10AX090R2F40E2SG vs 10AX115R3F40E2SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX090R2F40E2SG sa pamamagitan ng Intel at 10AX115R3F40E2SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AX090R2F40E2SG | 10AX115R3F40E2SG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900000 | — |
| LABs/CLBs | 339620 | — |
| Total RAM Bits | 59234304 | — |
| User I/O Count | 342 | — |
| Package Type | 1517-BBGA, FCBGA | — |
| Package Code | F40 (approx. 40mm FCBGA) | — |
| Speed Grade | 2 (R2 -2 transceiver rating) | -2 |
| Temperature Grade | E2 (Extended: -40C to +100C junction) | E2 (0C to +100C) |
| Lead-Free / RoHS | Yes (SG suffix) | — |
| Transceivers | Up to 14.1 Gbps (Arria 10 GX feature) | — |
| DSP Blocks | Variable-precision, hardened floating-point capable | 1,518 (variable-precision, hard FP) |
| Process Node | TSMC 20nm | — |
| Uri ng Pagpapasok | Surface Mount (FCBGA ball grid) | Surface Mount (Flip-Chip BGA) |
| Level ng MSL | 3 (168 Hours) | — |
| Packaging | Tray | — |
| Logic Elements (LE) | — | 1,150,000 |
| Adaptive Logic Modules (ALM) | — | 427,200 |
| Embedded Memory | — | 68,857,856 bits (8,557 Kbit) |
| M20K Memory Blocks | — | 2,738 |
| Maximum User I/O | — | 342 |
| Transceiver Channels | — | 24 (up to 14.1 Gbps) |
| Hard Memory Controllers | — | DDR4/DDR3/QDR IV |
| Hard PCIe Gen3 IP Cores | — | 2 |
| Process Technology | — | TSMC 20 nm |
| Packhaging | — | 1517-ball FCBGA (F40), 1.0 mm pitch |
| Configuration Memory | — | Embedded (no external flash required for typical use) |
| Tindminan RoHS | — | Compliant |