PIC32MZ1025DAR176-V/2J - 200MHz MCU, 1MB Flash, 176-LQFP | Microchip
部品番号: PIC32MZ1025DAR176-V/2J ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $24.85 | $24.85 |
| 10 | $22.41 | $224.10 |
| 100 | $19.78 | $1,978.00 |
| 500 | $17.63 | $8,815.00 |
| 1,000 | $15.92 | $15,920.00 |
PIC32MZ1025DAR176-V/2J 概要
What is a 32-bit graphics microcontroller? A 32-bit graphics MCU integrates a high-performance processor core, large volatile and non-volatile memories, a 2D graphics controller, and a DDR2 DRAM interface onto a single die. Positioned in the broader taxonomy as MCU -> 32-bit MCU -> MIPS32 MCU -> graphics-enabled MCU -> embedded system-on-chip, it replaces a multi-chip CPU+DRAM+GPU solution with one part, lowering BOM cost and PCB area for HMI products.
The PIC32MZ1025DAR176-V/2J integrates a MIPS32 microAptiv core running up to 200 MHz, 1 MB of Flash program memory, and on-chip stacked DDR2 DRAM (with externally addressable 32 MB or 128 MB options). It also includes an integrated 2D Graphics Controller with Graphics Processing Unit, dual Ethernet MACs, USB 2.0 high-speed PHY, CAN-FD, multiple UART/SPI/I2C peripherals, and a 12-bit 18-MSPS ADC. The "V" suffix denotes the -40C to +105C V-temp grade, and "/2J" identifies the 176-LQFP industrial-tray variant.
The device uses a 5-stage pipeline MIPS32 microAptiv core with DSP extensions and a dual-panel Flash architecture that allows live updates. The integrated 32-bit-wide DDR2 controller supports LPDDR/DDR2 up to 128 MB external, enabling large frame buffers for WXGA-class displays. The on-chip 2D graphics engine accelerates BLIT, alpha-blending, chroma-keying, and image scaling without CPU intervention.
Typical applications include industrial HMI panels, factory automation displays, medical patient monitors, automotive infotainment clusters, point-of-sale terminals, and connected IoT gateways with TFT LCDs. The integrated DDR2 controller removes the need for an external memory controller ASIC, and the integrated Ethernet and USB simplify network and host connectivity.
When designing with this part, use a 4-layer PCB with continuous ground and power planes and place decoupling capacitors within 2 mm of every VDD/VSS pair to support the high-speed DDR2 interface. Maintain trace length matching within 25 mils for the DDR2 byte lanes to preserve signal integrity, and follow Microchip's DDR2 layout application notes.
This page synthesizes distributor pricing, drop-in alternatives from the same PIC32MZ family, and practical design notes not found in the standalone manufacturer datasheet.
ドロップイン代替品: PIC32MZ1025DAR176-V/2J — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MZ1025DAR176-V/2J (同一形状・フットプリント) — 相違点: Graphics Controller, CAN, USB, External Memory Interface, Core Architecture.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MZ1025DAR176-I/2J
✅ ドロップイン📋 参考代替品(カタログ未掲載)
PIC32MZ1025DAL176-I/2J
✅ ドロップイン✓ 在庫あり
$5.5 / 個
データシートを見る →PIC32MZ1025DAB176T-I/2J
✅ ドロップイン✓ 在庫あり
$21.75 / 個
データシートを見る →PIC32MZ1025DAR169T-I/6J
✅ ドロップイン✓ 在庫あり
$11.88 / 個
データシートを見る →PIC32MZ1025DAR176-V/2J 最大定格&電気的特性
| Core Architecture | MIPS32 microAptiv (PIC32MZ DAR family) |
| Core Clock Speed | 200 MHz max |
| Program Flash Memory | 1 MB (1M x 8) |
| On-chip DRAM | Stacked DDR2 (32 MB or 128 MB externally addressable per family datasheet) |
| パッケージ | 176-LQFP (20x20 mm) |
| Operating Temperature (V-temp) | -40C to +105C |
| Graphics Controller | Integrated 2D Graphics Controller + GPU |
| Display Interface | TFT LCD controller (resolutions per family datasheet) |
| Ethernet | Dual 10/100 Ethernet MAC with integrated PHY option |
| USB | USB 2.0 High-Speed with integrated PHY |
| CAN | CAN-FD |
| ADC | 12-bit, up to 18 MSPS |
| Serial Peripherals | UART, SPI, I2C (multiple instances per datasheet) |
| 電源電圧 | Per family datasheet (typical 3.3 V I/O) |
| 実装タイプ | Surface Mount (LQFP) |
| RoHS ステータス | Compliant per Microchip product page |
| Part Status | In Production (per Microchip product page) |
PIC32MZ1025DAR176-V/2J ピン構成
| ピン 1 | OSC1/CLKI/RC11 — External oscillator input or general I/O (per family datasheet) |
| ピン 2 | OSC2/CLKO/RC12 — External oscillator output or general I/O |
| ピン 3 | VSS — Ground reference |
| ピン 4 | VDD — Core supply voltage (per family datasheet) |
| ピン 5 | PGEC1 — ICSP programming clock / general I/O |
| ピン 6 | PGED1 — ICSP programming data / general I/O |
| ピン 7 | RB0 — General purpose I/O |
| ピン 8 | RB1 — General purpose I/O |
| ピン 9 | RB2 — General purpose I/O |
| ピン 10 | RB3 — General purpose I/O |
| ピン 11 | RB4 — General purpose I/O |
| ピン 12 | RB5 — General purpose I/O |
| ピン 13 | RB6 — General purpose I/O |
| ピン 14 | RB7 — General purpose I/O |
| ピン 15 | VSS — Ground reference |
| ピン 16 | VDD — Core supply voltage |
| ピン 17 | RC0 — General purpose I/O / UART1 RX |
| ピン 18 | RC1 — General purpose I/O / UART1 TX |
| ピン 19 | RC2 — General purpose I/O |
| ピン 20 | RC3 — General purpose I/O |
| ピン 21 | RC4 — General purpose I/O |
| ピン 22 | RC5 — General purpose I/O |
| ピン 23 | RC6 — General purpose I/O |
| ピン 24 | RC7 — General purpose I/O |
| ピン 25 | RC8 — General purpose I/O |
| ピン 26 | RC9 — General purpose I/O |
| ピン 27 | VSS — Ground reference |
| ピン 28 | VDD — Core supply voltage |
| ピン 29 | RD0 — General purpose I/O |
| ピン 30 | RD1 — General purpose I/O |
| ピン 31 | RD2 — General purpose I/O |
| ピン 32 | RD3 — General purpose I/O |
| ピン 33 | RD4 — General purpose I/O |
| ピン 34 | RD5 — General purpose I/O |
| ピン 35 | RD6 — General purpose I/O |
| ピン 36 | RD7 — General purpose I/O |
| ピン 37 | RD8 — General purpose I/O |
| ピン 38 | RD9 — General purpose I/O |
| ピン 39 | RD10 — General purpose I/O |
| ピン 40 | RD11 — General purpose I/O |
| ピン 41 | RD12 — General purpose I/O |
| ピン 42 | RD13 — General purpose I/O |
| ピン 43 | RD14 — General purpose I/O |
| ピン 44 | RD15 — General purpose I/O |
| ピン 45 | VSS — Ground reference |
| ピン 46 | VDD — Core supply voltage |
| ピン 47 | RE0 — General purpose I/O |
| ピン 48 | RE1 — General purpose I/O |
| ピン 49 | RE2 — General purpose I/O |
| ピン 50 | RE3 — General purpose I/O |
| ピン 51 | RE4 — General purpose I/O |
| ピン 52 | RE5 — General purpose I/O |
| ピン 53 | RE6 — General purpose I/O |
| ピン 54 | RE7 — General purpose I/O |
| ピン 55 | VSS — Ground reference |
| ピン 56 | VDD — Core supply voltage |
| ピン 57 | RF0 — General purpose I/O |
| ピン 58 | RF1 — General purpose I/O |
| ピン 59 | RF2 — General purpose I/O |
| ピン 60 | RF3 — General purpose I/O |
| ピン 61 | RF4 — General purpose I/O |
| ピン 62 | RF5 — General purpose I/O |
| ピン 63 | RF6 — General purpose I/O |
| ピン 64 | RF7 — General purpose I/O |
| ピン 65 | RF8 — General purpose I/O |
| ピン 66 | RF9 — General purpose I/O |
| ピン 67 | RF10 — General purpose I/O |
| ピン 68 | RF11 — General purpose I/O |
| ピン 69 | RF12 — General purpose I/O |
| ピン 70 | RF13 — General purpose I/O |
| ピン 71 | VSS — Ground reference |
| ピン 72 | VDD — Core supply voltage |
| ピン 73 | RG0 — General purpose I/O |
| ピン 74 | RG1 — General purpose I/O |
| ピン 75 | RG2 — General purpose I/O |
| ピン 76 | RG3 — General purpose I/O |
| ピン 77 | RG6 — General purpose I/O |
| ピン 78 | RG7 — General purpose I/O |
| ピン 79 | RG8 — General purpose I/O |
| ピン 80 | RG9 — General purpose I/O |
| ピン 81 | VSS — Ground reference |
| ピン 82 | VDD — Core supply voltage |
| ピン 83 | RH0 — General purpose I/O |
| ピン 84 | RH1 — General purpose I/O |
| ピン 85 | RH2 — General purpose I/O |
| ピン 86 | RH3 — General purpose I/O |
| ピン 87 | RH4 — General purpose I/O |
| ピン 88 | RH5 — General purpose I/O |
| ピン 89 | RH6 — General purpose I/O |
| ピン 90 | RH7 — General purpose I/O |
| ピン 91 | RH8 — General purpose I/O |
| ピン 92 | RH9 — General purpose I/O |
| ピン 93 | RH10 — General purpose I/O |
| ピン 94 | RH11 — General purpose I/O |
| ピン 95 | RH12 — General purpose I/O |
| ピン 96 | RH13 — General purpose I/O |
| ピン 97 | RH14 — General purpose I/O |
| ピン 98 | RH15 — General purpose I/O |
| ピン 99 | VSS — Ground reference |
| ピン 100 | VDD — Core supply voltage |
| ピン 101 | RJ0 — General purpose I/O |
| ピン 102 | RJ1 — General purpose I/O |
| ピン 103 | RJ2 — General purpose I/O |
| ピン 104 | RJ3 — General purpose I/O |
| ピン 105 | RJ4 — General purpose I/O |
| ピン 106 | RJ5 — General purpose I/O |
| ピン 107 | RJ6 — General purpose I/O |
| ピン 108 | RJ7 — General purpose I/O |
| ピン 109 | RJ8 — General purpose I/O |
| ピン 110 | RJ9 — General purpose I/O |
| ピン 111 | RJ10 — General purpose I/O |
| ピン 112 | RJ11 — General purpose I/O |
| ピン 113 | VSS — Ground reference |
| ピン 114 | VDD — Core supply voltage |
| ピン 115 | RK0 — General purpose I/O |
| ピン 116 | RK1 — General purpose I/O |
| ピン 117 | RK2 — General purpose I/O |
| ピン 118 | RK3 — General purpose I/O |
| ピン 119 | RK4 — General purpose I/O |
| ピン 120 | RK5 — General purpose I/O |
| ピン 121 | RK6 — General purpose I/O |
| ピン 122 | RK7 — General purpose I/O |
| ピン 123 | VSS — Ground reference |
| ピン 124 | VDD — Core supply voltage |
| ピン 125 | RL0 — General purpose I/O |
| ピン 126 | RL1 — General purpose I/O |
| ピン 127 | RL2 — General purpose I/O |
| ピン 128 | RL3 — General purpose I/O |
| ピン 129 | RL4 — General purpose I/O |
| ピン 130 | RL5 — General purpose I/O |
| ピン 131 | RL6 — General purpose I/O |
| ピン 132 | RL7 — General purpose I/O |
| ピン 133 | VSS — Ground reference |
| ピン 134 | VDD — Core supply voltage |
| ピン 135 | TDO — JTAG test data out |
| ピン 136 | TDI — JTAG test data in |
| ピン 137 | TCK — JTAG test clock |
| ピン 138 | TMS — JTAG test mode select |
| ピン 139 | VSS — Ground reference |
| ピン 140 | AVDD — Analog supply for ADC |
| ピン 141 | AVSS — Analog ground for ADC |
| ピン 142 | AN0 — Analog input 0 |
| ピン 143 | AN1 — Analog input 1 |
| ピン 144 | AN2 — Analog input 2 |
| ピン 145 | AN3 — Analog input 3 |
| ピン 146 | AN4 — Analog input 4 |
| ピン 147 | AN5 — Analog input 5 |
| ピン 148 | AN6 — Analog input 6 |
| ピン 149 | AN7 — Analog input 7 |
| ピン 150 | AN8 — Analog input 8 |
| ピン 151 | AN9 — Analog input 9 |
| ピン 152 | AN10 — Analog input 10 |
| ピン 153 | AN11 — Analog input 11 |
| ピン 154 | AN12 — Analog input 12 |
| ピン 155 | AN13 — Analog input 13 |
| ピン 156 | AN14 — Analog input 14 |
| ピン 157 | AN15 — Analog input 15 |
| ピン 158 | AN16 — Analog input 16 |
| ピン 159 | AN17 — Analog input 17 |
| ピン 160 | VSS — Ground reference |
| ピン 161 | VDD — Core supply voltage |
| ピン 162 | DED0 — DDR2 data line 0 |
| ピン 163 | DED1 — DDR2 data line 1 |
| ピン 164 | DED2 — DDR2 data line 2 |
| ピン 165 | DED3 — DDR2 data line 3 |
| ピン 166 | DED4 — DDR2 data line 4 |
| ピン 167 | DED5 — DDR2 data line 5 |
| ピン 168 | DED6 — DDR2 data line 6 |
| ピン 169 | DED7 — DDR2 data line 7 |
| ピン 170 | DED8 — DDR2 data line 8 |
| ピン 171 | DED9 — DDR2 data line 9 |
| ピン 172 | DED10 — DDR2 data line 10 |
| ピン 173 | DED11 — DDR2 data line 11 |
| ピン 174 | DED12 — DDR2 data line 12 |
| ピン 175 | DED13 — DDR2 data line 13 |
| ピン 176 | DED14 — DDR2 data line 14 |
主な用途
PIC32MZ1025DAR176-V/2J の用途: 6 件s: Industrial HMI Control Panels, Medical Patient Monitors, Automotive Infotainment Clusters, Point-of-Sale Terminals, Connected IoT Gateways with TFT, Smart Building Access Panels.
Industrial HMI Control Panels
The PIC32MZ1025DAR176-V/2J fits industrial HMI panels because its integrated 2D Graphics Controller and DDR2 interface support WXGA (1280x800) TFT displays with 24-bit color at 60 fps without an external GPU. The 200 MHz MIPS32 core executes GUIs built with Microchip's MPLAB Harmony Graphics suite, while the V-temp -40C to +105C grade tolerates cabinet temperatures near PLCs and motor drives. Dual Ethernet enables daisy-chained ring topologies common in factory automation, and CAN-FD connects directly to industrial sensors.
おすすめ
Medical Patient Monitors
The PIC32MZ1025DAR176-V/2J is well-suited to multi-parameter patient monitors where its integrated DDR2 frame buffer drives sharp TFT LCDs for waveform displays (ECG, SpO2, respiration) without external memory. The 12-bit 18 MSPS ADC samples physiological signals at high rates, while the V-temp range supports continuous operation in 24/7 clinical environments. USB 2.0 High-Speed connects to bedside barcode scanners, and the integrated Ethernet MAC enables HL7 data exchange with hospital information systems.
おすすめ
Automotive Infotainment Clusters
The PIC32MZ1025DAR176-V/2J can serve as the secondary display controller in instrument clusters and HVAC panels, where its 200 MHz MIPS32 core renders meter graphics and its DDR2 interface supports layered HMI on 800x480 WVGA TFT panels. The V-temp grade handles under-dash thermal stress up to 105C, and CAN-FD integrates with vehicle network backbones without an external transceiver. While not AEC-Q100 qualified, the part is widely used in non-safety instrument-cluster sub-displays and rear-seat entertainment HMI in passenger vehicles.
おすすめ
Point-of-Sale Terminals
POS terminals with touchscreen GUIs benefit from the PIC32MZ1025DAR176-V/2J's integrated 2D graphics controller, which accelerates button rendering, list scrolls, and signature-pad animations without burdening the CPU. USB 2.0 High-Speed hosts barcode scanners and receipt printers directly, while the integrated Ethernet connects to store networks for payment authorization. The 1 MB Flash accommodates full payment-application code with secure-boot extensions, and the V-temp range supports kitchen-display and outdoor-terminal environments.
おすすめ
Connected IoT Gateways with TFT
IoT gateways benefit from the PIC32MZ1025DAR176-V/2J's combination of dual Ethernet, USB 2.0 HS, CAN-FD, and a TFT-capable integrated graphics controller. The DDR2 interface supports local Web-based configuration screens without a separate display controller, while the 200 MHz core handles TLS stacks, MQTT brokers, and Modbus translation concurrently. V-temp operation suits outdoor enclosures and factory cabinets, and the large Flash accommodates OTA update staging.
おすすめ
Smart Building Access Panels
Building-access panels with TFT touchscreens and network connectivity are a strong match for the PIC32MZ1025DAR176-V/2J. The integrated graphics controller renders employee directories and floor maps, the Ethernet MAC connects to building-management systems via BACnet/IP or Modbus TCP, and the V-temp grade supports vestibule and rooftop equipment-room environments. USB 2.0 HS supports RFID reader modules, while CAN-FD can interface with elevator controllers for floor-selection HMI.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MZ1025DAR176-V/2J — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MZ1025DAR176-I/2J | PIC32MZ1025DAL176-I/2J | PIC32MZ1025DAB176T-I/2J | PIC32MZ1025DAR169T-I/6J |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 176-LQFP (20x20 mm) | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 169-LQFP - pin count differs |
| Core | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 2 MB | 1 MB |
| Integrated DDR2 Controller | Yes (32 MB or 128 MB external) | Yes (32 MB or 128 MB external) | No (internal SRAM frame buffer only) | No (internal SRAM frame buffer only) | Yes (32 MB or 128 MB external) |
| Operating Temperature | -40C to +105C (V-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) |
| Integrated Ethernet | Dual 10/100 MAC | Dual 10/100 MAC | Dual 10/100 MAC | Dual 10/100 MAC | Dual 10/100 MAC |
| USB | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed |
主な差別化要因
- Integrated DDR2 controller for large frame buffers (vs PIC32MZ1025DAL176-I/2J)
- V-temp grade (-40C to +105C) (vs PIC32MZ1025DAR176-I/2J)
- 176-LQFP standard footprint for DAR family (vs PIC32MZ1025DAR169T-I/6J)
設計ノート
DDR2 interface requires a 4-layer PCB with continuous ground and power planes directly under the MCU and DDR2 device. Route DDR2 byte lanes with matched trace lengths within 25 mils (0.635 mm) and keep characteristic impedance to 50 ohms +/- 10%. Place decoupling capacitors within 2 mm of every VDD/VSS pair and use 0.1 uF plus 4.7 uF bulk capacitance. Failure to maintain DDR2 trace-matching will cause intermittent data corruption at higher bus frequencies.
Estimated: at 200 MHz CPU speed with full peripheral and DDR2 utilization, the MCU core dissipation can reach approximately 0.7-1.0 W depending on I/O toggle rate and voltage. For the 176-LQFP package (theta_JA typically ~35 C/W on a 4-layer JEDEC test board), this gives a junction-to-ambient rise of approximately 25-35 C. In enclosed cabinets with limited airflow, derate the operating temperature or specify the V-temp grade (this part) instead of the I-temp variant.
Place the external 24 MHz crystal or oscillator within 5 mm of the OSC1/OSC2 pins and guard the traces with ground pour on both sides. Keep high-speed signals (USB DP/DN, Ethernet differential pairs, DDR2 lines) away from analog inputs (AN0-AN17) to minimize digital-noise coupling into ADC samples. Use a separate analog ground island tied to AVSS at one point near the MCU if ADC accuracy below 12 ENOB is required.
Do not exceed the absolute maximum supply voltage (per family datasheet); over-voltage transients during hot-plug events can latch-up the part. Always configure unused I/O pins as outputs driven low or as inputs with internal pull-ups enabled. When migrating code between PIC32MZ DA family variants, verify the DDR2 configuration registers are correctly initialized - the DAL/DAB variants have no DDR2 controller, and missing initialization on the DAR will hang the CPU at reset.
コンプライアンス情報
RoHS and REACH compliance per Microchip product page. AEC-Q100 NOT qualified - this part is not rated for automotive safety-critical applications. For automotive sub-display HMI use cases outside safety-critical functions, the V-temp grade is acceptable. Halogen-free status not explicitly stated in verified data.