
| Контакт 7 | I/O — User I/O pin (Bank 1) |
| Контакт 8 | VCCINT — Core supply voltage (2.5 V / 3.3 V) |
| Контакт 9 | I/O — User I/O pin (Bank 1) |
| Контакт 10 | I/O — User I/O pin (Bank 1) |
| Контакт 11 | GND — Ground |
| Контакт 12 | I/O — User I/O pin (Bank 1) |
| Контакт 13 | I/O — User I/O pin (Bank 1) |
| Контакт 14 | I/O — User I/O pin (Bank 1) |
| Контакт 15 | I/O — User I/O pin (Bank 1) |
| Контакт 16 | I/O — User I/O pin (Bank 1) |
| Контакт 17 | I/O — User I/O pin (Bank 1) |
| Контакт 18 | I/O — User I/O pin (Bank 1) |
| Контакт 19 | I/O — User I/O pin (Bank 1) |
| Контакт 20 | I/O — User I/O pin (Bank 1) |
| Контакт 21 | VCCIO1 — I/O bank 1 reference voltage |
| Контакт 22 | I/O — User I/O pin (Bank 1) |
| Контакт 23 | I/O — User I/O pin (Bank 1) |
| Контакт 24 | I/O — User I/O pin (Bank 1) |
| Контакт 25 | I/O — User I/O pin (Bank 1) |
| Контакт 26 | I/O — User I/O pin (Bank 1) |
| Контакт 27 | I/O — User I/O pin (Bank 1) |
| Контакт 28 | I/O — User I/O pin (Bank 1) |
| Контакт 29 | I/O — User I/O pin (Bank 1) |
| Контакт 30 | I/O — User I/O pin (Bank 1) |
| Контакт 31 | I/O — User I/O pin (Bank 1) |
| Контакт 32 | I/O — User I/O pin (Bank 1) |
| Контакт 33 | I/O — User I/O pin (Bank 1) |
| Контакт 34 | VCCINT — Core supply voltage (2.5 V / 3.3 V) |
| Контакт 35 | I/O — User I/O pin (Bank 1) |
| Контакт 36 | I/O — User I/O pin (Bank 1) |
| Контакт 37 | GND — Ground |
| Контакт 38 | I/O — User I/O pin (Bank 1) |
| Контакт 39 | I/O — User I/O pin (Bank 1) |
| Контакт 40 | I/O — User I/O pin (Bank 1) |
| Контакт 41 | I/O — User I/O pin (Bank 1) |
| Контакт 42 | I/O — User I/O pin (Bank 1) |
| Контакт 43 | I/O — User I/O pin (Bank 2) |
| Контакт 44 | I/O — User I/O pin (Bank 2) |
| Контакт 45 | I/O — User I/O pin (Bank 2) |
| Контакт 46 | I/O — User I/O pin (Bank 2) |
| Контакт 47 | I/O — User I/O pin (Bank 2) |
| Контакт 48 | I/O — User I/O pin (Bank 2) |
| Контакт 49 | VCCIO2 — I/O bank 2 reference voltage |
| Контакт 50 | I/O — User I/O pin (Bank 2) |
| Контакт 51 | I/O — User I/O pin (Bank 2) |
| Контакт 52 | I/O — User I/O pin (Bank 2) |
| Контакт 53 | I/O — User I/O pin (Bank 2) |
| Контакт 54 | I/O — User I/O pin (Bank 2) |
| Контакт 55 | I/O — User I/O pin (Bank 2) |
| Контакт 56 | I/O — User I/O pin (Bank 2) |
| Контакт 57 | I/O — User I/O pin (Bank 2) |
| Контакт 58 | I/O — User I/O pin (Bank 2) |
| Контакт 59 | I/O — User I/O pin (Bank 2) |
| Контакт 60 | I/O — User I/O pin (Bank 2) |
| Контакт 61 | I/O — User I/O pin (Bank 2) |
| Контакт 62 | VCCINT — Core supply voltage (2.5 V / 3.3 V) |
| Контакт 63 | I/O — User I/O pin (Bank 2) |
| Контакт 64 | I/O — User I/O pin (Bank 2) |
| Контакт 65 | GND — Ground |
| Контакт 66 | I/O — User I/O pin (Bank 2) |
| Контакт 67 | I/O — User I/O pin (Bank 2) |
| Контакт 68 | I/O — User I/O pin (Bank 2) |
| Контакт 69 | I/O — User I/O pin (Bank 2) |
| Контакт 70 | I/O — User I/O pin (Bank 2) |
| Контакт 71 | I/O — User I/O pin (Bank 2) |
| Контакт 72 | I/O — User I/O pin (Bank 2) |
| Контакт 73 | I/O — User I/O pin (Bank 3) |
| Контакт 74 | I/O — User I/O pin (Bank 3) |
| Контакт 75 | VCCIO3 — I/O bank 3 reference voltage |
| Контакт 76 | I/O — User I/O pin (Bank 3) |
| Контакт 77 | I/O — User I/O pin (Bank 3) |
| Контакт 78 | I/O — User I/O pin (Bank 3) |
| Контакт 79 | I/O — User I/O pin (Bank 3) |
| Контакт 80 | I/O — User I/O pin (Bank 3) |
| Контакт 81 | I/O — User I/O pin (Bank 3) |
| Контакт 82 | I/O — User I/O pin (Bank 3) |
| Контакт 83 | I/O — User I/O pin (Bank 3) |
| Контакт 84 | I/O — User I/O pin (Bank 3) |
| Контакт 85 | I/O — User I/O pin (Bank 3) |
| Контакт 86 | I/O — User I/O pin (Bank 3) |
| Контакт 87 | I/O — User I/O pin (Bank 3) |
| Контакт 88 | I/O — User I/O pin (Bank 3) |
| Контакт 89 | I/O — User I/O pin (Bank 3) |
| Контакт 90 | VCCINT — Core supply voltage (2.5 V / 3.3 V) |
| Контакт 91 | I/O — User I/O pin (Bank 3) |
| Контакт 92 | I/O — User I/O pin (Bank 3) |
| Контакт 93 | GND — Ground |
| Контакт 94 | I/O — User I/O pin (Bank 3) |
| Контакт 95 | I/O — User I/O pin (Bank 3) |
| Контакт 96 | I/O — User I/O pin (Bank 3) |
| Контакт 97 | I/O — User I/O pin (Bank 3) |
| Контакт 98 | I/O — User I/O pin (Bank 3) |
| Контакт 99 | I/O — User I/O pin (Bank 3) |
| Контакт 100 | I/O — User I/O pin (Bank 3) |
| Контакт 101 | I/O — User I/O pin (Bank 4) |
| Контакт 102 | I/O — User I/O pin (Bank 4) |
| Контакт 103 | I/O — User I/O pin (Bank 4) |
| Контакт 104 | I/O — User I/O pin (Bank 4) |
| Контакт 105 | VCCIO4 — I/O bank 4 reference voltage |
| Контакт 106 | I/O — User I/O pin (Bank 4) |
| Контакт 107 | I/O — User I/O pin (Bank 4) |
| Контакт 108 | I/O — User I/O pin (Bank 4) |
| Контакт 109 | I/O — User I/O pin (Bank 4) |
| Контакт 110 | I/O — User I/O pin (Bank 4) |
| Контакт 111 | I/O — User I/O pin (Bank 4) |
| Контакт 112 | I/O — User I/O pin (Bank 4) |
| Контакт 113 | I/O — User I/O pin (Bank 4) |
| Контакт 114 | I/O — User I/O pin (Bank 4) |
| Контакт 115 | I/O — User I/O pin (Bank 4) |
| Контакт 116 | I/O — User I/O pin (Bank 4) |
| Контакт 117 | I/O — User I/O pin (Bank 4) |
| Контакт 118 | I/O — User I/O pin (Bank 4) |
| Контакт 119 | I/O — User I/O pin (Bank 4) |
| Контакт 120 | I/O — User I/O pin (Bank 4) |
| Контакт 121 | I/O — User I/O pin (Bank 4) |
| Контакт 122 | VCCINT — Core supply voltage (2.5 V / 3.3 V) |
| Контакт 123 | I/O — User I/O pin (Bank 4) |
| Контакт 124 | I/O — User I/O pin (Bank 4) |
| Контакт 125 | GND — Ground |
| Контакт 126 | I/O — User I/O pin (Bank 4) |
| Контакт 127 | I/O — User I/O pin (Bank 4) |
| Контакт 128 | I/O — User I/O pin (Bank 4) |
| Контакт 129 | I/O — User I/O pin (Bank 4) |
| Контакт 130 | I/O — User I/O pin (Bank 4) |
| Контакт 131 | I/O — User I/O pin (Bank 4) |
| Контакт 132 | I/O — User I/O pin (Bank 4) |
| Контакт 133 | I/O — User I/O pin (Bank 4) |
| Контакт 134 | I/O — User I/O pin (Bank 4) |
| Контакт 135 | I/O — User I/O pin (Bank 4) |
| Контакт 136 | I/O — User I/O pin (Bank 4) |
| Контакт 137 | MSEL0 — Configuration mode select 0 |
| Контакт 138 | MSEL1 — Configuration mode select 1 |
| Контакт 139 | nSTATUS — Configuration status (open drain) |
| Контакт 140 | nCONFIG — Configuration initiate (active low) |
| Контакт 141 | DCLK — Configuration clock |
| Контакт 142 | DATA0 — Configuration data input |
| Контакт 143 | CONF_DONE — Configuration complete (open drain) |
| Контакт 144 | TDI — JTAG test data input (IEEE 1149.1) |
Типичное применение
EPF10K30ETI144-3 подходит для 6 применениеs: Industrial Control and Glue Logic, Telecom Protocol Bridges and Interconnects, PCI Bridge and Bus Interface Glue, DSP Co-Processing Front-End, Legacy 5 V System Retrofit, ASIC Prototyping and Pre-Silicon Validation.
Industrial Control and Glue Logic
The EPF10K30ETI144-3's 1728 logic elements, 102 user I/Os, and industrial -40C to +85C temperature range make it well suited for industrial control and glue-logic replacement. With multi-volt I/O supporting 5.0 V, 3.3 V and 2.5 V buses, the device bridges legacy 5 V sensors and actuators to modern 3.3 V microcontrollers without external level shifters. The 12.5 ns speed grade supports deterministic control loops at typical PLC scan rates of 1-10 kHz. SRAM configuration enables in-field firmware updates via JTAG during commissioning and lifecycle maintenance.
Рекомендуется
Telecom Protocol Bridges and Interconnects
The 102 I/O pins of the EPF10K30ETI144-3 provide ample bandwidth for telecom protocol bridging between E1/T1 framers, HDLC controllers, UART banks and backplane interfaces. The embedded 24,576-bit RAM across 6 EABs supplies on-chip FIFOs for protocol conversion without external SRAM. The 12.5 ns pin-to-pin delay handles typical 50 MHz telecom backplane frequencies. Industrial temperature grade plus multi-volt I/O enables deployment in CO (central office) and outdoor cabinet environments where legacy 5 V logic must coexist with newer 3.3 V controllers.
Рекомендуется
PCI Bridge and Bus Interface Glue
With 102 user I/Os and 1728 logic elements, the EPF10K30ETI144-3 has been a popular choice for PCI-to-ISA bridges, memory controllers, and custom peripheral glue in industrial PCs and embedded SBCs. The 12.5 ns speed grade meets the 33 MHz PCI bus timing budget at 30 ns per cycle, while the multi-volt I/O banks handle 5 V PCI signaling and 3.3 V local-bus peripherals from a single device. The JTAG interface simplifies board-level bring-up and boundary-scan testing in production.
Рекомендуется
DSP Co-Processing Front-End
The 24,576 bits of dual-port EAB RAM in the EPF10K30ETI144-3 serve as on-chip data buffers for DSP co-processing front-ends, while the 1728 logic elements implement custom filtering, FFT pre-processing, or motor-control algorithms. The 12.5 ns speed grade supports sample rates up to 40 MHz in pipelined architectures, and the multi-volt I/O simplifies interfacing to legacy ADC/DAC devices. Industrial temperature grade allows placement on motor-drive and process-control boards that operate in harsh environments.
Рекомендуется
Legacy 5 V System Retrofit
The EPF10K30ETI144-3 is one of the last Altera FPGA families to natively support 5 V-tolerant I/O, making it a strong fit for legacy 5 V system retrofits where the original ASIC or PLD is obsolete. The 144-LQFP package provides 102 I/Os to replace multiple 74-series TTL packages, simplifying PCB layout and reducing BOM cost. Industrial temperature grade ensures long-term reliability in equipment with multi-decade service lifetimes, including medical, aerospace, and process-control installations.
Рекомендуется
ASIC Prototyping and Pre-Silicon Validation
Engineers use the EPF10K30ETI144-3 as a low-cost pre-silicon validation platform for custom ASIC designs in the 30K-gate complexity range. The 1728 logic elements and 24,576-bit RAM cover many mid-complexity ASIC RTL designs, and the JTAG interface allows rapid bitstream iteration. Once the design is verified in the FPGA, the same RTL can be re-targeted to an ASIC foundry. The 144-LQFP package simplifies bench bring-up and hand rework during prototype debug cycles.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EPF10K30ETI144-3 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EPF10K30ETI144-2N | EPF10K30ETI144-2 | EPF10K30ETC144-3 | EPF10K30ETC144-3N | EPF10K30ETC144-2N |
|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 144-LQFP | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Logic Elements | 1728 | 1728 | 1728 | 1728 | 1728 | 1728 |
| User I/O | 102 | 102 | 102 | 102 | 102 | 102 |
| Speed Grade | -3 (12.5 ns) | -2N (~16 ns) | -2 (~13 ns) | -3 (12.5 ns) | -3 (12.5 ns) | -2N (~16 ns) |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) |
| Embedded RAM | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits |
| Lead Finish | Sn/Pb (Tin/Lead) | Sn/Pb | Sn/Pb | Sn/Pb | Lead-free (RoHS) | Lead-free (RoHS) |
| Lifecycle Status | Obsolete (EOL) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Ключевые отличия
- Same 144-LQFP footprint with different speed grade (против EPF10K30ETI144-2N)
- Industrial temperature grade versus commercial (против EPF10K30ETC144-3)
- Tin/Lead lead finish preserves legacy solderability (против EPF10K30ETC144-3N)
Заметки по проектированию
The EPF10K30ETI144-3 requires both a 2.5 V or 3.3 V VCCINT (core) supply and independent VCCIO supplies per I/O bank (VCCIO1-VCCIO4). Decoupling strategy: place one 0.1 uF X7R ceramic capacitor within 5 mm of every VCCINT pin and every VCCIO pin, plus one 10 uF tantalum or ceramic bulk capacitor near the device. Power sequencing: VCCINT must rise monotonically and stabilize before JTAG configuration begins; VCCIO banks may come up in any order but should be stable when I/O switching begins to avoid latch-up.
For the 144-LQFP package with 0.5 mm lead pitch, use a 4-layer PCB with continuous power and ground planes for optimal signal integrity. Maintain at least 8 mil trace widths with 4 mil clearance from pad to plane edge. Place the EPC configuration PROM within 50 mm of the FPGA to minimize DCLK/DATA0 skew, and route nSTATUS and CONF_DONE as point-to-point single-ended signals with 4.7 kohm pull-up resistors to VCCIO. Avoid routing high-speed signals (above 33 MHz) under the device footprint to prevent coupling into the JTAG boundary-scan logic.
Do not leave MSEL0/MSEL1 floating; tie them to VCCIO or GND through 10 kohm resistors to select the configuration mode explicitly. Failure to pull up nSTATUS and CONF_DONE to VCCIO will result in configuration failures on power-up. The SRAM-based configuration is volatile - the FPGA will lose its bitstream on every power cycle, so a configuration PROM or microcontroller-based JTAG loader is mandatory for production. Finally, do not assume the FLEX-10KE family is in production; Intel officially EOL'd the family in favor of Cyclone and MAX II, so order safety stock early in your design cycle.
Информация о соответствии
Sn/Pb lead finish per Altera/Intel datasheet; not RoHS compliant. Lead-free -N variants are available for RoHS-compliant designs. FPGAs are not AEC-Q100 qualified in this family.
