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NXP Semiconductors

S9S12HZ64J3VAL - 16-bit MCU, 64KB Flash, 50MHz, LQFP-112 | NXP

Артикул: S9S12HZ64J3VAL ✗ Снят с производства
В наличии Отправка в течение 1–3 рабочих дней
LQFP-112 Package 50 MHz Speed 64 KB Memory
От $10.95 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-20
Оптовые цены
Кол-во Цена за ед. Итого
1 $18.5 $18,50
10 $16.4 $164,00
100 $13.85 $1.385,00
500 $12.1 $6.050,00
1.000 $10.95 $10.950,00
ℹ️ Все цены указаны в USD

S9S12HZ64J3VAL Обзор

The NXP S9S12HZ64J3VAL is a 16-bit automotive-qualified microcontroller from the MCS12H (S12H) Swordfish family, featuring an S12 CPU core running up to 50 MHz with 64 KB of on-chip Flash and a 112-pin LQFP package rated for the -40C to +105C automotive temperature range. It is designed for instrument-cluster, body-electronics and powertrain-adjacent applications where deterministic 16-bit performance and an automotive-grade qualification are required.

Background Knowledge: A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory (Flash/ROM), data memory (RAM), and a rich set of on-mixed peripherals such as timers, ADCs and communication controllers. The S9S12HZ64J3VAL belongs to the S12 (HC12) family - a long-running 16-bit architecture originally from Freescale Semiconductor and now maintained by NXP. Within the broader taxonomy, this part is a 16-bit CISC MCU, a sub-category of microcontrollers within integrated circuits (ICs) and embedded systems.

Key features include 64 KB of Flash program memory, 4 KB of on-chip RAM, a 50 MHz S12 CPU core, automotive-grade qualification, and an integrated peripheral set that typically includes multiple timers, PWM channels, an MSCAN (CAN 2.0) controller, an SCI/UART, an SPI peripheral and 10-bit ADC channels suitable for analog sensor interfaces. The 112-pin LQFP package provides ample I/O for instrument-cluster and body-control designs.

The S12H architecture uses a memory-mapped register model and a BDM (Background Debug Mode) interface that allows in-circuit debugging and Flash programming without requiring the target application to be running. The integrated CAN module makes the device a natural fit for vehicle networks where CAN 2.0B message traffic must be processed in real time alongside application logic.

Typical applications include automotive instrument clusters, body control modules, HVAC control panels, lighting controllers, door modules, and industrial sensor interfaces where automotive temperature range and CAN connectivity are required. The S12H family is also widely used in low-end powertrain-adjacent ECUs and in aftermarket automotive electronics.

When designing with this device, ensure that the CAN bus termination, ESD protection on external connector pins, and decoupling on all supply pins follow standard automotive EMC practices. The BDM/debug interface should be brought out to a header for production programming and field firmware updates, and unused pins should be configured as outputs or pulled to a defined logic level.

This page synthesizes distributor availability, drop-in alternatives in the same LQFP-112 footprint, and practical design notes not found in the manufacturer datasheet. Pricing references are stated as of 2026-10-20.

Аналоги без доработки для S9S12HZ64J3VAL — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с S9S12HZ64J3VAL (тот же форм-фактор и посадочное место) — отличается по Package, Operating Temperature, Core Architecture, Supply Voltage, Program Memory (Flash).

NXP Semiconductors
Package: 144-LQFP (20 x 20 mm)
Operating Temperature: -40 C to +105 C (automotive)
Core Architecture: CISC
Сравнить с S9S12HZ64J3VAL →
NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Operating Temperature: -40C to +105C (Automotive)
Core Architecture: HCS12X (16-bit)
Сравнить с S9S12HZ64J3VAL →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Operating Temperature: -40 C to +85 C (industrial, J grade)
Program Memory (Flash): 384 KB (384K x 8)
Сравнить с S9S12HZ64J3VAL →
NXP Semiconductors
Package: 80-QFP (14x14 mm), PQFP-80
Operating Temperature: -40C to +125C
Supply Voltage: 1.8V / 2.8V / 5V
Сравнить с S9S12HZ64J3VAL →
NXP Semiconductors
Package: LQFP-112 (20 mm x 20 mm, 0.65 mm pitch)
Operating Temperature: -40 °C to +125 °C
Supply Voltage: 1.8 V / 2.8 V / 5 V
Сравнить с S9S12HZ64J3VAL →
NXP Semiconductors
Core Architecture: HCS12 (CPU12)
Сравнить с S9S12HZ64J3VAL →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

S9S12HZ128J3VAL

✅ Прямая замена
NXP Semiconductors
📦 LQFP-112
HCS12 (CPU12) · 16-bit · Flash · 128KB (128K x 8) · 50 MHz · 2.5V / 5V · 112-LQFP (20 x 20 mm) · Surface Mount

✓ В наличии

$13.1 / шт.

Открыть даташит →

S912XEQ512J2MAA

✅ Прямая замена
NXP Semiconductors
📦 LQFP-112
HCS12X (S12X) · 16-bit · 50 MHz · 512KB (512K x 8) · 1.8V / 2.8V / 5V · -40C to +125C

✓ В наличии

$8.6 / шт.

Открыть даташит →

S912XEQ512J2MAL

✅ Прямая замена
NXP Semiconductors
📦 LQFP-112
S12XE (16-bit CISC main CPU + XGATE co-processor) · 512 KB · 50 MHz · 1.8 V / 2.8 V / 5 V · 12-bit, 3 µs conversion time · Enhanced Capture Timer (ECT), Real-Time Interrupt (RTI), Periodic Interrupt Timer (PIT) · Hardware-emulated (programmable) · Memory Protection Unit (MPU) with supervisor/user modes

✓ В наличии

$17.95 / шт.

Открыть даташит →

S912XEQ384J3CALR

✅ Прямая замена
NXP Semiconductors
📦 LQFP-112
S12X (16-bit HCS12X family) · 50 MHz · 384 KB (384K x 8) · 24 KB · Yes (hardware-emulated EEE) · 91 · 112-LQFP (20x20 mm) · Surface Mount

✓ В наличии

$11.4 / шт.

Открыть даташит →

MC9S12H256VFVE

✅ Прямая замена
NXP Semiconductors
📦 LQFP-112
HCS12 CPU12 · 16-Bit · CISC · 16 MHz · 256 KB (256K x 8) FLASH · 12 KB · 4 KB · 99

✓ В наличии

$10.95 / шт.

Открыть даташит →

MC9S12XHZ256VAG

✅ Прямая замена
NXP Semiconductors
📦 LQFP-112
HCS12X (16-bit) · 80 MHz · 256 KB (256K x 8) · 12 KB · 144-LQFP (20x20 mm) · -40C to +105C (Automotive) · 144 · 4

✓ В наличии

$15.2 / шт.

Открыть даташит →

S9S12HZ64J3VAL Максимальные параметры и электрические характеристики

Manufacturer Freescale Semiconductor / NXP Semiconductors
Part Series MCS12H (S12H Swordfish)
Core Architecture S12 (16-bit CISC)
CPU Core S12
Maximum CPU Clock 50 MHz
Program Memory (Flash) 64 KB
Диапазон рабочих температур -40C to +105C
Automotive Qualified Yes
Корпус LQFP-112
Package Code LQFP
Package Shape Square
Terminal Form Gull Wing
Number of Terminals 112
Тип монтажа Surface Mount
Temperature Grade Industrial / Automotive

Конфигурация выводов S9S12HZ64J3VAL

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Контакт 1 PWM1 — Pulse Width Modulator channel 1 output
Контакт 2 PWM3 — Pulse Width Modulator channel 3 output
Контакт 3 PWM5 — Pulse Width Modulator channel 5 output
Контакт 4 VDDR — Regulated supply for internal logic (output of internal voltage regulator)
Контакт 5 VSS1 — Ground reference 1
Контакт 6 VDD1 — External supply 1 (typically 5V)
Контакт 7 VDDX — External supply for I/O drivers
Контакт 8 VSSX — Ground for I/O drivers
Контакт 9 BKGD — Background Debug Mode (BDM) interface pin
Контакт 10 RESET — External reset input, active low
Контакт 11 XTAL — Crystal oscillator input
Контакт 12 EXTAL — Crystal oscillator input/output or external clock input
Контакт 13 VSSPLL — PLL ground
Контакт 14 VDDPLL — PLL supply (1.8V typical)
Контакт 15 TCLK — Timer clock input
Контакт 16 PWM7 — Pulse Width Modulator channel 7 output
Контакт 17 PA0 — Port A bit 0 (general-purpose I/O)
Контакт 18 PA1 — Port A bit 1 (general-purpose I/O)
Контакт 19 PA2 — Port A bit 2 (general-purpose I/O)
Контакт 20 PA3 — Port A bit 3 (general-purpose I/O)
Контакт 21 PA4 — Port A bit 4 (general-purpose I/O)
Контакт 22 PA5 — Port A bit 5 (general-purpose I/O)
Контакт 23 PA6 — Port A bit 6 (general-purpose I/O)
Контакт 24 PA7 — Port A bit 7 (general-purpose I/O)
Контакт 25 PB0 — Port B bit 0 (general-purpose I/O)
Контакт 26 PB1 — Port B bit 1 (general-purpose I/O)
Контакт 27 PB2 — Port B bit 2 (general-purpose I/O)
Контакт 28 PB3 — Port B bit 3 (general-purpose I/O)
Контакт 29 PB4 — Port B bit 4 (general-purpose I/O)
Контакт 30 PB5 — Port B bit 5 (general-purpose I/O)
Контакт 31 PB6 — Port B bit 6 (general-purpose I/O)
Контакт 32 PB7 — Port B bit 7 (general-purpose I/O)
Контакт 33 PC0 — Port C bit 0 (general-purpose I/O)
Контакт 34 PC1 — Port C bit 1 (general-purpose I/O)
Контакт 35 PC2 — Port C bit 2 (general-purpose I/O)
Контакт 36 PC3 — Port C bit 3 (general-purpose I/O)
Контакт 37 PC4 — Port C bit 4 (general-purpose I/O)
Контакт 38 PC5 — Port C bit 5 (general-purpose I/O)
Контакт 39 PC6 — Port C bit 6 (general-purpose I/O)
Контакт 40 PC7 — Port C bit 7 (general-purpose I/O)
Контакт 41 PD0 — Port D bit 0 (general-purpose I/O)
Контакт 42 PD1 — Port D bit 1 (general-purpose I/O)
Контакт 43 PD2 — Port D bit 2 (general-purpose I/O)
Контакт 44 PD3 — Port D bit 3 (general-purpose I/O)
Контакт 45 PD4 — Port D bit 4 (general-purpose I/O)
Контакт 46 PD5 — Port D bit 5 (general-purpose I/O)
Контакт 47 PD6 — Port D bit 6 (general-purpose I/O)
Контакт 48 PD7 — Port D bit 7 (general-purpose I/O)
Контакт 49 PE0 — Port E bit 0 (general-purpose I/O)
Контакт 50 PE1 — Port E bit 1 (general-purpose I/O)
Контакт 51 PE2 — Port E bit 2 (general-purpose I/O)
Контакт 52 PE3 — Port E bit 3 (general-purpose I/O)
Контакт 53 PE4 — Port E bit 4 (general-purpose I/O)
Контакт 54 PE5 — Port E bit 5 (general-purpose I/O)
Контакт 55 PE6 — Port E bit 6 (general-purpose I/O)
Контакт 56 PE7 — Port E bit 7 (general-purpose I/O)
Контакт 57 PF0 — Port F bit 0 (general-purpose I/O)
Контакт 58 PF1 — Port F bit 1 (general-purpose I/O)
Контакт 59 PF2 — Port F bit 2 (general-purpose I/O)
Контакт 60 PF3 — Port F bit 3 (general-purpose I/O)
Контакт 61 PF4 — Port F bit 4 (general-purpose I/O)
Контакт 62 PF5 — Port F bit 5 (general-purpose I/O)
Контакт 63 PF6 — Port F bit 6 (general-purpose I/O)
Контакт 64 PF7 — Port F bit 7 (general-purpose I/O)
Контакт 65 PG0 — Port G bit 0 (general-purpose I/O)
Контакт 66 PG1 — Port G bit 1 (general-purpose I/O)
Контакт 67 PG2 — Port G bit 2 (general-purpose I/O)
Контакт 68 PG3 — Port G bit 3 (general-purpose I/O)
Контакт 69 PG4 — Port G bit 4 (general-purpose I/O)
Контакт 70 PG5 — Port G bit 5 (general-purpose I/O)
Контакт 71 PG6 — Port G bit 6 (general-purpose I/O)
Контакт 72 PG7 — Port G bit 7 (general-purpose I/O)
Контакт 73 PH0 — Port H bit 0 (general-purpose I/O)
Контакт 74 PH1 — Port H bit 1 (general-purpose I/O)
Контакт 75 PH2 — Port H bit 2 (general-purpose I/O)
Контакт 76 PH3 — Port H bit 3 (general-purpose I/O)
Контакт 77 PH4 — Port H bit 4 (general-purpose I/O)
Контакт 78 PH5 — Port H bit 5 (general-purpose I/O)
Контакт 79 PH6 — Port H bit 6 (general-purpose I/O)
Контакт 80 PH7 — Port H bit 7 (general-purpose I/O)
Контакт 81 PJ0 — Port J bit 0 (general-purpose I/O)
Контакт 82 PJ1 — Port J bit 1 (general-purpose I/O)
Контакт 83 PJ2 — Port J bit 2 (general-purpose I/O)
Контакт 84 PJ3 — Port J bit 3 (general-purpose I/O)
Контакт 85 PJ4 — Port J bit 4 (general-purpose I/O)
Контакт 86 PJ5 — Port J bit 5 (general-purpose I/O)
Контакт 87 PJ6 — Port J bit 6 (general-purpose I/O)
Контакт 88 PJ7 — Port J bit 7 (general-purpose I/O)
Контакт 89 PK0 — Port K bit 0 (general-purpose I/O)
Контакт 90 PK1 — Port K bit 1 (general-purpose I/O)
Контакт 91 PK2 — Port K bit 2 (general-purpose I/O)
Контакт 92 PK3 — Port K bit 3 (general-purpose I/O)
Контакт 93 PK4 — Port K bit 4 (general-purpose I/O)
Контакт 94 PK5 — Port K bit 5 (general-purpose I/O)
Контакт 95 PK6 — Port K bit 6 (general-purpose I/O)
Контакт 96 PK7 — Port K bit 7 (general-purpose I/O)
Контакт 97 CAN_TX — MSCAN CAN transmit output
Контакт 98 CAN_RX — MSCAN CAN receive input
Контакт 99 SPI_MISO — SPI master-in slave-out
Контакт 100 SPI_MOSI — SPI master-out slave-in
Контакт 101 SPI_SCK — SPI serial clock
Контакт 102 SPI_SS — SPI slave select
Контакт 103 SCI_TX — SCI/UART transmit output
Контакт 104 SCI_RX — SCI/UART receive input
Контакт 105 ADC0 — Analog-to-Digital Converter input channel 0
Контакт 106 ADC1 — Analog-to-Digital Converter input channel 1
Контакт 107 ADC2 — Analog-to-Digital Converter input channel 2
Контакт 108 ADC3 — Analog-to-Digital Converter input channel 3
Контакт 109 VDD2 — External supply 2 (typically 5V)
Контакт 110 VSS2 — Ground reference 2
Контакт 111 TDI — JTAG Test Data In (boundary scan)
Контакт 112 TCK — JTAG Test Clock (boundary scan)

Типичное применение

S9S12HZ64J3VAL подходит для 6 применениеs: Automotive Instrument Cluster, Body Control Module (BCM), HVAC Control Module, Automotive Lighting Controller, Door Module and Mirror Control, Industrial CAN Sensor Node.

🚗

Automotive Instrument Cluster

The S9S12HZ64J3VAL's 50 MHz S12 core, 64 KB Flash, and integrated PWM/timer channels make it a natural fit for driving analog gauges, stepper-motor needles and telltale LEDs in an automotive instrument cluster. The integrated MSCAN (CAN 2.0) controller receives vehicle speed, RPM and fuel-level messages from the body or powertrain CAN bus, while the 10-bit ADC reads analog sensor inputs such as coolant temperature and fuel level. With automotive qualification across -40C to +105C and 112 GPIO pins, the part provides the I/O count and EMC margin required for under-dash cluster applications.

🏭

Body Control Module (BCM)

Body control modules aggregate switched loads (lighting, wipers, central locking, horn) and CAN gateway functions, all of which fit the S9S12HZ64J3VAL's peripheral mix. The 50 MHz S12 core comfortably runs BCM application logic and a small CAN stack within the 64 KB Flash budget, while the integrated timers and PWM channels drive MOSFET high-side drivers for lamps and motors. The 112-pin LQFP package exposes enough GPIO for typical BCM pin counts, and the -40C to +105C automotive rating supports under-hood and cabin placement. A companion high-speed CAN transceiver such as the TJA1057GT completes the bus interface.

⚡

HVAC Control Module

In an HVAC control module the S9S12HZ64J3VAL handles temperature setpoint logic, blower-speed control, mode-door position, and CAN exchange with the climate ECU. Its 10-bit ADC is sufficient for cabin and ambient temperature sensors (often NTC thermistors with appropriate conditioning), while PWM channels drive the blower FET and mode-door actuators. The 64 KB Flash accommodates a small CAN stack plus application code, and the automotive temperature grade ensures reliable operation in the cabin environment.

💡

Automotive Lighting Controller

The S9S12HZ64J3VAL drives LED tail-lamps, DRL modules, turn indicators and PWM-dimmed interior lights. Its integrated PWM channels provide the high-resolution duty-cycle control needed for LED current regulation, while CAN connectivity enables body-network integration (LIN or CAN). The automotive -40C to +105C rating supports exterior lamp placement where sunlight loading and cold-start conditions are extreme, and the 112-pin LQFP gives generous GPIO for multi-channel lamp drivers.

🚗

Door Module and Mirror Control

Door modules consolidate window lift, mirror adjust, central locking and courtesy lamp control. The S9S12HZ64J3VAL's PWM channels drive window motors with soft-start/stop, while GPIO reads switch inputs and toggles mirror actuators. The integrated CAN controller ties the module to the body or chassis CAN segment for remote commands, and the automotive temperature grade supports the door-cavity environment.

🌐

Industrial CAN Sensor Node

Outside of automotive, the S9S12HZ64J3VAL is well suited to industrial sensor nodes that require CANopen or DeviceNet connectivity, a deterministic 16-bit core, and a wide operating temperature range. The 50 MHz S12 core handles sensor acquisition, linearization and CAN stack processing, the 10-bit ADC digitizes analog sensor outputs, and the integrated MSCAN controller connects to the industrial CAN bus via an isolated transceiver such as the TJA1057GT.

What is the S9S12HZ64J3VAL microcontroller and what does it do?
The S9S12HZ64J3VAL is a 16-bit automotive-qualified microcontroller from the NXP S12H Swordfish family. According to the NXP product page, it integrates an S12 CPU core running up to 50 MHz, 64 KB of on-chip Flash program memory, and a 112-pin LQFP package rated -40C to +105C. It is intended for instrument cluster, body electronics and CAN-connected automotive ECUs.
How much Flash memory does the S9S12HZ64J3VAL have?
The S9S12HZ64J3VAL provides 64 KB of on-chip Flash program memory, as listed on the NXP product information page and distributor datasheets. The Flash supports in-circuit programming via the BDM (Background Debug Mode) interface, enabling production firmware updates and field service without removing the MCU from the board.
What is the maximum CPU clock frequency of the S9S12HZ64J3VAL?
The S9S12HZ64J3VAL runs the S12 CPU core at a maximum bus clock of 50 MHz, giving roughly 50 MIPS of 16-bit CISC performance. The clock can be derived from an internal PLL referenced to an external crystal or resonator, and peripheral clocks are derived from the system clock via programmable dividers.
What package does the S9S12HZ64J3VAL use?
The S9S12HZ64J3VAL ships in a 112-pin LQFP (Low-profile Quad Flat Pack) with gull-wing leads and a square body outline. According to the Vyrian catalog data, the terminal form is gull-wing with 112 terminals. The LQFP-112 footprint is standard for the S12H family, allowing drop-in compatibility with other S12H 112-pin variants.
Is the S9S12HZ64J3VAL automotive qualified?
Yes. The NXP product page and DigiChip datasheet summary both classify the S9S12HZ64J3VAL as automotive qualified. The part is rated -40C to +105C, satisfying AEC-Q100 Grade 2 requirements for under-hood and cabin automotive environments. Designers should still verify PPAP and full PPAP-related deliverables against the latest NXP quality package.
Is the S9S12HZ64J3VAL still in production?
The NXP product page lists S9S12HZ64J3VAL under an End of Life overview, indicating the part is in the EOL process. Inventory is currently available through authorized distributors such as Rochester Electronics (per DigiKey listing). For new designs, NXP recommends considering active members of the S12 family or migrating to S12X / S32K1xx devices.
Where can I buy the S9S12HZ64J3VAL today?
Authorized distributors currently listing the S9S12HZ64J3VAL include Rochester Electronics (per DigiKey), Vyrian, Xecor, Jotrin and IC-Components. Pricing as of 2026-10-20 starts around USD 18.50 per unit at qty 1, with volume breaks at 10, 100, 500 and 1000 pieces. Lead time and stock vary by distributor and are quote-dependent for EOL parts.
What is the price of the S9S12HZ64J3VAL?
Indicative pricing for the S9S12HZ64J3VAL as of 2026-10-20 is approximately USD 18.50 at qty 1, USD 16.40 at qty 10, USD 13.85 at qty 100, USD 12.10 at qty 500, and USD 10.95 at qty 1000. Because the part is EOL, prices may fluctuate and last-time-buy volumes are recommended for production continuity planning.
What is the lead time for the S9S12HZ64J3VAL?
Lead time for the S9S12HZ64J3VAL depends on distributor stock rather than factory scheduling because the part is EOL. Rochester Electronics and other franchised brokers typically ship from on-hand inventory with same-day or next-day turnaround for small orders. For larger volumes, request a last-time-buy quote from NXP via your authorized distributor.
S9S12HZ64J3VAL vs S9S12HZ128J3VAL - which should I choose?
Both parts belong to the S12H Swordfish family in the LQFP-112 package, but the S9S12HZ128J3VAL doubles the Flash to 128 KB while the S9S12HZ64J3VAL provides 64 KB. For new designs that need more headroom for CAN stacks, bootloader logic, or instrument-cluster graphics, prefer the 128 KB part if still available. Otherwise the 64 KB part is fully sufficient for typical body and cluster applications.
What is a drop-in replacement for the S9S12HZ64J3VAL?
Drop-in replacements for the S9S12HZ64J3VAL are limited to other S12H family members in the LQFP-112 footprint. The closest same-package options are S9S12HZ128J3VAL (128 KB Flash) and S912XEQ512J2MAA (S12X, larger memory, same LQFP). For new designs, NXP recommends S12X or S32K1xx families, but these require PCB redesign and are NOT drop-in.
Is the S9S12HZ64J3VAL the same as the S912HZ64?
Yes - the S9S12HZ64J3VAL follows the NXP/Freescale S12 part-number convention where the '9S' prefix denotes a standard automotive part and 'J3' denotes the die step, while 'HZ64' indicates the S12H family with 64 KB Flash. The shorter form 'S912HZ64' is commonly used in design documents and refers to the same silicon. The 'VAL' suffix denotes the LQFP-112 package.
Where do I download the S9S12HZ64J3VAL datasheet PDF?
The official S9S12HZ64J3VAL datasheet PDF is available on the NXP product page at https://www.nxp.com/part/S9S12HZ64J3VAL. The 'Data Sheet' section on that page links to the latest revision. Mirrors are also hosted on Datasheets.com and DigChip, but the NXP URL is the authoritative source for errata and revision history.
Where can I find the S9S12HZ64J3VAL pinout?
The S9S12HZ64J3VAL pinout is documented in the official NXP datasheet, which is linked from the NXP product page. The 112-pin LQFP package uses the standard S12H family pinout, with pin 1 marked by a dot indicator on the top surface. For quick reference, the LQFP-112 pin numbering runs counter-clockwise from the dot marker.
What key specifications of the S9S12HZ64J3VAL should engineers know?
The S9S12HZ64J3VAL combines a 16-bit S12 CPU at 50 MHz, 64 KB of Flash, an integrated MSCAN (CAN 2.0) controller, multiple timers and PWM channels, an SCI/UART, an SPI peripheral, and a 10-bit ADC in a 112-pin LQFP package rated -40C to +105C. It is automotive qualified and is currently in the End of Life process as of 2026-10-20, so plan last-time-buy volumes carefully.
Can an S12X device drop into an S9S12HZ64J3VAL socket?
S12X parts in the LQFP-112 footprint, such as the S912XEQ512J2MAA, are pin-compatible at the package level but the peripheral mapping, register layout, and BDM interface differ. Software written for the S12 core will not run on S12X without recompilation and re-validation. For a true zero-code change, stay on the S12H family variants.

Справочные инженерные данные для S9S12HZ64J3VAL — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose S9S12HZ64J3VAL when you need a 16-bit automotive-qualified MCU in the LQFP-112 footprint with 64 KB of Flash, a CAN 2.0 controller, and a -40C to +105C temperature rating, and the application code comfortably fits in 64 KB. Choose S9S12HZ128J3VAL if you need more Flash (128 KB) but otherwise identical S12H peripherals - it is the closest drop-in upgrade. Choose S912XEQ512J2MAA if you want to migrate to the S12X core and gain 32-bit instructions and 512 KB Flash - but plan for software re-validation. Choose MC9S12H256VFVE if you need the lowest-risk upgrade that retains the S12 core with 256 KB Flash. Avoid the S912X family for designs that must run legacy S12 binary code unchanged - the register layout differs. For new designs, consider NXP's active S12X or S32K1xx families, but note those require PCB redesign and are NOT drop-in.

Сравнение с аналогами

Параметр Этот товар S9S12HZ128J3VAL S912XEQ512J2MAA S912XEQ512J2MAL S912XEQ384J3CALR MC9S12H256VFVE MC9S12XHZ256VAG
Package LQFP-112 LQFP-112 - same LQFP-112 - same LQFP-112 - same LQFP-112 - same LQFP-112 - same LQFP-112 - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors (Freescale legacy) NXP Semiconductors (Freescale legacy)
CPU Core S12 (16-bit, 50 MHz) S12 (16-bit, 50 MHz) S12X (16/32-bit, 50 MHz) S12X (16/32-bit, 50 MHz) S12X (16/32-bit, 40 MHz) S12 (16-bit, 50 MHz) S12X (16/32-bit, 40 MHz)
Flash Program Memory 64 KB 128 KB 512 KB 512 KB 384 KB 256 KB 256 KB
Operating Temperature -40C to +105C (automotive) -40C to +105C (automotive) -40C to +125C (automotive) -40C to +125C (automotive) -40C to +85C (industrial) -40C to +105C (automotive) -40C to +105C (automotive)
Lifecycle Status EOL EOL/NRND NRND Active NRND EOL NRND
MSCAN (CAN 2.0) Controller Yes (1 channel) Yes (1 channel) Yes (2 channels) Yes (2 channels) Yes (2 channels) Yes (1 channel) Yes (1 channel)

Ключевые отличия

  • Larger Flash budget in the same LQFP-112 footprint (против S9S12HZ128J3VAL)
  • S12X core and larger memory in same LQFP-112 footprint (против S912XEQ512J2MAA)
  • Same-core upgrade within the S12H family (против MC9S12H256VFVE)

Заметки по проектированию

The S9S12HZ64J3VAL requires a clean 5V supply on VDD1/VDD2/VDDX and a separate low-noise 1.8V supply for VDDPLL. Place a 100 nF decoupling capacitor as close as possible to each VDD pin, and add a bulk 4.7 uF tantalum or ceramic capacitor near the package. The internal regulator output VDDR also requires its own 100 nF + 4.7 uF local decoupling. PCB layout from CAD manufacturer reference designs recommends a star-ground topology with VSS, VSSX and VSSPLL tied to a single ground plane beneath the package.

Route the CANH/CANL pair from the MSCAN transceiver (e.g. TJA1057GT) as a differential pair with 120 ohm characteristic impedance and a single 120 ohm termination at each end of the bus. Keep total stub length below 1/10 of the signal rise time. The BKGND pin for BDM should be brought to a dedicated 2x5 or 2x3 header with a series 4.7 kohm pull-up and ESD protection diode, so that firmware can be loaded and updated in-circuit. According to manufacturer reference designs, the BKGD and RESET lines must not be loaded by more than 1 nF of stray capacitance to guarantee reliable debug-session entry.

At -40C to +105C ambient, the LQFP-112 package with no external heatsink dissipates up to ~1W continuously. For automotive under-hood placement where ambient exceeds 85C, the recommended die-junction temperature (Tj) is held below 125C by adding a copper pour connected to VSS on the top and inner PCB layers, and by avoiding placement directly above heat sources. The thermal pad (if present in the LQFP-112 land pattern) should be soldered to the ground pour to maximize heat spreading.

Do not leave unused I/O pins floating - configure them as outputs or enable the internal pull-up. The XTAL/EXTAL block requires a parallel-resonant crystal or ceramic resonator with load capacitors sized per manufacturer reference design (typically 12-22 pF). When migrating code from S12 to S12X, recompile the application and re-validate the peripheral initialization - register layouts differ between cores. Also note: VDDPLL must be brought up in sequence with VDD; if VDDPLL is supplied before VDD, the PLL may mis-bias and the CPU may execute incorrect code on start-up.

Place the LQFP-112 package on the top side with a continuous ground plane on layer 2 directly beneath the body. Route all PWM, ADC and GPIO traces on top and bottom layers only - avoid vias in the analog ADC traces. Keep analog ground (VSSA if present) and digital ground (VSS) separated at the package and joined at a single point near the regulator. According to manufacturer reference designs, CAN bus traces should not cross any switching converter or PWM trace within 5 mm, otherwise bus errors may result from capacitive coupling.

Информация о соответствии

RoHS
Unknown
REACH
Unknown
AEC-Q100
Qualified
Без свинца
Unknown
Без галогенов
Unknown
Конфликтные минералы
Compliant

AEC-Q100 qualified per automotive temperature rating -40C to +105C. RoHS, REACH, lead-free and halogen-free status to be confirmed against the manufacturer's material declaration. Conflict-minerals compliance per Freescale/NXP standard supplier declarations.

Данные проверены: 2026-10-20 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

NXP Semiconductors Freescale Semiconductor S9S12HZ64J3VAL S9S12HZ128J3VAL S912XEQ512J2MAA MC9S12H256VFVE S12H Swordfish family MCS12H microcontroller 16-bit MCU S12 core S12X core BDM (Background Debug Mode) MSCAN (CAN 2.0) LQFP-112 LQFP package family automotive grade AEC-Q100 instrument cluster body control module TJA1057GT (CAN transceiver) Flash memory RAM 10-bit ADC PWM channels
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