S9S12HZ64J3VAL - 16-bit MCU, 64KB Flash, 50MHz, LQFP-112 | NXP
Teilenummer: S9S12HZ64J3VAL ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.4 | $164,00 |
| 100 | $13.85 | $1.385,00 |
| 500 | $12.1 | $6.050,00 |
| 1.000 | $10.95 | $10.950,00 |
S9S12HZ64J3VAL Übersicht
Background Knowledge: A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory (Flash/ROM), data memory (RAM), and a rich set of on-mixed peripherals such as timers, ADCs and communication controllers. The S9S12HZ64J3VAL belongs to the S12 (HC12) family - a long-running 16-bit architecture originally from Freescale Semiconductor and now maintained by NXP. Within the broader taxonomy, this part is a 16-bit CISC MCU, a sub-category of microcontrollers within integrated circuits (ICs) and embedded systems.
Key features include 64 KB of Flash program memory, 4 KB of on-chip RAM, a 50 MHz S12 CPU core, automotive-grade qualification, and an integrated peripheral set that typically includes multiple timers, PWM channels, an MSCAN (CAN 2.0) controller, an SCI/UART, an SPI peripheral and 10-bit ADC channels suitable for analog sensor interfaces. The 112-pin LQFP package provides ample I/O for instrument-cluster and body-control designs.
The S12H architecture uses a memory-mapped register model and a BDM (Background Debug Mode) interface that allows in-circuit debugging and Flash programming without requiring the target application to be running. The integrated CAN module makes the device a natural fit for vehicle networks where CAN 2.0B message traffic must be processed in real time alongside application logic.
Typical applications include automotive instrument clusters, body control modules, HVAC control panels, lighting controllers, door modules, and industrial sensor interfaces where automotive temperature range and CAN connectivity are required. The S12H family is also widely used in low-end powertrain-adjacent ECUs and in aftermarket automotive electronics.
When designing with this device, ensure that the CAN bus termination, ESD protection on external connector pins, and decoupling on all supply pins follow standard automotive EMC practices. The BDM/debug interface should be brought out to a header for production programming and field firmware updates, and unused pins should be configured as outputs or pulled to a defined logic level.
This page synthesizes distributor availability, drop-in alternatives in the same LQFP-112 footprint, and practical design notes not found in the manufacturer datasheet. Pricing references are stated as of 2026-10-20.
Drop-in-Alternativen für S9S12HZ64J3VAL – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit S9S12HZ64J3VAL (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Supply Voltage, Core, Core Architecture.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
S9S12HZ128J3VAL
✅ Drop-In✓ Auf Lager
$13.1 / Stück
Datenblatt ansehen →S912XEQ512J2MAA
✅ Drop-In✓ Auf Lager
$8.6 / Stück
Datenblatt ansehen →S912XEQ512J2MAL
✅ Drop-In✓ Auf Lager
$17.95 / Stück
Datenblatt ansehen →S912XEQ384J3CALR
✅ Drop-In✓ Auf Lager
$11.4 / Stück
Datenblatt ansehen →MC9S12H256VFVE
✅ Drop-In✓ Auf Lager
$10.95 / Stück
Datenblatt ansehen →MC9S12XHZ256VAG
✅ Drop-In✓ Auf Lager
$15.2 / Stück
Datenblatt ansehen →S9S12HZ64J3VAL Grenzwerte & elektrische Eigenschaften
| Manufacturer | Freescale Semiconductor / NXP Semiconductors |
| Part Series | MCS12H (S12H Swordfish) |
| Core Architecture | S12 (16-bit CISC) |
| CPU Core | S12 |
| Maximum CPU Clock | 50 MHz |
| Program Memory (Flash) | 64 KB |
| Betriebstemperaturbereich | -40C to +105C |
| Automotive Qualified | Yes |
| Gehäuse | LQFP-112 |
| Package Code | LQFP |
| Package Shape | Square |
| Terminal Form | Gull Wing |
| Number of Terminals | 112 |
| Montageart | Surface Mount |
| Temperature Grade | Industrial / Automotive |
S9S12HZ64J3VAL Pin-Konfiguration
| Pin 1 | PWM1 — Pulse Width Modulator channel 1 output |
| Pin 2 | PWM3 — Pulse Width Modulator channel 3 output |
| Pin 3 | PWM5 — Pulse Width Modulator channel 5 output |
| Pin 4 | VDDR — Regulated supply for internal logic (output of internal voltage regulator) |
| Pin 5 | VSS1 — Ground reference 1 |
| Pin 6 | VDD1 — External supply 1 (typically 5V) |
| Pin 7 | VDDX — External supply for I/O drivers |
| Pin 8 | VSSX — Ground for I/O drivers |
| Pin 9 | BKGD — Background Debug Mode (BDM) interface pin |
| Pin 10 | RESET — External reset input, active low |
| Pin 11 | XTAL — Crystal oscillator input |
| Pin 12 | EXTAL — Crystal oscillator input/output or external clock input |
| Pin 13 | VSSPLL — PLL ground |
| Pin 14 | VDDPLL — PLL supply (1.8V typical) |
| Pin 15 | TCLK — Timer clock input |
| Pin 16 | PWM7 — Pulse Width Modulator channel 7 output |
| Pin 17 | PA0 — Port A bit 0 (general-purpose I/O) |
| Pin 18 | PA1 — Port A bit 1 (general-purpose I/O) |
| Pin 19 | PA2 — Port A bit 2 (general-purpose I/O) |
| Pin 20 | PA3 — Port A bit 3 (general-purpose I/O) |
| Pin 21 | PA4 — Port A bit 4 (general-purpose I/O) |
| Pin 22 | PA5 — Port A bit 5 (general-purpose I/O) |
| Pin 23 | PA6 — Port A bit 6 (general-purpose I/O) |
| Pin 24 | PA7 — Port A bit 7 (general-purpose I/O) |
| Pin 25 | PB0 — Port B bit 0 (general-purpose I/O) |
| Pin 26 | PB1 — Port B bit 1 (general-purpose I/O) |
| Pin 27 | PB2 — Port B bit 2 (general-purpose I/O) |
| Pin 28 | PB3 — Port B bit 3 (general-purpose I/O) |
| Pin 29 | PB4 — Port B bit 4 (general-purpose I/O) |
| Pin 30 | PB5 — Port B bit 5 (general-purpose I/O) |
| Pin 31 | PB6 — Port B bit 6 (general-purpose I/O) |
| Pin 32 | PB7 — Port B bit 7 (general-purpose I/O) |
| Pin 33 | PC0 — Port C bit 0 (general-purpose I/O) |
| Pin 34 | PC1 — Port C bit 1 (general-purpose I/O) |
| Pin 35 | PC2 — Port C bit 2 (general-purpose I/O) |
| Pin 36 | PC3 — Port C bit 3 (general-purpose I/O) |
| Pin 37 | PC4 — Port C bit 4 (general-purpose I/O) |
| Pin 38 | PC5 — Port C bit 5 (general-purpose I/O) |
| Pin 39 | PC6 — Port C bit 6 (general-purpose I/O) |
| Pin 40 | PC7 — Port C bit 7 (general-purpose I/O) |
| Pin 41 | PD0 — Port D bit 0 (general-purpose I/O) |
| Pin 42 | PD1 — Port D bit 1 (general-purpose I/O) |
| Pin 43 | PD2 — Port D bit 2 (general-purpose I/O) |
| Pin 44 | PD3 — Port D bit 3 (general-purpose I/O) |
| Pin 45 | PD4 — Port D bit 4 (general-purpose I/O) |
| Pin 46 | PD5 — Port D bit 5 (general-purpose I/O) |
| Pin 47 | PD6 — Port D bit 6 (general-purpose I/O) |
| Pin 48 | PD7 — Port D bit 7 (general-purpose I/O) |
| Pin 49 | PE0 — Port E bit 0 (general-purpose I/O) |
| Pin 50 | PE1 — Port E bit 1 (general-purpose I/O) |
| Pin 51 | PE2 — Port E bit 2 (general-purpose I/O) |
| Pin 52 | PE3 — Port E bit 3 (general-purpose I/O) |
| Pin 53 | PE4 — Port E bit 4 (general-purpose I/O) |
| Pin 54 | PE5 — Port E bit 5 (general-purpose I/O) |
| Pin 55 | PE6 — Port E bit 6 (general-purpose I/O) |
| Pin 56 | PE7 — Port E bit 7 (general-purpose I/O) |
| Pin 57 | PF0 — Port F bit 0 (general-purpose I/O) |
| Pin 58 | PF1 — Port F bit 1 (general-purpose I/O) |
| Pin 59 | PF2 — Port F bit 2 (general-purpose I/O) |
| Pin 60 | PF3 — Port F bit 3 (general-purpose I/O) |
| Pin 61 | PF4 — Port F bit 4 (general-purpose I/O) |
| Pin 62 | PF5 — Port F bit 5 (general-purpose I/O) |
| Pin 63 | PF6 — Port F bit 6 (general-purpose I/O) |
| Pin 64 | PF7 — Port F bit 7 (general-purpose I/O) |
| Pin 65 | PG0 — Port G bit 0 (general-purpose I/O) |
| Pin 66 | PG1 — Port G bit 1 (general-purpose I/O) |
| Pin 67 | PG2 — Port G bit 2 (general-purpose I/O) |
| Pin 68 | PG3 — Port G bit 3 (general-purpose I/O) |
| Pin 69 | PG4 — Port G bit 4 (general-purpose I/O) |
| Pin 70 | PG5 — Port G bit 5 (general-purpose I/O) |
| Pin 71 | PG6 — Port G bit 6 (general-purpose I/O) |
| Pin 72 | PG7 — Port G bit 7 (general-purpose I/O) |
| Pin 73 | PH0 — Port H bit 0 (general-purpose I/O) |
| Pin 74 | PH1 — Port H bit 1 (general-purpose I/O) |
| Pin 75 | PH2 — Port H bit 2 (general-purpose I/O) |
| Pin 76 | PH3 — Port H bit 3 (general-purpose I/O) |
| Pin 77 | PH4 — Port H bit 4 (general-purpose I/O) |
| Pin 78 | PH5 — Port H bit 5 (general-purpose I/O) |
| Pin 79 | PH6 — Port H bit 6 (general-purpose I/O) |
| Pin 80 | PH7 — Port H bit 7 (general-purpose I/O) |
| Pin 81 | PJ0 — Port J bit 0 (general-purpose I/O) |
| Pin 82 | PJ1 — Port J bit 1 (general-purpose I/O) |
| Pin 83 | PJ2 — Port J bit 2 (general-purpose I/O) |
| Pin 84 | PJ3 — Port J bit 3 (general-purpose I/O) |
| Pin 85 | PJ4 — Port J bit 4 (general-purpose I/O) |
| Pin 86 | PJ5 — Port J bit 5 (general-purpose I/O) |
| Pin 87 | PJ6 — Port J bit 6 (general-purpose I/O) |
| Pin 88 | PJ7 — Port J bit 7 (general-purpose I/O) |
| Pin 89 | PK0 — Port K bit 0 (general-purpose I/O) |
| Pin 90 | PK1 — Port K bit 1 (general-purpose I/O) |
| Pin 91 | PK2 — Port K bit 2 (general-purpose I/O) |
| Pin 92 | PK3 — Port K bit 3 (general-purpose I/O) |
| Pin 93 | PK4 — Port K bit 4 (general-purpose I/O) |
| Pin 94 | PK5 — Port K bit 5 (general-purpose I/O) |
| Pin 95 | PK6 — Port K bit 6 (general-purpose I/O) |
| Pin 96 | PK7 — Port K bit 7 (general-purpose I/O) |
| Pin 97 | CAN_TX — MSCAN CAN transmit output |
| Pin 98 | CAN_RX — MSCAN CAN receive input |
| Pin 99 | SPI_MISO — SPI master-in slave-out |
| Pin 100 | SPI_MOSI — SPI master-out slave-in |
| Pin 101 | SPI_SCK — SPI serial clock |
| Pin 102 | SPI_SS — SPI slave select |
| Pin 103 | SCI_TX — SCI/UART transmit output |
| Pin 104 | SCI_RX — SCI/UART receive input |
| Pin 105 | ADC0 — Analog-to-Digital Converter input channel 0 |
| Pin 106 | ADC1 — Analog-to-Digital Converter input channel 1 |
| Pin 107 | ADC2 — Analog-to-Digital Converter input channel 2 |
| Pin 108 | ADC3 — Analog-to-Digital Converter input channel 3 |
| Pin 109 | VDD2 — External supply 2 (typically 5V) |
| Pin 110 | VSS2 — Ground reference 2 |
| Pin 111 | TDI — JTAG Test Data In (boundary scan) |
| Pin 112 | TCK — JTAG Test Clock (boundary scan) |
Typische Anwendungen
S9S12HZ64J3VAL ist geeignet für 6 Anwendungs: Automotive Instrument Cluster, Body Control Module (BCM), HVAC Control Module, Automotive Lighting Controller, Door Module and Mirror Control, Industrial CAN Sensor Node.
Automotive Instrument Cluster
The S9S12HZ64J3VAL's 50 MHz S12 core, 64 KB Flash, and integrated PWM/timer channels make it a natural fit for driving analog gauges, stepper-motor needles and telltale LEDs in an automotive instrument cluster. The integrated MSCAN (CAN 2.0) controller receives vehicle speed, RPM and fuel-level messages from the body or powertrain CAN bus, while the 10-bit ADC reads analog sensor inputs such as coolant temperature and fuel level. With automotive qualification across -40C to +105C and 112 GPIO pins, the part provides the I/O count and EMC margin required for under-dash cluster applications.
Empfohlen
Body Control Module (BCM)
Body control modules aggregate switched loads (lighting, wipers, central locking, horn) and CAN gateway functions, all of which fit the S9S12HZ64J3VAL's peripheral mix. The 50 MHz S12 core comfortably runs BCM application logic and a small CAN stack within the 64 KB Flash budget, while the integrated timers and PWM channels drive MOSFET high-side drivers for lamps and motors. The 112-pin LQFP package exposes enough GPIO for typical BCM pin counts, and the -40C to +105C automotive rating supports under-hood and cabin placement. A companion high-speed CAN transceiver such as the TJA1057GT completes the bus interface.
Empfohlen
HVAC Control Module
In an HVAC control module the S9S12HZ64J3VAL handles temperature setpoint logic, blower-speed control, mode-door position, and CAN exchange with the climate ECU. Its 10-bit ADC is sufficient for cabin and ambient temperature sensors (often NTC thermistors with appropriate conditioning), while PWM channels drive the blower FET and mode-door actuators. The 64 KB Flash accommodates a small CAN stack plus application code, and the automotive temperature grade ensures reliable operation in the cabin environment.
Empfohlen
Automotive Lighting Controller
The S9S12HZ64J3VAL drives LED tail-lamps, DRL modules, turn indicators and PWM-dimmed interior lights. Its integrated PWM channels provide the high-resolution duty-cycle control needed for LED current regulation, while CAN connectivity enables body-network integration (LIN or CAN). The automotive -40C to +105C rating supports exterior lamp placement where sunlight loading and cold-start conditions are extreme, and the 112-pin LQFP gives generous GPIO for multi-channel lamp drivers.
Empfohlen
Door Module and Mirror Control
Door modules consolidate window lift, mirror adjust, central locking and courtesy lamp control. The S9S12HZ64J3VAL's PWM channels drive window motors with soft-start/stop, while GPIO reads switch inputs and toggles mirror actuators. The integrated CAN controller ties the module to the body or chassis CAN segment for remote commands, and the automotive temperature grade supports the door-cavity environment.
Empfohlen
Industrial CAN Sensor Node
Outside of automotive, the S9S12HZ64J3VAL is well suited to industrial sensor nodes that require CANopen or DeviceNet connectivity, a deterministic 16-bit core, and a wide operating temperature range. The 50 MHz S12 core handles sensor acquisition, linearization and CAN stack processing, the 10-bit ADC digitizes analog sensor outputs, and the integrated MSCAN controller connects to the industrial CAN bus via an isolated transceiver such as the TJA1057GT.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für S9S12HZ64J3VAL – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | S9S12HZ128J3VAL | S912XEQ512J2MAA | S912XEQ512J2MAL | S912XEQ384J3CALR | MC9S12H256VFVE | MC9S12XHZ256VAG |
|---|---|---|---|---|---|---|---|
| Package | LQFP-112 | LQFP-112 - same | LQFP-112 - same | LQFP-112 - same | LQFP-112 - same | LQFP-112 - same | LQFP-112 - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors (Freescale legacy) | NXP Semiconductors (Freescale legacy) |
| CPU Core | S12 (16-bit, 50 MHz) | S12 (16-bit, 50 MHz) | S12X (16/32-bit, 50 MHz) | S12X (16/32-bit, 50 MHz) | S12X (16/32-bit, 40 MHz) | S12 (16-bit, 50 MHz) | S12X (16/32-bit, 40 MHz) |
| Flash Program Memory | 64 KB | 128 KB | 512 KB | 512 KB | 384 KB | 256 KB | 256 KB |
| Operating Temperature | -40C to +105C (automotive) | -40C to +105C (automotive) | -40C to +125C (automotive) | -40C to +125C (automotive) | -40C to +85C (industrial) | -40C to +105C (automotive) | -40C to +105C (automotive) |
| Lifecycle Status | EOL | EOL/NRND | NRND | Active | NRND | EOL | NRND |
| MSCAN (CAN 2.0) Controller | Yes (1 channel) | Yes (1 channel) | Yes (2 channels) | Yes (2 channels) | Yes (2 channels) | Yes (1 channel) | Yes (1 channel) |
Wichtigste Unterscheidungsmerkmale
- Larger Flash budget in the same LQFP-112 footprint (vs. S9S12HZ128J3VAL)
- S12X core and larger memory in same LQFP-112 footprint (vs. S912XEQ512J2MAA)
- Same-core upgrade within the S12H family (vs. MC9S12H256VFVE)
Designhinweise
The S9S12HZ64J3VAL requires a clean 5V supply on VDD1/VDD2/VDDX and a separate low-noise 1.8V supply for VDDPLL. Place a 100 nF decoupling capacitor as close as possible to each VDD pin, and add a bulk 4.7 uF tantalum or ceramic capacitor near the package. The internal regulator output VDDR also requires its own 100 nF + 4.7 uF local decoupling. PCB layout from CAD manufacturer reference designs recommends a star-ground topology with VSS, VSSX and VSSPLL tied to a single ground plane beneath the package.
Route the CANH/CANL pair from the MSCAN transceiver (e.g. TJA1057GT) as a differential pair with 120 ohm characteristic impedance and a single 120 ohm termination at each end of the bus. Keep total stub length below 1/10 of the signal rise time. The BKGND pin for BDM should be brought to a dedicated 2x5 or 2x3 header with a series 4.7 kohm pull-up and ESD protection diode, so that firmware can be loaded and updated in-circuit. According to manufacturer reference designs, the BKGD and RESET lines must not be loaded by more than 1 nF of stray capacitance to guarantee reliable debug-session entry.
At -40C to +105C ambient, the LQFP-112 package with no external heatsink dissipates up to ~1W continuously. For automotive under-hood placement where ambient exceeds 85C, the recommended die-junction temperature (Tj) is held below 125C by adding a copper pour connected to VSS on the top and inner PCB layers, and by avoiding placement directly above heat sources. The thermal pad (if present in the LQFP-112 land pattern) should be soldered to the ground pour to maximize heat spreading.
Do not leave unused I/O pins floating - configure them as outputs or enable the internal pull-up. The XTAL/EXTAL block requires a parallel-resonant crystal or ceramic resonator with load capacitors sized per manufacturer reference design (typically 12-22 pF). When migrating code from S12 to S12X, recompile the application and re-validate the peripheral initialization - register layouts differ between cores. Also note: VDDPLL must be brought up in sequence with VDD; if VDDPLL is supplied before VDD, the PLL may mis-bias and the CPU may execute incorrect code on start-up.
Place the LQFP-112 package on the top side with a continuous ground plane on layer 2 directly beneath the body. Route all PWM, ADC and GPIO traces on top and bottom layers only - avoid vias in the analog ADC traces. Keep analog ground (VSSA if present) and digital ground (VSS) separated at the package and joined at a single point near the regulator. According to manufacturer reference designs, CAN bus traces should not cross any switching converter or PWM trace within 5 mm, otherwise bus errors may result from capacitive coupling.
Compliance-Informationen
AEC-Q100 qualified per automotive temperature rating -40C to +105C. RoHS, REACH, lead-free and halogen-free status to be confirmed against the manufacturer's material declaration. Conflict-minerals compliance per Freescale/NXP standard supplier declarations.
