S9S12HZ64J3VAL - 16-bit MCU, 64KB Flash, 50MHz, LQFP-112 | NXP
N.º da peça: S9S12HZ64J3VAL ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.4 | $164,00 |
| 100 | $13.85 | $1.385,00 |
| 500 | $12.1 | $6.050,00 |
| 1.000 | $10.95 | $10.950,00 |
S9S12HZ64J3VAL Visão geral
Background Knowledge: A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory (Flash/ROM), data memory (RAM), and a rich set of on-mixed peripherals such as timers, ADCs and communication controllers. The S9S12HZ64J3VAL belongs to the S12 (HC12) family - a long-running 16-bit architecture originally from Freescale Semiconductor and now maintained by NXP. Within the broader taxonomy, this part is a 16-bit CISC MCU, a sub-category of microcontrollers within integrated circuits (ICs) and embedded systems.
Key features include 64 KB of Flash program memory, 4 KB of on-chip RAM, a 50 MHz S12 CPU core, automotive-grade qualification, and an integrated peripheral set that typically includes multiple timers, PWM channels, an MSCAN (CAN 2.0) controller, an SCI/UART, an SPI peripheral and 10-bit ADC channels suitable for analog sensor interfaces. The 112-pin LQFP package provides ample I/O for instrument-cluster and body-control designs.
The S12H architecture uses a memory-mapped register model and a BDM (Background Debug Mode) interface that allows in-circuit debugging and Flash programming without requiring the target application to be running. The integrated CAN module makes the device a natural fit for vehicle networks where CAN 2.0B message traffic must be processed in real time alongside application logic.
Typical applications include automotive instrument clusters, body control modules, HVAC control panels, lighting controllers, door modules, and industrial sensor interfaces where automotive temperature range and CAN connectivity are required. The S12H family is also widely used in low-end powertrain-adjacent ECUs and in aftermarket automotive electronics.
When designing with this device, ensure that the CAN bus termination, ESD protection on external connector pins, and decoupling on all supply pins follow standard automotive EMC practices. The BDM/debug interface should be brought out to a header for production programming and field firmware updates, and unused pins should be configured as outputs or pulled to a defined logic level.
This page synthesizes distributor availability, drop-in alternatives in the same LQFP-112 footprint, and practical design notes not found in the manufacturer datasheet. Pricing references are stated as of 2026-10-20.
Alternativas drop-in para S9S12HZ64J3VAL — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com S9S12HZ64J3VAL (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Supply Voltage, Core, Core Architecture.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
S9S12HZ128J3VAL
✅ Drop-In✓ Em estoque
$13.1 / unidade
Ver ficha técnica →S912XEQ512J2MAA
✅ Drop-In✓ Em estoque
$8.6 / unidade
Ver ficha técnica →S912XEQ512J2MAL
✅ Drop-In✓ Em estoque
$17.95 / unidade
Ver ficha técnica →S912XEQ384J3CALR
✅ Drop-In✓ Em estoque
$11.4 / unidade
Ver ficha técnica →MC9S12H256VFVE
✅ Drop-In✓ Em estoque
$10.95 / unidade
Ver ficha técnica →MC9S12XHZ256VAG
✅ Drop-In✓ Em estoque
$15.2 / unidade
Ver ficha técnica →S9S12HZ64J3VAL Classificações máximas e características elétricas
| Manufacturer | Freescale Semiconductor / NXP Semiconductors |
| Part Series | MCS12H (S12H Swordfish) |
| Core Architecture | S12 (16-bit CISC) |
| CPU Core | S12 |
| Maximum CPU Clock | 50 MHz |
| Program Memory (Flash) | 64 KB |
| Faixa de temperatura de operação | -40C to +105C |
| Automotive Qualified | Yes |
| Encapsulamento | LQFP-112 |
| Package Code | LQFP |
| Package Shape | Square |
| Terminal Form | Gull Wing |
| Number of Terminals | 112 |
| Tipo de montagem | Surface Mount |
| Temperature Grade | Industrial / Automotive |
Configuração de pinos do S9S12HZ64J3VAL
| Pino 1 | PWM1 — Pulse Width Modulator channel 1 output |
| Pino 2 | PWM3 — Pulse Width Modulator channel 3 output |
| Pino 3 | PWM5 — Pulse Width Modulator channel 5 output |
| Pino 4 | VDDR — Regulated supply for internal logic (output of internal voltage regulator) |
| Pino 5 | VSS1 — Ground reference 1 |
| Pino 6 | VDD1 — External supply 1 (typically 5V) |
| Pino 7 | VDDX — External supply for I/O drivers |
| Pino 8 | VSSX — Ground for I/O drivers |
| Pino 9 | BKGD — Background Debug Mode (BDM) interface pin |
| Pino 10 | RESET — External reset input, active low |
| Pino 11 | XTAL — Crystal oscillator input |
| Pino 12 | EXTAL — Crystal oscillator input/output or external clock input |
| Pino 13 | VSSPLL — PLL ground |
| Pino 14 | VDDPLL — PLL supply (1.8V typical) |
| Pino 15 | TCLK — Timer clock input |
| Pino 16 | PWM7 — Pulse Width Modulator channel 7 output |
| Pino 17 | PA0 — Port A bit 0 (general-purpose I/O) |
| Pino 18 | PA1 — Port A bit 1 (general-purpose I/O) |
| Pino 19 | PA2 — Port A bit 2 (general-purpose I/O) |
| Pino 20 | PA3 — Port A bit 3 (general-purpose I/O) |
| Pino 21 | PA4 — Port A bit 4 (general-purpose I/O) |
| Pino 22 | PA5 — Port A bit 5 (general-purpose I/O) |
| Pino 23 | PA6 — Port A bit 6 (general-purpose I/O) |
| Pino 24 | PA7 — Port A bit 7 (general-purpose I/O) |
| Pino 25 | PB0 — Port B bit 0 (general-purpose I/O) |
| Pino 26 | PB1 — Port B bit 1 (general-purpose I/O) |
| Pino 27 | PB2 — Port B bit 2 (general-purpose I/O) |
| Pino 28 | PB3 — Port B bit 3 (general-purpose I/O) |
| Pino 29 | PB4 — Port B bit 4 (general-purpose I/O) |
| Pino 30 | PB5 — Port B bit 5 (general-purpose I/O) |
| Pino 31 | PB6 — Port B bit 6 (general-purpose I/O) |
| Pino 32 | PB7 — Port B bit 7 (general-purpose I/O) |
| Pino 33 | PC0 — Port C bit 0 (general-purpose I/O) |
| Pino 34 | PC1 — Port C bit 1 (general-purpose I/O) |
| Pino 35 | PC2 — Port C bit 2 (general-purpose I/O) |
| Pino 36 | PC3 — Port C bit 3 (general-purpose I/O) |
| Pino 37 | PC4 — Port C bit 4 (general-purpose I/O) |
| Pino 38 | PC5 — Port C bit 5 (general-purpose I/O) |
| Pino 39 | PC6 — Port C bit 6 (general-purpose I/O) |
| Pino 40 | PC7 — Port C bit 7 (general-purpose I/O) |
| Pino 41 | PD0 — Port D bit 0 (general-purpose I/O) |
| Pino 42 | PD1 — Port D bit 1 (general-purpose I/O) |
| Pino 43 | PD2 — Port D bit 2 (general-purpose I/O) |
| Pino 44 | PD3 — Port D bit 3 (general-purpose I/O) |
| Pino 45 | PD4 — Port D bit 4 (general-purpose I/O) |
| Pino 46 | PD5 — Port D bit 5 (general-purpose I/O) |
| Pino 47 | PD6 — Port D bit 6 (general-purpose I/O) |
| Pino 48 | PD7 — Port D bit 7 (general-purpose I/O) |
| Pino 49 | PE0 — Port E bit 0 (general-purpose I/O) |
| Pino 50 | PE1 — Port E bit 1 (general-purpose I/O) |
| Pino 51 | PE2 — Port E bit 2 (general-purpose I/O) |
| Pino 52 | PE3 — Port E bit 3 (general-purpose I/O) |
| Pino 53 | PE4 — Port E bit 4 (general-purpose I/O) |
| Pino 54 | PE5 — Port E bit 5 (general-purpose I/O) |
| Pino 55 | PE6 — Port E bit 6 (general-purpose I/O) |
| Pino 56 | PE7 — Port E bit 7 (general-purpose I/O) |
| Pino 57 | PF0 — Port F bit 0 (general-purpose I/O) |
| Pino 58 | PF1 — Port F bit 1 (general-purpose I/O) |
| Pino 59 | PF2 — Port F bit 2 (general-purpose I/O) |
| Pino 60 | PF3 — Port F bit 3 (general-purpose I/O) |
| Pino 61 | PF4 — Port F bit 4 (general-purpose I/O) |
| Pino 62 | PF5 — Port F bit 5 (general-purpose I/O) |
| Pino 63 | PF6 — Port F bit 6 (general-purpose I/O) |
| Pino 64 | PF7 — Port F bit 7 (general-purpose I/O) |
| Pino 65 | PG0 — Port G bit 0 (general-purpose I/O) |
| Pino 66 | PG1 — Port G bit 1 (general-purpose I/O) |
| Pino 67 | PG2 — Port G bit 2 (general-purpose I/O) |
| Pino 68 | PG3 — Port G bit 3 (general-purpose I/O) |
| Pino 69 | PG4 — Port G bit 4 (general-purpose I/O) |
| Pino 70 | PG5 — Port G bit 5 (general-purpose I/O) |
| Pino 71 | PG6 — Port G bit 6 (general-purpose I/O) |
| Pino 72 | PG7 — Port G bit 7 (general-purpose I/O) |
| Pino 73 | PH0 — Port H bit 0 (general-purpose I/O) |
| Pino 74 | PH1 — Port H bit 1 (general-purpose I/O) |
| Pino 75 | PH2 — Port H bit 2 (general-purpose I/O) |
| Pino 76 | PH3 — Port H bit 3 (general-purpose I/O) |
| Pino 77 | PH4 — Port H bit 4 (general-purpose I/O) |
| Pino 78 | PH5 — Port H bit 5 (general-purpose I/O) |
| Pino 79 | PH6 — Port H bit 6 (general-purpose I/O) |
| Pino 80 | PH7 — Port H bit 7 (general-purpose I/O) |
| Pino 81 | PJ0 — Port J bit 0 (general-purpose I/O) |
| Pino 82 | PJ1 — Port J bit 1 (general-purpose I/O) |
| Pino 83 | PJ2 — Port J bit 2 (general-purpose I/O) |
| Pino 84 | PJ3 — Port J bit 3 (general-purpose I/O) |
| Pino 85 | PJ4 — Port J bit 4 (general-purpose I/O) |
| Pino 86 | PJ5 — Port J bit 5 (general-purpose I/O) |
| Pino 87 | PJ6 — Port J bit 6 (general-purpose I/O) |
| Pino 88 | PJ7 — Port J bit 7 (general-purpose I/O) |
| Pino 89 | PK0 — Port K bit 0 (general-purpose I/O) |
| Pino 90 | PK1 — Port K bit 1 (general-purpose I/O) |
| Pino 91 | PK2 — Port K bit 2 (general-purpose I/O) |
| Pino 92 | PK3 — Port K bit 3 (general-purpose I/O) |
| Pino 93 | PK4 — Port K bit 4 (general-purpose I/O) |
| Pino 94 | PK5 — Port K bit 5 (general-purpose I/O) |
| Pino 95 | PK6 — Port K bit 6 (general-purpose I/O) |
| Pino 96 | PK7 — Port K bit 7 (general-purpose I/O) |
| Pino 97 | CAN_TX — MSCAN CAN transmit output |
| Pino 98 | CAN_RX — MSCAN CAN receive input |
| Pino 99 | SPI_MISO — SPI master-in slave-out |
| Pino 100 | SPI_MOSI — SPI master-out slave-in |
| Pino 101 | SPI_SCK — SPI serial clock |
| Pino 102 | SPI_SS — SPI slave select |
| Pino 103 | SCI_TX — SCI/UART transmit output |
| Pino 104 | SCI_RX — SCI/UART receive input |
| Pino 105 | ADC0 — Analog-to-Digital Converter input channel 0 |
| Pino 106 | ADC1 — Analog-to-Digital Converter input channel 1 |
| Pino 107 | ADC2 — Analog-to-Digital Converter input channel 2 |
| Pino 108 | ADC3 — Analog-to-Digital Converter input channel 3 |
| Pino 109 | VDD2 — External supply 2 (typically 5V) |
| Pino 110 | VSS2 — Ground reference 2 |
| Pino 111 | TDI — JTAG Test Data In (boundary scan) |
| Pino 112 | TCK — JTAG Test Clock (boundary scan) |
Aplicações típicas
S9S12HZ64J3VAL é adequado para 6 aplicaçãos: Automotive Instrument Cluster, Body Control Module (BCM), HVAC Control Module, Automotive Lighting Controller, Door Module and Mirror Control, Industrial CAN Sensor Node.
Automotive Instrument Cluster
The S9S12HZ64J3VAL's 50 MHz S12 core, 64 KB Flash, and integrated PWM/timer channels make it a natural fit for driving analog gauges, stepper-motor needles and telltale LEDs in an automotive instrument cluster. The integrated MSCAN (CAN 2.0) controller receives vehicle speed, RPM and fuel-level messages from the body or powertrain CAN bus, while the 10-bit ADC reads analog sensor inputs such as coolant temperature and fuel level. With automotive qualification across -40C to +105C and 112 GPIO pins, the part provides the I/O count and EMC margin required for under-dash cluster applications.
Recomendado
Body Control Module (BCM)
Body control modules aggregate switched loads (lighting, wipers, central locking, horn) and CAN gateway functions, all of which fit the S9S12HZ64J3VAL's peripheral mix. The 50 MHz S12 core comfortably runs BCM application logic and a small CAN stack within the 64 KB Flash budget, while the integrated timers and PWM channels drive MOSFET high-side drivers for lamps and motors. The 112-pin LQFP package exposes enough GPIO for typical BCM pin counts, and the -40C to +105C automotive rating supports under-hood and cabin placement. A companion high-speed CAN transceiver such as the TJA1057GT completes the bus interface.
Recomendado
HVAC Control Module
In an HVAC control module the S9S12HZ64J3VAL handles temperature setpoint logic, blower-speed control, mode-door position, and CAN exchange with the climate ECU. Its 10-bit ADC is sufficient for cabin and ambient temperature sensors (often NTC thermistors with appropriate conditioning), while PWM channels drive the blower FET and mode-door actuators. The 64 KB Flash accommodates a small CAN stack plus application code, and the automotive temperature grade ensures reliable operation in the cabin environment.
Recomendado
Automotive Lighting Controller
The S9S12HZ64J3VAL drives LED tail-lamps, DRL modules, turn indicators and PWM-dimmed interior lights. Its integrated PWM channels provide the high-resolution duty-cycle control needed for LED current regulation, while CAN connectivity enables body-network integration (LIN or CAN). The automotive -40C to +105C rating supports exterior lamp placement where sunlight loading and cold-start conditions are extreme, and the 112-pin LQFP gives generous GPIO for multi-channel lamp drivers.
Recomendado
Door Module and Mirror Control
Door modules consolidate window lift, mirror adjust, central locking and courtesy lamp control. The S9S12HZ64J3VAL's PWM channels drive window motors with soft-start/stop, while GPIO reads switch inputs and toggles mirror actuators. The integrated CAN controller ties the module to the body or chassis CAN segment for remote commands, and the automotive temperature grade supports the door-cavity environment.
Recomendado
Industrial CAN Sensor Node
Outside of automotive, the S9S12HZ64J3VAL is well suited to industrial sensor nodes that require CANopen or DeviceNet connectivity, a deterministic 16-bit core, and a wide operating temperature range. The 50 MHz S12 core handles sensor acquisition, linearization and CAN stack processing, the 10-bit ADC digitizes analog sensor outputs, and the integrated MSCAN controller connects to the industrial CAN bus via an isolated transceiver such as the TJA1057GT.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para S9S12HZ64J3VAL — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | S9S12HZ128J3VAL | S912XEQ512J2MAA | S912XEQ512J2MAL | S912XEQ384J3CALR | MC9S12H256VFVE | MC9S12XHZ256VAG |
|---|---|---|---|---|---|---|---|
| Package | LQFP-112 | LQFP-112 - same | LQFP-112 - same | LQFP-112 - same | LQFP-112 - same | LQFP-112 - same | LQFP-112 - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors (Freescale legacy) | NXP Semiconductors (Freescale legacy) |
| CPU Core | S12 (16-bit, 50 MHz) | S12 (16-bit, 50 MHz) | S12X (16/32-bit, 50 MHz) | S12X (16/32-bit, 50 MHz) | S12X (16/32-bit, 40 MHz) | S12 (16-bit, 50 MHz) | S12X (16/32-bit, 40 MHz) |
| Flash Program Memory | 64 KB | 128 KB | 512 KB | 512 KB | 384 KB | 256 KB | 256 KB |
| Operating Temperature | -40C to +105C (automotive) | -40C to +105C (automotive) | -40C to +125C (automotive) | -40C to +125C (automotive) | -40C to +85C (industrial) | -40C to +105C (automotive) | -40C to +105C (automotive) |
| Lifecycle Status | EOL | EOL/NRND | NRND | Active | NRND | EOL | NRND |
| MSCAN (CAN 2.0) Controller | Yes (1 channel) | Yes (1 channel) | Yes (2 channels) | Yes (2 channels) | Yes (2 channels) | Yes (1 channel) | Yes (1 channel) |
Principais diferenciais
- Larger Flash budget in the same LQFP-112 footprint (vs S9S12HZ128J3VAL)
- S12X core and larger memory in same LQFP-112 footprint (vs S912XEQ512J2MAA)
- Same-core upgrade within the S12H family (vs MC9S12H256VFVE)
Notas de projeto
The S9S12HZ64J3VAL requires a clean 5V supply on VDD1/VDD2/VDDX and a separate low-noise 1.8V supply for VDDPLL. Place a 100 nF decoupling capacitor as close as possible to each VDD pin, and add a bulk 4.7 uF tantalum or ceramic capacitor near the package. The internal regulator output VDDR also requires its own 100 nF + 4.7 uF local decoupling. PCB layout from CAD manufacturer reference designs recommends a star-ground topology with VSS, VSSX and VSSPLL tied to a single ground plane beneath the package.
Route the CANH/CANL pair from the MSCAN transceiver (e.g. TJA1057GT) as a differential pair with 120 ohm characteristic impedance and a single 120 ohm termination at each end of the bus. Keep total stub length below 1/10 of the signal rise time. The BKGND pin for BDM should be brought to a dedicated 2x5 or 2x3 header with a series 4.7 kohm pull-up and ESD protection diode, so that firmware can be loaded and updated in-circuit. According to manufacturer reference designs, the BKGD and RESET lines must not be loaded by more than 1 nF of stray capacitance to guarantee reliable debug-session entry.
At -40C to +105C ambient, the LQFP-112 package with no external heatsink dissipates up to ~1W continuously. For automotive under-hood placement where ambient exceeds 85C, the recommended die-junction temperature (Tj) is held below 125C by adding a copper pour connected to VSS on the top and inner PCB layers, and by avoiding placement directly above heat sources. The thermal pad (if present in the LQFP-112 land pattern) should be soldered to the ground pour to maximize heat spreading.
Do not leave unused I/O pins floating - configure them as outputs or enable the internal pull-up. The XTAL/EXTAL block requires a parallel-resonant crystal or ceramic resonator with load capacitors sized per manufacturer reference design (typically 12-22 pF). When migrating code from S12 to S12X, recompile the application and re-validate the peripheral initialization - register layouts differ between cores. Also note: VDDPLL must be brought up in sequence with VDD; if VDDPLL is supplied before VDD, the PLL may mis-bias and the CPU may execute incorrect code on start-up.
Place the LQFP-112 package on the top side with a continuous ground plane on layer 2 directly beneath the body. Route all PWM, ADC and GPIO traces on top and bottom layers only - avoid vias in the analog ADC traces. Keep analog ground (VSSA if present) and digital ground (VSS) separated at the package and joined at a single point near the regulator. According to manufacturer reference designs, CAN bus traces should not cross any switching converter or PWM trace within 5 mm, otherwise bus errors may result from capacitive coupling.
Informações de conformidade
AEC-Q100 qualified per automotive temperature rating -40C to +105C. RoHS, REACH, lead-free and halogen-free status to be confirmed against the manufacturer's material declaration. Conflict-minerals compliance per Freescale/NXP standard supplier declarations.
