Intel

EPF6016TC1443N - FLEX 6000 FPGA, 16K Gates, 117 I/O, 144-LQFP | Intel

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5 V Vdss 144-LQFP (TQFP) Package -3 Speed

À partir de $16.2 USD / unité

MOQ : 1 |

Prix mis à jour : 2026-09-11

Tarifs dégressifs

Qté	Prix unitaire	Total
1	$32.5	$32,50
10	$28.75	$287,50
100	$22.4	$2 240,00
500	$18.9	$9 450,00
1 000	$16.2	$16 200,00

ℹ️ Tous les prix sont en USD

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EPF6016TC1443N Présentation

The Intel EPF6016TC1443N is a FLEX 6000 family Field Programmable Gate Array (FPGA) delivering 16,000 gates and 1,320 logic elements/cells in a 144-pin LQFP package. The device provides 117 user I/Os organized across the package perimeter and operates from a 5V core supply with 3.3V/5V multi-voltage I/O support. The '-3' speed grade targets moderate-performance logic applications where cost-effective SRAM-based programmability is required.

A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the designer can reprogram after manufacture to implement arbitrary digital logic. Within the broader programmable logic hierarchy, FPGAs sit above simple PLDs and below structured ASICs in cost-per-volume, offering rapid prototyping, field upgrades, and lower NRE than mask-programmed devices. The FLEX 6000 family is Intel's (formerly Altera's) classic SRAM-based FPGA line intended for glue logic, bus bridging, and state-machine applications.

Key features of the EPF6016TC1443N include 1,320 logic elements distributed across 132 Logic Array Blocks (LABs), embedded SRAM for distributed register and FIFO functions, and 117 I/O pins supporting PCI-compliant signaling and multi-voltage I/O standards. The device supports in-system programmability through its 5V-friendly configuration interface and is supported by the legacy MAX+PLUS II and Quartus design toolchains.

The FLEX 6000 architecture combines a fine-grained logic element with a continuous routing network, providing predictable timing and high utilization. The 0.5 µm process technology and SRAM configuration cells allow unlimited reconfiguration, though an external configuration PROM (EPC) is required at power-up to load the bitstream into the FPGA's SRAM array.

Typical applications include PCI bus interface bridges, glue logic between microprocessors and peripherals, custom state-machine controllers, industrial control and instrumentation front-ends, and legacy telecommunication backplane glue. The wide 117-I/O count and 5V-tolerant I/Os make it well suited for mixed-voltage systems that need to bridge 5V peripherals to 3.3V cores.

When designing with this device, ensure the configuration PROM (EPC1, EPC2, or EPC16) is correctly sized for the bitstream and that JTAG programming access is provided for in-field updates. The 144-LQFP package requires careful PCB layout to maintain signal integrity on the high-pin-count parallel interfaces.

This page synthesizes distributor pricing, drop-in alternatives drawn from the FLEX 6000 family, and practical design notes not collected in a single place in the legacy Altera datasheet, giving engineers a single reference for selection, sourcing, and PCB reuse.

Alternatives de remplacement direct pour EPF6016TC1443N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EPF6016TC1443N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Configuration Method, Speed Grade, Process Technology.

EPF6016ATC144-3

Intel

Package: TQFP-144 (20 x 20 mm)

Operating Temperature: 0 °C to +85 °C (commercial)

Configuration Method: SRAM, ISP via JTAG or EPC2/EPC4 PROM