EPM570M100C5N - 440 Macrocell MAX II CPLD, 100-MBGA | Intel
Артикул: EPM570M100C5N ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $18.4 | $18,40 |
| 10 | $16.55 | $165,50 |
| 100 | $13.92 | $1.392,00 |
| 250 | $12.6 | $3.150,00 |
| 500 | $11.85 | $5.925,00 |
EPM570M100C5N Обзор
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines the instant-on behavior of a PAL/GAL with the density and routability of a small FPGA. Within the broader hierarchy of programmable logic, CPLD sits between discrete 74-series glue logic and high-density FPGAs, providing deterministic timing, low standby power, and a single-chip solution for bus decoding, I/O expansion, and power-up control. The MAX II family specifically targets glue-logic replacement with MultiVolt I/O support, on-chip User Flash Memory (UFM), and JTAG-based in-system programmability.
Key features of the EPM570M100C5N include 8 Kbits of UFM for non-volatile user data, MultiVolt I/O supporting 1.5V/1.8V/2.5V/3.3V interfaces, a 2.5V/3.3V core, JTAG (IEEE 1149.1) and ISP support, plus a commercial operating temperature grade (0C to +85C). The device is built on a 0.18 um, 6-layer-metal flash process and consumes standby current in the microamp range, suiting it to power-sensitive designs.
Architecturally, MAX II uses a logic-element array with a continuous, non-segmented interconnect that delivers predictable, deterministic timing - critical for control applications such as address decoding, bus bridging, and reset distribution. The on-chip flash stores the configuration, so the device starts in a known state within microseconds of power-up, removing the external configuration memory required by SRAM-based FPGAs.
Typical applications include bus interface bridging, I/O expansion for microcontrollers and ASSPs, address/command decoding in DDR memory subsystems, power-sequencer and reset-controller logic, peripheral glue-logic replacement, and protocol bridging (UART, SPI, I2C, parallel). The wide MultiVolt I/O makes it especially useful when bridging a 1.8V processor to 3.3V peripherals.
When designing with the EPM570M100C5N, note that the 100-MBGA package requires a 4-layer PCB with microvia technology or a 6-layer stack-up for fan-out routing, plus proper thermal relief on the ball pads. All unused I/O pins should be configured as outputs driving a defined logic level to minimize quiescent current.
This page synthesizes distributor pricing, drop-in alternatives within the EPM570 pin-compatible family, and practical PCB/glue-logic design notes that complement (rather than duplicate) the manufacturer datasheet.
Аналоги без доработки для EPM570M100C5N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EPM570M100C5N (тот же форм-фактор и посадочное место) — отличается по Operating Temperature, Package, Process Technology, Programming Interface, Configuration Memory.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EPM570M100C4N
✅ Прямая замена✓ В наличии
$14.95 / шт.
Открыть даташит →EPM570GM100C5N
✅ Прямая замена✓ В наличии
$10.4 / шт.
Открыть даташит →EPM570GM100I5N
✅ Прямая замена✓ В наличии
$8.55 / шт.
Открыть даташит →EPM570GF100C5N
✅ Прямая замена✓ В наличии
$11.65 / шт.
Открыть даташит →EPM570F100C5N
✅ Прямая замена✓ В наличии
$5.2 / шт.
Открыть даташит →EPM570F100I5N
✅ Прямая замена✓ В наличии
$13.4 / шт.
Открыть даташит →EPM570M100C5N Максимальные параметры и электрические характеристики
| Family | MAX II |
| Series | EPM570 |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macrocell Count | 440 |
| Logic Elements | 570 |
| User I/Os | 76 |
| Количество выводов | 100 |
| Корпус | 100-MBGA (FineLine BGA, 6 x 6 mm, 0.5 mm pitch) |
| Maximum Frequency (fMAX) | 201.1 MHz |
| Pin-to-Pin Propagation Delay | 5.4 ns |
| Operating Supply Voltage (Core) | 2.5 V / 3.3 V |
| I/O Voltage Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| On-Chip User Flash Memory (UFM) | 8 Kbits |
| Process Technology | 0.18 um, 6-layer-metal flash |
| Programming Interface | JTAG (IEEE 1149.1) and ISP |
| Диапазон рабочих температур | 0 C to +85 C (Commercial) |
| Тип монтажа | Surface Mount (BGA) |
| Статус RoHS | Lead-Free / Compliant |
Руководство по цоколевке EPM570M100C5N в корпусе 100-mbga (fineline bga, 6 x 6 mm, 0.5 mm pitch)
Цоколевка для EPM570M100C5N (корпус 100-mbga (fineline bga, 6 x 6 mm, 0.5 mm pitch)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для EPM570M100C5N.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
EPM570M100C5N подходит для 6 применениеs: Bus Interface Bridging and I/O Expansion, Power Sequencing and Reset Distribution, DDR Memory Address/Command Decoding, Industrial Control and Factory Automation, Communication Protocol Bridging (UART/SPI/I2C to Parallel), Display and LED Matrix Driving.
Bus Interface Bridging and I/O Expansion
The EPM570M100C5N is well-suited as a glue-logic bridge between processors and peripherals because it offers 76 MultiVolt I/Os that natively support 1.5V/1.8V/2.5V/3.3V interfaces without external level shifters. Its 440 macrocells easily absorb address decoders, chip-select generators, and interrupt controllers for legacy 8/16-bit bus attachment to modern SoCs, while the 5.4 ns pin-to-pin delay keeps bus-cycle latency low. Place the CPLD between the processor and multiple peripherals to consolidate 74-series glue logic into a single re-programmable device, simplifying board layout and BOM. The on-chip UFM (8 Kbits) can hold boot options or board revision metadata for traceability.
Рекомендуется
Power Sequencing and Reset Distribution
The EPM570M100C5N's instant-on, non-volatile flash-based configuration makes it ideal for power-rail sequencing in multi-supply systems. On power-up, the device enters a known state within microseconds - no external boot PROM or configuration flash is required - so it can immediately assert reset signals, enable DC-DC converters, and gate MOSFETs in the correct order. With 76 user I/Os and 440 macrocells, the same CPLD can sequence 6-8 independent rails, monitor power-good flags, and latch fault conditions. The deterministic 5.4 ns pin-to-pin delay gives predictable timing margins for sequencing windows, which is critical for processors requiring strict supply ramp order.
Рекомендуется
DDR Memory Address/Command Decoding
For DDR2/DDR3 memory subsystems, the EPM570M100C5N can host the address and command decoding logic that sits between the memory controller and the DRAM, including chip-select generation, bank-address steering, and clock-enable control. The 201.1 MHz fMAX and 5.4 ns propagation delay comfortably meet DDR command timing budgets at 200-266 MHz clock rates. The MultiVolt I/O (1.5V/1.8V/2.5V/3.3V) allows direct interfacing with DDR2 SSTL-18 and DDR3 drivers. Because the configuration is non-volatile, the decoder state is deterministic at power-up, avoiding the unpredictable boot-time behavior seen with SRAM-based FPGAs.
Рекомендуется
Industrial Control and Factory Automation
In factory-automation controllers, the EPM570M100C5N serves as a deterministic logic concentrator that consolidates discrete I/O handling, encoder counters, and protocol translation (e.g., SPI to parallel). The 76 user I/Os interface with 24V-to-3.3V opto-isolated inputs on the field side while driving logic-level outputs back to the controller. Industrial designs benefit from the deterministic timing of CPLDs (no jitter from SRAM configuration), enabling reliable PWM generation, quadrature decoding, and interrupt edge detection. The 0C to +85C commercial temperature range covers most cabinet-mounted equipment; for outdoor or motor-control enclosures, the EPM570GM100I5N industrial variant extends to -40C to +100C.
Рекомендуется
Communication Protocol Bridging (UART/SPI/I2C to Parallel)
The EPM570M100C5N's 440 macrocells and 76 I/Os make it a good fit for protocol-bridging tasks such as converting multiple UART streams into a single parallel bus, expanding SPI slave selects, or implementing custom I2C-to-parallel adapters for legacy peripherals. The on-chip UFM (8 Kbits) can store device descriptors or address tables for the bridge. At 201.1 MHz internal fMAX, the device supports UART baud rates up to 10 Mbps and SPI clocks above 50 MHz with proper constraint settings, leaving headroom for status/state-machine logic alongside the protocol converters.
Рекомендуется
Display and LED Matrix Driving
For LED-matrix signage, character-LCD multiplexers, and small TFT display controllers, the EPM570M100C5N provides the deterministic timing needed to refresh rows or columns at uniform brightness without the visual artifacts that microsecond-level jitter can introduce. Its 76 user I/Os are enough to drive 8-12 multiplexed common-anode LED rows plus 8 column-driver enable lines. The 5.4 ns propagation delay permits refresh rates above 1 kHz for typical matrices, eliminating visible flicker. The MultiVolt I/O simplifies direct connection to both 3.3V driver ICs and 5V legacy LCD modules in mixed-supply designs.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EPM570M100C5N — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EPM570M100C4N | EPM570GM100C5N | EPM570GM100I5N | EPM570GF100C5N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 100-MBGA (6x6 mm) | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same |
| Macrocell Count | 440 | 440 | 440 | 440 | 440 |
| User I/Os | 76 | 76 | 76 | 76 | 76 |
| Speed Grade | C5 (5.4 ns tPD) | C4 (faster) | C5 | I5 (industrial) | C5 |
| Operating Temperature | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) |
| Core Voltage | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| RoHS / Lead-Free | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) |
Ключевые отличия
- Same-package industrial-grade drop-in option (против EPM570GM100I5N)
- Same-package faster speed-grade upgrade (против EPM570M100C4N)
- Functionally equivalent variant with identical density (против EPM570GM100C5N)
Заметки по проектированию
The 100-MBGA package (6 x 6 mm, 0.5 mm pitch) requires PCB microvia technology for fan-out routing. Use a 4-layer stack-up with HDI (laser-drilled) microvias from the BGA pads to inner signal layers, OR a 6-layer stack-up with conventional through-vias and dog-bone fan-out. Each BGA ball needs a non-solder-mask-defined (NSMD) land pad of approximately 0.30 mm diameter with a 0.50 mm pitch via. Maintain a clear keep-out of at least 0.4 mm from the package edge to the first routing track. X-ray inspection after reflow is recommended to verify joint integrity because the BGA balls are hidden under the package.
All unused I/O pins on the MAX II CPLD must be configured as outputs driving a defined logic level (high or low) rather than left as inputs. Unconfigured inputs float, causing shoot-through current in the I/O cell and increasing quiescent current draw by hundreds of microamperes per pin. In Quartus II, enable the 'Reserve all unused pins' setting under Device Options -> Unused Pins, and choose 'As output driving ground' or 'As output driving an unspecified signal' as the default state. Also, configure JTAG pins (TCK/TMS/TDO/TDI) appropriately if JTAG is not used: TMS and TDI require internal pull-ups that Quartus enables automatically when JTAG is disabled in the pin assignments.
The MAX II CPLD requires both a core supply (VCCINT, 3.3V or 2.5V) and one or more I/O supplies (VCCIO, supporting 1.5V/1.8V/2.5V/3.3V). Decoupling should follow the Altera reference: place one 0.1 uF X7R ceramic capacitor per VCCINT pin and one 0.1 uF per VCCIO bank, all within 3 mm of the respective BGA ball. Add a bulk 10 uF tantalum or ceramic capacitor near each supply pin. When the I/O bank is configured for 1.5V SSTL signaling, the reference voltage (VREF) requires its own decoupling of 0.1 uF + 10 uF at the bank supply pins. Power-rail sequencing (VCCINT before VCCIO, or vice versa) is not strictly required for MAX II, but matching the application datasheet recommendation of VCCINT at least 1.0V before VCCIO avoids I/O-cell latch-up risk on hot-plug events.
Информация о соответствии
RoHS compliant per manufacturer declaration. Not AEC-Q100 qualified; the MAX II family is not targeted at automotive safety-critical applications. For automotive, evaluate MAX 10 or Cyclone IV/E families. Halogen-free status not explicitly stated in the verified web data; set to 'unknown' rather than guessing.
