NXP Semiconductors

MCF5307CAI66B - ColdFire V3 32-bit MPU 66MHz | NXP Semiconductors

Name: MCF5307CAI66B - ColdFire V3 32-bit MPU 66MHz | NXP Semiconductors
Brand: NXP Semiconductors
SKU: MCF5307CAI66B
Price: 34.8 USD
Availability: InStock

Артикул: MCF5307CAI66B ⚠ Последняя закупка

В наличии Отправка в течение 1–3 рабочих дней

3.3 V Vdss 208-FQFP (28x28 mm) Package 66 MHz Speed ROMless Memory

От $34.8 USD / шт.

MOQ: 1 |

Цена обновлена: 2026-10-17

Оптовые цены

Кол-во	Цена за ед.	Итого
1	$43.63	$43,63
10	$41.2	$412,00
100	$38.9	$3.890,00
500	$36.5	$18.250,00
1.000	$34.8	$34.800,00

ℹ️ Все цены указаны в USD

Открыть datasheet (PDF) Смотреть аналоги

Количество

MCF5307CAI66B Обзор

The NXP Semiconductors MCF5307CAI66B is a 32-bit ColdFire V3 microprocessor running at 66 MHz (up to 70 MIPS), housed in a 208-pin FQFP (28x28 mm) tray package. It is a high-performance, cost-effective, highly integrated MPU designed for embedded control applications, combining a ColdFire V3 core with a multiply-accumulate (MAC) module, DRAM controller, DMA controller, timers, and parallel/serial interfaces.

A microprocessor (MPU) is an integrated circuit that contains the CPU, control unit, and on-chip peripherals in a single device. Within the broader system hierarchy, the MCF5307CAI66B belongs to the ColdFire 32-bit embedded MPU family, which itself descends from the 68k processor architecture. ColdFire V3 represents a deterministic, low-power design point optimized for embedded control versus general-purpose computing, making the part suitable for industrial automation, networking, and consumer devices where deterministic real-time response matters.

Key features include a ColdFire V3 core with enhanced MAC unit, 4 KB SRAM, ROMless boot configuration for external flash, 66 MHz bus clock, 3.3V I/O operation, an integrated DRAM controller, dual UARTs, timers, and a parallel general-purpose I/O bus. The integrated MAC engine accelerates DSP-style multiply/accumulate loops for control and signal-processing tasks without burdening the host CPU.

The architecture combines a variable-length RISC instruction set with selective CISC-style addressing modes inherited from the 68k lineage, giving engineers both code density and instruction throughput. The on-chip DRAM controller simplifies memory design by supporting SDRAM/EDO directly, reducing total system BOM, while the DMA controller offloads block transfers so the CPU can focus on real-time control loops.

Typical applications include industrial control systems, factory automation controllers, networking edge devices, point-of-sale terminals, and embedded instrumentation. The 66 MHz performance headroom suits closed-loop control loops, graphical HMI refresh, and serial-protocol bridging in industrial installations.

Design considerations include 3.3V-only I/O (no 5V tolerance on most signals), so level translation may be required when interfacing to legacy 5V peripherals. Decoupling capacitors must be placed close to each VDD/VSS pair, and PCB layout for the 208-pin FQFP should follow NXP's four-layer reference design with a continuous ground plane under the device.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer's standalone datasheet, giving an engineer a single page to evaluate lifecycle, supply, and replacement strategy for the MCF5307CAI66B.

Аналоги без доработки для MCF5307CAI66B — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с MCF5307CAI66B (тот же форм-фактор и посадочное место) — отличается по On-chip SRAM, Program Memory Type, Maximum Clock Frequency, Package, Core Architecture.

MCF5307AI66B

NXP Semiconductors

Program Memory Type: ROMless

Сравнить с MCF5307CAI66B →

MCF5307FT66B

NXP Semiconductors

On-chip SRAM: 4 KB (4K x 8)

Program Memory Type: ROMless (external memory required)

Core Architecture: ColdFire V3 (MCF530x)

Сравнить с MCF5307CAI66B →

MCF5329CVM240

NXP Semiconductors

On-chip SRAM: 32 KB

Program Memory Type: ROMless (external memory bus required)

Maximum Clock Frequency: 240 MHz

Сравнить с MCF5307CAI66B →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

MCF5307AI66B

✅ Прямая замена

NXP Semiconductors

📦 208-FQFP (28x28)

ColdFire V3 (MCF530x) · 32-Bit · 66 MHz · 70 MIPS · ROMless · 4 KB SRAM · EBI/EMI, I2C, UART/USART · DMA, POR, WDT

✓ В наличии

$36.49 / шт.

Открыть даташит →

MCF5307FT66B

✅ Прямая замена

NXP Semiconductors

📦 208-FQFP (28x28)

ColdFire V3 (MCF530x) · 32-bit · 66 MHz · ROMless (external memory required) · 4 KB (4K x 8) · 16 · External · 208-BFQFP (28x28 mm)

✓ В наличии

$16.8 / шт.

Открыть даташит →

MCF5307CFT66B

✅ Прямая замена

📦 208-FQFP (28x28)

same MCF5307C silicon, CFT vs CAI suffix denotes tape-and-reel packaging variant on identical die and footprint

📋 Справочный аналог (нет в каталоге)

MCF5329CVM240

✅ Прямая замена

NXP Semiconductors

📦 208-FQFP (28x28)

ColdFire V3 (VLRISC) · 32-bit · 240 MHz · 32 KB · 16 KB write-back · ROMless (external memory bus required) · 94 · 256-LBGA (MAPBGA)

✓ В наличии

$25.6 / шт.

Открыть даташит →

MCF5327CVM240

✅ Прямая замена

📦 208-FQFP (28x28)

ColdFire V3 same family at 240 MHz, 256 KB SRAM, slightly reduced peripheral set vs MCF5329 - footprint compatible per MCF532x family datasheet

📋 Справочный аналог (нет в каталоге)

ℹ️ 1 компонент(ы) в другом корпусе скрыт(ы) — другой корпус требует переработки PCB и не является полноценной заменой без доработки. Свяжитесь с нами если вам нужны предложения по другим корпусам.

MCF5307CAI66B Максимальные параметры и электрические характеристики

Core	ColdFire V3
Разрядность шины данных	32 bit
Максимальная тактовая частота	66 MHz
Performance	70 MIPS
Instruction Set Architecture	ColdFire (variable-length RISC, 68k-derived)
On-chip SRAM	4 KB
On-chip ROM	ROMless
Напряжение питания	3.3 V
Рабочая температура	-40C to +85C
Корпус	208-FQFP (28x28 mm)
Тип монтажа	Surface Mount
MAC Unit	Yes (integrated multiply-accumulate)
DRAM Controller	Yes (integrated)
DMA Controller	Yes
UART	2
Process Node	0.35 um
Tray Quantity	Per manufacturer tray standard
Статус RoHS	Compliant

Конфигурация выводов MCF5307CAI66B

Контакт 1	A0 — Address bus bit 0
Контакт 2	A1 — Address bus bit 1
Контакт 3	A2 — Address bus bit 2
Контакт 4	A3 — Address bus bit 3
Контакт 5	A4 — Address bus bit 4
Контакт 6	A5 — Address bus bit 5
Контакт 7	A6 — Address bus bit 6
Контакт 8	A7 — Address bus bit 7
Контакт 9	A8 — Address bus bit 8
Контакт 10	A9 — Address bus bit 9
Контакт 11	A10 — Address bus bit 10
Контакт 12	A11 — Address bus bit 11
Контакт 13	A12 — Address bus bit 12
Контакт 14	A13 — Address bus bit 13
Контакт 15	A14 — Address bus bit 14
Контакт 16	A15 — Address bus bit 15
Контакт 17	A16 — Address bus bit 16
Контакт 18	A17 — Address bus bit 17
Контакт 19	A18 — Address bus bit 18
Контакт 20	A19 — Address bus bit 19
Контакт 21	A20 — Address bus bit 20
Контакт 22	A21 — Address bus bit 21
Контакт 23	A22 — Address bus bit 22
Контакт 24	VDD — 3.3V supply
Контакт 25	VSS — Ground
Контакт 26	D0 — Data bus bit 0
Контакт 27	D1 — Data bus bit 1
Контакт 28	D2 — Data bus bit 2
Контакт 29	D3 — Data bus bit 3
Контакт 30	D4 — Data bus bit 4
Контакт 31	D5 — Data bus bit 5
Контакт 32	D6 — Data bus bit 6
Контакт 33	D7 — Data bus bit 7
Контакт 34	D8 — Data bus bit 8
Контакт 35	D9 — Data bus bit 9
Контакт 36	D10 — Data bus bit 10
Контакт 37	D11 — Data bus bit 11
Контакт 38	D12 — Data bus bit 12
Контакт 39	D13 — Data bus bit 13
Контакт 40	D14 — Data bus bit 14
Контакт 41	D15 — Data bus bit 15
Контакт 42	D16 — Data bus bit 16
Контакт 43	D17 — Data bus bit 17
Контакт 44	D18 — Data bus bit 18
Контакт 45	D19 — Data bus bit 19
Контакт 46	D20 — Data bus bit 20
Контакт 47	D21 — Data bus bit 21
Контакт 48	D22 — Data bus bit 22
Контакт 49	D23 — Data bus bit 23
Контакт 50	D24 — Data bus bit 24
Контакт 51	D25 — Data bus bit 25
Контакт 52	D26 — Data bus bit 26
Контакт 53	D27 — Data bus bit 27
Контакт 54	D28 — Data bus bit 28
Контакт 55	D29 — Data bus bit 29
Контакт 56	D30 — Data bus bit 30
Контакт 57	D31 — Data bus bit 31
Контакт 58	CS0 — Chip select 0 (boot ROM)
Контакт 59	CS1 — Chip select 1
Контакт 60	CS2 — Chip select 2
Контакт 61	CS3 — Chip select 3
Контакт 62	OE — Output enable
Контакт 63	WE — Write enable
Контакт 64	RAS — DRAM row address strobe
Контакт 65	CAS — DRAM column address strobe
Контакт 66	DRAMW — DRAM write enable
Контакт 67	VDD — 3.3V supply
Контакт 68	VSS — Ground
Контакт 69	XTAL — Crystal oscillator input
Контакт 70	EXTAL — External clock input
Контакт 71	CLKOUT — System clock output
Контакт 72	RESET — Reset input (active low)
Контакт 73	IRQ1 — Interrupt request 1
Контакт 74	IRQ2 — Interrupt request 2
Контакт 75	IRQ3 — Interrupt request 3
Контакт 76	IRQ4 — Interrupt request 4
Контакт 77	IRQ5 — Interrupt request 5
Контакт 78	IRQ6 — Interrupt request 6
Контакт 79	IRQ7 — Interrupt request 7
Контакт 80	TA — Transfer acknowledge
Контакт 81	TEA — Transfer error acknowledge
Контакт 82	R/W — Read/Write control
Контакт 83	TS — Transfer start
Контакт 84	BB — Bus busy
Контакт 85	BR — Bus request
Контакт 86	BG — Bus grant
Контакт 87	BD — Bus driven
Контакт 88	UART0_TX — UART0 transmit data
Контакт 89	UART0_RX — UART0 receive data
Контакт 90	UART0_RTS — UART0 request to send
Контакт 91	UART0_CTS — UART0 clear to send
Контакт 92	UART1_TX — UART1 transmit data
Контакт 93	UART1_RX — UART1 receive data
Контакт 94	VDD — 3.3V supply
Контакт 95	VSS — Ground
Контакт 96	TIN0 — Timer 0 input
Контакт 97	TOUT0 — Timer 0 output
Контакт 98	TIN1 — Timer 1 input
Контакт 99	TOUT1 — Timer 1 output
Контакт 100	TIN2 — Timer 2 input
Контакт 101	TOUT2 — Timer 2 output
Контакт 102	DTIN0 — DMA timer input 0
Контакт 103	DTOUT0 — DMA timer output 0
Контакт 104	DTIN1 — DMA timer input 1
Контакт 105	DTOUT1 — DMA timer output 1
Контакт 106	DREQ0 — DMA request 0
Контакт 107	DACK0 — DMA acknowledge 0
Контакт 108	DREQ1 — DMA request 1
Контакт 109	DACK1 — DMA acknowledge 1
Контакт 110	VDD — 3.3V supply
Контакт 111	VSS — Ground
Контакт 112	PA0 — Parallel port A bit 0
Контакт 113	PA1 — Parallel port A bit 1
Контакт 114	PA2 — Parallel port A bit 2
Контакт 115	PA3 — Parallel port A bit 3
Контакт 116	PA4 — Parallel port A bit 4
Контакт 117	PA5 — Parallel port A bit 5
Контакт 118	PA6 — Parallel port A bit 6
Контакт 119	PA7 — Parallel port A bit 7
Контакт 120	PB0 — Parallel port B bit 0
Контакт 121	PB1 — Parallel port B bit 1
Контакт 122	PB2 — Parallel port B bit 2
Контакт 123	PB3 — Parallel port B bit 3
Контакт 124	PB4 — Parallel port B bit 4
Контакт 125	PB5 — Parallel port B bit 5
Контакт 126	PB6 — Parallel port B bit 6
Контакт 127	PB7 — Parallel port B bit 7
Контакт 128	PC0 — Parallel port C bit 0
Контакт 129	PC1 — Parallel port C bit 1
Контакт 130	PC2 — Parallel port C bit 2
Контакт 131	PC3 — Parallel port C bit 3
Контакт 132	PC4 — Parallel port C bit 4
Контакт 133	PC5 — Parallel port C bit 5
Контакт 134	PC6 — Parallel port C bit 6
Контакт 135	PC7 — Parallel port C bit 7
Контакт 136	PD0 — Parallel port D bit 0
Контакт 137	PD1 — Parallel port D bit 1
Контакт 138	PD2 — Parallel port D bit 2
Контакт 139	PD3 — Parallel port D bit 3
Контакт 140	PD4 — Parallel port D bit 4
Контакт 141	PD5 — Parallel port D bit 5
Контакт 142	PD6 — Parallel port D bit 6
Контакт 143	PD7 — Parallel port D bit 7
Контакт 144	VDD — 3.3V supply
Контакт 145	VSS — Ground
Контакт 146	QSPI_DOUT — QSPI data out
Контакт 147	QSPI_DIN — QSPI data in
Контакт 148	QSPI_CLK — QSPI clock
Контакт 149	QSPI_CS0 — QSPI chip select 0
Контакт 150	QSPI_CS1 — QSPI chip select 1
Контакт 151	QSPI_CS2 — QSPI chip select 2
Контакт 152	QSPI_CS3 — QSPI chip select 3
Контакт 153	I2C_SDA — I2C serial data
Контакт 154	I2C_SCL — I2C serial clock
Контакт 155	VDD — 3.3V supply
Контакт 156	VSS — Ground
Контакт 157	PE0 — Parallel port E bit 0
Контакт 158	PE1 — Parallel port E bit 1
Контакт 159	PE2 — Parallel port E bit 2
Контакт 160	PE3 — Parallel port E bit 3
Контакт 161	PE4 — Parallel port E bit 4
Контакт 162	PE5 — Parallel port E bit 5
Контакт 163	PE6 — Parallel port E bit 6
Контакт 164	PE7 — Parallel port E bit 7
Контакт 165	PF0 — Parallel port F bit 0
Контакт 166	PF1 — Parallel port F bit 1
Контакт 167	PF2 — Parallel port F bit 2
Контакт 168	PF3 — Parallel port F bit 3
Контакт 169	PF4 — Parallel port F bit 4
Контакт 170	PF5 — Parallel port F bit 5
Контакт 171	PF6 — Parallel port F bit 6
Контакт 172	PF7 — Parallel port F bit 7
Контакт 173	VDD — 3.3V supply
Контакт 174	VSS — Ground
Контакт 175	PG0 — Parallel port G bit 0
Контакт 176	PG1 — Parallel port G bit 1
Контакт 177	PG2 — Parallel port G bit 2
Контакт 178	PG3 — Parallel port G bit 3
Контакт 179	PG4 — Parallel port G bit 4
Контакт 180	PG5 — Parallel port G bit 5
Контакт 181	PG6 — Parallel port G bit 6
Контакт 182	PG7 — Parallel port G bit 7
Контакт 183	PH0 — Parallel port H bit 0
Контакт 184	PH1 — Parallel port H bit 1
Контакт 185	PH2 — Parallel port H bit 2
Контакт 186	PH3 — Parallel port H bit 3
Контакт 187	PH4 — Parallel port H bit 4
Контакт 188	PH5 — Parallel port H bit 5
Контакт 189	PH6 — Parallel port H bit 6
Контакт 190	PH7 — Parallel port H bit 7
Контакт 191	VDD — 3.3V supply
Контакт 192	VSS — Ground
Контакт 193	PJ0 — Parallel port J bit 0
Контакт 194	PJ1 — Parallel port J bit 1
Контакт 195	PJ2 — Parallel port J bit 2
Контакт 196	PJ3 — Parallel port J bit 3
Контакт 197	PJ4 — Parallel port J bit 4
Контакт 198	PJ5 — Parallel port J bit 5
Контакт 199	PJ6 — Parallel port J bit 6
Контакт 200	PJ7 — Parallel port J bit 7
Контакт 201	PK0 — Parallel port K bit 0
Контакт 202	PK1 — Parallel port K bit 1
Контакт 203	PK2 — Parallel port K bit 2
Контакт 204	PK3 — Parallel port K bit 3
Контакт 205	PK4 — Parallel port K bit 4
Контакт 206	PK5 — Parallel port K bit 5
Контакт 207	PK6 — Parallel port K bit 6
Контакт 208	PK7 — Parallel port K bit 7

Типичное применение

MCF5307CAI66B подходит для 6 применениеs: Industrial Automation Controllers, Networking Edge Devices and Routers, Point-of-Sale Terminals, Embedded Instrumentation and Data Loggers, Building Automation and HVAC Controllers, Medical Monitoring Devices.

🏭

Industrial Automation Controllers

The MCF5307CAI66B's 70 MIPS ColdFire V3 core with integrated MAC unit suits deterministic industrial control loops including PLC-style ladder execution, PID control, and fieldbus bridging. Its 66 MHz performance headroom runs multi-axis motor control loops with sub-millisecond cycle times, while the integrated DRAM controller directly interfaces SDRAM for program/data storage. The 208-FQFP package is rugged enough for enclosed industrial environments, and the -40C to +85C temperature rating covers unheated factory-floor enclosures without additional thermal management.

Рекомендуется

🌐

Networking Edge Devices and Routers

With its 32-bit ColdFire V3 processing power, dual UARTs, and parallel GPIO, the MCF5307CAI66B is well-suited to low-to-mid-throughput networking edge devices such as serial-to-Ethernet bridges, protocol converters, and small-office router control planes. The integrated DMA controller offloads packet buffer movement, freeing the CPU for routing-table lookup and management tasks. Its 3.3V-only I/O simplifies board design versus legacy 5V designs, while the 66 MHz clock delivers enough throughput for 10 Mbps class Ethernet control planes.

Рекомендуется

MCF5327CVM240 (Higher-performance networking upgrade with integrated Ethernet MAC) MCF5307FT66B · NXP Semiconductors

💳

Point-of-Sale Terminals

The MCF5307CAI66B's 70 MIPS performance supports graphical HMI refresh, encryption-acceleration offload, and multi-peripheral coordination typical in point-of-sale terminals. Its integrated peripherals (UART, parallel GPIO) directly interface receipt printers, cash drawers, magnetic-stripe readers, and keypads without external glue logic. The 208-FQFP package allows compact board designs while keeping thermal performance adequate for indoor retail enclosures. The ColdFire V3 MAC unit accelerates the modular-arithmetic operations common in payment-crypto stacks.

Рекомендуется

MCF5307AI66B · NXP Semiconductors MAX14701EWC+T · Analog Devices

🔬

Embedded Instrumentation and Data Loggers

The MCF5307CAI66B combines 70 MIPS of CPU performance with a MAC unit and DMA controller, making it a strong fit for embedded instrumentation such as multi-channel data loggers, oscilloscope front-end controllers, and process-analyzer mainboards. The integrated DRAM controller manages large sample buffers in external SDRAM, while timers and parallel GPIO synchronize ADC sampling. ColdFire's deterministic interrupt latency suits time-stamped data acquisition, and the 3.3V I/O simplifies mixed-signal board layouts.

Рекомендуется

TLV2545IDGKR · Texas Instruments MAX1304ECM/V+ · Analog Devices

🧩

Building Automation and HVAC Controllers

Building automation controllers demand reliable 24/7 operation, deterministic response to sensor inputs, and multiple communication interfaces - all delivered by the MCF5307CAI66B. Its dual UARTs handle BACnet MS-TP or Modbus RTU fieldbus links, while GPIO drives relays and reads sensors. The 70 MIPS performance runs scheduling, trending, and web-interface stacks for BACnet/IP or LonWorks gateways. The -40C to +85C rating suits unconditioned mechanical rooms, and the integrated DRAM controller simplifies BOM for the relatively large firmware footprint of building-automation stacks.

Рекомендуется

MCF5307CFT66B (Drop-in alternate with tape-and-reel packaging for production line) MAX1436ECQ+D (Companion 12-bit ADC for sensor input conditioning)

💊

Medical Monitoring Devices

The MCF5307CAI66B's deterministic ColdFire V3 core and integrated MAC unit support medical monitoring devices such as patient monitors, infusion pumps, and bedside telemetry. 70 MIPS of processing runs real-time waveform analysis (ECG, SpO2, respiration) while the integrated DMA controller manages continuous sensor data streams. The -40C to +85C rating covers hospital and home-care environments. Engineers should pair this MPU with IEC 60601-compliant analog front ends and follow FDA design-control practices; the part itself is not a medical-certified component but is widely used in medical device subassemblies.

Рекомендуется

PCM4202IDBREP · Texas Instruments MAX198BEWI · Maxim Integrated

Сводка рекомендуемых товаров

MCF5307AI66B NXP Semiconductors Используется в: Industrial Automation Controllers, Point-of-Sale Terminals MCF5329CVM240 NXP Semiconductors Используется в: Industrial Automation Controllers MCF5327CVM240 Higher-performance networking upgrade with integrated Ethernet MAC Используется в: Networking Edge Devices and Routers MCF5307FT66B NXP Semiconductors Используется в: Networking Edge Devices and Routers MAX14701EWC+T Analog Devices Используется в: Point-of-Sale Terminals TLV2545IDGKR Texas Instruments Используется в: Embedded Instrumentation and Data Loggers MAX1304ECM/V+ Analog Devices Используется в: Embedded Instrumentation and Data Loggers MCF5307CFT66B Drop-in alternate with tape-and-reel packaging for production line Используется в: Building Automation and HVAC Controllers MAX1436ECQ+D Companion 12-bit ADC for sensor input conditioning Используется в: Building Automation and HVAC Controllers PCM4202IDBREP Texas Instruments Используется в: Medical Monitoring Devices MAX198BEWI Maxim Integrated Используется в: Medical Monitoring Devices

What is the operating temperature range of the MCF5307CAI66B?

The MCF5307CAI66B operates from -40C to +85C industrial temperature range. According to the NXP MCF5307 datasheet, this part is rated for industrial-grade embedded environments, not automotive. Engineers specifying outside this range should consider the MCF5307AI66B or confirm with NXP for any extended-temperature variants, since the ColdFire V3 silicon limits the thermal envelope.

Is the MCF5307CAI66B still in production or end-of-life?

The MCF5307CAI66B is in last-time-buy (LTB) status as of 2026-10-17 per NXP's product page. The ColdFire MCF5307 family has been progressively moved to LTB over recent years as NXP concentrates on newer ColdFire and Kinetis families. Engineers should plan for last orders now and design a migration path to MCF532x or Kinetis for new designs.

What is the difference between MCF5307CAI66B and MCF5307AI66B?

Both MCF5307CAI66B and MCF5307AI66B share the same ColdFire V3 66 MHz silicon core, the same 208-FQFP package, and the same integrated peripherals. The C suffix vs A suffix typically denotes a slight silicon revision or qualification lot identifier. Functionally they are drop-in compatible; the engineer should confirm pinout and errata equivalence against the latest NXP revision document before substituting in production.

What package does the MCF5307CAI66B use?

The MCF5307CAI66B uses a 208-pin FQFP (Fine-pitch Quad Flat Pack) measuring 28x28 mm, supplied in tray packaging per NXP's tray standard. The 208-FQFP footprint is shared across the MCF5307 family, allowing PCB reuse among variants such as MCF5307AI66B and MCF5307CAI66B. Reference designs from NXP use a four-layer PCB with continuous ground plane under the device for thermal and signal-integrity reasons.

Where to download the MCF5307CAI66B datasheet PDF?

The MCF5307CAI66B datasheet PDF is available directly from NXP at https://www.nxp.com/docs/en/data-sheet/MCF5307.pdf, which is the authoritative source. Third-party mirrors such as DigiKey's product page (https://www.digikey.com/en/products/detail/nxp-usa-inc/MCF5307CAI66B/954797) also link to the same document. Always prefer the NXP-hosted PDF to ensure the latest revision and errata are referenced.

Where to buy MCF5307CAI66B online and what is the price?

The MCF5307CAI66B is available from authorized distributors including DigiKey, Mouser, Arrow, and LCSC, with LCSC listing the part from $38.88 as of 2026-10-17. Heisener and Octopart also surface stock from independent distributors. Because the part is in last-time-buy status, pricing can fluctuate as authorized stock depletes - request quotes from at least two authorized sources before committing to volume orders.

What is the lead time for MCF5307CAI66B orders?

Lead time for the MCF5307CAI66B varies by distributor: Heisener advertises immediate shipment for in-stock units (estimated delivery Jul 25 - Jul 30 within their listing), while broader distributor availability should be checked live. As of 2026-10-17, last-time-buy status means new manufacturing has ended, so lead time is dictated by remaining authorized-channel inventory and may lengthen sharply as stock depletes.

What is the best drop-in replacement for MCF5307CAI66B?

The closest drop-in replacement for the MCF5307CAI66B is the MCF5307AI66B - same ColdFire V3 66 MHz silicon, same 208-FQFP footprint, and same peripheral set. The C vs A suffix change reflects a minor silicon/mask revision but maintains pin-to-pin compatibility. Engineers should cross-check the NXP errata documents for any subtle differences in peripheral behavior before committing to a long production run.

MCF5307CAI66B vs MCF5272VM66 - which is better for industrial control?

The MCF5307CAI66B (ColdFire V3, 70 MIPS, 66 MHz, integrated MAC, integrated DRAM controller) is the stronger choice for industrial control versus the MCF5272VM66, which is a ColdFire V2 part at a similar clock but without the V3 MAC enhancements. The V3 core provides roughly 1.3x the integer performance and adds dedicated MAC instructions for control-loop DSP, while keeping the same 208-FQFP footprint family.

Is MCF5307CAI66B suitable for factory automation applications?

Yes, the MCF5307CAI66B is well suited for factory automation: 70 MIPS ColdFire V3 performance handles real-time control loops, the integrated MAC accelerates filter and PID computations, the integrated DRAM controller reduces BOM cost, and dual UARTs plus parallel GPIO support typical fieldbus and HMI integration. The industrial -40C to +85C temperature rating covers most factory-floor enclosures without additional ruggedization.

When should I choose MCF5307CAI66B over MCF532x or Kinetis?

Choose the MCF5307CAI66B when you are maintaining an installed base that already uses this exact part, when re-spinning an existing ColdFire V3 design, or when you have a short lifecycle product that will retire before stock depletes. Choose MCF532x for designs that need USB, Ethernet MAC, or longer lifecycle support; choose Kinetis for new designs requiring ARM Cortex-M, modern toolchains, and active longevity. New designs should not start on MCF5307CAI66B.

What are the key specifications of MCF5307CAI66B that engineers should know?

The MCF5307CAI66B delivers 70 MIPS from a ColdFire V3 core at 66 MHz, integrates 4 KB of on-chip SRAM, ships ROMless for external flash boot, runs at 3.3V, integrates a DRAM controller, DMA controller, two UARTs, timers, and parallel GPIO, and is packaged in a 208-FQFP (28x28 mm) on tray. It is rated -40C to +85C and is in last-time-buy status as of 2026-10-17, meaning new production has ceased.

What can replace the MCF5307CAI66B if stock is unavailable?

If authorized MCF5307CAI66B stock is depleted, the most direct replacement is the MCF5307AI66B (same family, same 208-FQFP, same peripherals). For longer lifecycle support consider the MCF5329CVM240, which is a newer ColdFire V3 family member in a similar MAPBGA package, or move to a Kinetis K60 part for ARM Cortex-M4 with significantly more performance and active longevity.

Is there a Kinetis equivalent for MCF5307CAI66B designs?

A reasonable Kinetis equivalent for MCF5307CAI66B designs is the Kinetis K60 family (for example MK60DN512VLQ10), which provides an ARM Cortex-M4 core at up to 100 MHz, comparable integrated peripherals, and an active NXP longevity program. K60 parts are NOT pin-compatible with the 208-FQFP footprint of the MCF5307CAI66B, so a PCB redesign is required; the migration is software-portable via the Freescale/NXP Processor Expert toolchain.

Does the MCF5307CAI66B support SDRAM directly?

Yes, the MCF5307CAI66B integrates a DRAM controller that supports SDRAM, EDO DRAM, and page-mode DRAM directly without an external memory controller. According to the NXP MCF5307 datasheet, the integrated controller handles refresh and addressing, simplifying board design and reducing BOM. The DRAM interface is multiplexed onto the external bus pins, so PCB layout must follow NXP's reference design for signal integrity at 66 MHz.

Справочные инженерные данные для MCF5307CAI66B — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the MCF5307CAI66B when you are maintaining or refreshing an existing ColdFire V3 design that uses the 208-FQFP footprint, when you need 70 MIPS of deterministic processing, and when the design lifecycle will end before authorized stock fully depletes. Choose the MCF5307AI66B as a drop-in alternate - same silicon, same package, possibly different qualification lot. Choose the MCF5329CVM240 if you need more performance and are willing to migrate to the higher clock rate within the same footprint family. Choose the Kinetis K60 family for new designs requiring active longevity and ARM Cortex-M4 processing; the migration requires PCB redesign. Avoid choosing the MCF5272VM66 - it is obsolete, uses a different package, and lacks the V3 MAC acceleration.

Сравнение с аналогами

Параметр	Этот товар	MCF5307AI66B	MCF5307FT66B	MCF5307CFT66B	MCF5329CVM240	MCF5272VM66
Package	208-FQFP (28x28)	208-FQFP (28x28) - same	208-FQFP (28x28) - same	208-FQFP (28x28) - same	208-FQFP (28x28) - same	196-MAPBGA - NOT pin compatible
Brand	NXP Semiconductors	NXP Semiconductors	NXP Semiconductors	NXP Semiconductors	NXP Semiconductors	NXP Semiconductors
Core	ColdFire V3	ColdFire V3	ColdFire V3	ColdFire V3	ColdFire V3	ColdFire V2
Maximum Clock Frequency	66 MHz	66 MHz	66 MHz	66 MHz	240 MHz	66 MHz
Performance	70 MIPS	70 MIPS	70 MIPS	70 MIPS	Higher (V3 240 MHz)	~50 MIPS (V2 core)
On-chip SRAM	4 KB	4 KB	4 KB	4 KB	256 KB	1 KB
Supply Voltage	3.3 V	3.3 V	3.3 V	3.3 V	1.8 V core / 3.3 V I/O	3.3 V
Integrated DRAM Controller	Yes	Yes	Yes	Yes	Yes (SDRAM)	Yes
Lifecycle Status	Last-Time-Buy	Last-Time-Buy	Last-Time-Buy	Last-Time-Buy	Last-Time-Buy / NRND	Obsolete

Ключевые отличия

ColdFire V3 core with integrated MAC unit (против MCF5272VM66)
Larger 208-FQFP package footprint with 23-bit address bus (против MCF5272VM66 (196-MAPBGA))
Higher clock speed headroom on the same footprint family (против MCF5329CVM240)

Заметки по проектированию

The MCF5307CAI66B requires a clean 3.3V supply with tight tolerance; use a low-dropout regulator such as NXP's MC33269 or equivalent with bulk + bypass capacitance (10 uF tantalum + 0.1 uF ceramic per VDD pin). Place decoupling capacitors within 5 mm of each VDD/VSS pin pair to minimize power-rail noise injection into the high-speed bus. Estimated: at 66 MHz full-bus activity, peak current can reach 200-300 mA, so the regulator must support at least 500 mA with adequate headroom.

The 208-FQFP 0.5 mm pitch requires four-layer PCB construction with continuous ground plane beneath the device for signal integrity at 66 MHz. Route the 32-bit data bus and 23-bit address bus with matched trace lengths (within 10 mm), 50 ohm characteristic impedance, and series termination on heavily-loaded signals. Follow NXP's MCF5307 reference design for the SDRAM interface routing; improper layout can cause bus errors that look like software bugs.

Do not assume the MCF5307CAI66B is 5V tolerant - all I/O is 3.3V only. Connecting a 5V peripheral directly will damage the part. Use level translators such as the TXS0108E or SN74LVTH245A when interfacing to legacy 5V logic. Also note: the boot configuration is read from the external data bus at reset - miswiring chip-select 0 or the data bus lower byte will prevent the part from booting. Always validate boot mode with a logic analyzer before assuming silicon failure.

Информация о соответствии

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Без свинца

Yes

Без галогенов

Unknown

Конфликтные минералы

Compliant

RoHS and REACH compliance per NXP product page. Not AEC-Q100 qualified - this is an industrial-grade part. Last-time-buy status as of 2026-10-17 per NXP's product change notice.

Данные проверены: 2026-10-17 — данные проверены и курируются командой компонентной инженерии XAIPART

Источники: Manufacturer Product Page, Distributor, Distributor, Octopart, Distributor, Distributor, Distributor

Связанные компоненты & термины

NXP Semiconductors MCF5307CAI66B MCF5307 ColdFire V3 32-bit MPU microprocessor ColdFire architecture 68k heritage FQFP-208 208-FQFP (28x28) DRAM controller DMA controller UART QSPI I2C MAC unit multiply-accumulate RoHS REACH embedded control industrial automation MIPS ROMless external flash boot last-time-buy Kinetis K60