10AX090R2F40E2SG vs 10AX115R3F40E2SG 比較

詳細並排比較 10AX090R2F40E2SG 由 Intel 與 10AX115R3F40E2SG 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
10AX090R2F40E2SG 10AX090R2F40E2SG - Arria 10 GX FPGA 900K LE | Intel

10AX090R2F40E2SG - Arria 10 GX FPGA 900K LE | Intel

10AX090R2F40E2SG ✓ 啟用中
Intel
10AX115R3F40E2SG 10AX115R3F40E2SG - Arria 10 GX 1150K LE FPGA, 28nm | Intel

10AX115R3F40E2SG - Arria 10 GX 1150K LE FPGA, 28nm | Intel

10AX115R3F40E2SG ✓ 啟用中

規格比較

參數 10AX090R2F40E2SG 10AX115R3F40E2SG
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Arria 10 GX Arria 10 GX
Logic Elements 900000 —
LABs/CLBs 339620 —
Total RAM Bits 59234304 —
User I/O Count 342 —
Package Type 1517-BBGA, FCBGA —
Package Code F40 (approx. 40mm FCBGA) —
Speed Grade 2 (R2 -2 transceiver rating) -2
Temperature Grade E2 (Extended: -40C to +100C junction) E2 (0C to +100C)
Lead-Free / RoHS Yes (SG suffix) —
Transceivers Up to 14.1 Gbps (Arria 10 GX feature) —
DSP Blocks Variable-precision, hardened floating-point capable 1,518 (variable-precision, hard FP)
Process Node TSMC 20nm —
安裝類型 Surface Mount (FCBGA ball grid) Surface Mount (Flip-Chip BGA)
MSL 等級 3 (168 Hours) —
Packaging Tray —
Logic Elements (LE) — 1,150,000
Adaptive Logic Modules (ALM) — 427,200
Embedded Memory — 68,857,856 bits (8,557 Kbit)
M20K Memory Blocks — 2,738
Maximum User I/O — 342
Transceiver Channels — 24 (up to 14.1 Gbps)
Hard Memory Controllers — DDR4/DDR3/QDR IV
Hard PCIe Gen3 IP Cores — 2
Process Technology — TSMC 20 nm
封裝 — 1517-ball FCBGA (F40), 1.0 mm pitch
Configuration Memory — Embedded (no external flash required for typical use)
RoHS 狀態 — Compliant

資料表與資源

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