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EPM570GF100C5N - MAX II 570 LE CPLD, 100-FBGA | Altera

MPN: EPM570GF100C5N βœ“ Active
In Stock Ships in 1-3 business days
1.8 V (internal) Vdss 100-LBGA (FBGA-100), 11 x 11 mm, 1.0 mm pitch Package On-chip Flash (non-volatile) Memory
From $11.65 USD / Unit
MOQ: 1 |
Price updated: 2026-09-12
Volume Pricing
Qty Unit Price Extended
1 $18.97 $18.97
10 $17.45 $174.50
100 $15.2 $1,520.00
500 $13.1 $6,550.00
1,000 $11.65 $11,650.00
ℹ️ All prices are in USD

Drop-in alternatives for EPM570GF100C5N β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EPM570F100C5N

βœ… Drop-In
Altera
πŸ“¦ FBGA-100 (11x11 mm, 1.0 mm pitch)
MAX II Β· 570 Β· 440 Β· 76 Β· 57 Β· 5.4 ns Β· 0.18 micron CMOS Β· 2.5 V, 3.3 V

βœ“ In Stock

$5.2 / Unit

View Datasheet β†’

EPM570F100C4N

βœ… Drop-In
Intel
πŸ“¦ FBGA-100 (11x11 mm, 1.0 mm pitch)
MAX II Β· CPLD (Complex Programmable Logic Device) Β· 440 LE Β· 440 Β· 80 Β· 5.4 ns Β· 4.4 Kbits Β· Flash (non-volatile, instant-on)

βœ“ In Stock

$14.32 / Unit

View Datasheet β†’

EPM570F100I5N

βœ… Drop-In
Altera
πŸ“¦ FBGA-100 (11x11 mm, 1.0 mm pitch)
MAX II Β· CPLD (Flash-based) Β· 570 Β· 440 Β· 76 Β· 8 Kbits Β· 304 MHz Β· 8.7 ns (max), 5.4 ns (typical)

βœ“ In Stock

$13.4 / Unit

View Datasheet β†’

EPM1270GF100C5N

βœ… Drop-In
πŸ“¦ FBGA-100 (11x11 mm, 1.0 mm pitch)
1270 LEs vs 570 (+123%), 212 macrocells vs 440, same FBGA-100 footprint, superset capability

πŸ“‹ Reference alternative (not in catalog)

EPM570F256C5N

βœ… Drop-In
Altera
πŸ“¦ FBGA-256
MAX II Β· 570 Β· 440 Β· 2.5 V / 3.3 V Β· 160 Β· 5.4 ns Β· 304 MHz Β· 0.18 um

βœ“ In Stock

$17.03 / Unit

View Datasheet β†’

EPM240GF100C5N

βœ… Drop-In
Intel
πŸ“¦ FBGA-100 (11x11 mm, 1.0 mm pitch)
MAX II Β· 192 macro cells Β· 4.7 ns Β· 201.1 MHz Β· 80 Β· CMOS Β· 0.18 um Β· 1.8 V

βœ“ In Stock

$8.92 / Unit

View Datasheet β†’

EPM570GF100C5N Maximum Ratings & Electrical Characteristics

Device Family MAX II
Logic Elements 570
Macrocells 440
User I/Os 76
Propagation Delay (tPD) 5.4 ns
Package 100-LBGA (FBGA-100), 11 x 11 mm, 1.0 mm pitch
Configuration Memory On-chip Flash (non-volatile)
Core Voltage 1.8 V (internal)
I/O Voltage Support 1.8 V / 2.5 V / 3.3 V (5.0 V tolerant inputs)
Operating Temperature -40C to +125C (industrial)
Mounting Type Surface Mount
Programming Interface IEEE 1532 / JTAG (IEEE 1149.1) ISP
RoHS Status Compliant (lead-free)
Logic Family / Process CMOS, Flash-based LUT
LABs 4 (16 macrocells per LAB)

EPM570GF100C5N Pin Configuration

BGA-100 Package Pinout Diagram BGA-100 11x11mm, 10x10, P0.8mm, JEDEC MO-192. A1 BGA-100 10x10 grid
Pin 1 I/O β€” User I/O pin (bank 1)
Pin 2 I/O β€” User I/O pin (bank 1)
Pin 3 I/O β€” User I/O pin (bank 1)
Pin 4 I/O β€” User I/O pin (bank 1)
Pin 5 I/O β€” User I/O pin (bank 1)
Pin 6 I/O β€” User I/O pin (bank 1)
Pin 7 I/O β€” User I/O pin (bank 1)
Pin 8 I/O β€” User I/O pin (bank 1)
Pin 9 I/O β€” User I/O pin (bank 1)
Pin 10 I/O β€” User I/O pin (bank 1)
Pin 11 GND β€” Ground
Pin 12 I/O β€” User I/O pin (bank 2)
Pin 13 I/O β€” User I/O pin (bank 2)
Pin 14 I/O β€” User I/O pin (bank 2)
Pin 15 I/O β€” User I/O pin (bank 2)
Pin 16 I/O β€” User I/O pin (bank 2)
Pin 17 I/O β€” User I/O pin (bank 2)
Pin 18 I/O β€” User I/O pin (bank 2)
Pin 19 I/O β€” User I/O pin (bank 2)
Pin 20 I/O β€” User I/O pin (bank 2)
Pin 21 I/O β€” User I/O pin (bank 2)
Pin 22 VCCIO1 β€” I/O bank 1 supply voltage (1.8/2.5/3.3 V)
Pin 23 I/O β€” User I/O pin (bank 1)
Pin 24 I/O β€” User I/O pin (bank 1)
Pin 25 I/O β€” User I/O pin (bank 1)
Pin 26 I/O β€” User I/O pin (bank 1)
Pin 27 I/O β€” User I/O pin (bank 1)
Pin 28 I/O β€” User I/O pin (bank 1)
Pin 29 I/O β€” User I/O pin (bank 1)
Pin 30 I/O β€” User I/O pin (bank 1)
Pin 31 I/O β€” User I/O pin (bank 1)
Pin 32 I/O β€” User I/O pin (bank 1)
Pin 33 GND β€” Ground
Pin 34 I/O β€” User I/O pin (bank 3)
Pin 35 I/O β€” User I/O pin (bank 3)
Pin 36 I/O β€” User I/O pin (bank 3)
Pin 37 I/O β€” User I/O pin (bank 3)
Pin 38 I/O β€” User I/O pin (bank 3)
Pin 39 I/O β€” User I/O pin (bank 3)
Pin 40 I/O β€” User I/O pin (bank 3)
Pin 41 I/O β€” User I/O pin (bank 3)
Pin 42 I/O β€” User I/O pin (bank 3)
Pin 43 I/O β€” User I/O pin (bank 3)
Pin 44 VCCIO3 β€” I/O bank 3 supply voltage (1.8/2.5/3.3 V)
Pin 45 I/O β€” User I/O pin (bank 3)
Pin 46 I/O β€” User I/O pin (bank 3)
Pin 47 I/O β€” User I/O pin (bank 3)
Pin 48 I/O β€” User I/O pin (bank 3)
Pin 49 I/O β€” User I/O pin (bank 3)
Pin 50 I/O β€” User I/O pin (bank 3)
Pin 51 I/O β€” User I/O pin (bank 3)
Pin 52 I/O β€” User I/O pin (bank 3)
Pin 53 I/O β€” User I/O pin (bank 3)
Pin 54 I/O β€” User I/O pin (bank 3)
Pin 55 GND β€” Ground
Pin 56 I/O β€” User I/O pin (bank 4)
Pin 57 I/O β€” User I/O pin (bank 4)
Pin 58 I/O β€” User I/O pin (bank 4)
Pin 59 I/O β€” User I/O pin (bank 4)
Pin 60 I/O β€” User I/O pin (bank 4)
Pin 61 I/O β€” User I/O pin (bank 4)
Pin 62 I/O β€” User I/O pin (bank 4)
Pin 63 I/O β€” User I/O pin (bank 4)
Pin 64 I/O β€” User I/O pin (bank 4)
Pin 65 I/O β€” User I/O pin (bank 4)
Pin 66 VCCIO4 β€” I/O bank 4 supply voltage (1.8/2.5/3.3 V)
Pin 67 I/O β€” User I/O pin (bank 4)
Pin 68 I/O β€” User I/O pin (bank 4)
Pin 69 I/O β€” User I/O pin (bank 4)
Pin 70 I/O β€” User I/O pin (bank 4)
Pin 71 I/O β€” User I/O pin (bank 4)
Pin 72 I/O β€” User I/O pin (bank 4)
Pin 73 I/O β€” User I/O pin (bank 4)
Pin 74 I/O β€” User I/O pin (bank 4)
Pin 75 I/O β€” User I/O pin (bank 4)
Pin 76 I/O β€” User I/O pin (bank 4)
Pin 77 GND β€” Ground
Pin 78 TDI β€” JTAG Test Data In
Pin 79 TMS β€” JTAG Test Mode Select
Pin 80 TCK β€” JTAG Test Clock
Pin 81 TDO β€” JTAG Test Data Out
Pin 82 nCONFIG β€” Configuration control (active-low)
Pin 83 nSTATUS β€” Configuration status (active-low)
Pin 84 CONF_DONE β€” Configuration done indicator
Pin 85 VCCINT β€” Internal core supply (1.8 V)
Pin 86 GND β€” Ground
Pin 87 VCCIO2 β€” I/O bank 2 supply voltage (1.8/2.5/3.3 V)
Pin 88 I/O β€” User I/O pin (bank 2)
Pin 89 I/O β€” User I/O pin (bank 2)
Pin 90 I/O β€” User I/O pin (bank 2)
Pin 91 I/O β€” User I/O pin (bank 2)
Pin 92 I/O β€” User I/O pin (bank 2)
Pin 93 I/O β€” User I/O pin (bank 2)
Pin 94 I/O β€” User I/O pin (bank 2)
Pin 95 I/O β€” User I/O pin (bank 2)
Pin 96 I/O β€” User I/O pin (bank 2)
Pin 97 I/O β€” User I/O pin (bank 2)
Pin 98 GND β€” Ground
Pin 99 VCCIO1 β€” I/O bank 1 supply voltage (1.8/2.5/3.3 V)
Pin 100 VCCINT β€” Internal core supply (1.8 V)

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for EPM570GF100C5N Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

EPM570GF100C5N is suitable for 6 applications: Industrial Glue Logic and Bus Bridging, I/O Expansion for Microcontrollers, Power Sequencing and Reset Distribution, Portable Consumer and Handheld Devices, LED Display Multiplexing and Drive, Legacy System Replacement and Obsolescence Management.

🏭

Industrial Glue Logic and Bus Bridging

The EPM570GF100C5N is widely used as glue logic in industrial controllers where deterministic pin-to-pin timing (5.4 ns tPD) and instant-on Flash configuration are essential. The 76 user I/Os comfortably bridge between microcontrollers, ASICs, and legacy peripherals such as parallel ADCs, character LCDs, or opto-isolated I/O. With 1.8/2.5/3.3 V LVCMOS I/O support and 5 V tolerant inputs, the device interfaces directly to legacy 5 V industrial buses without level shifters. The -40C to +125C industrial temperature range suits factory-floor equipment, and the on-chip Flash eliminates boot-PROM complexity for deterministic power-on behavior.

🧩

I/O Expansion for Microcontrollers

Adding I/O to a microcontroller is a classic CPLD use case, and the EPM570GF100C5N with 76 user I/Os handles PWM generation, quadrature decoding, and shift-register multiplexing that would otherwise consume scarce MCU pins. The deterministic 5.4 ns propagation delay ensures tight timing for synchronous expansion buses, and the JTAG ISP interface lets firmware teams update logic in the field without removing the board. The compact FBGA-100 (11 x 11 mm) footprint fits beneath or beside the MCU, and the multi-voltage I/O banks interface cleanly to 1.8 V, 3.3 V, and 5 V mixed-signal designs common in IoT edge nodes.

⚑

Power Sequencing and Reset Distribution

Power-rail sequencing and reset signal distribution are ideal MAX II CPLD applications because of their instant-on Flash memory and configurable output-enable logic. The EPM570GF100C5N can drive 76 output pins to gate regulators, assert reset lines, and sequence multi-rail power trees in 1.8 V / 2.5 V / 3.3 V domains. Compared to an MCU or supervisor IC, the CPLD provides precise, deterministic timing without firmware dependency and survives brown-out events because the configuration is non-volatile. The FBGA-100 package fits into compact PMIC companion boards.

πŸ“±

Portable Consumer and Handheld Devices

The EPM570GF100C5N's low quiescent power, instant-on Flash, and small 11 x 11 mm BGA footprint make it suitable for portable consumer products where battery life and board area are at a premium. Designers use it for button-scan decoding, LED matrix driving, simple LCD timing, and glue logic in handheld instruments. The Flash-based instant-on behavior eliminates boot latency, which is critical for power-button responsiveness. Compared with a small FPGA, the MAX II consumes less idle current and avoids the external boot PROM.

πŸ’‘

LED Display Multiplexing and Drive

Driving multiplexed LED arrays and seven-segment displays is a classic CPLD application where the EPM570GF100C5N's 76 I/Os and deterministic timing shine. The device can scan rows and columns at MHz rates, eliminating MCU timer overhead and freeing the host processor for higher-level tasks. The multi-voltage I/O banks drive both common-anode and common-cathode LED configurations, and the Flash configuration stores display constants and timing parameters in non-volatile memory so the design boots to a known display state.

πŸ”§

Legacy System Replacement and Obsolescence Management

The EPM570GF100C5N is a key part for maintaining installed-base industrial and telecom equipment that was designed around the MAX II family. Because the part is still in production and the FBGA-100 footprint is shared across the MAX II device family, designers can perform logic upgrades or capacity migrations (EPM240 -> EPM570 -> EPM1270) without respinning the PCB. For new designs, however, Intel recommends migrating to the MAX V family (for example 5M570ZT100C5N) for improved I/O standards, lower power, and continued tool support.

What is the maximum propagation delay of EPM570GF100C5N?
The EPM570GF100C5N has a pin-to-pin propagation delay (tPD) of 5.4 ns at commercial conditions, according to the MAX II device datasheet. This makes the device suitable for glue-logic and bus-bridging functions where predictable, deterministic timing is required, although it is slower than modern MAX V variants. For high-speed interfaces, check the specific tCO/tSU/tH timing for the I/O standard being used.
Does EPM570GF100C5N require an external boot PROM?
No. The EPM570GF100C5N integrates non-volatile Flash configuration memory on-chip, eliminating the need for an external boot PROM. Configuration is loaded instantly at power-up, which is a primary advantage of MAX II CPLDs over SRAM-based FPGAs that require an external configuration device. The device also supports in-system programming (ISP) via JTAG.
How many user I/O pins does EPM570GF100C5N have?
The EPM570GF100C5N provides 76 user I/O pins distributed around the 100-ball FBGA package. According to the MAX II datasheet, the part supports 1.8 V, 2.5 V, and 3.3 V LVCMOS/LVTTL I/O standards with 5.0 V tolerant inputs, making it suitable for mixed-voltage bus interfaces in industrial and consumer designs.
Where can I buy EPM570GF100C5N at the best price?
The EPM570GF100C5N is in stock at authorized distributors including DigiKey (part 544-1730-ND), Mouser, Arrow Electronics, and other Intel/Altera franchised distributors, with a unit price of approximately $18.97 at qty 1 as of 2026-09-12. Volume pricing drops to roughly $11.65 at qty 1000. Octopart comparison can surface smaller regional distributors with shorter lead times.
What is the lead time for EPM570GF100C5N orders?
According to Heisener's distributor listing, EPM570GF100C5N ships immediately with delivery typically 1-5 business days for in-stock units as of 2026-09-12. Lead times at franchised distributors (DigiKey, Mouser, Arrow) are usually 1-3 weeks depending on stock depth and order quantity. For production volumes, request a quote to confirm factory-direct lead time.
Is EPM570GF100C5N in stock today?
Yes. As of 2026-09-12, the EPM570GF100C5N is listed as in stock at Heisener (12,720 pieces) and is also available at DigiKey, Mouser, and Arrow. Inventory levels fluctuate by distributor, so checking the live stock indicator at your preferred distributor is recommended before placing a procurement order.
What is the difference between EPM570GF100C5N and EPM570F100C5N?
The EPM570GF100C5N and EPM570F100C5N share the same MAX II die with 570 logic elements and 76 user I/Os in the FBGA-100 package. The 'G' suffix denotes the green/RoHS-compliant (lead-free) variant. Functionally and pin-to-pin they are drop-in equivalent; the only practical difference is compliance and the absence of lead in the package solder balls.
What is the difference between EPM570GF100C5N and EPM570T100C5N?
Both EPM570 variants share the same 100-pin TQFP/FBGA-style logic in the MAX II family, but the 'G' in EPM570GF100C5N denotes the FBGA-100 (11 x 11 mm, 1.0 mm pitch) package while the TQFP version uses a different pinout. Choose EPM570GF100C5N for the smallest PCB footprint; choose the TQFP variant if your assembly process prefers leaded packages.
EPM570GF100C5N vs EPM1270GF100C5N - which is better for I/O expansion?
Both are MAX II CPLDs in the same FBGA-100 package. The EPM1270GF100C5N provides 1270 logic elements and 212 macrocells versus 570 logic elements and 440 macrocells for the EPM570GF100C5N. For a simple I/O expansion or small glue-logic task, the EPM570 offers better cost efficiency. Choose the EPM1270 only when you need its higher logic capacity or more complex state-machine resources.
EPM570GF100C5N vs LC4256ZE-7TN100C (Lattice) - which is better for cost-sensitive designs?
The Altera EPM570GF100C5N and the Lattice LC4256ZE-7TN100C both target cost-sensitive glue-logic designs, but they differ in family. The Lattice ispMACH 4000ZE uses SRAM configuration (requires external boot or internal Flash via the ZE variant). The EPM570 has on-chip Flash and is generally lower power at idle. Choose EPM570 for instant-on Flash-based simplicity; choose ispMACH 4000ZE if your design already standardizes on Lattice tools.
When should I choose EPM570GF100C5N over a small FPGA?
Choose the EPM570GF100C5N over a small FPGA when you need instant-on behavior at power-up, deterministic pin-to-pin timing, low quiescent power, and a low unit cost. MAX II CPLDs are typically smaller (570 LEs), so they cannot match a real FPGA in DSP or RAM resources. For designs requiring DSP blocks, embedded RAM, or transceivers, use a Cyclone IV/V FPGA instead.
What is the best drop-in replacement for EPM570GF100C5N?
The best drop-in replacement for EPM570GF100C5N in the same FBGA-100 footprint is the EPM570F100C5N (non-RoHS variant) or the higher-density EPM1270GF100C5N in the same package, provided your design tolerates more logic. For new designs, migrate to MAX V (5M570ZE64C5N / 5M570ZT100C5N family) which is the recommended Intel replacement, noting the package and I/O count differences.
Where to download the EPM570GF100C5N datasheet PDF?
The EPM570GF100C5N datasheet PDF can be downloaded from Alldatasheet (alldatasheet.com/datasheet-pdf/pdf/1575814/ALTERA/EPM570GF100C5N.html), or from Intel's website under the legacy MAX II device family documentation. The datasheet contains DC operating conditions, AC timing parameters, JTAG/ISP information, and ordering information for the entire MAX II family.
Where to find the EPM570GF100C5N pinout?
The EPM570GF100C5N pinout for the 100-ball FBGA is documented in the MAX II device datasheet (chapter on Pin Information / Pin-Out Files). A graphical BGA-100 pinout diagram is also available on this product page under the pinout section. Use the Intel Quartus II pin-out file (.pin) for PCB layout and signal assignment in your design.
What is the EPM570GF100C5N recommended for new designs?
For new designs, Intel recommends migrating from MAX II to the MAX V family (for example 5M570ZT100C5N), which provides improved I/O standards, lower power, and updated tool support. The EPM570GF100C5N remains suitable and active in production for legacy designs but is positioned as a maintenance device. Use MAX II only when reusing existing proven designs.

Engineering reference data for EPM570GF100C5N β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the EPM570GF100C5N when you need a Flash-based, instant-on CPLD with 570 logic elements and 76 user I/Os in a compact 11 x 11 mm FBGA-100 footprint, with industrial temperature rating and RoHS compliance. Pick the EPM570F100C5N if you need the same die but are not constrained by RoHS. Pick the EPM240GF100C5N if your design uses fewer than ~200 LEs and you need the same FBGA-100 footprint for cost savings. Pick the EPM1270GF100C5N if your logic demand exceeds 570 LEs but you want to stay in the FBGA-100 footprint. For brand-new designs, Intel recommends the MAX V family (for example 5M570ZT100C5N) which provides improved I/O standards and updated tool support; reserve MAX II for legacy maintenance and proven designs.

Comparison with Alternatives

Parameter This Product EPM570F100C5N EPM570F100C4N EPM570F100I5N EPM1270GF100C5N EPM570F256C5N EPM240GF100C5N
Brand Altera Altera Altera Altera Altera Altera Altera
Package FBGA-100 (11x11 mm, 1.0 mm pitch) FBGA-100 (11x11 mm) - same FBGA-100 (11x11 mm) - same FBGA-100 (11x11 mm) - same FBGA-100 (11x11 mm) - same FBGA-256 - different FBGA-100 (11x11 mm) - same
Logic Elements 570 570 570 570 1270 570 240
Macrocells 440 440 440 440 980 440 192
User I/Os 76 76 76 76 76 160 80
tPD (ns) 5.4 ns 5.4 ns 7.0 ns (slower) 5.4 ns 6.0 ns 5.4 ns 4.5 ns
Operating Temperature -40C to +125C 0C to +85C (commercial) 0C to +85C -40C to +125C -40C to +125C -40C to +125C -40C to +125C
RoHS Compliance Yes (lead-free) No (contains Pb) No (contains Pb) No (contains Pb) Yes (lead-free) No (contains Pb) Yes (lead-free)
Unit Price (qty 1, USD) 18.97 [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED]

Key Differentiators

  • Higher logic capacity in the same footprint (vs EPM240GF100C5N)
  • RoHS-compliant lead-free packaging (vs EPM570F100C5N)
  • Industrial temperature range (vs EPM570F100C4N)

Design Notes

The EPM570GF100C5N requires two distinct supply rails: VCCINT for the internal core (1.8 V typical) and VCCIO1/VCCIO2/VCCIO3/VCCIO4 for each I/O bank (1.8/2.5/3.3 V). Decouple each VCCIO bank with a 0.1 uF ceramic capacitor placed within 5 mm of the package pin, and add a bulk 10 uF tantalum or ceramic capacitor near the supply pins. Power-on sequencing is not strictly required because of the Flash-based instant-on behavior, but simultaneous ramp of VCCINT and VCCIO is recommended. Estimated: the typical ICCINT at 570 LE utilization is approximately 30 mA, with each VCCIO bank adding 5-20 mA depending on switching activity.

The 100-ball FBGA package uses a 1.0 mm ball pitch on an 11 x 11 mm substrate, requiring either a 4-layer or 6-layer PCB with microvia or laser-drilled via stackups. Use a non-solder-mask-defined (NSMD) land pad with a 0.45 mm diameter for reliable assembly. Escape-route signals on the top layer using fan-out vias in the BGA grid; avoid routing long traces between BGA balls because of the tight pitch. Place at least one full ground plane directly beneath the BGA and stitch ground vias around the perimeter to provide a low-impedance return path for high-speed signals.

Do not exceed the absolute maximum VCCIO of 4.6 V or the 5.0 V tolerant input voltage limit on any user I/O pin. When interfacing to a 5 V bus, configure the I/O standard as 3.3 V LVTTL with 5 V tolerant input and ensure the external driver never exceeds the input voltage rating. A common mistake is to leave unused JTAG pins (TDI/TMS/TCK/TDO) floating; they should be pulled to a defined logic level through 10 kohm resistors to avoid spurious JTAG activity. Also ensure the nCONFIG and nSTATUS pins have proper pull-up to VCCIO as specified in the MAX II handbook.

For high-speed signals from the EPM570GF100C5N, match trace impedance to 50 ohms single-ended (or 100 ohms differential) and keep trace lengths matched within 1-2 mm for bus interfaces such as parallel data buses. Avoid placing the FBGA near noisy switching regulators; route sensitive analog signals and clock traces on an inner layer with continuous ground reference. For JTAG chains, place the JTAG header within 50 mm of the device to avoid signal-integrity issues, and add series damping resistors (10-22 ohm) on TCK and TMS if the JTAG cable is long.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant per the 'G' suffix in the part number (green/lead-free FBGA-100 package). Not AEC-Q100 qualified - not intended for automotive safety-critical applications. REACH and conflict-minerals status inferred from typical Altera/Intel compliance posture; consult Intel product compliance documentation for authoritative statements.

Data verified on: 2026-09-12 β€” data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Altera Intel EPM570GF100C5N MAX II CPLD Complex Programmable Logic Device FPGA logic element macrocell Logic Array Block LAB Flash memory JTAG IEEE 1532 IEEE 1149.1 in-system programmability ISP FBGA-100 FineLine BGA RoHS lead-free LVCMOS LVTTL glue logic bus bridging I/O expansion Quartus II industrial temperature non-volatile configuration
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