EPM570GF100C5N - MAX II 570 LE CPLD, 100-FBGA | Altera
Référence : EPM570GF100C5N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.97 | $18,97 |
| 10 | $17.45 | $174,50 |
| 100 | $15.2 | $1 520,00 |
| 500 | $13.1 | $6 550,00 |
| 1 000 | $11.65 | $11 650,00 |
EPM570GF100C5N Présentation
What is a MAX II CPLD? A Complex Programmable Logic Device is a non-volatile, instant-on programmable logic IC that implements glue logic, bus interfacing, state-machine control, and I/O expansion. The MAX II family uses a look-up-table (LUT) architecture backed by embedded Flash, distinguishing it from SRAM-based FPGAs that require external boot configuration. Within the broader taxonomy, the EPM570 sits in the CPLD -> programmable logic -> digital IC -> semiconductor family hierarchy, and is a low-cost, low-power alternative to small FPGAs for cost-sensitive glue-logic designs.
Key specifications include 440 macrocells, 76 user I/Os, a 1.8 V, 2.5 V, 3.3 V multi-voltage I/O interface with 5.0 V tolerant inputs, an internal core voltage of 1.8 V, and an industrial operating temperature range of -40C to +125C. The device supports in-system programmability via IEEE 1532 / IEEE 1149.1 JTAG and is fully RoHS compliant in a lead-free FBGA-100 package measuring 11 mm x 11 mm with a 1.0 mm ball pitch.
Architecturally, the EPM570 divides its 570 logic elements into four Logic Array Blocks (LABs), each with 16 macrocells, and connects them through a programmable interconnect array (PIA). Eight user I/O pins per LAB feed signals into the PIA, while the LAB outputs drive the global interconnect and I/O pins, providing predictable, deterministic timing that is characteristic of CPLDs.
Typical applications include bus bridging and glue logic in industrial controllers, I/O expansion for microcontrollers and ASICs, power-sequencing and reset distribution, LED drive multiplexing, and portable consumer devices where instant-on, low power, and small footprint are essential. The combination of Flash memory, JTAG ISP, and a small BGA footprint also makes the part attractive for space-constrained designs.
When designing with the EPM570GF100C5N, observe the multi-voltage I/O banking constraints of MAX II devices and consult the Quartus II support for the legacy MAX II tool flow. For new designs, consider MAX V (5M570ZE64C5N, 5M570ZT100C5N) as the recommended migration path with improved I/O support.
This page synthesizes distributor pricing, drop-in same-package MAX II alternatives, application references, and design notes not assembled in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EPM570GF100C5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM570GF100C5N (même facteur de forme et même empreinte) — différant par Package, Programming Interface, Operating Temperature, Process Technology, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM570F100C5N
✅ Remplacement direct✓ En stock
$5.2 / unité
Voir la fiche technique →EPM570F100C4N
✅ Remplacement direct✓ En stock
$14.32 / unité
Voir la fiche technique →EPM570F100I5N
✅ Remplacement direct✓ En stock
$13.4 / unité
Voir la fiche technique →EPM1270GF100C5N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM570F256C5N
✅ Remplacement direct✓ En stock
$17.03 / unité
Voir la fiche technique →EPM240GF100C5N
✅ Remplacement direct✓ En stock
$8.92 / unité
Voir la fiche technique →EPM570GF100C5N Valeurs maximales et caractéristiques électriques
| Device Family | MAX II |
| Logic Elements | 570 |
| Macrocells | 440 |
| User I/Os | 76 |
| Propagation Delay (tPD) | 5.4 ns |
| Boîtier | 100-LBGA (FBGA-100), 11 x 11 mm, 1.0 mm pitch |
| Configuration Memory | On-chip Flash (non-volatile) |
| Core Voltage | 1.8 V (internal) |
| I/O Voltage Support | 1.8 V / 2.5 V / 3.3 V (5.0 V tolerant inputs) |
| Température de fonctionnement | -40C to +125C (industrial) |
| Type de montage | Surface Mount |
| Programming Interface | IEEE 1532 / JTAG (IEEE 1149.1) ISP |
| Statut RoHS | Compliant (lead-free) |
| Logic Family / Process | CMOS, Flash-based LUT |
| LABs | 4 (16 macrocells per LAB) |
Configuration des broches de EPM570GF100C5N
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O pin (bank 2) |
| Broche 13 | I/O — User I/O pin (bank 2) |
| Broche 14 | I/O — User I/O pin (bank 2) |
| Broche 15 | I/O — User I/O pin (bank 2) |
| Broche 16 | I/O — User I/O pin (bank 2) |
| Broche 17 | I/O — User I/O pin (bank 2) |
| Broche 18 | I/O — User I/O pin (bank 2) |
| Broche 19 | I/O — User I/O pin (bank 2) |
| Broche 20 | I/O — User I/O pin (bank 2) |
| Broche 21 | I/O — User I/O pin (bank 2) |
| Broche 22 | VCCIO1 — I/O bank 1 supply voltage (1.8/2.5/3.3 V) |
| Broche 23 | I/O — User I/O pin (bank 1) |
| Broche 24 | I/O — User I/O pin (bank 1) |
| Broche 25 | I/O — User I/O pin (bank 1) |
| Broche 26 | I/O — User I/O pin (bank 1) |
| Broche 27 | I/O — User I/O pin (bank 1) |
| Broche 28 | I/O — User I/O pin (bank 1) |
| Broche 29 | I/O — User I/O pin (bank 1) |
| Broche 30 | I/O — User I/O pin (bank 1) |
| Broche 31 | I/O — User I/O pin (bank 1) |
| Broche 32 | I/O — User I/O pin (bank 1) |
| Broche 33 | GND — Ground |
| Broche 34 | I/O — User I/O pin (bank 3) |
| Broche 35 | I/O — User I/O pin (bank 3) |
| Broche 36 | I/O — User I/O pin (bank 3) |
| Broche 37 | I/O — User I/O pin (bank 3) |
| Broche 38 | I/O — User I/O pin (bank 3) |
| Broche 39 | I/O — User I/O pin (bank 3) |
| Broche 40 | I/O — User I/O pin (bank 3) |
| Broche 41 | I/O — User I/O pin (bank 3) |
| Broche 42 | I/O — User I/O pin (bank 3) |
| Broche 43 | I/O — User I/O pin (bank 3) |
| Broche 44 | VCCIO3 — I/O bank 3 supply voltage (1.8/2.5/3.3 V) |
| Broche 45 | I/O — User I/O pin (bank 3) |
| Broche 46 | I/O — User I/O pin (bank 3) |
| Broche 47 | I/O — User I/O pin (bank 3) |
| Broche 48 | I/O — User I/O pin (bank 3) |
| Broche 49 | I/O — User I/O pin (bank 3) |
| Broche 50 | I/O — User I/O pin (bank 3) |
| Broche 51 | I/O — User I/O pin (bank 3) |
| Broche 52 | I/O — User I/O pin (bank 3) |
| Broche 53 | I/O — User I/O pin (bank 3) |
| Broche 54 | I/O — User I/O pin (bank 3) |
| Broche 55 | GND — Ground |
| Broche 56 | I/O — User I/O pin (bank 4) |
| Broche 57 | I/O — User I/O pin (bank 4) |
| Broche 58 | I/O — User I/O pin (bank 4) |
| Broche 59 | I/O — User I/O pin (bank 4) |
| Broche 60 | I/O — User I/O pin (bank 4) |
| Broche 61 | I/O — User I/O pin (bank 4) |
| Broche 62 | I/O — User I/O pin (bank 4) |
| Broche 63 | I/O — User I/O pin (bank 4) |
| Broche 64 | I/O — User I/O pin (bank 4) |
| Broche 65 | I/O — User I/O pin (bank 4) |
| Broche 66 | VCCIO4 — I/O bank 4 supply voltage (1.8/2.5/3.3 V) |
| Broche 67 | I/O — User I/O pin (bank 4) |
| Broche 68 | I/O — User I/O pin (bank 4) |
| Broche 69 | I/O — User I/O pin (bank 4) |
| Broche 70 | I/O — User I/O pin (bank 4) |
| Broche 71 | I/O — User I/O pin (bank 4) |
| Broche 72 | I/O — User I/O pin (bank 4) |
| Broche 73 | I/O — User I/O pin (bank 4) |
| Broche 74 | I/O — User I/O pin (bank 4) |
| Broche 75 | I/O — User I/O pin (bank 4) |
| Broche 76 | I/O — User I/O pin (bank 4) |
| Broche 77 | GND — Ground |
| Broche 78 | TDI — JTAG Test Data In |
| Broche 79 | TMS — JTAG Test Mode Select |
| Broche 80 | TCK — JTAG Test Clock |
| Broche 81 | TDO — JTAG Test Data Out |
| Broche 82 | nCONFIG — Configuration control (active-low) |
| Broche 83 | nSTATUS — Configuration status (active-low) |
| Broche 84 | CONF_DONE — Configuration done indicator |
| Broche 85 | VCCINT — Internal core supply (1.8 V) |
| Broche 86 | GND — Ground |
| Broche 87 | VCCIO2 — I/O bank 2 supply voltage (1.8/2.5/3.3 V) |
| Broche 88 | I/O — User I/O pin (bank 2) |
| Broche 89 | I/O — User I/O pin (bank 2) |
| Broche 90 | I/O — User I/O pin (bank 2) |
| Broche 91 | I/O — User I/O pin (bank 2) |
| Broche 92 | I/O — User I/O pin (bank 2) |
| Broche 93 | I/O — User I/O pin (bank 2) |
| Broche 94 | I/O — User I/O pin (bank 2) |
| Broche 95 | I/O — User I/O pin (bank 2) |
| Broche 96 | I/O — User I/O pin (bank 2) |
| Broche 97 | I/O — User I/O pin (bank 2) |
| Broche 98 | GND — Ground |
| Broche 99 | VCCIO1 — I/O bank 1 supply voltage (1.8/2.5/3.3 V) |
| Broche 100 | VCCINT — Internal core supply (1.8 V) |
Applications typiques
EPM570GF100C5N convient pour 6 applications: Industrial Glue Logic and Bus Bridging, I/O Expansion for Microcontrollers, Power Sequencing and Reset Distribution, Portable Consumer and Handheld Devices, LED Display Multiplexing and Drive, Legacy System Replacement and Obsolescence Management.
Industrial Glue Logic and Bus Bridging
The EPM570GF100C5N is widely used as glue logic in industrial controllers where deterministic pin-to-pin timing (5.4 ns tPD) and instant-on Flash configuration are essential. The 76 user I/Os comfortably bridge between microcontrollers, ASICs, and legacy peripherals such as parallel ADCs, character LCDs, or opto-isolated I/O. With 1.8/2.5/3.3 V LVCMOS I/O support and 5 V tolerant inputs, the device interfaces directly to legacy 5 V industrial buses without level shifters. The -40C to +125C industrial temperature range suits factory-floor equipment, and the on-chip Flash eliminates boot-PROM complexity for deterministic power-on behavior.
Recommandé
I/O Expansion for Microcontrollers
Adding I/O to a microcontroller is a classic CPLD use case, and the EPM570GF100C5N with 76 user I/Os handles PWM generation, quadrature decoding, and shift-register multiplexing that would otherwise consume scarce MCU pins. The deterministic 5.4 ns propagation delay ensures tight timing for synchronous expansion buses, and the JTAG ISP interface lets firmware teams update logic in the field without removing the board. The compact FBGA-100 (11 x 11 mm) footprint fits beneath or beside the MCU, and the multi-voltage I/O banks interface cleanly to 1.8 V, 3.3 V, and 5 V mixed-signal designs common in IoT edge nodes.
Recommandé
Power Sequencing and Reset Distribution
Power-rail sequencing and reset signal distribution are ideal MAX II CPLD applications because of their instant-on Flash memory and configurable output-enable logic. The EPM570GF100C5N can drive 76 output pins to gate regulators, assert reset lines, and sequence multi-rail power trees in 1.8 V / 2.5 V / 3.3 V domains. Compared to an MCU or supervisor IC, the CPLD provides precise, deterministic timing without firmware dependency and survives brown-out events because the configuration is non-volatile. The FBGA-100 package fits into compact PMIC companion boards.
Recommandé
Portable Consumer and Handheld Devices
The EPM570GF100C5N's low quiescent power, instant-on Flash, and small 11 x 11 mm BGA footprint make it suitable for portable consumer products where battery life and board area are at a premium. Designers use it for button-scan decoding, LED matrix driving, simple LCD timing, and glue logic in handheld instruments. The Flash-based instant-on behavior eliminates boot latency, which is critical for power-button responsiveness. Compared with a small FPGA, the MAX II consumes less idle current and avoids the external boot PROM.
Recommandé
LED Display Multiplexing and Drive
Driving multiplexed LED arrays and seven-segment displays is a classic CPLD application where the EPM570GF100C5N's 76 I/Os and deterministic timing shine. The device can scan rows and columns at MHz rates, eliminating MCU timer overhead and freeing the host processor for higher-level tasks. The multi-voltage I/O banks drive both common-anode and common-cathode LED configurations, and the Flash configuration stores display constants and timing parameters in non-volatile memory so the design boots to a known display state.
Recommandé
Legacy System Replacement and Obsolescence Management
The EPM570GF100C5N is a key part for maintaining installed-base industrial and telecom equipment that was designed around the MAX II family. Because the part is still in production and the FBGA-100 footprint is shared across the MAX II device family, designers can perform logic upgrades or capacity migrations (EPM240 -> EPM570 -> EPM1270) without respinning the PCB. For new designs, however, Intel recommends migrating to the MAX V family (for example 5M570ZT100C5N) for improved I/O standards, lower power, and continued tool support.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM570GF100C5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM570F100C5N | EPM570F100C4N | EPM570F100I5N | EPM1270GF100C5N | EPM570F256C5N | EPM240GF100C5N |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | FBGA-100 (11x11 mm, 1.0 mm pitch) | FBGA-100 (11x11 mm) - same | FBGA-100 (11x11 mm) - same | FBGA-100 (11x11 mm) - same | FBGA-100 (11x11 mm) - same | FBGA-256 - different | FBGA-100 (11x11 mm) - same |
| Logic Elements | 570 | 570 | 570 | 570 | 1270 | 570 | 240 |
| Macrocells | 440 | 440 | 440 | 440 | 980 | 440 | 192 |
| User I/Os | 76 | 76 | 76 | 76 | 76 | 160 | 80 |
| tPD (ns) | 5.4 ns | 5.4 ns | 7.0 ns (slower) | 5.4 ns | 6.0 ns | 5.4 ns | 4.5 ns |
| Operating Temperature | -40C to +125C | 0C to +85C (commercial) | 0C to +85C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| RoHS Compliance | Yes (lead-free) | No (contains Pb) | No (contains Pb) | No (contains Pb) | Yes (lead-free) | No (contains Pb) | Yes (lead-free) |
Principaux différenciateurs
- Higher logic capacity in the same footprint (vs EPM240GF100C5N)
- RoHS-compliant lead-free packaging (vs EPM570F100C5N)
- Industrial temperature range (vs EPM570F100C4N)
Notes de conception
The EPM570GF100C5N requires two distinct supply rails: VCCINT for the internal core (1.8 V typical) and VCCIO1/VCCIO2/VCCIO3/VCCIO4 for each I/O bank (1.8/2.5/3.3 V). Decouple each VCCIO bank with a 0.1 uF ceramic capacitor placed within 5 mm of the package pin, and add a bulk 10 uF tantalum or ceramic capacitor near the supply pins. Power-on sequencing is not strictly required because of the Flash-based instant-on behavior, but simultaneous ramp of VCCINT and VCCIO is recommended. Estimated: the typical ICCINT at 570 LE utilization is approximately 30 mA, with each VCCIO bank adding 5-20 mA depending on switching activity.
The 100-ball FBGA package uses a 1.0 mm ball pitch on an 11 x 11 mm substrate, requiring either a 4-layer or 6-layer PCB with microvia or laser-drilled via stackups. Use a non-solder-mask-defined (NSMD) land pad with a 0.45 mm diameter for reliable assembly. Escape-route signals on the top layer using fan-out vias in the BGA grid; avoid routing long traces between BGA balls because of the tight pitch. Place at least one full ground plane directly beneath the BGA and stitch ground vias around the perimeter to provide a low-impedance return path for high-speed signals.
Do not exceed the absolute maximum VCCIO of 4.6 V or the 5.0 V tolerant input voltage limit on any user I/O pin. When interfacing to a 5 V bus, configure the I/O standard as 3.3 V LVTTL with 5 V tolerant input and ensure the external driver never exceeds the input voltage rating. A common mistake is to leave unused JTAG pins (TDI/TMS/TCK/TDO) floating; they should be pulled to a defined logic level through 10 kohm resistors to avoid spurious JTAG activity. Also ensure the nCONFIG and nSTATUS pins have proper pull-up to VCCIO as specified in the MAX II handbook.
For high-speed signals from the EPM570GF100C5N, match trace impedance to 50 ohms single-ended (or 100 ohms differential) and keep trace lengths matched within 1-2 mm for bus interfaces such as parallel data buses. Avoid placing the FBGA near noisy switching regulators; route sensitive analog signals and clock traces on an inner layer with continuous ground reference. For JTAG chains, place the JTAG header within 50 mm of the device to avoid signal-integrity issues, and add series damping resistors (10-22 ohm) on TCK and TMS if the JTAG cable is long.
Informations de conformité
RoHS compliant per the 'G' suffix in the part number (green/lead-free FBGA-100 package). Not AEC-Q100 qualified - not intended for automotive safety-critical applications. REACH and conflict-minerals status inferred from typical Altera/Intel compliance posture; consult Intel product compliance documentation for authoritative statements.
