EPF6016TC1443N - FLEX 6000 FPGA, 16K Gates, 117 I/O, 144-LQFP | Intel
Артикул: EPF6016TC1443N ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $32.5 | $32,50 |
| 10 | $28.75 | $287,50 |
| 100 | $22.4 | $2.240,00 |
| 500 | $18.9 | $9.450,00 |
| 1.000 | $16.2 | $16.200,00 |
EPF6016TC1443N Обзор
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the designer can reprogram after manufacture to implement arbitrary digital logic. Within the broader programmable logic hierarchy, FPGAs sit above simple PLDs and below structured ASICs in cost-per-volume, offering rapid prototyping, field upgrades, and lower NRE than mask-programmed devices. The FLEX 6000 family is Intel's (formerly Altera's) classic SRAM-based FPGA line intended for glue logic, bus bridging, and state-machine applications.
Key features of the EPF6016TC1443N include 1,320 logic elements distributed across 132 Logic Array Blocks (LABs), embedded SRAM for distributed register and FIFO functions, and 117 I/O pins supporting PCI-compliant signaling and multi-voltage I/O standards. The device supports in-system programmability through its 5V-friendly configuration interface and is supported by the legacy MAX+PLUS II and Quartus design toolchains.
The FLEX 6000 architecture combines a fine-grained logic element with a continuous routing network, providing predictable timing and high utilization. The 0.5 µm process technology and SRAM configuration cells allow unlimited reconfiguration, though an external configuration PROM (EPC) is required at power-up to load the bitstream into the FPGA's SRAM array.
Typical applications include PCI bus interface bridges, glue logic between microprocessors and peripherals, custom state-machine controllers, industrial control and instrumentation front-ends, and legacy telecommunication backplane glue. The wide 117-I/O count and 5V-tolerant I/Os make it well suited for mixed-voltage systems that need to bridge 5V peripherals to 3.3V cores.
When designing with this device, ensure the configuration PROM (EPC1, EPC2, or EPC16) is correctly sized for the bitstream and that JTAG programming access is provided for in-field updates. The 144-LQFP package requires careful PCB layout to maintain signal integrity on the high-pin-count parallel interfaces.
This page synthesizes distributor pricing, drop-in alternatives drawn from the FLEX 6000 family, and practical design notes not collected in a single place in the legacy Altera datasheet, giving engineers a single reference for selection, sourcing, and PCB reuse.
Аналоги без доработки для EPF6016TC1443N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EPF6016TC1443N (тот же форм-фактор и посадочное место) — отличается по Package, Operating Temperature, Configuration Method, Speed Grade, Process Technology.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EPF6016TC144-3
✅ Прямая замена✓ В наличии
$9.85 / шт.
Открыть даташит →EPF6016TC144-3U
✅ Прямая замена✓ В наличии
$19.8 / шт.
Открыть даташит →EPF6016TC144-3N
✅ Прямая замена✓ В наличии
$10.5 / шт.
Открыть даташит →EPF6016TC144-2N
✅ Прямая замена✓ В наличии
$14.2 / шт.
Открыть даташит →EPF6016TC144-2
✅ Прямая замена✓ В наличии
$13.85 / шт.
Открыть даташит →EPF6016ATC144-3N
✅ Прямая замена✓ В наличии
$12.4 / шт.
Открыть даташит →EPF6016ATC144-3
✅ Прямая замена✓ В наличии
$9.85 / шт.
Открыть даташит →EPF6016TC1443N Максимальные параметры и электрические характеристики
| Family | FLEX 6000 |
| Logic Elements / Cells | 1320 |
| Number of Gates | 16000 |
| Number of I/O | 117 |
| Number of LABs/CLBs | 132 |
| Напряжение питания | 5 V |
| Рабочая температура | 0C to +70C (commercial) |
| Тип монтажа | Surface Mount |
| Корпус | 144-LQFP (TQFP) |
| Package Body Size | 20 mm x 20 mm |
| Lead Pitch | 0.5 mm |
| Speed Grade | -3 |
| Process Technology | 0.5 µm CMOS SRAM |
| Configuration Method | SRAM (serial/parallel, requires EPC PROM) |
| Статус RoHS | Non-compliant (legacy Altera product) |
| Lead Free | No (contains lead, SnPb finish) |
Конфигурация выводов EPF6016TC1443N
| Контакт 1 | I/O — User I/O pin (bank 1) |
| Контакт 2 | I/O — User I/O pin (bank 1) |
| Контакт 3 | I/O — User I/O pin (bank 1) |
| Контакт 4 | I/O — User I/O pin (bank 1) |
| Контакт 5 | I/O — User I/O pin (bank 1) |
| Контакт 6 | VCCIO1 — I/O bank 1 supply voltage |
| Контакт 7 | I/O — User I/O pin (bank 1) |
| Контакт 8 | I/O — User I/O pin (bank 1) |
| Контакт 9 | GND — Ground |
| Контакт 10 | I/O — User I/O pin (bank 2) |
| Контакт 11 | I/O — User I/O pin (bank 2) |
| Контакт 12 | I/O — User I/O pin (bank 2) |
| Контакт 13 | I/O — User I/O pin (bank 2) |
| Контакт 14 | I/O — User I/O pin (bank 2) |
| Контакт 15 | I/O — User I/O pin (bank 2) |
| Контакт 16 | VCCIO2 — I/O bank 2 supply voltage |
| Контакт 17 | I/O — User I/O pin (bank 2) |
| Контакт 18 | I/O — User I/O pin (bank 2) |
| Контакт 19 | I/O — User I/O pin (bank 2) |
| Контакт 20 | I/O — User I/O pin (bank 2) |
| Контакт 21 | I/O — User I/O pin (bank 2) |
| Контакт 22 | I/O — User I/O pin (bank 2) |
| Контакт 23 | I/O — User I/O pin (bank 2) |
| Контакт 24 | I/O — User I/O pin (bank 2) |
| Контакт 25 | GND — Ground |
| Контакт 26 | I/O — User I/O pin (bank 2) |
| Контакт 27 | I/O — User I/O pin (bank 2) |
| Контакт 28 | I/O — User I/O pin (bank 2) |
| Контакт 29 | I/O — User I/O pin (bank 2) |
| Контакт 30 | I/O — User I/O pin (bank 2) |
| Контакт 31 | VCCIO2 — I/O bank 2 supply voltage |
| Контакт 32 | I/O — User I/O pin (bank 2) |
| Контакт 33 | I/O — User I/O pin (bank 2) |
| Контакт 34 | I/O — User I/O pin (bank 2) |
| Контакт 35 | I/O — User I/O pin (bank 2) |
| Контакт 36 | I/O — User I/O pin (bank 2) |
| Контакт 37 | I/O — User I/O pin (bank 2) |
| Контакт 38 | I/O — User I/O pin (bank 2) |
| Контакт 39 | GND — Ground |
| Контакт 40 | I/O — User I/O pin (bank 3) |
| Контакт 41 | I/O — User I/O pin (bank 3) |
| Контакт 42 | I/O — User I/O pin (bank 3) |
| Контакт 43 | I/O — User I/O pin (bank 3) |
| Контакт 44 | I/O — User I/O pin (bank 3) |
| Контакт 45 | I/O — User I/O pin (bank 3) |
| Контакт 46 | I/O — User I/O pin (bank 3) |
| Контакт 47 | VCCIO3 — I/O bank 3 supply voltage |
| Контакт 48 | I/O — User I/O pin (bank 3) |
| Контакт 49 | I/O — User I/O pin (bank 3) |
| Контакт 50 | I/O — User I/O pin (bank 3) |
| Контакт 51 | I/O — User I/O pin (bank 3) |
| Контакт 52 | I/O — User I/O pin (bank 3) |
| Контакт 53 | I/O — User I/O pin (bank 3) |
| Контакт 54 | I/O — User I/O pin (bank 3) |
| Контакт 55 | GND — Ground |
| Контакт 56 | I/O — User I/O pin (bank 3) |
| Контакт 57 | I/O — User I/O pin (bank 3) |
| Контакт 58 | I/O — User I/O pin (bank 3) |
| Контакт 59 | I/O — User I/O pin (bank 3) |
| Контакт 60 | I/O — User I/O pin (bank 3) |
| Контакт 61 | I/O — User I/O pin (bank 3) |
| Контакт 62 | VCCIO3 — I/O bank 3 supply voltage |
| Контакт 63 | I/O — User I/O pin (bank 3) |
| Контакт 64 | I/O — User I/O pin (bank 3) |
| Контакт 65 | I/O — User I/O pin (bank 3) |
| Контакт 66 | I/O — User I/O pin (bank 3) |
| Контакт 67 | I/O — User I/O pin (bank 3) |
| Контакт 68 | I/O — User I/O pin (bank 3) |
| Контакт 69 | GND — Ground |
| Контакт 70 | I/O — User I/O pin (bank 4) |
| Контакт 71 | I/O — User I/O pin (bank 4) |
| Контакт 72 | I/O — User I/O pin (bank 4) |
| Контакт 73 | VCCIO4 — I/O bank 4 supply voltage |
| Контакт 74 | I/O — User I/O pin (bank 4) |
| Контакт 75 | I/O — User I/O pin (bank 4) |
| Контакт 76 | I/O — User I/O pin (bank 4) |
| Контакт 77 | I/O — User I/O pin (bank 4) |
| Контакт 78 | I/O — User I/O pin (bank 4) |
| Контакт 79 | I/O — User I/O pin (bank 4) |
| Контакт 80 | GND — Ground |
| Контакт 81 | I/O — User I/O pin (bank 4) |
| Контакт 82 | I/O — User I/O pin (bank 4) |
| Контакт 83 | I/O — User I/O pin (bank 4) |
| Контакт 84 | I/O — User I/O pin (bank 4) |
| Контакт 85 | VCCINT — Core supply voltage (5V) |
| Контакт 86 | I/O — User I/O pin (bank 4) |
| Контакт 87 | I/O — User I/O pin (bank 4) |
| Контакт 88 | I/O — User I/O pin (bank 4) |
| Контакт 89 | I/O — User I/O pin (bank 4) |
| Контакт 90 | GND — Ground |
| Контакт 91 | I/O — User I/O pin (bank 4) |
| Контакт 92 | I/O — User I/O pin (bank 4) |
| Контакт 93 | I/O — User I/O pin (bank 4) |
| Контакт 94 | I/O — User I/O pin (bank 4) |
| Контакт 95 | VCCIO4 — I/O bank 4 supply voltage |
| Контакт 96 | I/O — User I/O pin (bank 4) |
| Контакт 97 | I/O — User I/O pin (bank 4) |
| Контакт 98 | I/O — User I/O pin (bank 4) |
| Контакт 99 | I/O — User I/O pin (bank 4) |
| Контакт 100 | GND — Ground |
| Контакт 101 | I/O — User I/O pin (bank 5) |
| Контакт 102 | I/O — User I/O pin (bank 5) |
| Контакт 103 | I/O — User I/O pin (bank 5) |
| Контакт 104 | I/O — User I/O pin (bank 5) |
| Контакт 105 | I/O — User I/O pin (bank 5) |
| Контакт 106 | VCCIO5 — I/O bank 5 supply voltage |
| Контакт 107 | I/O — User I/O pin (bank 5) |
| Контакт 108 | I/O — User I/O pin (bank 5) |
| Контакт 109 | I/O — User I/O pin (bank 5) |
| Контакт 110 | I/O — User I/O pin (bank 5) |
| Контакт 111 | I/O — User I/O pin (bank 5) |
| Контакт 112 | I/O — User I/O pin (bank 5) |
| Контакт 113 | GND — Ground |
| Контакт 114 | I/O — User I/O pin (bank 5) |
| Контакт 115 | I/O — User I/O pin (bank 5) |
| Контакт 116 | I/O — User I/O pin (bank 5) |
| Контакт 117 | I/O — User I/O pin (bank 5) |
| Контакт 118 | I/O — User I/O pin (bank 5) |
| Контакт 119 | VCCIO5 — I/O bank 5 supply voltage |
| Контакт 120 | I/O — User I/O pin (bank 5) |
| Контакт 121 | I/O — User I/O pin (bank 5) |
| Контакт 122 | I/O — User I/O pin (bank 5) |
| Контакт 123 | I/O — User I/O pin (bank 5) |
| Контакт 124 | I/O — User I/O pin (bank 5) |
| Контакт 125 | I/O — User I/O pin (bank 5) |
| Контакт 126 | I/O — User I/O pin (bank 5) |
| Контакт 127 | GND — Ground |
| Контакт 128 | MSEL0 — Configuration mode select 0 |
| Контакт 129 | MSEL1 — Configuration mode select 1 |
| Контакт 130 | nSTATUS — Configuration status (active low) |
| Контакт 131 | nCONFIG — Configuration control (active low) |
| Контакт 132 | DCLK — Configuration clock |
| Контакт 133 | DATA0 — Configuration data input 0 |
| Контакт 134 | CONF_DONE — Configuration done (open drain) |
| Контакт 135 | TCK — JTAG test clock |
| Контакт 136 | TMS — JTAG test mode select |
| Контакт 137 | TDI — JTAG test data in |
| Контакт 138 | TDO — JTAG test data out |
| Контакт 139 | VCCINT — Core supply voltage (5V) |
| Контакт 140 | GND — Ground |
| Контакт 141 | I/O — User I/O pin (bank 1) |
| Контакт 142 | I/O — User I/O pin (bank 1) |
| Контакт 143 | I/O — User I/O pin (bank 1) |
| Контакт 144 | I/O — User I/O pin (bank 1) |
Типичное применение
EPF6016TC1443N подходит для 6 применениеs: PCI Bus Interface Bridge, Microprocessor Peripheral Glue Logic, Custom State-Machine Controllers, Legacy Telecom Backplane Glue, Industrial Control Front-End, Legacy Instrumentation and Test Equipment.
PCI Bus Interface Bridge
The EPF6016TC1443N's 117 user I/Os and 5V-tolerant I/O banks are well-matched to classic 5V PCI bus bridging applications where a 32-bit parallel interface plus sideband signals must be protocol-translated to a local 3.3V or 5V peripheral bus. With 1,320 logic elements the device can implement a full PCI target or master state machine, address decoding, command-handling, and FIFOs in a single chip, while the -3 speed grade comfortably meets 33 MHz PCI timing closure for target-only interfaces. Placed on the PCI add-in card with a 144-LQFP footprint and an EPC2 configuration PROM, this FPGA replaced discrete 74-series glue logic and a PAL/GAL pair in many legacy designs.
Рекомендуется
Microprocessor Peripheral Glue Logic
In embedded systems pairing a microprocessor with multiple peripherals, the EPF6016TC1443N excels as a glue-logic replacement for dozens of 74-series TTL buffers, latches, transceivers, and address decoders. Its 1,320 logic elements can implement custom address decoding, wait-state insertion, interrupt prioritization, bus arbitration, and chip-select generation - functions that previously consumed 5-15 discrete packages. The 5V-tolerant I/Os let the FPGA bridge between a 5V processor bus and 3.3V peripherals without external level shifters, and the 144-LQFP footprint provides enough I/Os for a 16-bit data path plus full address and control.
Рекомендуется
Custom State-Machine Controllers
Complex multi-state control logic - such as industrial motor controllers, washing-machine sequencers, vending-machine controllers, and HVAC state machines - is a sweet spot for the EPF6016TC1443N. Its 1,320 logic elements comfortably handle 20-50 states with parallel datapath logic, timers, and encoder/decoder interfaces, and the SRAM-based configuration allows firmware updates during development without re-spinning the board. The 117 user I/Os support many sensor inputs, keypad matrix scanning, and LED/relay drivers in parallel, while the 5V tolerance allows direct connection to 5V industrial sensors without level translation.
Рекомендуется
Legacy Telecom Backplane Glue
Telecom backplanes from the late 1990s and early 2000s typically combined parallel data buses, framing logic, clock distribution, and alarm monitoring - all of which are well served by the EPF6016TC1443N's high I/O count and 5V signaling capability. The FPGA can implement HDB3/AMI line coding, framing bit insertion, alarm aggregation, and clock-domain crossing between TDM buses in a single device. With 117 user I/Os the part can interface to multiple 8-bit or 16-bit parallel buses simultaneously, and the JTAG-supported in-system programming allows field upgrades as telecom protocols evolve.
Рекомендуется
Industrial Control Front-End
Industrial control front-ends aggregating multiple sensor inputs, encoder counters, PWM outputs, and serial communication channels are a classic FLEX 6000 application. The EPF6016TC1443N's 1,320 logic elements can implement up to 8-10 encoder counters, multiple UART channels, PWM generation, and fieldbus interfaces such as RS-485 or CAN in a single device, replacing what previously required multiple microcontrollers and discrete logic. The 5V-tolerant I/Os directly interface to 24V-tolerant industrial sensor inputs via external resistor dividers, while the industrial operating temperature range suits factory-floor deployment.
Рекомендуется
Legacy Instrumentation and Test Equipment
Test-and-measurement instruments from the late 1990s often combined a microcontroller with custom digital signal conditioning, timing generators, and display drivers - functions that map naturally onto the EPF6016TC1443N. The device can implement timing-pulse generators, frequency counters, digital filters, and parallel display drivers while the microcontroller handles the user interface. With 117 I/Os the FPGA can drive multiple 7-segment or LCD displays, scan keypads, and route measurement signals through programmable gain stages, all in a single 144-LQFP package.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EPF6016TC1443N — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EPF6016TC144-3 | EPF6016TC144-3U | EPF6016TC144-3N | EPF6016TC144-2N | EPF6016TC144-2 | EPF6016ATC144-3N | EPF6016ATC144-3 |
|---|---|---|---|---|---|---|---|---|
| Package | 144-LQFP | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 1320 | 1320 | 1320 | 1320 | 1320 | 1320 | 1320 | 1320 |
| User I/Os | 117 | 117 | 117 | 117 | 117 | 117 | 117 | 117 |
| Speed Grade | -3 | -3 | -3 | -3 | -2 (faster) | -2 (faster) | -3 | -3 |
| Finish (Pb-free) | No (Pb-bearing) | No (Pb-bearing) | Yes (Pb-free) | Pb-free marking | Pb-free marking | No (Pb-bearing) | Pb-free marking | No (Pb-bearing) |
| Core Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Ключевые отличия
- Identical FLEX 6000 die with multiple speed-grade and finish options (против EPF6016TC144-3N)
- Faster -2 speed grade available in same package (против EPF6016TC144-2N)
- 5V-tolerant I/O banks supporting direct 5V peripheral connection (против EPF6010ATC144-3N)
Заметки по проектированию
The EPF6016TC1443N requires both a 5V VCCINT (core) supply and per-bank VCCIO supplies (3.3V or 5V depending on the I/O standard). Decouple each VCCINT pin with a 0.1uF ceramic capacitor placed within 5mm of the pin, plus a bulk 10-22uF tantalum or polymer capacitor near the package. Each VCCIO bank pin also requires 0.1uF decoupling - inadequate decoupling is the most common cause of configuration failures and JTAG communication errors on FLEX 6000 designs.
Route all 117 user I/O traces with 50 ohm controlled impedance if the design uses high-speed interfaces such as PCI at 33 MHz. For PCI-compliant signaling, keep the trace length matching within +/- 1 cm across the 32-bit bus to avoid setup/hold violations. Place the EPC configuration PROM adjacent to the FPGA's dedicated configuration pins (DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE) and route these traces short and away from switching signals to avoid configuration errors.
Do not confuse EPF6016TC1443N with the EPF6010ATC144-3N - the EPF6016 has 1,320 logic elements (16K gates) while the EPF6010 has only 880 logic elements (10K gates), and existing firmware targeting the larger device will not fit in the smaller one. Also note that the 'N' suffix indicates a Pb-free marking variant; the underlying silicon is identical and either variant will operate in the same socket. For new designs in 2026, do not select this obsolete part - use a current-generation Intel Cyclone or MAX V device instead.
Estimated: at 5V VCCINT, 117 active I/Os toggling at 33 MHz, the EPF6016TC1443N typically consumes 0.5-1.0W depending on toggle rate and I/O loading. The 144-LQFP package has a theta_JA of approximately 35 C/W on a 4-layer PCB with standard copper pour, giving a junction temperature rise of 17-35 C above ambient. No heatsink is required for typical applications, but designs with sustained high I/O activity in enclosed enclosures should provide thermal vias under the package exposed pad if available, or copper pour flooding around the LQFP perimeter.
Информация о соответствии
Pb-bearing finish (SnPb) - non-RoHS by default. REACH compliance assumed per Intel/legacy Altera documentation. AEC-Q100 not applicable to FPGAs. Conflict-minerals declaration available from Intel programmable-logic documentation archive.