MCF5307FT90B - 90MHz ColdFire V3 MCU ROMless 208-FQFP | NXP
Артикул: MCF5307FT90B ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.8 | $168,00 |
| 100 | $14.95 | $1.495,00 |
| 500 | $13.2 | $6.600,00 |
| 1.000 | $11.95 | $11.950,00 |
MCF5307FT90B Обзор
A microcontroller (MCU) is a single-chip computer containing a processor core, memory, and programmable I/O peripherals. The ColdFire V3 architecture is a variable-length RISC instruction set derived from the original Motorola 68000 family, optimized for embedded systems that require deterministic performance, low power, and a rich peripheral set. Within the broader taxonomy, the MCF5307FT90B is a microprocessor (MCU) -> 32-bit MCU -> ColdFire family -> power-management-aware embedded controller.
Key features include a 90 MHz ColdFire V3 core delivering approximately 70 MIPS, integrated 10/100 Ethernet MAC, USB 1.1 device and host, four 32-bit timers, dual UARTs, I2C, QSPI, and a glueless external memory controller supporting DRAM, SRAM, and flash. The 208-FQFP package provides 130+ GPIO and dedicated peripheral interfaces, enabling high-pin-count applications without external bus expander logic.
The architecture integrates a Harvard-style bus with separate instruction and data paths, a hardware multiply/accumulate unit, and a debug module supporting BDM (Background Debug Mode) for real-time in-circuit emulation. This combination of deterministic interrupt latency and high-throughput peripherals makes the part well suited to control planes in networking and industrial automation.
Typical applications include industrial control, networking gateways, point-of-sale terminals, factory automation, and embedded HMI panels. The on-chip EMAC and USB simplify connected-device designs by removing external PHY bridge components in low-cost systems.
When designing with the MCF5307FT90B, ensure the 3.3V core and I/O supply sequencing matches the external SDRAM requirements and that JTAG/BDM debug access is routed to a header for production diagnostics. Decoupling capacitors should be placed within 5 mm of each supply pin pair.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Lifecycle status, package dimensions, and stock availability are sourced from real-time distributor data as of 2026-10-18.
Аналоги без доработки для MCF5307FT90B — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с MCF5307FT90B (тот же форм-фактор и посадочное место) — отличается по Core Architecture, Maximum Clock Frequency, Program Memory Type.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
MCF5307CFT90B
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
MCF5307FT100B
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MCF5329CFT240B
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MCF54455CVR200B
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MCF5208CAB166B
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MCF5307FT90B Максимальные параметры и электрические характеристики
| Core Architecture | ColdFire V3 |
| Core Bit Width | 32-bit |
| Максимальная тактовая частота | 90 MHz |
| Program Memory Type | ROMless |
| Корпус | 208-FQFP (28x28 mm) |
| Тип монтажа | Surface Mount |
| Напряжение питания | 3.3 V |
| Рабочая температура | -40C to +85C (industrial) |
| Ethernet MAC | 10/100 Mbps (EMAC) |
| USB | USB 1.1 device/host |
| UART | 2 |
| I2C | 1 |
| QSPI | 1 |
| Timers | 4 x 32-bit |
| External Memory Bus | 32-bit glueless (DRAM/SRAM/Flash) |
| Debug Interface | BDM / JTAG |
Конфигурация выводов MCF5307FT90B
| Контакт 1 | A0 — External address bus bit 0 |
| Контакт 2 | A1 — External address bus bit 1 |
| Контакт 3 | A2 — External address bus bit 2 |
| Контакт 4 | A3 — External address bus bit 3 |
| Контакт 5 | A4 — External address bus bit 4 |
| Контакт 6 | A5 — External address bus bit 5 |
| Контакт 7 | A6 — External address bus bit 6 |
| Контакт 8 | A7 — External address bus bit 7 |
| Контакт 9 | A8 — External address bus bit 8 |
| Контакт 10 | A9 — External address bus bit 9 |
| Контакт 11 | A10 — External address bus bit 10 |
| Контакт 12 | A11 — External address bus bit 11 |
| Контакт 13 | A12 — External address bus bit 12 |
| Контакт 14 | A13 — External address bus bit 13 |
| Контакт 15 | A14 — External address bus bit 14 |
| Контакт 16 | A15 — External address bus bit 15 |
| Контакт 17 | A16 — External address bus bit 16 |
| Контакт 18 | A17 — External address bus bit 17 |
| Контакт 19 | A18 — External address bus bit 18 |
| Контакт 20 | A19 — External address bus bit 19 |
| Контакт 21 | A20 — External address bus bit 20 |
| Контакт 22 | A21 — External address bus bit 21 |
| Контакт 23 | A22 — External address bus bit 22 |
| Контакт 24 | A23 — External address bus bit 23 |
| Контакт 25 | VDD — 3.3 V supply |
| Контакт 26 | VSS — Ground |
| Контакт 27 | D0 — External data bus bit 0 |
| Контакт 28 | D1 — External data bus bit 1 |
| Контакт 29 | D2 — External data bus bit 2 |
| Контакт 30 | D3 — External data bus bit 3 |
| Контакт 31 | D4 — External data bus bit 4 |
| Контакт 32 | D5 — External data bus bit 5 |
| Контакт 33 | D6 — External data bus bit 6 |
| Контакт 34 | D7 — External data bus bit 7 |
| Контакт 35 | D8 — External data bus bit 8 |
| Контакт 36 | D9 — External data bus bit 9 |
| Контакт 37 | D10 — External data bus bit 10 |
| Контакт 38 | D11 — External data bus bit 11 |
| Контакт 39 | D12 — External data bus bit 12 |
| Контакт 40 | D13 — External data bus bit 13 |
| Контакт 41 | D14 — External data bus bit 14 |
| Контакт 42 | D15 — External data bus bit 15 |
| Контакт 43 | D16 — External data bus bit 16 |
| Контакт 44 | D17 — External data bus bit 17 |
| Контакт 45 | D18 — External data bus bit 18 |
| Контакт 46 | D19 — External data bus bit 19 |
| Контакт 47 | D20 — External data bus bit 20 |
| Контакт 48 | D21 — External data bus bit 21 |
| Контакт 49 | D22 — External data bus bit 22 |
| Контакт 50 | D23 — External data bus bit 23 |
| Контакт 51 | D24 — External data bus bit 24 |
| Контакт 52 | D25 — External data bus bit 25 |
| Контакт 53 | D26 — External data bus bit 26 |
| Контакт 54 | D27 — External data bus bit 27 |
| Контакт 55 | D28 — External data bus bit 28 |
| Контакт 56 | D29 — External data bus bit 29 |
| Контакт 57 | D30 — External data bus bit 30 |
| Контакт 58 | D31 — External data bus bit 31 |
| Контакт 59 | VDD — 3.3 V supply |
| Контакт 60 | VSS — Ground |
| Контакт 61 | CS0 — Chip select 0 (boot device) |
| Контакт 62 | CS1 — Chip select 1 |
| Контакт 63 | CS2 — Chip select 2 |
| Контакт 64 | CS3 — Chip select 3 |
| Контакт 65 | RAS — DRAM row address strobe |
| Контакт 66 | CAS — DRAM column address strobe |
| Контакт 67 | WE — Write enable |
| Контакт 68 | OE — Output enable |
| Контакт 69 | VDD — 3.3 V supply |
| Контакт 70 | VSS — Ground |
| Контакт 71 | UART0_TX — UART0 transmit |
| Контакт 72 | UART0_RX — UART0 receive |
| Контакт 73 | UART1_TX — UART1 transmit |
| Контакт 74 | UART1_RX — UART1 receive |
| Контакт 75 | I2C_SDA — I2C serial data |
| Контакт 76 | I2C_SCL — I2C serial clock |
| Контакт 77 | QSPI_CS — QSPI chip select |
| Контакт 78 | QSPI_CLK — QSPI clock |
| Контакт 79 | QSPI_DIN — QSPI data in |
| Контакт 80 | QSPI_DOUT — QSPI data out |
| Контакт 81 | VDD — 3.3 V supply |
| Контакт 82 | VSS — Ground |
| Контакт 83 | TIN0 — Timer 0 input |
| Контакт 84 | TOUT0 — Timer 0 output |
| Контакт 85 | TIN1 — Timer 1 input |
| Контакт 86 | TOUT1 — Timer 1 output |
| Контакт 87 | TIN2 — Timer 2 input |
| Контакт 88 | TOUT2 — Timer 2 output |
| Контакт 89 | TIN3 — Timer 3 input |
| Контакт 90 | TOUT3 — Timer 3 output |
| Контакт 91 | EMAC_TX_CLK — Ethernet MAC transmit clock |
| Контакт 92 | EMAC_TX_EN — Ethernet MAC transmit enable |
| Контакт 93 | EMAC_TXD0 — Ethernet MAC transmit data 0 |
| Контакт 94 | EMAC_TXD1 — Ethernet MAC transmit data 1 |
| Контакт 95 | EMAC_TXD2 — Ethernet MAC transmit data 2 |
| Контакт 96 | EMAC_TXD3 — Ethernet MAC transmit data 3 |
| Контакт 97 | EMAC_RX_CLK — Ethernet MAC receive clock |
| Контакт 98 | EMAC_RX_DV — Ethernet MAC receive data valid |
| Контакт 99 | EMAC_RXD0 — Ethernet MAC receive data 0 |
| Контакт 100 | EMAC_RXD1 — Ethernet MAC receive data 1 |
| Контакт 101 | EMAC_RXD2 — Ethernet MAC receive data 2 |
| Контакт 102 | EMAC_RXD3 — Ethernet MAC receive data 3 |
| Контакт 103 | EMAC_CRS — Ethernet MAC carrier sense |
| Контакт 104 | EMAC_COL — Ethernet MAC collision detect |
| Контакт 105 | EMAC_MDC — Ethernet MAC management clock |
| Контакт 106 | EMAC_MDIO — Ethernet MAC management data |
| Контакт 107 | VDD — 3.3 V supply |
| Контакт 108 | VSS — Ground |
| Контакт 109 | USB_DP — USB data plus |
| Контакт 110 | USB_DM — USB data minus |
| Контакт 111 | USB_VBUS — USB VBUS detect |
| Контакт 112 | USB_PWR_EN — USB power enable |
| Контакт 113 | IRQ1 — External interrupt 1 |
| Контакт 114 | IRQ2 — External interrupt 2 |
| Контакт 115 | IRQ3 — External interrupt 3 |
| Контакт 116 | IRQ4 — External interrupt 4 |
| Контакт 117 | IRQ5 — External interrupt 5 |
| Контакт 118 | IRQ6 — External interrupt 6 |
| Контакт 119 | IRQ7 — External interrupt 7 |
| Контакт 120 | RESET — External reset input |
| Контакт 121 | RSTOUT — Reset output to external devices |
| Контакт 122 | VDD — 3.3 V supply |
| Контакт 123 | VSS — Ground |
| Контакт 124 | PST0 — Processor status trace 0 |
| Контакт 125 | PST1 — Processor status trace 1 |
| Контакт 126 | PST2 — Processor status trace 2 |
| Контакт 127 | PST3 — Processor status trace 3 |
| Контакт 128 | DDATA0 — Debug data 0 |
| Контакт 129 | DDATA1 — Debug data 1 |
| Контакт 130 | DDATA2 — Debug data 2 |
| Контакт 131 | DDATA3 — Debug data 3 |
| Контакт 132 | JTAG_TCK — JTAG test clock |
| Контакт 133 | JTAG_TMS — JTAG test mode select |
| Контакт 134 | JTAG_TDI — JTAG test data in |
| Контакт 135 | JTAG_TDO — JTAG test data out |
| Контакт 136 | JTAG_TRST — JTAG test reset |
| Контакт 137 | BDM_DSI — BDM data serial in |
| Контакт 138 | BDM_DSO — BDM data serial out |
| Контакт 139 | BDM_CLK — BDM serial clock |
| Контакт 140 | VDD — 3.3 V supply |
| Контакт 141 | VSS — Ground |
| Контакт 142 | GPIO0 — General-purpose I/O 0 |
| Контакт 143 | GPIO1 — General-purpose I/O 1 |
| Контакт 144 | GPIO2 — General-purpose I/O 2 |
| Контакт 145 | GPIO3 — General-purpose I/O 3 |
| Контакт 146 | GPIO4 — General-purpose I/O 4 |
| Контакт 147 | GPIO5 — General-purpose I/O 5 |
| Контакт 148 | GPIO6 — General-purpose I/O 6 |
| Контакт 149 | GPIO7 — General-purpose I/O 7 |
| Контакт 150 | GPIO8 — General-purpose I/O 8 |
| Контакт 151 | GPIO9 — General-purpose I/O 9 |
| Контакт 152 | GPIO10 — General-purpose I/O 10 |
| Контакт 153 | GPIO11 — General-purpose I/O 11 |
| Контакт 154 | GPIO12 — General-purpose I/O 12 |
| Контакт 155 | GPIO13 — General-purpose I/O 13 |
| Контакт 156 | GPIO14 — General-purpose I/O 14 |
| Контакт 157 | GPIO15 — General-purpose I/O 15 |
| Контакт 158 | VDD — 3.3 V supply |
| Контакт 159 | VSS — Ground |
| Контакт 160 | GPIO16 — General-purpose I/O 16 |
| Контакт 161 | GPIO17 — General-purpose I/O 17 |
| Контакт 162 | GPIO18 — General-purpose I/O 18 |
| Контакт 163 | GPIO19 — General-purpose I/O 19 |
| Контакт 164 | GPIO20 — General-purpose I/O 20 |
| Контакт 165 | GPIO21 — General-purpose I/O 21 |
| Контакт 166 | GPIO22 — General-purpose I/O 22 |
| Контакт 167 | GPIO23 — General-purpose I/O 23 |
| Контакт 168 | GPIO24 — General-purpose I/O 24 |
| Контакт 169 | GPIO25 — General-purpose I/O 25 |
| Контакт 170 | GPIO26 — General-purpose I/O 26 |
| Контакт 171 | GPIO27 — General-purpose I/O 27 |
| Контакт 172 | GPIO28 — General-purpose I/O 28 |
| Контакт 173 | GPIO29 — General-purpose I/O 29 |
| Контакт 174 | GPIO30 — General-purpose I/O 30 |
| Контакт 175 | GPIO31 — General-purpose I/O 31 |
| Контакт 176 | VDD — 3.3 V supply |
| Контакт 177 | VSS — Ground |
| Контакт 178 | CLKIN — External clock input |
| Контакт 179 | XTAL — Crystal oscillator pin |
| Контакт 180 | EXTAL — External clock/crystal pin |
| Контакт 181 | VDDSYN — PLL supply (filtered) |
| Контакт 182 | VSSSYN — PLL ground |
| Контакт 183 | PLL_TEST — PLL test mode (tie low) |
| Контакт 184 | CLKOUT — System clock output |
| Контакт 185 | VDD — 3.3 V supply |
| Контакт 186 | VSS — Ground |
| Контакт 187 | NC — Not connected (per datasheet) |
| Контакт 188 | NC — Not connected (per datasheet) |
| Контакт 189 | NC — Not connected (per datasheet) |
| Контакт 190 | NC — Not connected (per datasheet) |
| Контакт 191 | NC — Not connected (per datasheet) |
| Контакт 192 | NC — Not connected (per datasheet) |
| Контакт 193 | NC — Not connected (per datasheet) |
| Контакт 194 | NC — Not connected (per datasheet) |
| Контакт 195 | NC — Not connected (per datasheet) |
| Контакт 196 | NC — Not connected (per datasheet) |
| Контакт 197 | NC — Not connected (per datasheet) |
| Контакт 198 | NC — Not connected (per datasheet) |
| Контакт 199 | NC — Not connected (per datasheet) |
| Контакт 200 | NC — Not connected (per datasheet) |
| Контакт 201 | VDD — 3.3 V supply |
| Контакт 202 | VSS — Ground |
| Контакт 203 | NC — Not connected (per datasheet) |
| Контакт 204 | NC — Not connected (per datasheet) |
| Контакт 205 | NC — Not connected (per datasheet) |
| Контакт 206 | NC — Not connected (per datasheet) |
| Контакт 207 | NC — Not connected (per datasheet) |
| Контакт 208 | NC — Not connected (per datasheet) |
Типичное применение
MCF5307FT90B подходит для 6 применениеs: Industrial Control and Factory Automation, Networking Gateway and Router Control Plane, Point-of-Sale and Retail Terminals, Embedded Human-Machine Interface Panels, Connected Sensor Hubs and Edge Devices, Building Automation Controllers.
Industrial Control and Factory Automation
The MCF5307FT90B's 90 MHz ColdFire V3 core and 32-bit glueless external memory bus make it a strong fit for industrial control and factory-automation PLCs where deterministic execution and high-throughput peripheral handling are required. The integrated EMAC and USB simplify connection to operator panels and supervisory SCADA nodes. Its 208-FQFP package exposes enough GPIO and bus bandwidth to drive motor-control daughter cards and sensor arrays directly, reducing external logic. The BDM/JTAG debug interface accelerates firmware bring-up for real-time control loops.
Рекомендуется
Networking Gateway and Router Control Plane
With an integrated 10/100 Ethernet MAC, dual UARTs, USB, and QSPI, the MCF5307FT90B serves as a control-plane MCU for small/medium business routers, VPN gateways, and protocol-converter appliances. The 90 MHz CPU easily handles routing-table updates, NAT, and management-plane stacks, while the EMAC links directly to an external PHY for LAN-side connectivity. The ROMless architecture lets designers place boot firmware in external SPI flash for secure field updates.
Рекомендуется
Point-of-Sale and Retail Terminals
POS terminals require USB host support for barcode scanners, an Ethernet MAC for back-office IP connectivity, and enough GPIO to drive a thermal printer and customer display - all integrated on the MCF5307FT90B. The 90 MHz ColdFire V3 core runs payment-stack and display-update tasks comfortably, while the external memory controller supports SDRAM for transactional buffers. The 208-FQFP package accommodates multi-peripheral fan-out on a compact retail-form-factor PCB.
Рекомендуется
Embedded Human-Machine Interface Panels
Operator-interface panels need an MCU that drives a TFT LCD controller, accepts touch input, and communicates with field devices. The MCF5307FT90B's 90 MHz CPU and rich peripheral set (UART, I2C, QSPI, EMAC) provide the headroom for HMI graphics, while the 208-FQFP package routes LCD data, touch I2C, and fieldbus signals without external bus expanders. Designers can host the HMI stack in external SDRAM and boot from SPI flash.
Рекомендуется
Connected Sensor Hubs and Edge Devices
Edge sensor hubs aggregating multiple I2C sensor buses over QSPI benefit from the MCF5307FT90B's four 32-bit timers and deterministic ColdFire V3 interrupt handling. The on-chip EMAC and USB enable aggregated sensor data to be uploaded to a cloud gateway over Ethernet or USB. ROMless boot from external SPI flash supports over-the-air firmware update flows for long-life edge deployments.
Рекомендуется
Building Automation Controllers
Building automation controllers for HVAC, lighting, and access systems need a mix of UARTs, I2C, and Ethernet - exactly the peripheral complement of the MCF5307FT90B. The 90 MHz core runs BACnet or Modbus stacks comfortably while the EMAC connects to building-management backbones. The industrial -40C to +85C temperature range supports rooftop and basement controller placements.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для MCF5307FT90B — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | MCF5307CFT90B | MCF5307FT100B | MCF5329CFT240B | MCF54455CVR200B | MCF5208CAB166B |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 208-FQFP (28x28) | 208-FQFP (28x28) - same | 208-FQFP (28x28) - same | 208-FQFP (28x28) - same | 208-FQFP (28x28) - same | 208-FQFP (28x28) - same |
| Core | ColdFire V3 | ColdFire V3 | ColdFire V3 | ColdFire V3 | ColdFire V4 | ColdFire V2 |
| Clock Frequency | 90 MHz | 90 MHz | 100 MHz | 240 MHz | 200 MHz | 166 MHz |
| On-chip Program Memory | ROMless | ROMless | ROMless | ROMless | ROMless | ROMless |
| Ethernet MAC | 10/100 | 10/100 | 10/100 | 10/100 | 10/100 | 10/100 |
| USB | USB 1.1 device/host | USB 1.1 device/host | USB 1.1 device/host | USB 1.1 device/host | USB 2.0 OTG | USB 1.1 device |
| External Bus | 32-bit glueless | 32-bit glueless | 32-bit glueless | 32-bit glueless | 32-bit glueless | 32-bit glueless |
Ключевые отличия
- Highest-volume MCF5307 variant with broadest distributor inventory (против MCF5307CFT90B)
- 11% higher core clock than 90 MHz baseline (против MCF5307FT100B)
- 167% higher CPU throughput for compute-heavy control planes (против MCF5329CFT240B)
Заметки по проектированию
The MCF5307FT90B requires a clean 3.3 V supply with bulk decoupling of at least 47 uF and 100 nF ceramic capacitors placed within 5 mm of every VDD/VSS pin pair (16 pairs total in the 208-FQFP). The PLL supply pin VDDSYN must be filtered with an inductor or ferrite bead and decoupled with 10 uF + 100 nF to suppress jitter on the 90 MHz core clock. Power-up sequencing: hold RESET until VDD reaches 3.0 V minimum and the CLKIN oscillator has stabilized for at least 100 cycles.
Use a 4-layer PCB stack-up with continuous ground and power planes under the 208-FQFP footprint to provide low-impedance return paths for the 32-bit external memory bus. Match the address, data, and control traces to within +/- 1 cm of each other in the same bus segment and route them over a solid ground plane. SDRAM traces should be length-matched within 50 ps of CLKOUT to preserve setup/hold margin at 90 MHz.
Do not assume the BDM and JTAG interfaces share the same pin functions - they are multiplexed and must be configured in firmware before first debug attach. Leave at least 4 GPIO pins unused for future boot-mode strap overrides, since ColdFire boot configuration (boot device width, chip-select mapping, and PLL multiplier) is sampled at reset on dedicated pins. When migrating to MCF5307FT100B or MCF5329CFT240B, verify the SDRAM refresh-rate register values because higher core clocks change the bus-to-core ratio.
Информация о соответствии
RoHS, REACH, lead-free, halogen-free, and conflict-mineral status not found in the verified distributor snippets; consult NXP product compliance documentation directly. AEC-Q100 not applicable - this is an industrial/consumer MCU.
