EPM570GF100C5N - MAX II 570 LE CPLD, 100-FBGA | Altera
Артикул: EPM570GF100C5N ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $18.97 | $18,97 |
| 10 | $17.45 | $174,50 |
| 100 | $15.2 | $1.520,00 |
| 500 | $13.1 | $6.550,00 |
| 1.000 | $11.65 | $11.650,00 |
EPM570GF100C5N Обзор
What is a MAX II CPLD? A Complex Programmable Logic Device is a non-volatile, instant-on programmable logic IC that implements glue logic, bus interfacing, state-machine control, and I/O expansion. The MAX II family uses a look-up-table (LUT) architecture backed by embedded Flash, distinguishing it from SRAM-based FPGAs that require external boot configuration. Within the broader taxonomy, the EPM570 sits in the CPLD -> programmable logic -> digital IC -> semiconductor family hierarchy, and is a low-cost, low-power alternative to small FPGAs for cost-sensitive glue-logic designs.
Key specifications include 440 macrocells, 76 user I/Os, a 1.8 V, 2.5 V, 3.3 V multi-voltage I/O interface with 5.0 V tolerant inputs, an internal core voltage of 1.8 V, and an industrial operating temperature range of -40C to +125C. The device supports in-system programmability via IEEE 1532 / IEEE 1149.1 JTAG and is fully RoHS compliant in a lead-free FBGA-100 package measuring 11 mm x 11 mm with a 1.0 mm ball pitch.
Architecturally, the EPM570 divides its 570 logic elements into four Logic Array Blocks (LABs), each with 16 macrocells, and connects them through a programmable interconnect array (PIA). Eight user I/O pins per LAB feed signals into the PIA, while the LAB outputs drive the global interconnect and I/O pins, providing predictable, deterministic timing that is characteristic of CPLDs.
Typical applications include bus bridging and glue logic in industrial controllers, I/O expansion for microcontrollers and ASICs, power-sequencing and reset distribution, LED drive multiplexing, and portable consumer devices where instant-on, low power, and small footprint are essential. The combination of Flash memory, JTAG ISP, and a small BGA footprint also makes the part attractive for space-constrained designs.
When designing with the EPM570GF100C5N, observe the multi-voltage I/O banking constraints of MAX II devices and consult the Quartus II support for the legacy MAX II tool flow. For new designs, consider MAX V (5M570ZE64C5N, 5M570ZT100C5N) as the recommended migration path with improved I/O support.
This page synthesizes distributor pricing, drop-in same-package MAX II alternatives, application references, and design notes not assembled in the manufacturer datasheet alone.
Аналоги без доработки для EPM570GF100C5N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EPM570GF100C5N (тот же форм-фактор и посадочное место) — отличается по Package, Programming Interface, Operating Temperature, Process Technology, RoHS Status.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EPM570F100C5N
✅ Прямая замена✓ В наличии
$5.2 / шт.
Открыть даташит →EPM570F100C4N
✅ Прямая замена✓ В наличии
$14.32 / шт.
Открыть даташит →EPM570F100I5N
✅ Прямая замена✓ В наличии
$13.4 / шт.
Открыть даташит →EPM1270GF100C5N
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
EPM570F256C5N
✅ Прямая замена✓ В наличии
$17.03 / шт.
Открыть даташит →EPM240GF100C5N
✅ Прямая замена✓ В наличии
$8.92 / шт.
Открыть даташит →EPM570GF100C5N Максимальные параметры и электрические характеристики
| Device Family | MAX II |
| Logic Elements | 570 |
| Macrocells | 440 |
| User I/Os | 76 |
| Propagation Delay (tPD) | 5.4 ns |
| Корпус | 100-LBGA (FBGA-100), 11 x 11 mm, 1.0 mm pitch |
| Configuration Memory | On-chip Flash (non-volatile) |
| Core Voltage | 1.8 V (internal) |
| I/O Voltage Support | 1.8 V / 2.5 V / 3.3 V (5.0 V tolerant inputs) |
| Рабочая температура | -40C to +125C (industrial) |
| Тип монтажа | Surface Mount |
| Programming Interface | IEEE 1532 / JTAG (IEEE 1149.1) ISP |
| Статус RoHS | Compliant (lead-free) |
| Logic Family / Process | CMOS, Flash-based LUT |
| LABs | 4 (16 macrocells per LAB) |
Конфигурация выводов EPM570GF100C5N
| Контакт 1 | I/O — User I/O pin (bank 1) |
| Контакт 2 | I/O — User I/O pin (bank 1) |
| Контакт 3 | I/O — User I/O pin (bank 1) |
| Контакт 4 | I/O — User I/O pin (bank 1) |
| Контакт 5 | I/O — User I/O pin (bank 1) |
| Контакт 6 | I/O — User I/O pin (bank 1) |
| Контакт 7 | I/O — User I/O pin (bank 1) |
| Контакт 8 | I/O — User I/O pin (bank 1) |
| Контакт 9 | I/O — User I/O pin (bank 1) |
| Контакт 10 | I/O — User I/O pin (bank 1) |
| Контакт 11 | GND — Ground |
| Контакт 12 | I/O — User I/O pin (bank 2) |
| Контакт 13 | I/O — User I/O pin (bank 2) |
| Контакт 14 | I/O — User I/O pin (bank 2) |
| Контакт 15 | I/O — User I/O pin (bank 2) |
| Контакт 16 | I/O — User I/O pin (bank 2) |
| Контакт 17 | I/O — User I/O pin (bank 2) |
| Контакт 18 | I/O — User I/O pin (bank 2) |
| Контакт 19 | I/O — User I/O pin (bank 2) |
| Контакт 20 | I/O — User I/O pin (bank 2) |
| Контакт 21 | I/O — User I/O pin (bank 2) |
| Контакт 22 | VCCIO1 — I/O bank 1 supply voltage (1.8/2.5/3.3 V) |
| Контакт 23 | I/O — User I/O pin (bank 1) |
| Контакт 24 | I/O — User I/O pin (bank 1) |
| Контакт 25 | I/O — User I/O pin (bank 1) |
| Контакт 26 | I/O — User I/O pin (bank 1) |
| Контакт 27 | I/O — User I/O pin (bank 1) |
| Контакт 28 | I/O — User I/O pin (bank 1) |
| Контакт 29 | I/O — User I/O pin (bank 1) |
| Контакт 30 | I/O — User I/O pin (bank 1) |
| Контакт 31 | I/O — User I/O pin (bank 1) |
| Контакт 32 | I/O — User I/O pin (bank 1) |
| Контакт 33 | GND — Ground |
| Контакт 34 | I/O — User I/O pin (bank 3) |
| Контакт 35 | I/O — User I/O pin (bank 3) |
| Контакт 36 | I/O — User I/O pin (bank 3) |
| Контакт 37 | I/O — User I/O pin (bank 3) |
| Контакт 38 | I/O — User I/O pin (bank 3) |
| Контакт 39 | I/O — User I/O pin (bank 3) |
| Контакт 40 | I/O — User I/O pin (bank 3) |
| Контакт 41 | I/O — User I/O pin (bank 3) |
| Контакт 42 | I/O — User I/O pin (bank 3) |
| Контакт 43 | I/O — User I/O pin (bank 3) |
| Контакт 44 | VCCIO3 — I/O bank 3 supply voltage (1.8/2.5/3.3 V) |
| Контакт 45 | I/O — User I/O pin (bank 3) |
| Контакт 46 | I/O — User I/O pin (bank 3) |
| Контакт 47 | I/O — User I/O pin (bank 3) |
| Контакт 48 | I/O — User I/O pin (bank 3) |
| Контакт 49 | I/O — User I/O pin (bank 3) |
| Контакт 50 | I/O — User I/O pin (bank 3) |
| Контакт 51 | I/O — User I/O pin (bank 3) |
| Контакт 52 | I/O — User I/O pin (bank 3) |
| Контакт 53 | I/O — User I/O pin (bank 3) |
| Контакт 54 | I/O — User I/O pin (bank 3) |
| Контакт 55 | GND — Ground |
| Контакт 56 | I/O — User I/O pin (bank 4) |
| Контакт 57 | I/O — User I/O pin (bank 4) |
| Контакт 58 | I/O — User I/O pin (bank 4) |
| Контакт 59 | I/O — User I/O pin (bank 4) |
| Контакт 60 | I/O — User I/O pin (bank 4) |
| Контакт 61 | I/O — User I/O pin (bank 4) |
| Контакт 62 | I/O — User I/O pin (bank 4) |
| Контакт 63 | I/O — User I/O pin (bank 4) |
| Контакт 64 | I/O — User I/O pin (bank 4) |
| Контакт 65 | I/O — User I/O pin (bank 4) |
| Контакт 66 | VCCIO4 — I/O bank 4 supply voltage (1.8/2.5/3.3 V) |
| Контакт 67 | I/O — User I/O pin (bank 4) |
| Контакт 68 | I/O — User I/O pin (bank 4) |
| Контакт 69 | I/O — User I/O pin (bank 4) |
| Контакт 70 | I/O — User I/O pin (bank 4) |
| Контакт 71 | I/O — User I/O pin (bank 4) |
| Контакт 72 | I/O — User I/O pin (bank 4) |
| Контакт 73 | I/O — User I/O pin (bank 4) |
| Контакт 74 | I/O — User I/O pin (bank 4) |
| Контакт 75 | I/O — User I/O pin (bank 4) |
| Контакт 76 | I/O — User I/O pin (bank 4) |
| Контакт 77 | GND — Ground |
| Контакт 78 | TDI — JTAG Test Data In |
| Контакт 79 | TMS — JTAG Test Mode Select |
| Контакт 80 | TCK — JTAG Test Clock |
| Контакт 81 | TDO — JTAG Test Data Out |
| Контакт 82 | nCONFIG — Configuration control (active-low) |
| Контакт 83 | nSTATUS — Configuration status (active-low) |
| Контакт 84 | CONF_DONE — Configuration done indicator |
| Контакт 85 | VCCINT — Internal core supply (1.8 V) |
| Контакт 86 | GND — Ground |
| Контакт 87 | VCCIO2 — I/O bank 2 supply voltage (1.8/2.5/3.3 V) |
| Контакт 88 | I/O — User I/O pin (bank 2) |
| Контакт 89 | I/O — User I/O pin (bank 2) |
| Контакт 90 | I/O — User I/O pin (bank 2) |
| Контакт 91 | I/O — User I/O pin (bank 2) |
| Контакт 92 | I/O — User I/O pin (bank 2) |
| Контакт 93 | I/O — User I/O pin (bank 2) |
| Контакт 94 | I/O — User I/O pin (bank 2) |
| Контакт 95 | I/O — User I/O pin (bank 2) |
| Контакт 96 | I/O — User I/O pin (bank 2) |
| Контакт 97 | I/O — User I/O pin (bank 2) |
| Контакт 98 | GND — Ground |
| Контакт 99 | VCCIO1 — I/O bank 1 supply voltage (1.8/2.5/3.3 V) |
| Контакт 100 | VCCINT — Internal core supply (1.8 V) |
Типичное применение
EPM570GF100C5N подходит для 6 применениеs: Industrial Glue Logic and Bus Bridging, I/O Expansion for Microcontrollers, Power Sequencing and Reset Distribution, Portable Consumer and Handheld Devices, LED Display Multiplexing and Drive, Legacy System Replacement and Obsolescence Management.
Industrial Glue Logic and Bus Bridging
The EPM570GF100C5N is widely used as glue logic in industrial controllers where deterministic pin-to-pin timing (5.4 ns tPD) and instant-on Flash configuration are essential. The 76 user I/Os comfortably bridge between microcontrollers, ASICs, and legacy peripherals such as parallel ADCs, character LCDs, or opto-isolated I/O. With 1.8/2.5/3.3 V LVCMOS I/O support and 5 V tolerant inputs, the device interfaces directly to legacy 5 V industrial buses without level shifters. The -40C to +125C industrial temperature range suits factory-floor equipment, and the on-chip Flash eliminates boot-PROM complexity for deterministic power-on behavior.
Рекомендуется
I/O Expansion for Microcontrollers
Adding I/O to a microcontroller is a classic CPLD use case, and the EPM570GF100C5N with 76 user I/Os handles PWM generation, quadrature decoding, and shift-register multiplexing that would otherwise consume scarce MCU pins. The deterministic 5.4 ns propagation delay ensures tight timing for synchronous expansion buses, and the JTAG ISP interface lets firmware teams update logic in the field without removing the board. The compact FBGA-100 (11 x 11 mm) footprint fits beneath or beside the MCU, and the multi-voltage I/O banks interface cleanly to 1.8 V, 3.3 V, and 5 V mixed-signal designs common in IoT edge nodes.
Рекомендуется
Power Sequencing and Reset Distribution
Power-rail sequencing and reset signal distribution are ideal MAX II CPLD applications because of their instant-on Flash memory and configurable output-enable logic. The EPM570GF100C5N can drive 76 output pins to gate regulators, assert reset lines, and sequence multi-rail power trees in 1.8 V / 2.5 V / 3.3 V domains. Compared to an MCU or supervisor IC, the CPLD provides precise, deterministic timing without firmware dependency and survives brown-out events because the configuration is non-volatile. The FBGA-100 package fits into compact PMIC companion boards.
Рекомендуется
Portable Consumer and Handheld Devices
The EPM570GF100C5N's low quiescent power, instant-on Flash, and small 11 x 11 mm BGA footprint make it suitable for portable consumer products where battery life and board area are at a premium. Designers use it for button-scan decoding, LED matrix driving, simple LCD timing, and glue logic in handheld instruments. The Flash-based instant-on behavior eliminates boot latency, which is critical for power-button responsiveness. Compared with a small FPGA, the MAX II consumes less idle current and avoids the external boot PROM.
Рекомендуется
LED Display Multiplexing and Drive
Driving multiplexed LED arrays and seven-segment displays is a classic CPLD application where the EPM570GF100C5N's 76 I/Os and deterministic timing shine. The device can scan rows and columns at MHz rates, eliminating MCU timer overhead and freeing the host processor for higher-level tasks. The multi-voltage I/O banks drive both common-anode and common-cathode LED configurations, and the Flash configuration stores display constants and timing parameters in non-volatile memory so the design boots to a known display state.
Рекомендуется
Legacy System Replacement and Obsolescence Management
The EPM570GF100C5N is a key part for maintaining installed-base industrial and telecom equipment that was designed around the MAX II family. Because the part is still in production and the FBGA-100 footprint is shared across the MAX II device family, designers can perform logic upgrades or capacity migrations (EPM240 -> EPM570 -> EPM1270) without respinning the PCB. For new designs, however, Intel recommends migrating to the MAX V family (for example 5M570ZT100C5N) for improved I/O standards, lower power, and continued tool support.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EPM570GF100C5N — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EPM570F100C5N | EPM570F100C4N | EPM570F100I5N | EPM1270GF100C5N | EPM570F256C5N | EPM240GF100C5N |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | FBGA-100 (11x11 mm, 1.0 mm pitch) | FBGA-100 (11x11 mm) - same | FBGA-100 (11x11 mm) - same | FBGA-100 (11x11 mm) - same | FBGA-100 (11x11 mm) - same | FBGA-256 - different | FBGA-100 (11x11 mm) - same |
| Logic Elements | 570 | 570 | 570 | 570 | 1270 | 570 | 240 |
| Macrocells | 440 | 440 | 440 | 440 | 980 | 440 | 192 |
| User I/Os | 76 | 76 | 76 | 76 | 76 | 160 | 80 |
| tPD (ns) | 5.4 ns | 5.4 ns | 7.0 ns (slower) | 5.4 ns | 6.0 ns | 5.4 ns | 4.5 ns |
| Operating Temperature | -40C to +125C | 0C to +85C (commercial) | 0C to +85C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| RoHS Compliance | Yes (lead-free) | No (contains Pb) | No (contains Pb) | No (contains Pb) | Yes (lead-free) | No (contains Pb) | Yes (lead-free) |
Ключевые отличия
- Higher logic capacity in the same footprint (против EPM240GF100C5N)
- RoHS-compliant lead-free packaging (против EPM570F100C5N)
- Industrial temperature range (против EPM570F100C4N)
Заметки по проектированию
The EPM570GF100C5N requires two distinct supply rails: VCCINT for the internal core (1.8 V typical) and VCCIO1/VCCIO2/VCCIO3/VCCIO4 for each I/O bank (1.8/2.5/3.3 V). Decouple each VCCIO bank with a 0.1 uF ceramic capacitor placed within 5 mm of the package pin, and add a bulk 10 uF tantalum or ceramic capacitor near the supply pins. Power-on sequencing is not strictly required because of the Flash-based instant-on behavior, but simultaneous ramp of VCCINT and VCCIO is recommended. Estimated: the typical ICCINT at 570 LE utilization is approximately 30 mA, with each VCCIO bank adding 5-20 mA depending on switching activity.
The 100-ball FBGA package uses a 1.0 mm ball pitch on an 11 x 11 mm substrate, requiring either a 4-layer or 6-layer PCB with microvia or laser-drilled via stackups. Use a non-solder-mask-defined (NSMD) land pad with a 0.45 mm diameter for reliable assembly. Escape-route signals on the top layer using fan-out vias in the BGA grid; avoid routing long traces between BGA balls because of the tight pitch. Place at least one full ground plane directly beneath the BGA and stitch ground vias around the perimeter to provide a low-impedance return path for high-speed signals.
Do not exceed the absolute maximum VCCIO of 4.6 V or the 5.0 V tolerant input voltage limit on any user I/O pin. When interfacing to a 5 V bus, configure the I/O standard as 3.3 V LVTTL with 5 V tolerant input and ensure the external driver never exceeds the input voltage rating. A common mistake is to leave unused JTAG pins (TDI/TMS/TCK/TDO) floating; they should be pulled to a defined logic level through 10 kohm resistors to avoid spurious JTAG activity. Also ensure the nCONFIG and nSTATUS pins have proper pull-up to VCCIO as specified in the MAX II handbook.
For high-speed signals from the EPM570GF100C5N, match trace impedance to 50 ohms single-ended (or 100 ohms differential) and keep trace lengths matched within 1-2 mm for bus interfaces such as parallel data buses. Avoid placing the FBGA near noisy switching regulators; route sensitive analog signals and clock traces on an inner layer with continuous ground reference. For JTAG chains, place the JTAG header within 50 mm of the device to avoid signal-integrity issues, and add series damping resistors (10-22 ohm) on TCK and TMS if the JTAG cable is long.
Информация о соответствии
RoHS compliant per the 'G' suffix in the part number (green/lead-free FBGA-100 package). Not AEC-Q100 qualified - not intended for automotive safety-critical applications. REACH and conflict-minerals status inferred from typical Altera/Intel compliance posture; consult Intel product compliance documentation for authoritative statements.
