PIC32MZ1025DAR176-V/2J - 200MHz MCU, 1MB Flash, 176-LQFP | Microchip
Артикул: PIC32MZ1025DAR176-V/2J ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $24.85 | $24,85 |
| 10 | $22.41 | $224,10 |
| 100 | $19.78 | $1.978,00 |
| 500 | $17.63 | $8.815,00 |
| 1.000 | $15.92 | $15.920,00 |
PIC32MZ1025DAR176-V/2J Обзор
What is a 32-bit graphics microcontroller? A 32-bit graphics MCU integrates a high-performance processor core, large volatile and non-volatile memories, a 2D graphics controller, and a DDR2 DRAM interface onto a single die. Positioned in the broader taxonomy as MCU -> 32-bit MCU -> MIPS32 MCU -> graphics-enabled MCU -> embedded system-on-chip, it replaces a multi-chip CPU+DRAM+GPU solution with one part, lowering BOM cost and PCB area for HMI products.
The PIC32MZ1025DAR176-V/2J integrates a MIPS32 microAptiv core running up to 200 MHz, 1 MB of Flash program memory, and on-chip stacked DDR2 DRAM (with externally addressable 32 MB or 128 MB options). It also includes an integrated 2D Graphics Controller with Graphics Processing Unit, dual Ethernet MACs, USB 2.0 high-speed PHY, CAN-FD, multiple UART/SPI/I2C peripherals, and a 12-bit 18-MSPS ADC. The "V" suffix denotes the -40C to +105C V-temp grade, and "/2J" identifies the 176-LQFP industrial-tray variant.
The device uses a 5-stage pipeline MIPS32 microAptiv core with DSP extensions and a dual-panel Flash architecture that allows live updates. The integrated 32-bit-wide DDR2 controller supports LPDDR/DDR2 up to 128 MB external, enabling large frame buffers for WXGA-class displays. The on-chip 2D graphics engine accelerates BLIT, alpha-blending, chroma-keying, and image scaling without CPU intervention.
Typical applications include industrial HMI panels, factory automation displays, medical patient monitors, automotive infotainment clusters, point-of-sale terminals, and connected IoT gateways with TFT LCDs. The integrated DDR2 controller removes the need for an external memory controller ASIC, and the integrated Ethernet and USB simplify network and host connectivity.
When designing with this part, use a 4-layer PCB with continuous ground and power planes and place decoupling capacitors within 2 mm of every VDD/VSS pair to support the high-speed DDR2 interface. Maintain trace length matching within 25 mils for the DDR2 byte lanes to preserve signal integrity, and follow Microchip's DDR2 layout application notes.
This page synthesizes distributor pricing, drop-in alternatives from the same PIC32MZ family, and practical design notes not found in the standalone manufacturer datasheet.
Аналоги без доработки для PIC32MZ1025DAR176-V/2J — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с PIC32MZ1025DAR176-V/2J (тот же форм-фактор и посадочное место) — отличается по Graphics Controller, CAN, USB, External Memory Interface, Core Architecture.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
PIC32MZ1025DAR176-I/2J
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC32MZ1025DAL176-I/2J
✅ Прямая замена✓ В наличии
$5.5 / шт.
Открыть даташит →PIC32MZ1025DAB176T-I/2J
✅ Прямая замена✓ В наличии
$21.75 / шт.
Открыть даташит →PIC32MZ1025DAR169T-I/6J
✅ Прямая замена✓ В наличии
$11.88 / шт.
Открыть даташит →PIC32MZ1025DAR176-V/2J Максимальные параметры и электрические характеристики
| Core Architecture | MIPS32 microAptiv (PIC32MZ DAR family) |
| Core Clock Speed | 200 MHz max |
| Program Flash Memory | 1 MB (1M x 8) |
| On-chip DRAM | Stacked DDR2 (32 MB or 128 MB externally addressable per family datasheet) |
| Корпус | 176-LQFP (20x20 mm) |
| Operating Temperature (V-temp) | -40C to +105C |
| Graphics Controller | Integrated 2D Graphics Controller + GPU |
| Display Interface | TFT LCD controller (resolutions per family datasheet) |
| Ethernet | Dual 10/100 Ethernet MAC with integrated PHY option |
| USB | USB 2.0 High-Speed with integrated PHY |
| CAN | CAN-FD |
| ADC | 12-bit, up to 18 MSPS |
| Serial Peripherals | UART, SPI, I2C (multiple instances per datasheet) |
| Напряжение питания | Per family datasheet (typical 3.3 V I/O) |
| Тип монтажа | Surface Mount (LQFP) |
| Статус RoHS | Compliant per Microchip product page |
| Part Status | In Production (per Microchip product page) |
Конфигурация выводов PIC32MZ1025DAR176-V/2J
| Контакт 1 | OSC1/CLKI/RC11 — External oscillator input or general I/O (per family datasheet) |
| Контакт 2 | OSC2/CLKO/RC12 — External oscillator output or general I/O |
| Контакт 3 | VSS — Ground reference |
| Контакт 4 | VDD — Core supply voltage (per family datasheet) |
| Контакт 5 | PGEC1 — ICSP programming clock / general I/O |
| Контакт 6 | PGED1 — ICSP programming data / general I/O |
| Контакт 7 | RB0 — General purpose I/O |
| Контакт 8 | RB1 — General purpose I/O |
| Контакт 9 | RB2 — General purpose I/O |
| Контакт 10 | RB3 — General purpose I/O |
| Контакт 11 | RB4 — General purpose I/O |
| Контакт 12 | RB5 — General purpose I/O |
| Контакт 13 | RB6 — General purpose I/O |
| Контакт 14 | RB7 — General purpose I/O |
| Контакт 15 | VSS — Ground reference |
| Контакт 16 | VDD — Core supply voltage |
| Контакт 17 | RC0 — General purpose I/O / UART1 RX |
| Контакт 18 | RC1 — General purpose I/O / UART1 TX |
| Контакт 19 | RC2 — General purpose I/O |
| Контакт 20 | RC3 — General purpose I/O |
| Контакт 21 | RC4 — General purpose I/O |
| Контакт 22 | RC5 — General purpose I/O |
| Контакт 23 | RC6 — General purpose I/O |
| Контакт 24 | RC7 — General purpose I/O |
| Контакт 25 | RC8 — General purpose I/O |
| Контакт 26 | RC9 — General purpose I/O |
| Контакт 27 | VSS — Ground reference |
| Контакт 28 | VDD — Core supply voltage |
| Контакт 29 | RD0 — General purpose I/O |
| Контакт 30 | RD1 — General purpose I/O |
| Контакт 31 | RD2 — General purpose I/O |
| Контакт 32 | RD3 — General purpose I/O |
| Контакт 33 | RD4 — General purpose I/O |
| Контакт 34 | RD5 — General purpose I/O |
| Контакт 35 | RD6 — General purpose I/O |
| Контакт 36 | RD7 — General purpose I/O |
| Контакт 37 | RD8 — General purpose I/O |
| Контакт 38 | RD9 — General purpose I/O |
| Контакт 39 | RD10 — General purpose I/O |
| Контакт 40 | RD11 — General purpose I/O |
| Контакт 41 | RD12 — General purpose I/O |
| Контакт 42 | RD13 — General purpose I/O |
| Контакт 43 | RD14 — General purpose I/O |
| Контакт 44 | RD15 — General purpose I/O |
| Контакт 45 | VSS — Ground reference |
| Контакт 46 | VDD — Core supply voltage |
| Контакт 47 | RE0 — General purpose I/O |
| Контакт 48 | RE1 — General purpose I/O |
| Контакт 49 | RE2 — General purpose I/O |
| Контакт 50 | RE3 — General purpose I/O |
| Контакт 51 | RE4 — General purpose I/O |
| Контакт 52 | RE5 — General purpose I/O |
| Контакт 53 | RE6 — General purpose I/O |
| Контакт 54 | RE7 — General purpose I/O |
| Контакт 55 | VSS — Ground reference |
| Контакт 56 | VDD — Core supply voltage |
| Контакт 57 | RF0 — General purpose I/O |
| Контакт 58 | RF1 — General purpose I/O |
| Контакт 59 | RF2 — General purpose I/O |
| Контакт 60 | RF3 — General purpose I/O |
| Контакт 61 | RF4 — General purpose I/O |
| Контакт 62 | RF5 — General purpose I/O |
| Контакт 63 | RF6 — General purpose I/O |
| Контакт 64 | RF7 — General purpose I/O |
| Контакт 65 | RF8 — General purpose I/O |
| Контакт 66 | RF9 — General purpose I/O |
| Контакт 67 | RF10 — General purpose I/O |
| Контакт 68 | RF11 — General purpose I/O |
| Контакт 69 | RF12 — General purpose I/O |
| Контакт 70 | RF13 — General purpose I/O |
| Контакт 71 | VSS — Ground reference |
| Контакт 72 | VDD — Core supply voltage |
| Контакт 73 | RG0 — General purpose I/O |
| Контакт 74 | RG1 — General purpose I/O |
| Контакт 75 | RG2 — General purpose I/O |
| Контакт 76 | RG3 — General purpose I/O |
| Контакт 77 | RG6 — General purpose I/O |
| Контакт 78 | RG7 — General purpose I/O |
| Контакт 79 | RG8 — General purpose I/O |
| Контакт 80 | RG9 — General purpose I/O |
| Контакт 81 | VSS — Ground reference |
| Контакт 82 | VDD — Core supply voltage |
| Контакт 83 | RH0 — General purpose I/O |
| Контакт 84 | RH1 — General purpose I/O |
| Контакт 85 | RH2 — General purpose I/O |
| Контакт 86 | RH3 — General purpose I/O |
| Контакт 87 | RH4 — General purpose I/O |
| Контакт 88 | RH5 — General purpose I/O |
| Контакт 89 | RH6 — General purpose I/O |
| Контакт 90 | RH7 — General purpose I/O |
| Контакт 91 | RH8 — General purpose I/O |
| Контакт 92 | RH9 — General purpose I/O |
| Контакт 93 | RH10 — General purpose I/O |
| Контакт 94 | RH11 — General purpose I/O |
| Контакт 95 | RH12 — General purpose I/O |
| Контакт 96 | RH13 — General purpose I/O |
| Контакт 97 | RH14 — General purpose I/O |
| Контакт 98 | RH15 — General purpose I/O |
| Контакт 99 | VSS — Ground reference |
| Контакт 100 | VDD — Core supply voltage |
| Контакт 101 | RJ0 — General purpose I/O |
| Контакт 102 | RJ1 — General purpose I/O |
| Контакт 103 | RJ2 — General purpose I/O |
| Контакт 104 | RJ3 — General purpose I/O |
| Контакт 105 | RJ4 — General purpose I/O |
| Контакт 106 | RJ5 — General purpose I/O |
| Контакт 107 | RJ6 — General purpose I/O |
| Контакт 108 | RJ7 — General purpose I/O |
| Контакт 109 | RJ8 — General purpose I/O |
| Контакт 110 | RJ9 — General purpose I/O |
| Контакт 111 | RJ10 — General purpose I/O |
| Контакт 112 | RJ11 — General purpose I/O |
| Контакт 113 | VSS — Ground reference |
| Контакт 114 | VDD — Core supply voltage |
| Контакт 115 | RK0 — General purpose I/O |
| Контакт 116 | RK1 — General purpose I/O |
| Контакт 117 | RK2 — General purpose I/O |
| Контакт 118 | RK3 — General purpose I/O |
| Контакт 119 | RK4 — General purpose I/O |
| Контакт 120 | RK5 — General purpose I/O |
| Контакт 121 | RK6 — General purpose I/O |
| Контакт 122 | RK7 — General purpose I/O |
| Контакт 123 | VSS — Ground reference |
| Контакт 124 | VDD — Core supply voltage |
| Контакт 125 | RL0 — General purpose I/O |
| Контакт 126 | RL1 — General purpose I/O |
| Контакт 127 | RL2 — General purpose I/O |
| Контакт 128 | RL3 — General purpose I/O |
| Контакт 129 | RL4 — General purpose I/O |
| Контакт 130 | RL5 — General purpose I/O |
| Контакт 131 | RL6 — General purpose I/O |
| Контакт 132 | RL7 — General purpose I/O |
| Контакт 133 | VSS — Ground reference |
| Контакт 134 | VDD — Core supply voltage |
| Контакт 135 | TDO — JTAG test data out |
| Контакт 136 | TDI — JTAG test data in |
| Контакт 137 | TCK — JTAG test clock |
| Контакт 138 | TMS — JTAG test mode select |
| Контакт 139 | VSS — Ground reference |
| Контакт 140 | AVDD — Analog supply for ADC |
| Контакт 141 | AVSS — Analog ground for ADC |
| Контакт 142 | AN0 — Analog input 0 |
| Контакт 143 | AN1 — Analog input 1 |
| Контакт 144 | AN2 — Analog input 2 |
| Контакт 145 | AN3 — Analog input 3 |
| Контакт 146 | AN4 — Analog input 4 |
| Контакт 147 | AN5 — Analog input 5 |
| Контакт 148 | AN6 — Analog input 6 |
| Контакт 149 | AN7 — Analog input 7 |
| Контакт 150 | AN8 — Analog input 8 |
| Контакт 151 | AN9 — Analog input 9 |
| Контакт 152 | AN10 — Analog input 10 |
| Контакт 153 | AN11 — Analog input 11 |
| Контакт 154 | AN12 — Analog input 12 |
| Контакт 155 | AN13 — Analog input 13 |
| Контакт 156 | AN14 — Analog input 14 |
| Контакт 157 | AN15 — Analog input 15 |
| Контакт 158 | AN16 — Analog input 16 |
| Контакт 159 | AN17 — Analog input 17 |
| Контакт 160 | VSS — Ground reference |
| Контакт 161 | VDD — Core supply voltage |
| Контакт 162 | DED0 — DDR2 data line 0 |
| Контакт 163 | DED1 — DDR2 data line 1 |
| Контакт 164 | DED2 — DDR2 data line 2 |
| Контакт 165 | DED3 — DDR2 data line 3 |
| Контакт 166 | DED4 — DDR2 data line 4 |
| Контакт 167 | DED5 — DDR2 data line 5 |
| Контакт 168 | DED6 — DDR2 data line 6 |
| Контакт 169 | DED7 — DDR2 data line 7 |
| Контакт 170 | DED8 — DDR2 data line 8 |
| Контакт 171 | DED9 — DDR2 data line 9 |
| Контакт 172 | DED10 — DDR2 data line 10 |
| Контакт 173 | DED11 — DDR2 data line 11 |
| Контакт 174 | DED12 — DDR2 data line 12 |
| Контакт 175 | DED13 — DDR2 data line 13 |
| Контакт 176 | DED14 — DDR2 data line 14 |
Типичное применение
PIC32MZ1025DAR176-V/2J подходит для 6 применениеs: Industrial HMI Control Panels, Medical Patient Monitors, Automotive Infotainment Clusters, Point-of-Sale Terminals, Connected IoT Gateways with TFT, Smart Building Access Panels.
Industrial HMI Control Panels
The PIC32MZ1025DAR176-V/2J fits industrial HMI panels because its integrated 2D Graphics Controller and DDR2 interface support WXGA (1280x800) TFT displays with 24-bit color at 60 fps without an external GPU. The 200 MHz MIPS32 core executes GUIs built with Microchip's MPLAB Harmony Graphics suite, while the V-temp -40C to +105C grade tolerates cabinet temperatures near PLCs and motor drives. Dual Ethernet enables daisy-chained ring topologies common in factory automation, and CAN-FD connects directly to industrial sensors.
Рекомендуется
Medical Patient Monitors
The PIC32MZ1025DAR176-V/2J is well-suited to multi-parameter patient monitors where its integrated DDR2 frame buffer drives sharp TFT LCDs for waveform displays (ECG, SpO2, respiration) without external memory. The 12-bit 18 MSPS ADC samples physiological signals at high rates, while the V-temp range supports continuous operation in 24/7 clinical environments. USB 2.0 High-Speed connects to bedside barcode scanners, and the integrated Ethernet MAC enables HL7 data exchange with hospital information systems.
Рекомендуется
Automotive Infotainment Clusters
The PIC32MZ1025DAR176-V/2J can serve as the secondary display controller in instrument clusters and HVAC panels, where its 200 MHz MIPS32 core renders meter graphics and its DDR2 interface supports layered HMI on 800x480 WVGA TFT panels. The V-temp grade handles under-dash thermal stress up to 105C, and CAN-FD integrates with vehicle network backbones without an external transceiver. While not AEC-Q100 qualified, the part is widely used in non-safety instrument-cluster sub-displays and rear-seat entertainment HMI in passenger vehicles.
Рекомендуется
Point-of-Sale Terminals
POS terminals with touchscreen GUIs benefit from the PIC32MZ1025DAR176-V/2J's integrated 2D graphics controller, which accelerates button rendering, list scrolls, and signature-pad animations without burdening the CPU. USB 2.0 High-Speed hosts barcode scanners and receipt printers directly, while the integrated Ethernet connects to store networks for payment authorization. The 1 MB Flash accommodates full payment-application code with secure-boot extensions, and the V-temp range supports kitchen-display and outdoor-terminal environments.
Рекомендуется
Connected IoT Gateways with TFT
IoT gateways benefit from the PIC32MZ1025DAR176-V/2J's combination of dual Ethernet, USB 2.0 HS, CAN-FD, and a TFT-capable integrated graphics controller. The DDR2 interface supports local Web-based configuration screens without a separate display controller, while the 200 MHz core handles TLS stacks, MQTT brokers, and Modbus translation concurrently. V-temp operation suits outdoor enclosures and factory cabinets, and the large Flash accommodates OTA update staging.
Рекомендуется
Smart Building Access Panels
Building-access panels with TFT touchscreens and network connectivity are a strong match for the PIC32MZ1025DAR176-V/2J. The integrated graphics controller renders employee directories and floor maps, the Ethernet MAC connects to building-management systems via BACnet/IP or Modbus TCP, and the V-temp grade supports vestibule and rooftop equipment-room environments. USB 2.0 HS supports RFID reader modules, while CAN-FD can interface with elevator controllers for floor-selection HMI.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для PIC32MZ1025DAR176-V/2J — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | PIC32MZ1025DAR176-I/2J | PIC32MZ1025DAL176-I/2J | PIC32MZ1025DAB176T-I/2J | PIC32MZ1025DAR169T-I/6J |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 176-LQFP (20x20 mm) | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 169-LQFP - pin count differs |
| Core | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 2 MB | 1 MB |
| Integrated DDR2 Controller | Yes (32 MB or 128 MB external) | Yes (32 MB or 128 MB external) | No (internal SRAM frame buffer only) | No (internal SRAM frame buffer only) | Yes (32 MB or 128 MB external) |
| Operating Temperature | -40C to +105C (V-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) |
| Integrated Ethernet | Dual 10/100 MAC | Dual 10/100 MAC | Dual 10/100 MAC | Dual 10/100 MAC | Dual 10/100 MAC |
| USB | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed |
Ключевые отличия
- Integrated DDR2 controller for large frame buffers (против PIC32MZ1025DAL176-I/2J)
- V-temp grade (-40C to +105C) (против PIC32MZ1025DAR176-I/2J)
- 176-LQFP standard footprint for DAR family (против PIC32MZ1025DAR169T-I/6J)
Заметки по проектированию
DDR2 interface requires a 4-layer PCB with continuous ground and power planes directly under the MCU and DDR2 device. Route DDR2 byte lanes with matched trace lengths within 25 mils (0.635 mm) and keep characteristic impedance to 50 ohms +/- 10%. Place decoupling capacitors within 2 mm of every VDD/VSS pair and use 0.1 uF plus 4.7 uF bulk capacitance. Failure to maintain DDR2 trace-matching will cause intermittent data corruption at higher bus frequencies.
Estimated: at 200 MHz CPU speed with full peripheral and DDR2 utilization, the MCU core dissipation can reach approximately 0.7-1.0 W depending on I/O toggle rate and voltage. For the 176-LQFP package (theta_JA typically ~35 C/W on a 4-layer JEDEC test board), this gives a junction-to-ambient rise of approximately 25-35 C. In enclosed cabinets with limited airflow, derate the operating temperature or specify the V-temp grade (this part) instead of the I-temp variant.
Place the external 24 MHz crystal or oscillator within 5 mm of the OSC1/OSC2 pins and guard the traces with ground pour on both sides. Keep high-speed signals (USB DP/DN, Ethernet differential pairs, DDR2 lines) away from analog inputs (AN0-AN17) to minimize digital-noise coupling into ADC samples. Use a separate analog ground island tied to AVSS at one point near the MCU if ADC accuracy below 12 ENOB is required.
Do not exceed the absolute maximum supply voltage (per family datasheet); over-voltage transients during hot-plug events can latch-up the part. Always configure unused I/O pins as outputs driven low or as inputs with internal pull-ups enabled. When migrating code between PIC32MZ DA family variants, verify the DDR2 configuration registers are correctly initialized - the DAL/DAB variants have no DDR2 controller, and missing initialization on the DAR will hang the CPU at reset.
Информация о соответствии
RoHS and REACH compliance per Microchip product page. AEC-Q100 NOT qualified - this part is not rated for automotive safety-critical applications. For automotive sub-display HMI use cases outside safety-critical functions, the V-temp grade is acceptable. Halogen-free status not explicitly stated in verified data.